JP7244534B2 - 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 - Google Patents
電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Download PDFInfo
- Publication number
- JP7244534B2 JP7244534B2 JP2020553884A JP2020553884A JP7244534B2 JP 7244534 B2 JP7244534 B2 JP 7244534B2 JP 2020553884 A JP2020553884 A JP 2020553884A JP 2020553884 A JP2020553884 A JP 2020553884A JP 7244534 B2 JP7244534 B2 JP 7244534B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- insulating adhesive
- shielding film
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018202932 | 2018-10-29 | ||
JP2018202932 | 2018-10-29 | ||
PCT/JP2019/042153 WO2020090726A1 (ja) | 2018-10-29 | 2019-10-28 | 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020090726A1 JPWO2020090726A1 (ja) | 2021-11-11 |
JP7244534B2 true JP7244534B2 (ja) | 2023-03-22 |
Family
ID=70463666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020553884A Active JP7244534B2 (ja) | 2018-10-29 | 2019-10-28 | 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7244534B2 (zh) |
KR (1) | KR102530878B1 (zh) |
CN (1) | CN112586103B (zh) |
TW (1) | TWI771595B (zh) |
WO (1) | WO2020090726A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI741648B (zh) * | 2020-06-12 | 2021-10-01 | 亞洲電材股份有限公司 | 覆蓋膜及其製備方法 |
CN117395977B (zh) * | 2023-11-20 | 2024-03-22 | 广州方邦电子股份有限公司 | 一种电磁屏蔽膜及其应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009200113A (ja) | 2008-02-19 | 2009-09-03 | Nitto Denko Corp | シールド配線回路基板 |
JP2012156457A (ja) | 2011-01-28 | 2012-08-16 | Tatsuta Electric Wire & Cable Co Ltd | シールドプリント配線板 |
JP2013193253A (ja) | 2012-03-16 | 2013-09-30 | Yamaichi Electronics Co Ltd | 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法 |
JP2016157920A (ja) | 2015-12-18 | 2016-09-01 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
JP2017010995A (ja) | 2015-06-17 | 2017-01-12 | 住友電工プリントサーキット株式会社 | シールド材、電子部品及び接着シート |
JP2017025280A (ja) | 2015-07-16 | 2017-02-02 | 東洋インキScホールディングス株式会社 | 導電性接着剤層、導電性接着シートおよびプリント配線板 |
JP2017535072A (ja) | 2014-10-08 | 2017-11-24 | グアンチョウ ファン バン エレクトロニクス カンパニー リミテッド | フリー接地膜とその製造方法、フリー接地膜を含む遮蔽回路基板と接地方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4201548B2 (ja) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
CN103763893B (zh) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法 |
JP6381117B2 (ja) * | 2014-09-04 | 2018-08-29 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法 |
CN107079611A (zh) * | 2014-12-05 | 2017-08-18 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
JP5861790B1 (ja) * | 2015-02-25 | 2016-02-16 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
-
2019
- 2019-06-20 TW TW108121498A patent/TWI771595B/zh active
- 2019-10-28 WO PCT/JP2019/042153 patent/WO2020090726A1/ja active Application Filing
- 2019-10-28 CN CN201980057301.9A patent/CN112586103B/zh active Active
- 2019-10-28 KR KR1020217015067A patent/KR102530878B1/ko active IP Right Grant
- 2019-10-28 JP JP2020553884A patent/JP7244534B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009200113A (ja) | 2008-02-19 | 2009-09-03 | Nitto Denko Corp | シールド配線回路基板 |
JP2012156457A (ja) | 2011-01-28 | 2012-08-16 | Tatsuta Electric Wire & Cable Co Ltd | シールドプリント配線板 |
JP2013193253A (ja) | 2012-03-16 | 2013-09-30 | Yamaichi Electronics Co Ltd | 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法 |
JP2017535072A (ja) | 2014-10-08 | 2017-11-24 | グアンチョウ ファン バン エレクトロニクス カンパニー リミテッド | フリー接地膜とその製造方法、フリー接地膜を含む遮蔽回路基板と接地方法 |
JP2017010995A (ja) | 2015-06-17 | 2017-01-12 | 住友電工プリントサーキット株式会社 | シールド材、電子部品及び接着シート |
JP2017025280A (ja) | 2015-07-16 | 2017-02-02 | 東洋インキScホールディングス株式会社 | 導電性接着剤層、導電性接着シートおよびプリント配線板 |
JP2016157920A (ja) | 2015-12-18 | 2016-09-01 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
Also Published As
Publication number | Publication date |
---|---|
WO2020090726A1 (ja) | 2020-05-07 |
JPWO2020090726A1 (ja) | 2021-11-11 |
KR102530878B1 (ko) | 2023-05-09 |
TW202017463A (zh) | 2020-05-01 |
CN112586103A (zh) | 2021-03-30 |
KR20210080464A (ko) | 2021-06-30 |
TWI771595B (zh) | 2022-07-21 |
CN112586103B (zh) | 2024-07-05 |
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