JP7464467B2 - ウェーハ洗浄装置 - Google Patents
ウェーハ洗浄装置 Download PDFInfo
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- JP7464467B2 JP7464467B2 JP2020113983A JP2020113983A JP7464467B2 JP 7464467 B2 JP7464467 B2 JP 7464467B2 JP 2020113983 A JP2020113983 A JP 2020113983A JP 2020113983 A JP2020113983 A JP 2020113983A JP 7464467 B2 JP7464467 B2 JP 7464467B2
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- JP
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- Prior art keywords
- wafer
- nozzle
- outer periphery
- cleaning
- holding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims description 70
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 48
- 239000007921 spray Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 101
- 238000005507 spraying Methods 0.000 description 10
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000010981 drying operation Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/02087—Cleaning of wafer edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
なお、第1ノズル21、第2ノズル24および第3ノズル27は、それぞれのエア源22,25および28からのエアのみを噴射すること、および、それぞれの水源23,26および29からの水のみを噴射することも可能なように構成されている。
初めに、洗浄動作が実施される。
この動作では、まず、保持テーブル10の保持面11によって、ウェーハ100が保持される。
第1ノズル21、第2ノズル24および第3ノズル27は、供給された水とエアとを混合することにより二流体洗浄水からなる高圧水を生成し、それぞれに設定された上述した噴射方向で、ウェーハ100の外周縁101に対する高圧水の噴射を開始する。
この洗浄動作により、ウェーハ100の外周縁101に付着した樹脂等の汚れが除去される。
次に、乾燥動作が実施される。乾燥動作では、まず、回転制御部17が、モータ15を制御して、保持面11によってウェーハ100を保持している保持テーブル10を、1000rpm以上(たとえば、2000rpm)の回転速度で、たとえば、20秒間にわたって回転させる。この際、最初の15秒間は、洗浄手段20からのエア等の噴射はなされず、ウェーハ100を保持している保持テーブル10の回転によって、ウェーハ100に付着している水が飛ばされる。
なお、洗浄動作で保持テーブル10の回転を停止させないで、洗浄動作ののち直ちに乾燥動作の回転速度に切り換えてもよい。
このように、エアノズル40は、ウェーハ100の回転中心にエアを吹き付けているため乾燥時間を短縮することができる。
また、保持テーブル10の外周にエアを噴射させウェーハ100の下面を乾燥させてもよい。
10:保持テーブル、11:保持面、12:中心点、
13:スピンドル、15:モータ、17:回転制御部、
20:洗浄手段、
21:第1ノズル、22:エア源、23:水源、
24:第2ノズル、25:エア源、26:水源、
27:第3ノズル、28:エア源、29:水源、
30:洗浄制御部、
40:エアノズル、
100:ウェーハ、101:外周縁
Claims (3)
- ウェーハの外周縁を洗浄するウェーハ洗浄装置であって、
保持面によって、ウェーハの外周縁がはみ出るようにウェーハを保持する保持テーブルと、
該保持面の中心を軸に該保持テーブルを回転させるモータと、
該モータの回転速度を制御する回転制御部と、
該保持面に保持されたウェーハの外周縁よりも外側から、ウェーハの外周縁に向かって高圧水を噴射して、ウェーハの外周縁を洗浄する洗浄手段と、を備え、
該洗浄手段は、
該ウェーハの外周縁よりも外側から、該保持面に平行な0度方向で、該ウェーハの外周縁に高圧水を噴射する第1ノズルと、
該ウェーハの外周縁よりも外側上方から、該保持面に対して45度下向きとなる方向で、該ウェーハの外周縁に高圧水を噴射する第2ノズルと、
該ウェーハの外周縁よりも外側下方から、該保持面に対して45度上向きとなる方向で、該ウェーハの外周縁に高圧水を噴射する第3ノズルと、を備え、
該第1ノズルと該第2ノズルと該第3ノズルとが、ウェーハの周方向において互いに離間するように配置されている、
ウェーハ洗浄装置。 - 該洗浄手段は、水とエアとを混合することによって、エアの圧力を利用した高圧水を噴射する、
請求項1記載のウェーハ洗浄装置。 - 該回転制御部は、該保持テーブルを10rpm以下の回転速度で回転させてウェーハの外周を洗浄した後、該保持テーブルを1000rpm以上の回転速度で回転させてウェーハを乾燥させるように構成されている、
請求項1記載のウェーハ洗浄装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020113983A JP7464467B2 (ja) | 2020-07-01 | 2020-07-01 | ウェーハ洗浄装置 |
US17/339,354 US11881418B2 (en) | 2020-07-01 | 2021-06-04 | Wafer cleaning apparatus |
TW110121708A TW202202676A (zh) | 2020-07-01 | 2021-06-15 | 晶圓洗淨裝置 |
KR1020210080875A KR20220003453A (ko) | 2020-07-01 | 2021-06-22 | 웨이퍼 세정 장치 |
DE102021206551.1A DE102021206551A1 (de) | 2020-07-01 | 2021-06-24 | Wafer-reinigungsvorrichtung |
CN202110718701.9A CN113889425A (zh) | 2020-07-01 | 2021-06-28 | 晶片清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020113983A JP7464467B2 (ja) | 2020-07-01 | 2020-07-01 | ウェーハ洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022012270A JP2022012270A (ja) | 2022-01-17 |
JP7464467B2 true JP7464467B2 (ja) | 2024-04-09 |
Family
ID=79010574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020113983A Active JP7464467B2 (ja) | 2020-07-01 | 2020-07-01 | ウェーハ洗浄装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11881418B2 (ja) |
JP (1) | JP7464467B2 (ja) |
KR (1) | KR20220003453A (ja) |
CN (1) | CN113889425A (ja) |
DE (1) | DE102021206551A1 (ja) |
TW (1) | TW202202676A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115889293B (zh) * | 2022-11-08 | 2024-04-16 | 西安奕斯伟材料科技股份有限公司 | 清洗硅片的周缘的装置、方法及清洗硅片的设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194034A (ja) | 2008-02-12 | 2009-08-27 | Tokyo Electron Ltd | 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 |
JP2019145734A (ja) | 2018-02-23 | 2019-08-29 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄方法 |
Family Cites Families (14)
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JP3300624B2 (ja) * | 1997-01-24 | 2002-07-08 | 東京エレクトロン株式会社 | 基板端面の洗浄方法 |
EP1091388A3 (en) * | 1999-10-06 | 2005-09-21 | Ebara Corporation | Method and apparatus for cleaning a substrate |
US6558053B2 (en) * | 2001-04-19 | 2003-05-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
KR100445259B1 (ko) * | 2001-11-27 | 2004-08-21 | 삼성전자주식회사 | 세정방법 및 이를 수행하기 위한 세정 장치 |
US10403517B2 (en) * | 2015-02-18 | 2019-09-03 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
JP6602702B2 (ja) | 2016-03-15 | 2019-11-06 | 株式会社ディスコ | 保護部材形成装置 |
JP6875104B2 (ja) * | 2016-11-15 | 2021-05-19 | 株式会社Screenホールディングス | 塗布方法 |
JP6814620B2 (ja) | 2016-12-08 | 2021-01-20 | 株式会社ディスコ | 剥離装置 |
JP2018125499A (ja) * | 2017-02-03 | 2018-08-09 | 東芝メモリ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6920849B2 (ja) * | 2017-03-27 | 2021-08-18 | 株式会社荏原製作所 | 基板処理方法および装置 |
JP6908474B2 (ja) | 2017-09-06 | 2021-07-28 | 株式会社ディスコ | ウエーハ洗浄装置 |
US11342202B2 (en) * | 2018-08-17 | 2022-05-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated wafer cleaning |
KR102311324B1 (ko) * | 2019-08-27 | 2021-10-12 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP7341825B2 (ja) * | 2019-09-27 | 2023-09-11 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
-
2020
- 2020-07-01 JP JP2020113983A patent/JP7464467B2/ja active Active
-
2021
- 2021-06-04 US US17/339,354 patent/US11881418B2/en active Active
- 2021-06-15 TW TW110121708A patent/TW202202676A/zh unknown
- 2021-06-22 KR KR1020210080875A patent/KR20220003453A/ko active Search and Examination
- 2021-06-24 DE DE102021206551.1A patent/DE102021206551A1/de active Pending
- 2021-06-28 CN CN202110718701.9A patent/CN113889425A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194034A (ja) | 2008-02-12 | 2009-08-27 | Tokyo Electron Ltd | 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 |
JP2019145734A (ja) | 2018-02-23 | 2019-08-29 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113889425A (zh) | 2022-01-04 |
US20220005710A1 (en) | 2022-01-06 |
JP2022012270A (ja) | 2022-01-17 |
TW202202676A (zh) | 2022-01-16 |
DE102021206551A1 (de) | 2022-01-05 |
KR20220003453A (ko) | 2022-01-10 |
US11881418B2 (en) | 2024-01-23 |
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