JP7383630B2 - 電子アセンブリおよび自動車用発光装置 - Google Patents
電子アセンブリおよび自動車用発光装置 Download PDFInfo
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- JP7383630B2 JP7383630B2 JP2020552254A JP2020552254A JP7383630B2 JP 7383630 B2 JP7383630 B2 JP 7383630B2 JP 2020552254 A JP2020552254 A JP 2020552254A JP 2020552254 A JP2020552254 A JP 2020552254A JP 7383630 B2 JP7383630 B2 JP 7383630B2
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- 230000000712 assembly Effects 0.000 title description 5
- 238000000429 assembly Methods 0.000 title description 5
- 238000005452 bending Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/25—Projection lenses
- F21S41/255—Lenses with a front view of circular or truncated circular outline
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
- F21S41/32—Optical layout thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第1面と前記第1面の反対側の第2面とを有するプリント回路板と、
前記プリント回路板の前記第1面に取り付けられた電子部品と、
を備えた電子アセンブリにおいて、
前記プリント回路板は、絶縁金属基板プリント回路板であり、かつ、当該プリント回路板を第1主部分と第2主部分とに分割する第1屈曲部を備え、前記電子部品は前記第1主部分に配置されており、
前記第1主部分と前記第2主部分とは、1つの共通平面内に含まれない、
電子アセンブリを提供する。
本発明による上記の態様による電子アセンブリであって、前記電子部品は発光ダイオード(LED)等の半導体光源である電子アセンブリと、
前記半導体光源からの光を受光して前記光を前記発光装置の外部に投影される光パターンに成形するように配置された第1光学素子と、
を備えた自動車用発光装置に関する。
Claims (15)
- 第1面(21)と前記第1面(21)の反対側の第2面(22)とを有するプリント回路板(2)と、
前記プリント回路板(2)の前記第1面(21)に取り付けられた電子部品(3)と、
を備えた電子アセンブリ(1)において、
前記プリント回路板(2)は、絶縁金属基板プリント回路板であり、かつ、当該プリント回路板を第1主部分(23)と第2主部分(24)とに分割する第1屈曲部(20)を備え、前記電子部品(3)は前記第1主部分(23)に配置されており、
前記第1主部分(23)と前記第2主部分(24)とは、1つの共通平面内に含まれないように配置されており、
前記プリント回路板は導電性トラックを備え、前記導電性トラックは前記プリント回路板(2)の前記第1主部分(23)のみに設けられ、前記プリント回路板は前記第1屈曲部(20)および前記第2主部分(24)には導電性トラックを有していない、電子アセンブリ(1)。 - 前記電子部品(3)は、発光ダイオード(LED)等の半導体光源である、請求項1に記載の電子アセンブリ(1)。
- 前記第1屈曲部(20)は、前記第1主部分(23)の前記第1面を前記第2主部分(24)の前記第1面の方に向けて屈曲させるようなものである、請求項1または2に記載の電子アセンブリ(1)。
- 前記第1および第2主部分(23、24)は80乃至100度の角度を形成する、請求項1から3のうちのいずれか一項に記載の電子アセンブリ(1)。
- 前記第2主部分(24)は少なくとも第2屈曲部(20’)をさらに備え、当該第2屈曲部(20’)は前記第2主部分を少なくとも2つの副部分(241、242、243)に分割する、請求項1から4のうちのいずれか一項に記載の電子アセンブリ(1)。
- 前記第2屈曲部(20’)は、副部分のうちの主部(242)の前記第2面を他の副部分(241)の前記第2面の方に向けて屈曲させるようなものである、請求項5に記載の電子アセンブリ(1)。
- 前記副部分(241、242、243)のうちの2つは80乃至100度の角度を形成する、請求項5または6に記載の電子アセンブリ(1)。
- 前記第1主部分(23)は複数の第1屈曲部(20)を備え、これにより、第1主部分(23)および第2主部分(24)とは別のさらなる主部分の第3主部分(25)が形成される、請求項1から4のうちのいずれか一項に記載の電子アセンブリ(1)。
- 前記第1屈曲部(20)は、当該第1屈曲部(20)における前記プリント回路板の厚さより大きい曲率半径を有する、請求項1から8のうちのいずれか一項に記載の電子アセンブリ(1)。
- 前記第2屈曲部(20’)の一つは、対応する第2屈曲部(20’)における前記プリント回路板の厚さより大きい曲率半径を有する、請求項5から7のうちのいずれか一項に記載の電子アセンブリ(1)。
- 溝が少なくとも1つの屈曲部(20、20’)に、より具体的には各屈曲部(20、20’)に設けられ、前記溝は関連する前記屈曲部の延伸方向に実質的に平行である、請求項1から10のうちのいずれかに記載の電子アセンブリ(1)。
- 前記プリント回路板は、金属から形成されたコアを備えている、請求項1から11のうちのいずれか一項に記載の電子アセンブリ(1)。
- 前記プリント回路板はその部品のうちの1つが黒いか、前記プリント回路板が黒く塗装されているか、あるいは、前記プリント回路板が黒く陽極酸化処理されおり、これにより前記プリント回路板が黒い外観を呈する、請求項1から12のうちのいずれか一項に記載の電子アセンブリ(1)。
- 自動車用発光装置(10)であって、
請求項1から13のうちのいずれか一項に記載の電子アセンブリ(1)であって、前記電子部品(3)は発光ダイオード(LED)等の半導体光源である電子アセンブリ(1)と、
前記半導体光源(3)からの光を受光して前記光を当該自動車用発光装置(10)の外部に投影される光パターンに成形するように配置された第1光学素子(4、5)と、
を備えた自動車用発光装置(10)。 - 前記第1光学素子(4、5)は、レンズ、光ガイド、リフレクタ、またはコリメータのうちの少なくとも1つである、請求項14に記載の自動車用発光装置(10)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18382225.3 | 2018-03-29 | ||
EP18382225.3A EP3547806A1 (en) | 2018-03-29 | 2018-03-29 | Electronic assembly and automotive luminous device |
PCT/EP2019/058056 WO2019185892A1 (en) | 2018-03-29 | 2019-03-29 | Electronic assembly and automotive luminous device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021520063A JP2021520063A (ja) | 2021-08-12 |
JP7383630B2 true JP7383630B2 (ja) | 2023-11-20 |
Family
ID=62046835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020552254A Active JP7383630B2 (ja) | 2018-03-29 | 2019-03-29 | 電子アセンブリおよび自動車用発光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11432401B2 (ja) |
EP (1) | EP3547806A1 (ja) |
JP (1) | JP7383630B2 (ja) |
CN (1) | CN112088583A (ja) |
WO (1) | WO2019185892A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3110955A1 (fr) * | 2020-05-27 | 2021-12-03 | Valeo Vision | Automotive lighting device |
FR3126475B1 (fr) * | 2021-08-31 | 2024-01-05 | Valeo Vision | Module d'émission de lumière comprenant un support destiné à dissiper de la chaleur |
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JP2009081193A (ja) | 2007-09-25 | 2009-04-16 | Sanyo Electric Co Ltd | 発光モジュールおよびその製造方法 |
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US20150300609A1 (en) | 2013-01-31 | 2015-10-22 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight source and manufacturing method thereof |
US20170299143A1 (en) | 2014-09-30 | 2017-10-19 | Valeo Vision | Lighting module comprising at least one component and a connector which are disposed on a heat dissipater, and lighting device for automotive vehicle comprising such a module |
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2018
- 2018-03-29 EP EP18382225.3A patent/EP3547806A1/en active Pending
-
2019
- 2019-03-29 US US17/043,572 patent/US11432401B2/en active Active
- 2019-03-29 WO PCT/EP2019/058056 patent/WO2019185892A1/en active Application Filing
- 2019-03-29 CN CN201980030780.5A patent/CN112088583A/zh active Pending
- 2019-03-29 JP JP2020552254A patent/JP7383630B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009081193A (ja) | 2007-09-25 | 2009-04-16 | Sanyo Electric Co Ltd | 発光モジュールおよびその製造方法 |
US20140153245A1 (en) | 2012-12-05 | 2014-06-05 | O P I Products, Inc. | Metal core printed circuit board as heat sink for leds |
US20150300609A1 (en) | 2013-01-31 | 2015-10-22 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight source and manufacturing method thereof |
US20170299143A1 (en) | 2014-09-30 | 2017-10-19 | Valeo Vision | Lighting module comprising at least one component and a connector which are disposed on a heat dissipater, and lighting device for automotive vehicle comprising such a module |
Also Published As
Publication number | Publication date |
---|---|
JP2021520063A (ja) | 2021-08-12 |
US20210022244A1 (en) | 2021-01-21 |
WO2019185892A1 (en) | 2019-10-03 |
US11432401B2 (en) | 2022-08-30 |
EP3547806A1 (en) | 2019-10-02 |
CN112088583A (zh) | 2020-12-15 |
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