JP7446887B2 - フィルム状接着剤 - Google Patents

フィルム状接着剤 Download PDF

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Publication number
JP7446887B2
JP7446887B2 JP2020060371A JP2020060371A JP7446887B2 JP 7446887 B2 JP7446887 B2 JP 7446887B2 JP 2020060371 A JP2020060371 A JP 2020060371A JP 2020060371 A JP2020060371 A JP 2020060371A JP 7446887 B2 JP7446887 B2 JP 7446887B2
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JP
Japan
Prior art keywords
adhesive
film
film adhesive
base material
composite sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020060371A
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English (en)
Japanese (ja)
Other versions
JP2021155680A (ja
Inventor
佑耶 田中
渉 岩屋
啓示 布施
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2020060371A priority Critical patent/JP7446887B2/ja
Priority to KR1020210039304A priority patent/KR20210122149A/ko
Priority to TW110110958A priority patent/TW202142647A/zh
Priority to CN202110327450.1A priority patent/CN113462334A/zh
Publication of JP2021155680A publication Critical patent/JP2021155680A/ja
Application granted granted Critical
Publication of JP7446887B2 publication Critical patent/JP7446887B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2020060371A 2020-03-30 2020-03-30 フィルム状接着剤 Active JP7446887B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020060371A JP7446887B2 (ja) 2020-03-30 2020-03-30 フィルム状接着剤
KR1020210039304A KR20210122149A (ko) 2020-03-30 2021-03-26 필름형 접착제
TW110110958A TW202142647A (zh) 2020-03-30 2021-03-26 膜狀接著劑以及膜狀接著劑複合片
CN202110327450.1A CN113462334A (zh) 2020-03-30 2021-03-26 膜状粘合剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020060371A JP7446887B2 (ja) 2020-03-30 2020-03-30 フィルム状接着剤

Publications (2)

Publication Number Publication Date
JP2021155680A JP2021155680A (ja) 2021-10-07
JP7446887B2 true JP7446887B2 (ja) 2024-03-11

Family

ID=77868338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020060371A Active JP7446887B2 (ja) 2020-03-30 2020-03-30 フィルム状接着剤

Country Status (4)

Country Link
JP (1) JP7446887B2 (ko)
KR (1) KR20210122149A (ko)
CN (1) CN113462334A (ko)
TW (1) TW202142647A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102666524B1 (ko) * 2023-05-19 2024-05-20 에이엠씨주식회사 신규한 웨이퍼 백그라인딩 테이프

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208564A (ja) 1999-01-11 2000-07-28 Ube Ind Ltd Ｌｏｃ用テ―プ
JP2002129126A (ja) 2000-10-23 2002-05-09 Tomoegawa Paper Co Ltd 半導体装置用接着剤組成物および接着シート
JP2003321655A (ja) 2002-04-26 2003-11-14 Saehan Micronics Inc 複合フィルム及びそれを付着したリードフレーム
JP2004035650A (ja) 2002-07-01 2004-02-05 Gun Ei Chem Ind Co Ltd ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
US20090110940A1 (en) 2007-10-08 2009-04-30 Yong Woo Hong Adhesive film composition, associated dicing die bonding film, die package, and associated methods
JP2011046963A (ja) 2003-06-06 2011-03-10 Hitachi Chem Co Ltd 接着シート
WO2012056511A1 (ja) 2010-10-25 2012-05-03 古河電気工業株式会社 接着フィルム及びウエハ加工用テープ
JP2012188673A (ja) 2007-04-06 2012-10-04 Hitachi Chemical Co Ltd 半導体用接着フィルム、複合シート及びこれらを用いた半導体チップの製造方法
JP2012222002A (ja) 2011-04-04 2012-11-12 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP2012219247A (ja) 2011-04-13 2012-11-12 Nitto Denko Corp 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
WO2016024569A1 (ja) 2014-08-15 2016-02-18 ユニチカ株式会社 樹脂組成物およびそれを用いた積層体
WO2016067925A1 (ja) 2014-10-28 2016-05-06 東洋紡株式会社 ポリカーボネートイミド系樹脂ペーストおよび該ペーストを硬化して得られるソルダーレジスト層、表面保護層、層間絶縁層または接着層を有する電子部品
JP6074698B1 (ja) 2015-07-31 2017-02-08 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP2017066233A (ja) 2015-09-29 2017-04-06 株式会社巴川製紙所 電子部品用接着テープ
WO2017168830A1 (ja) 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
WO2018180594A1 (ja) 2017-03-28 2018-10-04 リンテック株式会社 フィルム状接着剤複合シート及び半導体装置の製造方法
JP2019104862A (ja) 2017-12-14 2019-06-27 日東電工株式会社 接着フィルムおよびダイシングテープ付き接着フィルム
JP2019119841A (ja) 2018-01-11 2019-07-22 ユニチカ株式会社 積層体
WO2019182009A1 (ja) 2018-03-23 2019-09-26 リンテック株式会社 ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04325590A (ja) * 1991-04-25 1992-11-13 Nitto Denko Corp エポキシ樹脂系接着剤組成物
KR101176431B1 (ko) 2007-10-09 2012-08-30 히다치 가세고교 가부시끼가이샤 접착 필름이 부착된 반도체칩의 제조 방법, 이 제조 방법에 사용되는 반도체용 접착 필름, 및 반도체 장치의 제조 방법
JP2010245191A (ja) * 2009-04-02 2010-10-28 Hitachi Chem Co Ltd フィルム状接着剤
JP6678641B2 (ja) * 2015-03-04 2020-04-08 リンテック株式会社 フィルム状接着剤複合シート及び半導体装置の製造方法
JP6803673B2 (ja) * 2016-03-23 2020-12-23 日東電工株式会社 粘着シート

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208564A (ja) 1999-01-11 2000-07-28 Ube Ind Ltd Ｌｏｃ用テ―プ
JP2002129126A (ja) 2000-10-23 2002-05-09 Tomoegawa Paper Co Ltd 半導体装置用接着剤組成物および接着シート
JP2003321655A (ja) 2002-04-26 2003-11-14 Saehan Micronics Inc 複合フィルム及びそれを付着したリードフレーム
JP2004035650A (ja) 2002-07-01 2004-02-05 Gun Ei Chem Ind Co Ltd ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
JP2011046963A (ja) 2003-06-06 2011-03-10 Hitachi Chem Co Ltd 接着シート
JP2012188673A (ja) 2007-04-06 2012-10-04 Hitachi Chemical Co Ltd 半導体用接着フィルム、複合シート及びこれらを用いた半導体チップの製造方法
US20090110940A1 (en) 2007-10-08 2009-04-30 Yong Woo Hong Adhesive film composition, associated dicing die bonding film, die package, and associated methods
WO2012056511A1 (ja) 2010-10-25 2012-05-03 古河電気工業株式会社 接着フィルム及びウエハ加工用テープ
JP2012222002A (ja) 2011-04-04 2012-11-12 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP2012219247A (ja) 2011-04-13 2012-11-12 Nitto Denko Corp 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
WO2016024569A1 (ja) 2014-08-15 2016-02-18 ユニチカ株式会社 樹脂組成物およびそれを用いた積層体
WO2016067925A1 (ja) 2014-10-28 2016-05-06 東洋紡株式会社 ポリカーボネートイミド系樹脂ペーストおよび該ペーストを硬化して得られるソルダーレジスト層、表面保護層、層間絶縁層または接着層を有する電子部品
JP6074698B1 (ja) 2015-07-31 2017-02-08 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP2017066233A (ja) 2015-09-29 2017-04-06 株式会社巴川製紙所 電子部品用接着テープ
WO2017168830A1 (ja) 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
WO2018180594A1 (ja) 2017-03-28 2018-10-04 リンテック株式会社 フィルム状接着剤複合シート及び半導体装置の製造方法
JP2019104862A (ja) 2017-12-14 2019-06-27 日東電工株式会社 接着フィルムおよびダイシングテープ付き接着フィルム
JP2019119841A (ja) 2018-01-11 2019-07-22 ユニチカ株式会社 積層体
WO2019182009A1 (ja) 2018-03-23 2019-09-26 リンテック株式会社 ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法

Also Published As

Publication number Publication date
JP2021155680A (ja) 2021-10-07
TW202142647A (zh) 2021-11-16
KR20210122149A (ko) 2021-10-08
CN113462334A (zh) 2021-10-01

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