JP7325299B2 - プリント配線基板の接合部構造 - Google Patents

プリント配線基板の接合部構造 Download PDF

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Publication number
JP7325299B2
JP7325299B2 JP2019196932A JP2019196932A JP7325299B2 JP 7325299 B2 JP7325299 B2 JP 7325299B2 JP 2019196932 A JP2019196932 A JP 2019196932A JP 2019196932 A JP2019196932 A JP 2019196932A JP 7325299 B2 JP7325299 B2 JP 7325299B2
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Japan
Prior art keywords
substrate
printed wiring
wiring board
wiring pattern
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019196932A
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English (en)
Japanese (ja)
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JP2021072327A (ja
Inventor
祐士 増山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2019196932A priority Critical patent/JP7325299B2/ja
Priority to CN202011138850.XA priority patent/CN112752392A/zh
Publication of JP2021072327A publication Critical patent/JP2021072327A/ja
Application granted granted Critical
Publication of JP7325299B2 publication Critical patent/JP7325299B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
JP2019196932A 2019-10-30 2019-10-30 プリント配線基板の接合部構造 Active JP7325299B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019196932A JP7325299B2 (ja) 2019-10-30 2019-10-30 プリント配線基板の接合部構造
CN202011138850.XA CN112752392A (zh) 2019-10-30 2020-10-22 印刷配线基板的接合部构造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019196932A JP7325299B2 (ja) 2019-10-30 2019-10-30 プリント配線基板の接合部構造

Publications (2)

Publication Number Publication Date
JP2021072327A JP2021072327A (ja) 2021-05-06
JP7325299B2 true JP7325299B2 (ja) 2023-08-14

Family

ID=75648330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019196932A Active JP7325299B2 (ja) 2019-10-30 2019-10-30 プリント配線基板の接合部構造

Country Status (2)

Country Link
JP (1) JP7325299B2 (zh)
CN (1) CN112752392A (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258618A (ja) 2006-03-24 2007-10-04 Fujikura Ltd 接続部補強構造、プリント配線板及び接続部補強構造形成方法
JP2008091797A (ja) 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590748A (ja) * 1991-09-27 1993-04-09 Canon Inc 基板の接続方法
JP2002232088A (ja) * 2001-02-07 2002-08-16 Yamaguchi Seisakusho:Kk 印刷配線基板の接合構造
JP4554873B2 (ja) * 2002-04-22 2010-09-29 日本電気株式会社 配線板、電子機器および電子部品の実装方法並びに製造方法
JP2005032815A (ja) * 2003-07-08 2005-02-03 Alps Electric Co Ltd 可撓配線板およびその製造方法
JP2010283259A (ja) * 2009-06-08 2010-12-16 Sumitomo Electric System Solutions Co Ltd 配線板の接合方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258618A (ja) 2006-03-24 2007-10-04 Fujikura Ltd 接続部補強構造、プリント配線板及び接続部補強構造形成方法
JP2008091797A (ja) 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置

Also Published As

Publication number Publication date
CN112752392A (zh) 2021-05-04
JP2021072327A (ja) 2021-05-06

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