JP7244534B2 - 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 - Google Patents

電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Download PDF

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Publication number
JP7244534B2
JP7244534B2 JP2020553884A JP2020553884A JP7244534B2 JP 7244534 B2 JP7244534 B2 JP 7244534B2 JP 2020553884 A JP2020553884 A JP 2020553884A JP 2020553884 A JP2020553884 A JP 2020553884A JP 7244534 B2 JP7244534 B2 JP 7244534B2
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Japan
Prior art keywords
adhesive layer
insulating adhesive
shielding film
wiring board
printed wiring
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JP2020553884A
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English (en)
Japanese (ja)
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JPWO2020090726A1 (ja
Inventor
晃司 高見
慶彦 青柳
憲治 上農
正博 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020553884A 2018-10-29 2019-10-28 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Active JP7244534B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018202932 2018-10-29
JP2018202932 2018-10-29
PCT/JP2019/042153 WO2020090726A1 (ja) 2018-10-29 2019-10-28 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2020090726A1 JPWO2020090726A1 (ja) 2021-11-11
JP7244534B2 true JP7244534B2 (ja) 2023-03-22

Family

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JP2020553884A Active JP7244534B2 (ja) 2018-10-29 2019-10-28 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Country Status (5)

Country Link
JP (1) JP7244534B2 (zh)
KR (1) KR102530878B1 (zh)
CN (1) CN112586103B (zh)
TW (1) TWI771595B (zh)
WO (1) WO2020090726A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741648B (zh) * 2020-06-12 2021-10-01 亞洲電材股份有限公司 覆蓋膜及其製備方法
CN117395977B (zh) * 2023-11-20 2024-03-22 广州方邦电子股份有限公司 一种电磁屏蔽膜及其应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200113A (ja) 2008-02-19 2009-09-03 Nitto Denko Corp シールド配線回路基板
JP2012156457A (ja) 2011-01-28 2012-08-16 Tatsuta Electric Wire & Cable Co Ltd シールドプリント配線板
JP2013193253A (ja) 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JP2016157920A (ja) 2015-12-18 2016-09-01 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
JP2017010995A (ja) 2015-06-17 2017-01-12 住友電工プリントサーキット株式会社 シールド材、電子部品及び接着シート
JP2017025280A (ja) 2015-07-16 2017-02-02 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
JP2017535072A (ja) 2014-10-08 2017-11-24 グアンチョウ ファン バン エレクトロニクス カンパニー リミテッド フリー接地膜とその製造方法、フリー接地膜を含む遮蔽回路基板と接地方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
JP6381117B2 (ja) * 2014-09-04 2018-08-29 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
CN107079611A (zh) * 2014-12-05 2017-08-18 拓自达电线株式会社 电磁波屏蔽膜
JP5861790B1 (ja) * 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200113A (ja) 2008-02-19 2009-09-03 Nitto Denko Corp シールド配線回路基板
JP2012156457A (ja) 2011-01-28 2012-08-16 Tatsuta Electric Wire & Cable Co Ltd シールドプリント配線板
JP2013193253A (ja) 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JP2017535072A (ja) 2014-10-08 2017-11-24 グアンチョウ ファン バン エレクトロニクス カンパニー リミテッド フリー接地膜とその製造方法、フリー接地膜を含む遮蔽回路基板と接地方法
JP2017010995A (ja) 2015-06-17 2017-01-12 住友電工プリントサーキット株式会社 シールド材、電子部品及び接着シート
JP2017025280A (ja) 2015-07-16 2017-02-02 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
JP2016157920A (ja) 2015-12-18 2016-09-01 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Also Published As

Publication number Publication date
WO2020090726A1 (ja) 2020-05-07
JPWO2020090726A1 (ja) 2021-11-11
KR102530878B1 (ko) 2023-05-09
TW202017463A (zh) 2020-05-01
CN112586103A (zh) 2021-03-30
KR20210080464A (ko) 2021-06-30
TWI771595B (zh) 2022-07-21
CN112586103B (zh) 2024-07-05

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