JP7258421B2 - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
- Publication number
- JP7258421B2 JP7258421B2 JP2019025978A JP2019025978A JP7258421B2 JP 7258421 B2 JP7258421 B2 JP 7258421B2 JP 2019025978 A JP2019025978 A JP 2019025978A JP 2019025978 A JP2019025978 A JP 2019025978A JP 7258421 B2 JP7258421 B2 JP 7258421B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- wafer
- thermocompression
- cutting
- dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Images
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Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
1a 表面
1b 裏面
3 分割予定ライン
3a 分割溝
5 デバイス
5a デバイスチップの裏面
5b チッピング
7 フレーム
7a 開口
9 ポリオレフィン系シート
9a 切断痕
9b 第1の面
9c 第2の面
11 フレームユニット
2 チャックテーブル
2a 保持面
2b 吸引源
2c 切り替え部
4 ヒートガン
4a 熱風
6 ヒートローラー
8 赤外線ランプ
8a 赤外線
10 カッター
12 切削装置
14 切削ユニット
16 スピンドルハウジング
18 切削ブレード
20 切削水供給ノズル
22 バイト切削装置
24 基台
24a 支持部
26 操作盤
28 開口
30 チャックテーブル
30a 多孔質部材
30b 吸引口
32 X軸方向移動テーブル
34 搬入出領域
36 加工領域
38 バイト切削ユニット
40 ガイドレール
42 移動プレート
44 ボールねじ
46 パルスモータ
48 スピンドル
50 マウント
52 バイト工具
54 撮像ユニット
56 画像
Claims (6)
- 複数のデバイスが、分割予定ラインによって区画された表面の各領域に形成されたウェーハを個々のデバイスチップに分割するウェーハの加工方法であって、
ウェーハを収容する開口を有するフレームの該開口内にウェーハを位置付け、該ウェーハの裏面と該フレームの外周とに熱圧着シートを配設する熱圧着シート配設工程と、
該熱圧着シートを加熱し熱圧着により該ウェーハと該フレームとを該熱圧着シートを介して一体化する一体化工程と、
切削ブレードを回転可能に備えた切削装置を用いて該ウェーハを分割予定ラインに沿って切削して分割溝を形成し、該ウェーハを個々のデバイスチップに分割する分割工程と、
該分割工程の前または後に、該熱圧着シートの該ウェーハに熱圧着された第1の面とは反対側の第2の面のうち、該第1の面の該ウェーハに熱圧着された領域に重なる領域を平坦化する平坦化工程と、
平坦化された該第2の面側から該熱圧着シートを通して該デバイスチップの該裏面側を観察し、該分割溝の状態を確認する裏面観察工程と、
を備え、
該平坦化工程は、バイト工具によって該熱圧着シートの該第2の面の該領域を切削することにより実施することを特徴とするウェーハの加工方法。 - 該裏面観察工程では、該デバイスチップの裏面が写る画像を撮像ユニットによって取得することを特徴とする請求項1記載のウェーハの加工方法。
- 該熱圧着シートは、ポリオレフィン系シート、ポリエステル系シートのいずれかであることを特徴とする請求項1記載のウェーハの加工方法。
- 該ポリオレフィン系シートは、ポリエチレンシート、ポリプロピレンシート、ポリスチレンシートのいずれかであり、
該ポリエステル系シートは、ポリエチレンテレフタレートシート、ポリエチレンナフタレートシートのいずれかであることを特徴とする請求項3記載のウェーハの加工方法。 - 該一体化工程において、
該ポリオレフィン系シートが該ポリエチレンシートである場合に加熱温度は120℃~140℃であり、該ポリオレフィン系シートが該ポリプロピレンシートである場合に加熱温度は160℃~180℃であり、該ポリオレフィン系シートが該ポリスチレンシートである場合に加熱温度は220℃~240℃であり、
該ポリエステル系シートが該ポリエチレンテレフタレートシートである場合に加熱温度は250℃~270℃であり、該ポリエステル系シートが該ポリエチレンナフタレートシートである場合に加熱温度は160℃~180℃である
ことを特徴とする請求項4記載のウェーハの加工方法。 - 該ウェーハは、Si、GaN、GaAs、ガラスのいずれかで構成されることを特徴とする請求項1記載のウェーハの加工方法。
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