JP7370920B2 - ステージ装置 - Google Patents
ステージ装置 Download PDFInfo
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- JP7370920B2 JP7370920B2 JP2020062981A JP2020062981A JP7370920B2 JP 7370920 B2 JP7370920 B2 JP 7370920B2 JP 2020062981 A JP2020062981 A JP 2020062981A JP 2020062981 A JP2020062981 A JP 2020062981A JP 7370920 B2 JP7370920 B2 JP 7370920B2
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- 238000012986 modification Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/38—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members using fluid bearings or fluid cushion supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2707/00—Automatic supply or removal of metal workpieces
- B23Q2707/04—Automatic supply or removal of metal workpieces by means of grippers also magnetic or pneumatic gripping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Machine Tool Units (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第1Y軸駆動部20の第1Y軸可動子30のコイルと、第2Y軸駆動部22の第2Y軸可動子36のコイルに電流が供給されると、各コイルとY軸固定子との間に電磁力が発生し、その電磁相互作用によってY軸可動子ひいては第2移動体14(および第1移動体12)がY軸方向に移動する。第1X軸駆動部16の第1X軸可動子54のコイルと、第2X軸駆動部18の第2X軸可動子60のコイルに電流が供給されると、各コイルとX軸固定子との間に電磁力が発生し、その電磁相互作用によってX軸可動子ひいては第1移動体12がX軸方向に移動する。このように第1移動体12および第2移動体14を移動させることにより、第1移動体12のステージ70をXY方向に移動させ、ステージ70に載置される対象物をXY方向に位置決めする。第1X軸駆動部16および第2X軸駆動部18と第2移動体14とは、拘束ユニット88によりY軸方向の相対移動が拘束されているため、第2移動体14のY軸方向の移動にともなって第1X軸駆動部16および第2X軸駆動部18もY軸方向に移動する。
図6は、拘束ユニット88の別の例を説明する図である。図6は、図5に対応する。本変形例では、拘束ユニット88は、エアパッド96である。エアパッド96は、X軸駆動部および第2移動体14の一方に固定される。図6では、エアパッド96は、ガイドビーム42と対向する支持部材の側面に固定される。エアパッド96は、ガイドビーム42との隙間が微小になるように、スペーサ98を介して支持部材に固定されてもよい。エアパッド96は、ガイドビーム42の側面を向いた吸引口96aおよび噴出口96bを有する。エアパッド96は、吸引口96aからエアを吸引する。この吸引力により、X軸駆動部と第2移動体14とのY軸方向の相対移動を拘束される。
図7は、拘束ユニット88のさらに別の例を説明する図である。図7は、図5に対応する。第1X軸駆動部16と第2X軸駆動部18とは、一体となってY軸方向に移動するように、接続部材94によって互いに接続されている。図7では、第1支持部材56と第2支持部材62とが、接続部材94によって接続されている。
図8は、拘束ユニット88のさらに別の例を説明する図である。図8は、図7に対応する。
実施の形態では、Y軸駆動部が第2移動体14をY軸方向に駆動する場合について説明したが、これには限定されず、Y軸駆動部は、X軸駆動部をY軸方向に駆動してもよい。この場合、Y軸駆動部の可動子とX軸駆動部とが連結される。Y軸駆動部に駆動されてX軸駆動部がY軸方向に移動すると、拘束ユニット88によりX軸駆動部とのY軸方向の相対移動が拘束された第2移動体は、X軸駆動部とともにY軸方向に移動する。
Claims (4)
- 第1移動体と、
前記第1移動体をX軸方向に駆動する、Y軸方向に移動可能に構成されたX軸駆動部と、
前記第1移動体のX軸方向の移動を案内し、Y軸方向に移動可能に構成された第2移動体と、
前記X軸駆動部または前記第2移動体をY軸方向に駆動するY軸駆動部と、
前記X軸駆動部と前記第2移動体とのX軸方向の相対移動を拘束せず、Y軸方向の相対移動を両者が非接触の状態で拘束する拘束ユニットと、
を備えることを特徴とするステージ装置。 - 前記X軸駆動部と前記第2移動体とは、互いに独立して支持されることを特徴とする請求項1に記載のステージ装置。
- 前記拘束ユニットは、エアの吸引力、エアの反発力、磁気の吸引力または磁気の反発力により、前記X軸駆動部と前記第2移動体とのY軸方向の相対移動を拘束することを特徴とする請求項1または2に記載のステージ装置。
- 前記X軸駆動部と前記Y軸駆動部とは、互いに独立して支持されることを特徴とする請求項1から3のいずれかに記載のステージ装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020062981A JP7370920B2 (ja) | 2020-03-31 | 2020-03-31 | ステージ装置 |
KR1020210037027A KR102527517B1 (ko) | 2020-03-31 | 2021-03-23 | 스테이지장치 |
TW110111037A TWI839602B (zh) | 2020-03-31 | 2021-03-26 | 載台裝置 |
CN202110345848.8A CN113471133A (zh) | 2020-03-31 | 2021-03-31 | 载物台装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020062981A JP7370920B2 (ja) | 2020-03-31 | 2020-03-31 | ステージ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021163835A JP2021163835A (ja) | 2021-10-11 |
JP7370920B2 true JP7370920B2 (ja) | 2023-10-30 |
Family
ID=77868396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020062981A Active JP7370920B2 (ja) | 2020-03-31 | 2020-03-31 | ステージ装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7370920B2 (ja) |
KR (1) | KR102527517B1 (ja) |
CN (1) | CN113471133A (ja) |
TW (1) | TWI839602B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002130281A (ja) | 2000-10-27 | 2002-05-09 | Sigma Technos Kk | Xyステージ |
WO2006068233A1 (ja) | 2004-12-24 | 2006-06-29 | Nikon Corporation | 磁気案内装置、ステージ装置、露光装置、及びデバイスの製造方法 |
JP2017208373A (ja) | 2016-05-16 | 2017-11-24 | 住友重機械工業株式会社 | ステージ装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4078099B2 (ja) * | 2002-03-14 | 2008-04-23 | 株式会社リコー | 保持装置および保持方法 |
JP4122815B2 (ja) * | 2002-04-03 | 2008-07-23 | 株式会社ニコン | リニアモータおよびステージ装置並びにリニアモータの制御方法 |
JP4391883B2 (ja) * | 2004-05-19 | 2009-12-24 | 住友重機械工業株式会社 | 移動***置制御装置及びこの制御装置を用いたステージ装置 |
JP2005331402A (ja) * | 2004-05-20 | 2005-12-02 | Sumitomo Heavy Ind Ltd | ステージ装置 |
WO2008129762A1 (ja) * | 2007-03-05 | 2008-10-30 | Nikon Corporation | 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法 |
JP5106981B2 (ja) | 2007-10-19 | 2012-12-26 | 住友重機械工業株式会社 | ステージ装置 |
TWI471971B (zh) * | 2007-10-30 | 2015-02-01 | 尼康股份有限公司 | Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method |
JP5026455B2 (ja) * | 2009-03-18 | 2012-09-12 | 住友重機械工業株式会社 | Xyステージ装置、半導体検査装置、及び半導体露光装置 |
JP5295855B2 (ja) * | 2009-04-28 | 2013-09-18 | 住友重機械工業株式会社 | 反力処理機構 |
JP5304566B2 (ja) * | 2009-09-16 | 2013-10-02 | 株式会社安川電機 | フェールセーフ機構を備えた基盤搬送装置 |
US9898000B2 (en) * | 2013-01-30 | 2018-02-20 | Akribis Systems Pte Ltd | Planar positioning system and method of using the same |
JP2018167337A (ja) * | 2017-03-29 | 2018-11-01 | ブラザー工業株式会社 | 加工装置 |
CN108809037A (zh) * | 2018-06-20 | 2018-11-13 | 魏明刚 | 一种无反作用力的电磁发动机 |
-
2020
- 2020-03-31 JP JP2020062981A patent/JP7370920B2/ja active Active
-
2021
- 2021-03-23 KR KR1020210037027A patent/KR102527517B1/ko active IP Right Grant
- 2021-03-26 TW TW110111037A patent/TWI839602B/zh active
- 2021-03-31 CN CN202110345848.8A patent/CN113471133A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002130281A (ja) | 2000-10-27 | 2002-05-09 | Sigma Technos Kk | Xyステージ |
WO2006068233A1 (ja) | 2004-12-24 | 2006-06-29 | Nikon Corporation | 磁気案内装置、ステージ装置、露光装置、及びデバイスの製造方法 |
JP2017208373A (ja) | 2016-05-16 | 2017-11-24 | 住友重機械工業株式会社 | ステージ装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20210122116A (ko) | 2021-10-08 |
TWI839602B (zh) | 2024-04-21 |
CN113471133A (zh) | 2021-10-01 |
TW202140186A (zh) | 2021-11-01 |
JP2021163835A (ja) | 2021-10-11 |
KR102527517B1 (ko) | 2023-04-28 |
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