JP7493465B2 - 加工装置及び被加工物の搬出方法 - Google Patents
加工装置及び被加工物の搬出方法 Download PDFInfo
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- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Feeding Of Workpieces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明の実施形態に係る加工装置1及び被加工物の搬出方法を図面に基づいて説明する。図1は、実施形態に係る加工装置1の構成例を示す斜視図である。図2は、図1の加工装置1の要部を示す断面図である。図3は、図1の加工装置1の要部を示す斜視図である。実施形態に係る加工装置1は、図1に示すように、保持テーブル10と、加工ユニット20と、液体供給ノズル30と、第1搬出ユニット40と、第2搬出ユニット50と、制御ユニット60と、表示ユニット70と、洗浄ユニット80と、カセット載置台90と、を有する。
10 保持テーブル
11 ポーラス板
12 枠体
13 保持面
13-1 中央領域(吸引エリア)
13-2 外周領域(吸引エリアの外周部分)
14 凹部
14-1 底面
14-2 内側面
15-1 中央部分
15-2 外周部分
16 吸引ライン
17 吸引源
18 エア供給ライン
19 エア供給源
20 加工ユニット
30 液体供給ノズル
35 加工用の液体(水)
40 第1搬出ユニット
50 第2搬出ユニット
60 制御ユニット
100 被加工物
Claims (2)
- 被加工物を保持する保持面を有する保持テーブルと、
該保持テーブルに保持された被加工物を加工する加工ユニットと、
該加工ユニットで加工される加工点に加工用の液体を供給する液体供給ノズルと、
該保持テーブルから被加工物を搬出する搬出ユニットと、
制御ユニットと、を有する加工装置であって、
該保持テーブルは、
被加工物を吸引保持する中央領域を有するポーラス板と、
該ポーラス板を収容する凹部を有する枠体と、
該枠体の底面に形成され該中央領域と吸引源とを連通させる吸引ラインと、
該中央領域を囲繞する外周領域からエアを噴出させる、エア供給源と連通されたエア供給ラインと、を備え、
該制御ユニットは、該吸引ラインによって該ポーラス板と該吸引源とを連通させ該中央領域で被加工物を吸引し、該ポーラス板と被加工物との間の水を除去しつつ、該エア供給ラインにエアを供給し、該外周領域からエアを噴出させて被加工物の外周部を該保持面から浮上させ、該ポーラス板と被加工物との間の水の表面張力を解除した状態で、該搬出ユニットによって被加工物を該保持テーブルから搬出することを特徴とする加工装置。 - 被加工物を保持する保持面を有する保持テーブルと、該保持テーブルに保持された被加工物を加工する加工ユニットと、該加工ユニットで加工される加工点に加工用の液体を供給する液体供給ノズルと、該保持テーブルから被加工物を搬出する搬出ユニットと、を有する加工装置において、被加工物を該搬出ユニットによって該保持テーブルから搬出する搬出方法であって、
該保持テーブルは、
被加工物を吸引保持する中央領域を有するポーラス板と、
該ポーラス板を収容する凹部を有する枠体と、
該枠体の底面に形成され該中央領域と吸引源とを連通させる吸引ラインと、
該中央領域を囲繞する外周領域からエアを噴出させる、エア供給源と連通されたエア供給ラインと、を備え、
該吸引ラインによって該ポーラス板と該吸引源とを連通させ該中央領域で被加工物を吸引し、該ポーラス板と被加工物との間の水を除去しつつ、該エア供給ラインにエアを供給し該外周領域からエアを噴出させて被加工物の外周部のみを該保持面から浮上させ、該ポーラス板と被加工物との間の水の表面張力を解除する外周浮上ステップと、
該搬出ユニットによって被加工物を保持する被加工物保持ステップと、
該被加工物保持ステップ及び該外周浮上ステップの後、該中央領域における被加工物の吸引を遮断して該保持テーブルから被加工物全体を離反させて該保持テーブルから被加工物を搬出する搬出ステップと、
を備える被加工物の搬出方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2021001746A JP7493465B2 (ja) | 2021-01-07 | 2021-01-07 | 加工装置及び被加工物の搬出方法 |
KR1020210181561A KR20220099897A (ko) | 2021-01-07 | 2021-12-17 | 가공 장치 및 피가공물의 반출 방법 |
CN202111630473.6A CN114743909A (zh) | 2021-01-07 | 2021-12-28 | 加工装置和被加工物的搬出方法 |
TW110149694A TW202228195A (zh) | 2021-01-07 | 2021-12-30 | 加工裝置及被加工物之搬出方法 |
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JP2021001746A JP7493465B2 (ja) | 2021-01-07 | 2021-01-07 | 加工装置及び被加工物の搬出方法 |
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JP2022106618A JP2022106618A (ja) | 2022-07-20 |
JP7493465B2 true JP7493465B2 (ja) | 2024-05-31 |
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JP2021001746A Active JP7493465B2 (ja) | 2021-01-07 | 2021-01-07 | 加工装置及び被加工物の搬出方法 |
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JP (1) | JP7493465B2 (ja) |
KR (1) | KR20220099897A (ja) |
CN (1) | CN114743909A (ja) |
TW (1) | TW202228195A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6113698A (en) | 1997-07-10 | 2000-09-05 | Applied Materials, Inc. | Degassing method and apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5638828A (en) | 1979-09-07 | 1981-04-14 | Sony Corp | Manufacture of semiconductor device |
JP2016127195A (ja) | 2015-01-07 | 2016-07-11 | 株式会社ディスコ | ウエーハの研削方法 |
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2021
- 2021-01-07 JP JP2021001746A patent/JP7493465B2/ja active Active
- 2021-12-17 KR KR1020210181561A patent/KR20220099897A/ko unknown
- 2021-12-28 CN CN202111630473.6A patent/CN114743909A/zh active Pending
- 2021-12-30 TW TW110149694A patent/TW202228195A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6113698A (en) | 1997-07-10 | 2000-09-05 | Applied Materials, Inc. | Degassing method and apparatus |
Also Published As
Publication number | Publication date |
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CN114743909A (zh) | 2022-07-12 |
KR20220099897A (ko) | 2022-07-14 |
TW202228195A (zh) | 2022-07-16 |
JP2022106618A (ja) | 2022-07-20 |
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