JPH01124214A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPH01124214A JPH01124214A JP62282088A JP28208887A JPH01124214A JP H01124214 A JPH01124214 A JP H01124214A JP 62282088 A JP62282088 A JP 62282088A JP 28208887 A JP28208887 A JP 28208887A JP H01124214 A JPH01124214 A JP H01124214A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- solid electrolytic
- foil
- electrolytic capacitor
- valve metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 31
- 239000007787 solid Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910052758 niobium Inorganic materials 0.000 abstract description 2
- 239000010955 niobium Substances 0.000 abstract description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229910052715 tantalum Inorganic materials 0.000 abstract description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 40
- 239000004020 conductor Substances 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000003566 sealing material Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、固体電解コンデンサの製造方法に関し、特に
封止後の高温寿命特性が良好な固体電解コンデンサの製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a solid electrolytic capacitor, and particularly to a method for manufacturing a solid electrolytic capacitor that has good high-temperature life characteristics after being sealed.
［従来の技術］
一般に、固体電解コンデンサの素子は、弁作用金属から
なる陽極基体に酸化皮膜層を形成し、この酸化皮膜層の
外面に対向電極として二酸化マンガンなどの半導体層を
形成する。さらに、接触抵抗を減じるために銀ペースト
層を設けて導電体層を形成している。このようにして作
製した固体電解コンデンサ素子は、熱硬化性樹脂等によ
って封止される。[Prior Art] Generally, in a solid electrolytic capacitor element, an oxide film layer is formed on an anode substrate made of a valve metal, and a semiconductor layer such as manganese dioxide or the like is formed as a counter electrode on the outer surface of this oxide film layer. Furthermore, in order to reduce contact resistance, a silver paste layer is provided to form a conductor layer. The solid electrolytic capacitor element thus produced is sealed with a thermosetting resin or the like.
［発明が解決しようとする問題点］
しかしながら、導電体層まで形成した固体電解コンデン
サ素子を直接、熱硬化性樹脂等によって封止した場合、
作製した固体電解コンデンサの高温寿命特性か著しく劣
化することがあった。[Problems to be solved by the invention] However, when a solid electrolytic capacitor element with a conductive layer formed thereon is directly sealed with a thermosetting resin or the like,
The high temperature life characteristics of the fabricated solid electrolytic capacitors sometimes deteriorated significantly.
本発明は、上記の事情に鑑み、封止後の高温寿命特性の
優れた固体電解コンデンサの製造方法を提供することに
ある。In view of the above circumstances, the present invention provides a method for manufacturing a solid electrolytic capacitor with excellent high-temperature life characteristics after sealing.
［問題点を解決するための手段コ
本発明は陽極弁金属のエツチング箔上に、誘電体酸化皮
膜層、半導体層、および導電体層が順次形成され、渦巻
状に巻回しである巻回体の両端開口部を封口処理した後
に、巻回体の外面を封止する固体電解コンデンサの製造
方法にある。[Means for Solving the Problems] The present invention provides a spirally wound body in which a dielectric oxide film layer, a semiconductor layer, and a conductive layer are sequentially formed on an etched foil of an anode valve metal. The method of manufacturing a solid electrolytic capacitor includes sealing the outer surface of the wound body after sealing the openings at both ends of the solid electrolytic capacitor.
以下、本発明の固体電解コンデンサの製造方法について
詳細に説明する。Hereinafter, the method for manufacturing a solid electrolytic capacitor of the present invention will be explained in detail.
本発明の陽極弁金属エツチング箔に用いられる弁金属と
しては、アルミニウム、タンタル、ニオブ、チタン及び
これらを基質とする合金等弁作用を有する金属であれば
よいが、特にアルミニウムを使用するのが有利である。The valve metal used in the anode valve metal etching foil of the present invention may be any metal that has a valve action, such as aluminum, tantalum, niobium, titanium, or alloys using these as a substrate, but it is particularly advantageous to use aluminum. It is.
弁金属エツチング箔の形状は、通常、箔、リボン等、板
状（以下箔という）のものである。The valve metal etching foil is usually in the form of a plate (hereinafter referred to as foil) such as foil or ribbon.
上記箔のエツチング方法は公知の方法が採用できる。ま
た、箔の表面には、誘電体酸化皮膜層が設けられる。箔
表面の誘電体酸化皮膜層は、弁金属表層部分に設けられ
た弁金属自体の酸化皮膜であってもよく、あるいは弁金
属の表面上に設けられた他の誘電体酸化物の層であって
もよいが、特に弁金属自体の酸化皮膜であることが望ま
しい。A known method can be used for etching the foil. Further, a dielectric oxide film layer is provided on the surface of the foil. The dielectric oxide film layer on the surface of the foil may be an oxide film of the valve metal itself provided on the surface layer of the valve metal, or a layer of another dielectric oxide provided on the surface of the valve metal. However, an oxide film on the valve metal itself is particularly desirable.
何れの場合においても誘電体酸化皮膜を設ける方法とし
ては、従来公知の方法を用いることができる。In either case, a conventionally known method can be used to provide the dielectric oxide film.
前記誘電体酸化皮膜層上に順次設けられる半導体層、導
電体層の種類および作製方法については、必らずしも限
定されるものではなく、公知のもの及び方法が採用でき
るる。その中でも、とりわけ本願出願人の出願によって
既に提案した半導体層および導電体層を用いることが好
ましい（特願昭８１−２０１７７０号、特願昭８１−２
６８０９２号）。The types and manufacturing methods of the semiconductor layer and conductor layer sequentially provided on the dielectric oxide film layer are not necessarily limited, and known methods and methods can be employed. Among these, it is particularly preferable to use the semiconductor layer and conductor layer already proposed in the application filed by the applicant (Japanese Patent Application No. 81-201770, Japanese Patent Application No. 81-2
No. 68092).
陽極弁金属箔上に、順次、誘電体酸化皮膜層、半導体層
、および導電体層が形成され、渦巻状に巻回した構造体
すなわち積層巻同体の作製方法は、例えば、箔を渦巻状
に巻回してから、順次、誘電体酸化皮膜層、半導体層、
および導電体層を形成してもよく、また、箔上に順次、
誘電体酸化皮膜層、半導体層、および導電体層を形成し
てから渦巻状に巻回してもよい。或は箔上に誘電体酸化
皮膜層を形成してから渦巻状に巻回し、順次、半導体層
、および導電体層を形成するか、または、箔上に、順次
、誘電体酸化皮膜層、半導体層を形成してから渦巻状に
巻回し、後に導電体層を形成してもよい。A dielectric oxide film layer, a semiconductor layer, and a conductive layer are sequentially formed on the anode valve metal foil, and a spirally wound structure, that is, a laminated winding body is manufactured by, for example, After winding, the dielectric oxide film layer, the semiconductor layer,
and a conductor layer may be formed on the foil, and
The dielectric oxide film layer, the semiconductor layer, and the conductor layer may be formed and then spirally wound. Alternatively, a dielectric oxide film layer is formed on the foil and then spirally wound to sequentially form a semiconductor layer and a conductor layer, or a dielectric oxide film layer and a semiconductor layer are sequentially formed on the foil. The layers may be formed and then spirally wound to form the conductor layer later.
積層巻同体を作製する方法に特に制限はなく、又、巻き
数、巻き径、巻きピッチ等は、夫々所望により決めるこ
とができ特に制限はない。There is no particular restriction on the method of producing the laminated winding body, and the number of turns, winding diameter, winding pitch, etc. can be determined as desired and there are no particular restrictions.
前述した固体電解コンデンサ素子を封止するにあたり、
先ず固体電解コンデンサ素子である巻回体の両端開口部
を封口処理しておくことが肝要である。In sealing the solid electrolytic capacitor element mentioned above,
First, it is important to seal the openings at both ends of the wound body, which is a solid electrolytic capacitor element.
封口材料として、エポキシ樹脂、フェノール樹脂等公知
の封止材料を使用することができる。封目方法は、たと
えば、デイスペンサー等により両端開口部のみに封止材
料を注入し加熱硬化することによって行われる。As the sealing material, known sealing materials such as epoxy resin and phenol resin can be used. The sealing method is performed, for example, by injecting a sealing material only into the openings at both ends using a dispenser or the like and curing it by heating.
巻回体の両端開口部を封口処理することは、固体電解コ
ンデンサ素子自体が補強され、引き続き行われる固体電
解コンデンサ素子の外面を全て封止する時の応力に耐え
ることができるものと考えられる。It is thought that by sealing the openings at both ends of the wound body, the solid electrolytic capacitor element itself is reinforced and can withstand the stress that will be applied when the entire outer surface of the solid electrolytic capacitor element is subsequently sealed.
巻回体の両端の開口部を封口した後、固体電解コンデン
サ素子全面を封止する方法は前述した封口材料をディッ
ピング処理、粉体塗装処理等をすることによって行われ
る。After sealing the openings at both ends of the wound body, the entire surface of the solid electrolytic capacitor element is sealed by subjecting the aforementioned sealing material to dipping treatment, powder coating treatment, or the like.
巻回体の両端の開口部を封口処理する時に使用する封口
材料と固体電解コンデンサ素子を全面封止する時に使用
する封口材料は同一であっても、異なるものであっても
よい。The sealing material used to seal the openings at both ends of the wound body and the sealing material used to completely seal the solid electrolytic capacitor element may be the same or different.
［実 施 例コ 以下、この発明を実施例に基づいて説明する。[Implementation example] Hereinafter, this invention will be explained based on examples.
第１図は渦巻状に巻回した固体電解コンデンサ素子の筒
状の巻回体の斜視図であり、１は巻回体、２は陽極リー
ド、３は陰極リードである。巻回体１は長さ２ＣＩＩ＋
％幅０．５ｃｍのアルミニウムエツチング箔上に順次、
アルミナ酸化皮膜層、二酸化鉛と硫酸鉛の３対１混合物
からなる半導体層、銀ベーストからなる導電体層が形成
されていて渦巻状に巻回されており、上、下の両端面に
は開口部がある。陽極リード２はアルミニウムエツチン
グ箔にかしめ付けされており、陰極リード３は導電体層
に銀ペーストで接続されている。FIG. 1 is a perspective view of a cylindrical wound body of a solid electrolytic capacitor element that is spirally wound. 1 is a wound body, 2 is an anode lead, and 3 is a cathode lead. The length of the winding body 1 is 2CII+
%Sequentially on an aluminum etching foil with a width of 0.5 cm,
An alumina oxide film layer, a semiconductor layer made of a 3:1 mixture of lead dioxide and lead sulfate, and a conductive layer made of silver base are formed and are wound in a spiral shape, with openings on both the top and bottom end faces. There is a department. The anode lead 2 is caulked to aluminum etched foil, and the cathode lead 3 is connected to the conductor layer with silver paste.
第２図は第１図で示した固体電解コンデンサ素子の巻回
体１の上下の両端面の開口部を封口樹脂４（エポキシ樹
脂）で封口した斜視図である。第３図は巻回体１の両端
面の開口部をエポキシ樹脂で封口した後、この固体電解
コンデンサ素子の外面を全面的に封止樹脂５（エポキシ
樹脂）で封止した断面図である。第１図、第２図および
第３図に示した工程に従って作製した固体電解コンデン
サ（実施例）、および実施例と同一の巻回体ではあるが
、巻回体の両端面の開口部は封口にせずに直接、エポキ
シ樹脂で巻回体の外面全体を封止した固体電解コンデン
サ（比較例）を各々１０個づつ作製した。第１表は実施
例および比較例で作成した各々１０個の固体電解コンデ
ンサの平均値の初期性能および高温寿命性能をまとめで
ある。FIG. 2 is a perspective view of the solid electrolytic capacitor element shown in FIG. 1 in which the openings on both upper and lower end surfaces of the wound body 1 are sealed with a sealing resin 4 (epoxy resin). FIG. 3 is a cross-sectional view of the solid electrolytic capacitor element whose outer surface is completely sealed with sealing resin 5 (epoxy resin) after the openings on both end faces of the wound body 1 are sealed with epoxy resin. A solid electrolytic capacitor (example) manufactured according to the steps shown in FIGS. 1, 2, and 3, and the same wound body as in the example, but the openings on both end faces of the wound body are sealed. Ten solid electrolytic capacitors (comparative examples) were produced in which the entire outer surface of the wound body was directly sealed with epoxy resin without coating. Table 1 summarizes the average initial performance and high-temperature life performance of 10 solid electrolytic capacitors prepared in Examples and Comparative Examples.
第 １ 表
［発明の効果］
本発明の固体電解コンデンサの製造方法によれば、陽極
弁金属のエツチング箔上に誘電体酸化皮膜層、半導体層
、および導電体層が順次形成され渦巻状に巻回されてい
る巻回体を、巻回体の両端開口部を封口処理した後、巻
回体の外面を封止しているので高温寿命試験後の損失係
数が小さい高温寿命特性の良好な固体電解コンデンサを
作製することができる。Table 1 [Effects of the Invention] According to the method for manufacturing a solid electrolytic capacitor of the present invention, a dielectric oxide film layer, a semiconductor layer, and a conductive layer are sequentially formed on the etched foil of the anode valve metal and wound into a spiral shape. After the openings at both ends of the wound body are sealed, the outer surface of the wound body is sealed, resulting in a solid product with good high-temperature life characteristics and a small loss coefficient after high-temperature life tests. Electrolytic capacitors can be manufactured.
第１図は固体電解コンデンサ素子の巻回体の斜視図、第
２図は巻回体の両端面の開口部を封口した斜視図、第３
図は固体電解コンデンサ素子の外面を封止した断面図で
ある。
１・・・巻回体 ２・・・陽極リード３・・
・陰極リード ４・・・封口樹脂５・・・封止
樹脂Fig. 1 is a perspective view of a wound body of a solid electrolytic capacitor element, Fig. 2 is a perspective view with the openings on both end faces of the wound body sealed, and Fig. 3 is a perspective view of a wound body of a solid electrolytic capacitor element.
The figure is a cross-sectional view of a solid electrolytic capacitor element whose outer surface is sealed. 1... Winding body 2... Anode lead 3...
・Cathode lead 4... Sealing resin 5... Sealing resin
Claims (1)
膜層、半導体層、及び導電体層が形成され、渦巻状に巻
回されている巻回体の両端開口部を封口処理した後、前
記巻回体の外面を封止することを特徴とする固体電解コ
ンデンサの製造方法。A dielectric oxide film layer, a semiconductor layer, and a conductive layer are sequentially formed on the etched foil of the anode valve metal, and after sealing the openings at both ends of the spirally wound body, A method for manufacturing a solid electrolytic capacitor, characterized in that the outer surface of a wound body is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282088A JPH01124214A (en) | 1987-11-10 | 1987-11-10 | Manufacture of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282088A JPH01124214A (en) | 1987-11-10 | 1987-11-10 | Manufacture of solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01124214A true JPH01124214A (en) | 1989-05-17 |
Family
ID=17647967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62282088A Pending JPH01124214A (en) | 1987-11-10 | 1987-11-10 | Manufacture of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01124214A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6420043B1 (en) | 1996-11-07 | 2002-07-16 | Cabot Corporation | Niobium powders and niobium electrolytic capacitors |
| US6616728B2 (en) | 1998-05-04 | 2003-09-09 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62214611A (en) * | 1986-03-14 | 1987-09-21 | 日本電子興業株式会社 | Manufacture of electrolytic capacitor |
-
1987
- 1987-11-10 JP JP62282088A patent/JPH01124214A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62214611A (en) * | 1986-03-14 | 1987-09-21 | 日本電子興業株式会社 | Manufacture of electrolytic capacitor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6420043B1 (en) | 1996-11-07 | 2002-07-16 | Cabot Corporation | Niobium powders and niobium electrolytic capacitors |
| US6616728B2 (en) | 1998-05-04 | 2003-09-09 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
| US6896715B2 (en) | 1998-05-04 | 2005-05-24 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
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