JP7422383B2 - 基板支持装置及び基板洗浄装置 - Google Patents
基板支持装置及び基板洗浄装置 Download PDFInfo
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- JP7422383B2 JP7422383B2 JP2019089278A JP2019089278A JP7422383B2 JP 7422383 B2 JP7422383 B2 JP 7422383B2 JP 2019089278 A JP2019089278 A JP 2019089278A JP 2019089278 A JP2019089278 A JP 2019089278A JP 7422383 B2 JP7422383 B2 JP 7422383B2
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- 239000000758 substrate Substances 0.000 title claims description 378
- 238000004140 cleaning Methods 0.000 title claims description 121
- 230000002093 peripheral effect Effects 0.000 claims description 85
- 239000007788 liquid Substances 0.000 claims description 70
- 238000001179 sorption measurement Methods 0.000 claims description 20
- 230000000630 rising effect Effects 0.000 description 14
- 230000007723 transport mechanism Effects 0.000 description 12
- 238000004891 communication Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 5
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- 230000004048 modification Effects 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Claims (9)
- 矩形状の基板を支持する支持面を有し、鉛直軸周りに回転する基板支持部と、
前記支持面の内周部に設けられ、基板を吸着する第1吸着部と、
前記支持面の外周部に設けられ、基板を吸着する第2吸着部と、
前記第1吸着部で基板を吸着するための負圧を付与する第1負圧流路部と、
前記第1負圧流路部とは独立して設けられ、前記第2吸着部で基板を吸着するための負圧を付与する第2負圧流路部と、
前記基板支持部の径方向の外側に設けられ、前記基板支持部から外側にはみ出した基板の角部をそれぞれ支持する4つの基板外周支持部と、を備える基板支持装置。 - 前記基板支持部は、円盤状である、請求項1に記載の基板支持装置。
- 前記第1吸着部は、平面視で円形状又は略円形状であり、
前記第2吸着部は、平面視で環状である、請求項1又は請求項2に記載の基板支持装置。 - 前記第1吸着部と前記第2吸着部とは、前記基板支持部の径方向に間隔をあけて配置されている、請求項1から請求項3のいずれか一項に記載の基板支持装置。
- 前記第1吸着部は、前記第2吸着部より基板の吸着力が高く設定されている、請求項1から請求項4のいずれか一項に記載の基板支持装置。
- 前記第1吸着部及び前記第2吸着部は、それぞれ前記支持面に沿った吸着溝を有し、
前記第1吸着部の前記吸着溝は、前記第2吸着部の前記吸着溝よりも、平面視における総面積が大きい、請求項5に記載の基板支持装置。 - 前記基板外周支持部は、
基端が前記基板支持部に固定されかつ先端部が前記基板支持部から径方向の外側に延びるアームと、
前記アームの上面に設けられて基板の外周部を支持する支持パッドと、を備える、請求項1から請求項6のいずれか一項に記載の基板支持装置。 - 前記基板支持部は、鉛直軸周りに一体で回転する支持軸を有し、
前記第1負圧流路部及び前記第2負圧流路部の一部は、それぞれ前記支持軸内に設けられている、請求項1から請求項7のいずれか一項に記載の基板支持装置。 - 請求項1から請求項8のいずれか一項に記載の基板支持装置と、
前記基板支持装置の前記基板支持部に保持された基板に洗浄液を供給する洗浄液供給部と、を備える基板洗浄装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019089278A JP7422383B2 (ja) | 2019-05-09 | 2019-05-09 | 基板支持装置及び基板洗浄装置 |
TW109106919A TWI839478B (zh) | 2019-05-09 | 2020-03-03 | 基板支持裝置及基板洗淨裝置 |
KR1020200036290A KR20200130095A (ko) | 2019-05-09 | 2020-03-25 | 기판 지지 장치 및 기판 세정 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019089278A JP7422383B2 (ja) | 2019-05-09 | 2019-05-09 | 基板支持装置及び基板洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020188035A JP2020188035A (ja) | 2020-11-19 |
JP7422383B2 true JP7422383B2 (ja) | 2024-01-26 |
Family
ID=73223112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019089278A Active JP7422383B2 (ja) | 2019-05-09 | 2019-05-09 | 基板支持装置及び基板洗浄装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7422383B2 (ja) |
KR (1) | KR20200130095A (ja) |
TW (1) | TWI839478B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230013541A (ko) * | 2021-07-19 | 2023-01-26 | 세메스 주식회사 | 지지 유닛 및 이를 포함하는 기판 처리 장치 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000035681A (ja) | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 現像装置及び現像方法 |
JP2001024051A (ja) | 1999-07-09 | 2001-01-26 | Tokyo Seimitsu Co Ltd | ウェーハ吸着パッド |
JP2002204999A (ja) | 2001-01-05 | 2002-07-23 | Shibaura Mechatronics Corp | スピン処理装置 |
JP2003001182A (ja) | 2001-04-17 | 2003-01-07 | Tokyo Electron Ltd | 塗布膜形成装置およびスピンチャック |
JP2004146587A (ja) | 2002-10-24 | 2004-05-20 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
JP2005116842A (ja) | 2003-10-09 | 2005-04-28 | Shinko Electric Ind Co Ltd | ウェーハ吸着ステージ及びウェーハの吸着方法 |
JP2008251754A (ja) | 2007-03-29 | 2008-10-16 | Nikon Corp | 基板搬送方法及び装置、並びに露光方法及び装置 |
JP2011082457A (ja) | 2009-10-09 | 2011-04-21 | Showa Denko Kk | 基板の処理方法及び基板保持装置 |
JP2013214676A (ja) | 2012-04-04 | 2013-10-17 | Tokyo Electron Ltd | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP2016092239A (ja) | 2014-11-05 | 2016-05-23 | 株式会社東芝 | 保持装置及び処理装置 |
US20190371646A1 (en) | 2018-05-30 | 2019-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer chuck |
JP2020188034A (ja) | 2019-05-09 | 2020-11-19 | 東京応化工業株式会社 | 基板洗浄装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS592138U (ja) * | 1982-06-28 | 1984-01-09 | 日本電気株式会社 | 半導体ウエハ−スの吸着治具 |
JPS6032325A (ja) * | 1983-08-02 | 1985-02-19 | Oki Electric Ind Co Ltd | 半導体ウエハの乾燥方法 |
JPH10150097A (ja) * | 1996-11-21 | 1998-06-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスピンチャック |
JPH1167882A (ja) * | 1997-08-22 | 1999-03-09 | Nikon Corp | 基板吸着装置及び基板吸着方法 |
-
2019
- 2019-05-09 JP JP2019089278A patent/JP7422383B2/ja active Active
-
2020
- 2020-03-03 TW TW109106919A patent/TWI839478B/zh active
- 2020-03-25 KR KR1020200036290A patent/KR20200130095A/ko unknown
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000035681A (ja) | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 現像装置及び現像方法 |
JP2001024051A (ja) | 1999-07-09 | 2001-01-26 | Tokyo Seimitsu Co Ltd | ウェーハ吸着パッド |
JP2002204999A (ja) | 2001-01-05 | 2002-07-23 | Shibaura Mechatronics Corp | スピン処理装置 |
JP2003001182A (ja) | 2001-04-17 | 2003-01-07 | Tokyo Electron Ltd | 塗布膜形成装置およびスピンチャック |
JP2004146587A (ja) | 2002-10-24 | 2004-05-20 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
JP2005116842A (ja) | 2003-10-09 | 2005-04-28 | Shinko Electric Ind Co Ltd | ウェーハ吸着ステージ及びウェーハの吸着方法 |
JP2008251754A (ja) | 2007-03-29 | 2008-10-16 | Nikon Corp | 基板搬送方法及び装置、並びに露光方法及び装置 |
JP2011082457A (ja) | 2009-10-09 | 2011-04-21 | Showa Denko Kk | 基板の処理方法及び基板保持装置 |
JP2013214676A (ja) | 2012-04-04 | 2013-10-17 | Tokyo Electron Ltd | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP2016092239A (ja) | 2014-11-05 | 2016-05-23 | 株式会社東芝 | 保持装置及び処理装置 |
US20190371646A1 (en) | 2018-05-30 | 2019-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer chuck |
JP2020188034A (ja) | 2019-05-09 | 2020-11-19 | 東京応化工業株式会社 | 基板洗浄装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2020188035A (ja) | 2020-11-19 |
KR20200130095A (ko) | 2020-11-18 |
TW202105587A (zh) | 2021-02-01 |
TWI839478B (zh) | 2024-04-21 |
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