JP7495465B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP7495465B2 JP7495465B2 JP2022168252A JP2022168252A JP7495465B2 JP 7495465 B2 JP7495465 B2 JP 7495465B2 JP 2022168252 A JP2022168252 A JP 2022168252A JP 2022168252 A JP2022168252 A JP 2022168252A JP 7495465 B2 JP7495465 B2 JP 7495465B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- electronic device
- heat sink
- graphite sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 72
- 229910002804 graphite Inorganic materials 0.000 claims description 71
- 239000010439 graphite Substances 0.000 claims description 71
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000012530 fluid Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1681—Details related solely to hinges
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1683—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for the transmission of signal or power between the different housings, e.g. details of wired or wireless communication, passage of cabling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Mathematical Physics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
12A 第1筐体
12B 第2筐体
14 ヒンジ装置
17A,17B フレーム部材
18A,18B カバー部材
20 マザーボード
20a CPU(電気部品)
26,32 バッテリ装置
26a,26b,26c セル
26da 電極部
26e 溝部
28 ステー
30 サーマルモジュール
38,40,42 フレキシブル基板
49 背表紙部品
50A 連結縁部(縁部)
50Aa 背面形成部
50Ab 中段部
50Ac 低段部
56 ベーパーチャンバ(放熱体)
58 グラファイトシート(熱伝導シート)
60,62 ヒートパイプ
64 隙間
86,88,90 グラファイトシート
86a 折返し部
86b 一端部
Claims (9)
- 電子機器であって、
筐体内に設けられた発熱する電気部品と、
前記筐体内に設けられて前記電気部品の平面視全面に熱接続され、平面視で前記電気部品より面積が大きい板状の放熱体と、
互いに離間した位置で前記放熱体から突出して延在する複数のヒートパイプと、
を有する
ことを特徴とする電子機器。 - 請求項1に記載の電子機器において、
複数の前記ヒートパイプのうち少なくとも2つは前記放熱体から同方向に突出して、前記放熱体より薄い共通の熱伝導シートにそれぞれ接続されている
ことを特徴とする電子機器。 - 請求項1に記載の電子機器において、
前記筐体の縁部は熱伝導材料で構成され、
複数の前記ヒートパイプのうち1つは前記筐体の前記縁部および前記放熱体の縁に沿って設けられており、両者を熱接続している
ことを特徴とする電子機器。 - 請求項1に記載の電子機器において、
前記筐体内には複数のセルからなるバッテリが設けられており、
複数の前記ヒートパイプのうち1つは複数の前記セルの間に形成された溝部に延在している
ことを特徴とする電子機器。 - 請求項4に記載の電子機器において、
複数の前記ヒートパイプは前記放熱体より薄い熱伝導シートが熱接続されており、
前記熱伝導シートと前記放熱体とは、前記バッテリの電極部を露呈させるように隙間が設けられている
ことを特徴とする電子機器。 - 請求項1に記載の電子機器において、
複数の前記ヒートパイプは前記放熱体より薄い熱伝導シートが熱接続されており、
前記熱伝導シートと前記放熱体との間には、ステーを露呈させるように隙間が設けられており、
前記ステーには前記筐体を覆うカバー部材が固定される
ことを特徴とする電子機器。 - 請求項1に記載の電子機器において、
複数の前記ヒートパイプは、平面視で前記電気部品と重ならないように配置されている
ことを特徴とする電子機器。 - 請求項2または5に記載の電子機器において、
前記熱伝導シートは、グラファイトシート又は金属シートである
ことを特徴とする電子機器。 - 電子機器であって、
筐体内に設けられた発熱する電気部品と、
前記筐体内に設けられて前記電気部品の平面視全面に熱接続され、平面視で前記電気部品より面積が大きい板状の放熱体と、
前記放熱体の縁に沿って設けられた直線状のヒートパイプと、
を有し、
前記筐体の縁部は熱伝導材料で構成され、
前記ヒートパイプは前記筐体の前記縁部と前記放熱体の縁と熱接続している
ことを特徴とする電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022168252A JP7495465B2 (ja) | 2022-10-20 | 2022-10-20 | 電子機器 |
US18/459,361 US20240237292A9 (en) | 2022-10-20 | 2023-08-31 | Electronic apparatus |
CN202311356838.XA CN117917617A (zh) | 2022-10-20 | 2023-10-19 | 电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022168252A JP7495465B2 (ja) | 2022-10-20 | 2022-10-20 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2024060763A JP2024060763A (ja) | 2024-05-07 |
JP7495465B2 true JP7495465B2 (ja) | 2024-06-04 |
Family
ID=90730040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022168252A Active JP7495465B2 (ja) | 2022-10-20 | 2022-10-20 | 電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20240237292A9 (ja) |
JP (1) | JP7495465B2 (ja) |
CN (1) | CN117917617A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014139501A (ja) | 2012-12-21 | 2014-07-31 | Toshiba Home Technology Corp | ヒートパイプ、スマートフォン、タブレット端末または携帯情報端末 |
JP2014216610A (ja) | 2013-04-30 | 2014-11-17 | Necカシオモバイルコミュニケーションズ株式会社 | 放熱構造体及び電子機器 |
JP2015095629A (ja) | 2013-11-14 | 2015-05-18 | 株式会社フジクラ | 携帯型電子機器の冷却構造 |
-
2022
- 2022-10-20 JP JP2022168252A patent/JP7495465B2/ja active Active
-
2023
- 2023-08-31 US US18/459,361 patent/US20240237292A9/en active Pending
- 2023-10-19 CN CN202311356838.XA patent/CN117917617A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014139501A (ja) | 2012-12-21 | 2014-07-31 | Toshiba Home Technology Corp | ヒートパイプ、スマートフォン、タブレット端末または携帯情報端末 |
JP2014216610A (ja) | 2013-04-30 | 2014-11-17 | Necカシオモバイルコミュニケーションズ株式会社 | 放熱構造体及び電子機器 |
JP2015095629A (ja) | 2013-11-14 | 2015-05-18 | 株式会社フジクラ | 携帯型電子機器の冷却構造 |
Also Published As
Publication number | Publication date |
---|---|
CN117917617A (zh) | 2024-04-23 |
US20240237292A9 (en) | 2024-07-11 |
US20240138116A1 (en) | 2024-04-25 |
JP2024060763A (ja) | 2024-05-07 |
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