JP2023155279A - 基板処理システム、及び基板処理方法 - Google Patents
基板処理システム、及び基板処理方法 Download PDFInfo
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- JP2023155279A JP2023155279A JP2023131290A JP2023131290A JP2023155279A JP 2023155279 A JP2023155279 A JP 2023155279A JP 2023131290 A JP2023131290 A JP 2023131290A JP 2023131290 A JP2023131290 A JP 2023131290A JP 2023155279 A JP2023155279 A JP 2023155279A
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- Weting (AREA)
Abstract
【解決手段】複数枚の基板を収容したカセットが搬入される搬入部と、複数枚の基板を含むロットを、一括で処理するバッチ処理部と、前記ロットの前記基板を1枚ずつ処理する枚葉処理部と、複数枚の前記基板を収容したカセットが搬出される搬出部と、前記バッチ処理部と前記枚葉処理部との間で前記基板を受け渡すインターフェース部と、前記搬入部と前記バッチ処理部との間で前記基板を受け渡す第2インターフェース部と、を有し、前記搬入部と前記搬出部は別々に設けられ、前記搬入部と前記搬出部の間に、前記基板の搬送方向に沿って、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部と、がこの順番で並ぶ。
【選択図】図10
Description
複数枚の基板を収容したカセットが搬入される搬入部と、
複数枚の基板を含むロットを、一括で処理するバッチ処理部と、
前記ロットの前記基板を1枚ずつ処理する枚葉処理部と、
複数枚の前記基板を収容したカセットが搬出される搬出部と、
前記バッチ処理部と前記枚葉処理部との間で前記基板を受け渡すインターフェース部と、
前記搬入部と前記バッチ処理部との間で前記基板を受け渡す第2インターフェース部と、
を有し、
前記搬入部と前記搬出部は別々に設けられ、前記搬入部と前記搬出部の間に、前記基板の搬送方向に沿って、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部と、がこの順番で並ぶ。
3 枚葉処理部
5 インターフェース部
52 搬送部
6 バッチ処理部
68 第3リンス液槽(処理槽)
811 第1保持具
814 第2保持具
W 基板
Claims (8)
- 複数枚の基板を収容したカセットが搬入される搬入部と、
複数枚の基板を含むロットを、一括で処理するバッチ処理部と、
前記ロットの前記基板を1枚ずつ処理する枚葉処理部と、
複数枚の前記基板を収容したカセットが搬出される搬出部と、
前記バッチ処理部と前記枚葉処理部との間で前記基板を受け渡すインターフェース部と、
前記搬入部と前記バッチ処理部との間で前記基板を受け渡す第2インターフェース部と、
を有し、
前記搬入部と前記搬出部は別々に設けられ、前記搬入部と前記搬出部の間に、前記基板の搬送方向に沿って、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部と、がこの順番で並ぶ、基板処理システム。 - 前記第2インターフェース部は、前記ロットを形成するロット形成部を含む、請求項1に記載の基板処理システム。
- 前記インターフェース部は、前記バッチ処理部から前記枚葉処理部に前記基板を搬送する搬送部を含む、請求項1又は2に記載の基板処理システム。
- 前記バッチ処理部は、前記ロットが浸漬される処理液又は霧状の処理液を貯留する処理槽を有し、
前記搬送部は、前記処理液中で保持される前記基板を、前記バッチ処理部の前記処理槽から前記枚葉処理部に搬送する、請求項3に記載の基板処理システム。 - 前記処理槽は、前記ロットが浸漬される純水を貯留する、請求項4に記載の基板処理システム。
- 前記枚葉処理部は、前記基板を1枚ずつ液体で処理する液処理装置を含む、請求項1~5のいずれか1項に記載の基板処理システム。
- 前記枚葉処理部は、前記基板を1枚ずつ超臨界流体で乾燥する乾燥装置を含む、請求項1~6のいずれか1項に記載の基板処理システム。
- 請求項1~7のいずれか1項に記載の基板処理システムを用い、前記搬入部と前記搬出部の間で、前記第2インターフェース部と、前記バッチ処理部と、前記インターフェース部と、前記枚葉処理部とにこの順番で前記基板を搬送する、基板処理方法。
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