JP7503652B2 - 半導体材料からなる基板ウェハ上にエピタキシャル層を堆積するための方法および装置 - Google Patents
半導体材料からなる基板ウェハ上にエピタキシャル層を堆積するための方法および装置 Download PDFInfo
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- JP7503652B2 JP7503652B2 JP2022565687A JP2022565687A JP7503652B2 JP 7503652 B2 JP7503652 B2 JP 7503652B2 JP 2022565687 A JP2022565687 A JP 2022565687A JP 2022565687 A JP2022565687 A JP 2022565687A JP 7503652 B2 JP7503652 B2 JP 7503652B2
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- 238000000151 deposition Methods 0.000 title claims description 49
- 239000000758 substrate Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000000463 material Substances 0.000 title claims description 6
- 230000008021 deposition Effects 0.000 claims description 42
- 238000012544 monitoring process Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 42
- 239000007789 gas Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000284 extract Substances 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000003708 edge detection Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02634—Homoepitaxy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
- C30B15/16—Heating of the melt or the crystallised materials by irradiation or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Description
エピタキシャル層を有する半導体ウェハは、そのような方法の製品であり、電子産業における特に要求の厳しい用途に必要とされる。したがって、エピタキシャル層の厚みの均一性およびエピタキシャル層中のドーパントの分布の均一性に関する、エピタキシャル層に対する要件は、特に厳しい。したがって、厳しい要件を満たすエピタキシャル層を有する半導体ウェハを高歩留まりで製造することを可能にする製造条件を作り出す強い動機がある。
図1に示す堆積装置20の反応チャンバは、上方から上部ドーム17によって、下方から下部ドーム18によって境界が定められている。支持シャフト9は、反応チャンバの中心に突出し、支持アーム10は、前記シャフトから上端で分岐している。支持アーム10は、エピタキシャル層の堆積中に基板ウェハ1が載置されるサセプタ2を支持する。図示の実施形態では、堆積装置20の装填中に基板ウェハ1を昇降シャフト11上に載置し、昇降シャフト11を下降させることによって基板ウェハ1をサセプタ上に載置することが提供される。堆積ガスは、上部ドーム17に面する基板ガラスの前面を介してガス入口からガス出口に向けられ、ガス入口およびガス出口は両方とも堆積装置の側壁に位置する。堆積装置の側壁とサセプタ2との間には予熱リング3が配置されている。加えて、サセプタの下において、反応チャンバを通って、その下向きの側と平行に向けられるパージガスのために、対応するガス入口およびガス出口を設けることができる。矢印は、ガス流の流れ方向を示す。反応チャンバは、上部ドーム17および下部ドーム18を通して放射エネルギーを照射するランプバンク19によって外部から加熱される。
1 基板ウェハ
2 サセプタ
3 予熱リング
4 配置面
5 間隙
6 画像抜粋
7 カメラシステム
8 画像処理装置
9 支持シャフト
10 支持アーム
11 昇降シャフト
12 駆動ユニット
13 アクチュエータ(x方向)
14 アクチュエータ(y方向)
15 アクチュエータ(傾斜角φ)
16 アクチュエータ(傾斜角θ)
17 上部ドーム
18 下部ドーム
19 ランプバンク
20 堆積装置
21 制御装置
22 垂直軸
23 裏面
24 基部
25 ベロー
Claims (2)
- 半導体材料の基板ウェハ(1)上にエピタキシャル層を堆積させる方法であって、
前記基板ウェハ(1)がサセプタ(2)上に載置され、前記サセプタ(2)が支持シャ
フト(9)のアームによって保持されるように、堆積装置(20)内に前記基板ウェハ(
1)および前記サセプタ(2)を配置することと、
前記サセプタ(2)の不整列が、前記サセプタを囲む予熱リング(3)の位置に対する
前記サセプタの位置に関して存在するかどうかを監視することと、
前記支持シャフト(9)の不整列が、前記予熱リング(3)の位置に対する前記支持シ
ャフト(9)の位置に関して存在するかどうかを監視することと、
前記不整列の少なくとも1つが存在する場合、前記支持シャフト(9)を変位および傾
斜させるための駆動ユニット(12)を動作させる制御装置(21)によって、450℃
以上の温度で対応の不整列を除去することと、
前記エピタキシャル層を前記基板ウェハ(1)上に堆積することとを含む、方法。 - 前記堆積装置(20)を閉じた状態で、前記不整列の少なくとも1つを補正することを
特徴とする、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20171534.9 | 2020-04-27 | ||
EP20171534.9A EP3905311A1 (de) | 2020-04-27 | 2020-04-27 | Verfahren und vorrichtung zum abscheiden einer epitaktischen schicht auf einer substratscheibe aus halbleitermaterial |
PCT/EP2021/059668 WO2021219381A1 (de) | 2020-04-27 | 2021-04-14 | Verfahren und vorrichtung zum abscheiden einer epitaktischen schicht auf einer substratscheibe aus halbleitermaterial |
Publications (2)
Publication Number | Publication Date |
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JP2023528172A JP2023528172A (ja) | 2023-07-04 |
JP7503652B2 true JP7503652B2 (ja) | 2024-06-20 |
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JP2022565687A Active JP7503652B2 (ja) | 2020-04-27 | 2021-04-14 | 半導体材料からなる基板ウェハ上にエピタキシャル層を堆積するための方法および装置 |
Country Status (8)
Country | Link |
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US (1) | US20230178398A1 (ja) |
EP (1) | EP3905311A1 (ja) |
JP (1) | JP7503652B2 (ja) |
KR (1) | KR20230005250A (ja) |
CN (1) | CN115461852A (ja) |
IL (1) | IL297558A (ja) |
TW (1) | TWI763425B (ja) |
WO (1) | WO2021219381A1 (ja) |
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EP4098782A1 (de) * | 2021-06-01 | 2022-12-07 | Siltronic AG | Verfahren zum abscheiden einer epitaktischen schicht auf einer substratscheibe aus halbleitermaterial in einer abscheidevorrichtung |
US20230143537A1 (en) * | 2021-11-11 | 2023-05-11 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor processing tool and method of operation |
KR102660602B1 (ko) * | 2024-02-08 | 2024-04-25 | (주)네오스테크놀로지스 | 다축 als의 실시간 수평보정 장치 |
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JP2003133397A (ja) | 2001-10-26 | 2003-05-09 | Komatsu Electronic Metals Co Ltd | 半導体ウェハ製造装置の回転式サセプタ支持機構 |
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DE102015223807A1 (de) | 2015-12-01 | 2017-06-01 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht in einer Abscheidekammer, Vorrichtung zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht und Halbleiterscheibe mit epitaktischer Schicht |
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2020
- 2020-04-27 EP EP20171534.9A patent/EP3905311A1/de active Pending
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JP2023528172A (ja) | 2023-07-04 |
KR20230005250A (ko) | 2023-01-09 |
IL297558A (en) | 2022-12-01 |
TWI763425B (zh) | 2022-05-01 |
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