JP7511728B2 - 基板処理システム、及び基板処理方法 - Google Patents
基板処理システム、及び基板処理方法 Download PDFInfo
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- JP7511728B2 JP7511728B2 JP2023131290A JP2023131290A JP7511728B2 JP 7511728 B2 JP7511728 B2 JP 7511728B2 JP 2023131290 A JP2023131290 A JP 2023131290A JP 2023131290 A JP2023131290 A JP 2023131290A JP 7511728 B2 JP7511728 B2 JP 7511728B2
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- 239000000758 substrate Substances 0.000 title claims description 295
- 238000012545 processing Methods 0.000 title claims description 207
- 238000003672 processing method Methods 0.000 title claims description 6
- 230000032258 transport Effects 0.000 claims description 242
- 239000007788 liquid Substances 0.000 claims description 145
- 238000001035 drying Methods 0.000 claims description 45
- 238000012546 transfer Methods 0.000 claims description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 239000003595 mist Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 description 43
- 230000015572 biosynthetic process Effects 0.000 description 35
- 235000012431 wafers Nutrition 0.000 description 28
- 230000007704 transition Effects 0.000 description 24
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IUQLCQSKKGSTBR-UHFFFAOYSA-N n-amino-n-butylformamide Chemical compound CCCCN(N)C=O IUQLCQSKKGSTBR-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
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- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
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Description
複数枚の基板を収容したカセットが搬入される搬入部と、
複数枚の基板を含むロットを、一括で処理するバッチ処理部と、
前記ロットの前記基板を1枚ずつ処理する枚葉処理部と、
複数枚の前記基板を収容したカセットが搬出される搬出部と、
前記バッチ処理部と前記枚葉処理部との間で前記基板を受け渡すインターフェース部と、
前記搬入部と前記バッチ処理部との間で前記基板を受け渡す第2インターフェース部と、
を有し、
前記搬入部と前記搬出部は別々に設けられ、前記搬入部と前記搬出部の間に、前記基板の搬送方向に沿って、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部と、がこの順番で並び、
前記枚葉処理部は、前記基板を1枚ずつ液体で処理する液処理装置を含む。
3 枚葉処理部
5 インターフェース部
52 搬送部
6 バッチ処理部
68 第3リンス液槽(処理槽)
811 第1保持具
814 第2保持具
W 基板
Claims (7)
- 複数枚の基板を収容したカセットが搬入される搬入部と、
複数枚の前記基板を含むロットを、一括で処理するバッチ処理部と、
前記ロットの前記基板を1枚ずつ処理する枚葉処理部と、
複数枚の前記基板を収容したカセットが搬出される搬出部と、
前記バッチ処理部と前記枚葉処理部との間で前記基板を受け渡すインターフェース部と、
前記搬入部と前記バッチ処理部との間で前記基板を受け渡す第2インターフェース部と、
を有し、
前記搬入部と前記搬出部は別々に設けられ、前記搬入部と前記搬出部の間に、前記基板の搬送方向に沿って、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部と、がこの順番で並び、
前記枚葉処理部は、前記基板を1枚ずつ液体で処理する液処理装置を含む、基板処理システム。 - 複数枚の基板を収容したカセットが搬入される搬入部と、
複数枚の前記基板を含むロットを、一括で処理するバッチ処理部と、
前記ロットの前記基板を1枚ずつ処理する枚葉処理部と、
複数枚の前記基板を収容したカセットが搬出される搬出部と、
前記バッチ処理部と前記枚葉処理部との間で前記基板を受け渡すインターフェース部と、
前記搬入部と前記バッチ処理部との間で前記基板を受け渡す第2インターフェース部と、
を有し、
前記搬入部と前記搬出部は別々に設けられ、前記搬入部と前記搬出部の間に、前記基板の搬送方向に沿って、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部と、がこの順番で並び、
前記枚葉処理部は、前記基板を1枚ずつ超臨界流体で乾燥する乾燥装置を含む、基板処理システム。 - 前記第2インターフェース部は、前記ロットを形成するロット形成部を含む、請求項1又は2に記載の基板処理システム。
- 前記インターフェース部は、前記バッチ処理部から前記枚葉処理部に前記基板を搬送する搬送部を含む、請求項1~3のいずれか1項に記載の基板処理システム。
- 前記バッチ処理部は、前記ロットが浸漬される処理液又は霧状の処理液を貯留する処理槽を有し、
前記搬送部は、前記処理液中で保持される前記基板を、前記バッチ処理部の前記処理槽から前記枚葉処理部に搬送する、請求項4に記載の基板処理システム。 - 前記処理槽は、前記ロットが浸漬される純水を貯留する、請求項5に記載の基板処理システム。
- 請求項1~6のいずれか1項に記載の基板処理システムを用い、前記搬入部と前記搬出部の間で、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部とにこの順番で前記基板を搬送する、基板処理方法。
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