JP7233800B2 - ダイシングテープ用粘着組成物およびこれを含むダイシングテープ - Google Patents
ダイシングテープ用粘着組成物およびこれを含むダイシングテープ Download PDFInfo
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- JP7233800B2 JP7233800B2 JP2021545907A JP2021545907A JP7233800B2 JP 7233800 B2 JP7233800 B2 JP 7233800B2 JP 2021545907 A JP2021545907 A JP 2021545907A JP 2021545907 A JP2021545907 A JP 2021545907A JP 7233800 B2 JP7233800 B2 JP 7233800B2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/0041—Optical brightening agents, organic pigments
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/005—Stabilisers against oxidation, heat, light, ozone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/01—Hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
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- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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Description
(1)ダイボンディングフィルムの製造
高分子量アクリル樹脂(Tg20℃、重量平均分子量85万)90gとエポキシ樹脂(ノボラック型エポキシ樹脂、軟化点94℃)30g、エポキシ樹脂の硬化剤としてフェノール樹脂(フェノールノボラック樹脂、軟化点94℃)20g、中温開始硬化促進剤(2-メチルイミダゾール)0.1g、高温開始硬化促進剤(2-フェニル-4-メチル-イミダゾール)0.5g、充填剤としてシリカ(平均粒径75nm)20gからなる組成物とメチルエチルケトンを撹拌混合した。
アクリル系ベース樹脂の主鎖にアクリレート官能基を側鎖として20wt%付加した高分子樹脂(Mw700,000)100gに、TDI系イソシアネート硬化剤約3g、光開始剤(Irgacure184)5gの混合物、ジメチルアントラセン(TCI社、>98%、Mw106.28g/mol)約4.6g、およびイソプロピルチオキサントン0.43gを混合して、粘着剤組成物を製造した。
前記製造されたダイシングテープに、円形に切断されたダイボンディングフィルムを5kgf/cm2の条件で貼り合わせにより転写した後、ダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセン約9.3gおよびイソプロピルチオキサントン0.43gを用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセン約18.32gおよびイソプロピルチオキサントン約0.42gを用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンの代わりにトリエチルシリルエチニル-ペンタセン(TCI社)約1.1gを用い、イソプロピルチオキサントン約0.43gを用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンの代わりにトリエチルシリルエチニル-ペンタセン(TCI社)約3.60gを用い、イソプロピルチオキサントン約0.43gを用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセン約18.32gおよびアントラセン系感光剤0.42gを用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンおよびイソプロピルチオキサントンを用いないことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンを約0.3gおよびイソプロピルチオキサントン約0.30gを用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンの代わりにトリエチルシリルエチニル-ペンタセン(TCI社)1.1gおよびイソプロピルチオキサントンを用いないことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンを約25gおよびイソプロピルチオキサントンを約0.43g用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
ダイシングテープの製造時、ジメチルアントラセンを約18.3gおよびナフタレン系感光剤を約0.42g用いたことを除けば、実施例1と同様の方法でダイシングダイボンディングフィルムを製造した。
前記実施例および比較例のダイシングダイボンディングフィルムに対して下記の方法で物性を評価し、その結果を表1および2に示した。
前記実施例および比較例で製造されたダイシングダイボンディングフィルムを幅25mmとなるようにカッティングして、粘着力測定サンプルを用意した。
前記実験例1で得られた初期粘着力と酸素曝露条件における粘着力を用いて粘着力が減少した比率を計算した後、その結果値を表1および2に示した。
前記実施例および比較例で製造されたダイシングダイボンディングフィルムの離型フィルムを剥がした後、ダイボンディングの面をミラーウエハ(8インチ、厚さ35μm)に温度70℃でマウンティングした後、チップの大きさが13.3mm×9.1mmとなるように下記の条件でダイシングを実施した。
機器:DFD-6361(DISCO)
ブレードタイプ:27HEBB(DISCO)
カッティングブレード高さ(cut depth):80μm
ダイシングスピード:15mm/s
ブレード回転数:45,000rpm
-ピックアップ条件-
機器:SPA-400(SHINKAWA)
エキスパンディング高さ:3mm
ニードル数:10本
ニードル穿刺高さ(needle plunge up height):0.2mm
ニードル穿刺速度(needle plunge up speed):10mm/s
Claims (11)
- 粘着バインダー、一重項酸素捕捉剤、感光剤、および光開始剤を含み、
前記粘着バインダーは、(メタ)アクリレート系樹脂を含み、
前記一重項酸素捕捉剤の含有量は、前記粘着バインダー100重量部に対して、0.5重量部以上20.0重量部以下である、
ダイシングテープ用粘着組成物。 - 前記粘着バインダーは、-28℃~-58℃のガラス転移温度を有する(メタ)アクリレート系樹脂を含む、
請求項1に記載のダイシングテープ用粘着組成物。 - 前記(メタ)アクリレート系樹脂は、(メタ)アクリル酸エステル系単量体および架橋性官能基含有単量体の共重合体を含む、
請求項2に記載のダイシングテープ用粘着組成物。 - 前記一重項酸素捕捉剤は、
ジメチルアントラセン(dimethyl anthracene、DMA)、ジブチルアントラセン(dibutyl anthracene、DBA)、トリエチルシリルエチニル-ペンタセン(triethylsilylethynyl-pentacene)、ジフェニルフラン(diphenyl furan、DPF)、およびこれらの組み合わせからなる群より選択された1つである、
請求項1~3のいずれか一項に記載のダイシングテープ用粘着組成物。 - 前記感光剤は、
アントラセン(anthracenes)系化合物、フェナントレン(phenanthrenes)系化合物、クリセン(chrysenes)系化合物、ベンズピレン(benzpyrenes)系化合物、フルオランテン(fluoranthenes)系化合物、ルブレン(rubrenes)系化合物、ピレン(pyrenes)系化合物、キサントン(xanthones)系化合物、インダンスレン(indanthrenes)系化合物、チオキサンテン-9-オン(thioxanthen-9-ones)系化合物、およびこれらの組み合わせからなる群より選択された1つである、
請求項1~4のいずれか一項に記載のダイシングテープ用粘着組成物。 - 前記感光剤の含有量は、前記粘着バインダー100重量部に対して、0.1重量部以上1.0重量部以下である、
請求項1~5のいずれか一項に記載のダイシングテープ用粘着組成物。 - 前記光開始剤は、ベンゾインとそのアルキルエーテル類、アセトフェノン類、アントラキノン類、チオキサントン類、ケタール類、ベンゾフェノン類、α-アミノアセトフェノン類、アシルホスフィンオキシド類、オキシムエステル類、およびこれらの組み合わせからなる群より選択された1つである、
請求項1~6のいずれか一項に記載のダイシングテープ用粘着組成物。 - 前記粘着組成物は、硬化剤、溶媒、およびこれらの混合物からなる群より選択された1つをさらに含む、
請求項1~7のいずれか一項に記載のダイシングテープ用粘着組成物。 - 基材フィルムと、前記基材フィルムの少なくとも一面上に備えられた粘着層とを含み、
前記粘着層は、請求項1~8のいずれか1項に記載のダイシングテープ用粘着組成物を含む、
ダイシングテープ。 - 前記粘着層の初期粘着力に対して、酸素曝露条件の紫外線(UV)照射後の粘着力の減少率は、20%~80%である、
請求項9に記載のダイシングテープ。 - 前記基材フィルムは、ポリオレフィンフィルム、ポリエステルフィルム、ポリカーボネートフィルム、ポリ塩化ビニルフィルム、ポリテトラフルオロエチレンフィルム、ポリブテンフィルム、ポリブタジエンフィルム、塩化ビニル共重合体フィルム、エチレン-酢酸ビニル共重合体フィルム、エチレン-プロピレン共重合体フィルム、およびエチレン-アルキルアクリレート共重合体フィルムからなる群より選択された1つの高分子フィルムである、
請求項9または10に記載のダイシングテープ。
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