JP7256786B2 - 粘着シート - Google Patents
粘着シート Download PDFInfo
- Publication number
- JP7256786B2 JP7256786B2 JP2020505035A JP2020505035A JP7256786B2 JP 7256786 B2 JP7256786 B2 JP 7256786B2 JP 2020505035 A JP2020505035 A JP 2020505035A JP 2020505035 A JP2020505035 A JP 2020505035A JP 7256786 B2 JP7256786 B2 JP 7256786B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- pressure
- sensitive adhesive
- adhesive layer
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Materials For Medical Uses (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018040794 | 2018-03-07 | ||
JP2018040794 | 2018-03-07 | ||
PCT/JP2019/008511 WO2019172218A1 (ja) | 2018-03-07 | 2019-03-05 | 粘着シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019172218A1 JPWO2019172218A1 (ja) | 2021-03-04 |
JP7256786B2 true JP7256786B2 (ja) | 2023-04-12 |
Family
ID=67847209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020505035A Active JP7256786B2 (ja) | 2018-03-07 | 2019-03-05 | 粘着シート |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7256786B2 (zh) |
TW (1) | TWI788537B (zh) |
WO (1) | WO2019172218A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7188658B1 (ja) * | 2021-09-27 | 2022-12-13 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007245389A (ja) | 2006-03-14 | 2007-09-27 | Nitto Denko Corp | 半導体用粘着シート |
WO2012124389A1 (ja) | 2011-03-17 | 2012-09-20 | リンテック株式会社 | エネルギー線硬化型粘着剤および粘着シート |
WO2018003312A1 (ja) | 2016-06-30 | 2018-01-04 | リンテック株式会社 | 半導体加工用シート |
-
2019
- 2019-03-05 WO PCT/JP2019/008511 patent/WO2019172218A1/ja active Application Filing
- 2019-03-05 JP JP2020505035A patent/JP7256786B2/ja active Active
- 2019-03-07 TW TW108107528A patent/TWI788537B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007245389A (ja) | 2006-03-14 | 2007-09-27 | Nitto Denko Corp | 半導体用粘着シート |
WO2012124389A1 (ja) | 2011-03-17 | 2012-09-20 | リンテック株式会社 | エネルギー線硬化型粘着剤および粘着シート |
WO2018003312A1 (ja) | 2016-06-30 | 2018-01-04 | リンテック株式会社 | 半導体加工用シート |
Also Published As
Publication number | Publication date |
---|---|
WO2019172218A1 (ja) | 2019-09-12 |
TW201945490A (zh) | 2019-12-01 |
JPWO2019172218A1 (ja) | 2021-03-04 |
TWI788537B (zh) | 2023-01-01 |
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