JP2023528172A - 半導体材料からなる基板ウェハ上にエピタキシャル層を堆積するための方法および装置 - Google Patents
半導体材料からなる基板ウェハ上にエピタキシャル層を堆積するための方法および装置 Download PDFInfo
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- JP2023528172A JP2023528172A JP2022565687A JP2022565687A JP2023528172A JP 2023528172 A JP2023528172 A JP 2023528172A JP 2022565687 A JP2022565687 A JP 2022565687A JP 2022565687 A JP2022565687 A JP 2022565687A JP 2023528172 A JP2023528172 A JP 2023528172A
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- 238000000151 deposition Methods 0.000 title claims abstract description 51
- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 title claims abstract description 8
- 230000008021 deposition Effects 0.000 claims abstract description 41
- 238000012544 monitoring process Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 description 41
- 239000007789 gas Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000003708 edge detection Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000004941 influx Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02634—Homoepitaxy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
- C30B15/16—Heating of the melt or the crystallised materials by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- H01L21/02367—Substrates
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Abstract
Description
エピタキシャル層を有する半導体ウェハは、そのような方法の製品であり、電子産業における特に要求の厳しい用途に必要とされる。したがって、エピタキシャル層の厚みの均一性およびエピタキシャル層中のドーパントの分布の均一性に関する、エピタキシャル層に対する要件は、特に厳しい。したがって、厳しい要件を満たすエピタキシャル層を有する半導体ウェハを高歩留まりで製造することを可能にする製造条件を作り出す強い動機がある。
図1に示す堆積装置20の反応チャンバは、上方から上部ドーム17によって、下方から下部ドーム18によって境界が定められている。支持シャフト9は、反応チャンバの中心に突出し、支持アーム10は、前記シャフトから上端で分岐している。支持アーム10は、エピタキシャル層の堆積中に基板ウェハ1が載置されるサセプタ2を支持する。図示の実施形態では、堆積装置20の装填中に基板ウェハ1を昇降シャフト11上に載置し、昇降シャフト11を下降させることによって基板ウェハ1をサセプタ上に載置することが提供される。堆積ガスは、上部ドーム17に面する基板ガラスの前面を介してガス入口からガス出口に向けられ、ガス入口およびガス出口は両方とも堆積装置の側壁に位置する。堆積装置の側壁とサセプタ2との間には予熱リング3が配置されている。加えて、サセプタの下において、反応チャンバを通って、その下向きの側と平行に向けられるパージガスのために、対応するガス入口およびガス出口を設けることができる。矢印は、ガス流の流れ方向を示す。反応チャンバは、上部ドーム17および下部ドーム18を通して放射エネルギーを照射するランプバンク19によって外部から加熱される。
1 基板ウェハ
2 サセプタ
3 予熱リング
4 配置面
5 間隙
6 画像抜粋
7 カメラシステム
8 画像処理装置
9 支持シャフト
10 支持アーム
11 昇降シャフト
12 駆動ユニット
13 アクチュエータ(x方向)
14 アクチュエータ(y方向)
15 アクチュエータ(傾斜角φ)
16 アクチュエータ(傾斜角θ)
17 上部ドーム
18 下部ドーム
19 ランプバンク
20 堆積装置
21 制御装置
22 垂直軸
23 裏面
24 基部
25 ベロー
Claims (4)
- 半導体材料の基板ウェハ上にエピタキシャル層を堆積させる方法であって、前記基板ウェハがサセプタ上に載置され、前記サセプタが支持シャフトのアームによって保持されるように、堆積装置内に前記基板ウェハおよび前記サセプタを配置することと、前記サセプタの不整列が、前記サセプタを囲む予熱リングの位置に対する前記サセプタの位置に関して存在するかどうかを監視することと、前記支持シャフトの不整列が、前記予熱リングの位置に対する前記支持シャフトの位置に関して存在するかどうかを監視することと、前記不整列の少なくとも1つが存在する場合、対応の不整列を除去することと、前記エピタキシャル層を前記基板ウェハ上に堆積することとを含む、方法。
- 前記支持シャフトを所定の位置に移動させることによって前記支持シャフトの前記不整列を補正することを特徴とする、請求項1に記載の方法。
- 450℃以上の温度で前記支持シャフトを移動させることを特徴とする、請求項2に記載の方法。
- 半導体材料で作られた基板ウェハ上にエピタキシャル層を堆積するための装置であって、サセプタと、予熱リングと、サセプタ支持アームを有する支持シャフトと、カメラシステムとを備え、前記カメラシステムは、前記サセプタと前記予熱リングとの間の間隙の一部分の幅および前記カメラシステムから前記サセプタまでの距離を監視するためのものであり、前記装置はさらに、前記予熱リングの位置に対する前記サセプタの位置に関する前記サセプタの不整列および/または前記予熱リングの位置に対する前記支持シャフトの位置に関する前記支持シャフトの不整列の存在を判定するための画像処理装置と、前記サセプタ支持シャフトを移動および傾斜させるための駆動ユニットと、不整列の場合に信号を生成するための制御装置とを備え、前記信号は、前記駆動装置を、前記存在する不整列を補正する態様で移動させる、装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP20171534.9 | 2020-04-27 | ||
EP20171534.9A EP3905311A1 (de) | 2020-04-27 | 2020-04-27 | Verfahren und vorrichtung zum abscheiden einer epitaktischen schicht auf einer substratscheibe aus halbleitermaterial |
PCT/EP2021/059668 WO2021219381A1 (de) | 2020-04-27 | 2021-04-14 | Verfahren und vorrichtung zum abscheiden einer epitaktischen schicht auf einer substratscheibe aus halbleitermaterial |
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JP2023528172A true JP2023528172A (ja) | 2023-07-04 |
JP7503652B2 JP7503652B2 (ja) | 2024-06-20 |
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US (1) | US20230178398A1 (ja) |
EP (1) | EP3905311A1 (ja) |
JP (1) | JP7503652B2 (ja) |
KR (1) | KR20230005250A (ja) |
CN (1) | CN115461852A (ja) |
IL (1) | IL297558A (ja) |
TW (1) | TWI763425B (ja) |
WO (1) | WO2021219381A1 (ja) |
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EP4098782A1 (de) * | 2021-06-01 | 2022-12-07 | Siltronic AG | Verfahren zum abscheiden einer epitaktischen schicht auf einer substratscheibe aus halbleitermaterial in einer abscheidevorrichtung |
US20230143537A1 (en) * | 2021-11-11 | 2023-05-11 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor processing tool and method of operation |
KR102660602B1 (ko) * | 2024-02-08 | 2024-04-25 | (주)네오스테크놀로지스 | 다축 als의 실시간 수평보정 장치 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6197117B1 (en) | 1997-07-23 | 2001-03-06 | Applied Materials, Inc. | Wafer out-of-pocket detector and susceptor leveling tool |
JP2003133397A (ja) | 2001-10-26 | 2003-05-09 | Komatsu Electronic Metals Co Ltd | 半導体ウェハ製造装置の回転式サセプタ支持機構 |
CN100470767C (zh) * | 2004-03-26 | 2009-03-18 | 富士胶片株式会社 | 接合衬底的装置及方法 |
US8398777B2 (en) * | 2008-05-02 | 2013-03-19 | Applied Materials, Inc. | System and method for pedestal adjustment |
US8726837B2 (en) | 2008-06-23 | 2014-05-20 | Applied Materials, Inc. | Semiconductor process chamber vision and monitoring system |
JP5464068B2 (ja) | 2010-06-14 | 2014-04-09 | 株式会社Sumco | エピタキシャル成長装置における内部部材の位置調整方法 |
DE102011007632B3 (de) * | 2011-04-18 | 2012-02-16 | Siltronic Ag | Verfahren und Vorrichtung zum Abscheiden einer von Prozessgas stammenden Materialschicht auf einer Substratscheibe |
JP5535347B1 (ja) * | 2013-02-04 | 2014-07-02 | エピクルー株式会社 | 撮像装置、半導体製造装置および半導体製造方法 |
KR101539298B1 (ko) * | 2013-11-25 | 2015-07-29 | 주식회사 엘지실트론 | 에피택셜 웨이퍼 성장 장치 |
US10196741B2 (en) * | 2014-06-27 | 2019-02-05 | Applied Materials, Inc. | Wafer placement and gap control optimization through in situ feedback |
CN106663630B (zh) * | 2014-07-11 | 2020-09-22 | 应用材料公司 | 用于校准基座的设备及方法 |
US9959610B2 (en) | 2014-10-30 | 2018-05-01 | Applied Materials, Inc. | System and method to detect substrate and/or substrate support misalignment using imaging |
US10458020B2 (en) * | 2015-04-14 | 2019-10-29 | Ebara Corporation | Substrate processing apparatus and substrate processing method |
KR20180006496A (ko) | 2015-06-05 | 2018-01-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 서셉터 포지션 및 회전 장치, 및 사용 방법들 |
JP6432742B2 (ja) | 2015-09-30 | 2018-12-05 | 信越半導体株式会社 | エピタキシャル成長装置及びエピタキシャルウェーハの製造方法 |
DE102015223807A1 (de) | 2015-12-01 | 2017-06-01 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht in einer Abscheidekammer, Vorrichtung zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht und Halbleiterscheibe mit epitaktischer Schicht |
KR101868907B1 (ko) * | 2017-03-15 | 2018-07-20 | (주)에스에스피 | 경사 및 높이 조절이 가능한 웨이퍼 스테이지 장치 |
KR102546322B1 (ko) * | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
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KR20230005250A (ko) | 2023-01-09 |
IL297558A (en) | 2022-12-01 |
TWI763425B (zh) | 2022-05-01 |
EP3905311A1 (de) | 2021-11-03 |
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