JP7233613B2 - 半導体装置、電力変換装置、移動体、及び、半導体装置の製造方法 - Google Patents
半導体装置、電力変換装置、移動体、及び、半導体装置の製造方法 Download PDFInfo
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- JP7233613B2 JP7233613B2 JP2022524789A JP2022524789A JP7233613B2 JP 7233613 B2 JP7233613 B2 JP 7233613B2 JP 2022524789 A JP2022524789 A JP 2022524789A JP 2022524789 A JP2022524789 A JP 2022524789A JP 7233613 B2 JP7233613 B2 JP 7233613B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Inverter Devices (AREA)
Description
まず、本実施の形態1に係る半導体装置について説明する前に、これと関連する半導体装置(以下、「関連半導体装置」と記す)の製造工程について説明する。なお、関連半導体装置は、例えば電力用半導体装置である。
図5及び図6は、本実施の形態1に係る半導体装置の製造工程を説明するための断面斜視図であり、図7は図6の断面図である。なお、図5~図7は、図2~図4にそれぞれ対応している。以下、本実施の形態1に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じまたは類似する参照符号を付し、異なる構成要素について主に説明する。
本実施の形態2に係る電力変換装置は、実施の形態1に係る半導体装置を有する主変換回路を備える。以上で説明した半導体装置は特定の電力変換装置に限定されるものではないが、以下、本実施の形態2として、三相のインバータに、実施の形態1に係る半導体装置を適用した場合について説明する。
図10は、本実施の形態3に係る移動体の構成を示す図である。図10に示す移動体400には、実施の形態9に係る電力変換装置200が搭載され、移動体400は、電力変換装置200からの出力を用いて移動可能となっている。このような構成によれば、移動体400の信頼性を高めることができる。なおここでは、移動体400は、鉄道車両であるとして説明したが、これに限ったものではなく、例えば、ハイブリッド自動車、電気自動車、エレベーターなどであってもよい。
Claims (8)
- 第1窪みと前記第1窪みに並設された第2窪みとを有する金属パターンと、半導体素子とが配設された絶縁基板と、
一部が前記第1窪み内に配設された電子部品と、
前記金属パターンと前記電子部品とを接続するはんだと
を備える、半導体装置。 - 請求項1に記載の半導体装置であって、
前記第1窪み及び前記第2窪みは、それぞれ前記第1窪みの開口及び前記第2窪みの開口に向かって広がる断面形状を有する、半導体装置。 - 請求項1または請求項2に記載の半導体装置であって、
前記金属パターン上に配設され、前記第1窪み及び前記第2窪みを囲う平面形状を有するソルダーレジストをさらに備える、半導体装置。 - 請求項1から請求項3のうちのいずれか1項に記載の半導体装置であって、
前記はんだの一部は、前記第2窪み内に配設されている、半導体装置。 - 請求項1から請求項4のうちのいずれか1項に記載の半導体装置であって、
前記第1窪みと前記第2窪みとは離間されている、半導体装置。 - 請求項1から請求項5のうちのいずれか1項に記載の半導体装置を有し、入力される電力を変換して出力する主変換回路と、
前記半導体装置を駆動する駆動信号を前記半導体装置に出力する駆動回路と、
前記駆動回路を制御する制御信号を前記駆動回路に出力する制御回路と、
を備える、電力変換装置。 - 請求項6に記載の電力変換装置を備える、移動体。
- 第1窪みと前記第1窪みに並設された第2窪みとを有する金属パターンが配設された絶縁基板を準備し、
前記第1窪みに電子部品の一部を嵌入し、
前記第2窪みにはんだボールの一部を嵌入し、
前記はんだボールを溶融することによって、前記金属パターンと前記電子部品とを接続するはんだを形成し、
半導体素子を前記絶縁基板に配設する、半導体装置の製造方法。
Applications Claiming Priority (1)
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PCT/JP2020/020057 WO2021234892A1 (ja) | 2020-05-21 | 2020-05-21 | 半導体装置、電力変換装置、移動体、及び、半導体装置の製造方法 |
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JPWO2021234892A1 JPWO2021234892A1 (ja) | 2021-11-25 |
JP7233613B2 true JP7233613B2 (ja) | 2023-03-06 |
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JP2022524789A Active JP7233613B2 (ja) | 2020-05-21 | 2020-05-21 | 半導体装置、電力変換装置、移動体、及び、半導体装置の製造方法 |
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US (1) | US20230164915A1 (ja) |
JP (1) | JP7233613B2 (ja) |
CN (1) | CN115668483A (ja) |
DE (1) | DE112020007225T5 (ja) |
WO (1) | WO2021234892A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7466244B1 (ja) | 2023-03-29 | 2024-04-12 | 株式会社エス・アイ・ルネス | 建物の床面レベルの調整方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237338A (ja) | 2000-02-21 | 2001-08-31 | Nippon Circuit Kogyo Kk | フリップチップボールグリッドアレイ基板及びその製造法 |
JP2012099642A (ja) | 2010-11-02 | 2012-05-24 | Hitachi Metals Ltd | 半導体装置、それを用いた電子部品およびそれらの製造方法 |
JP2016058594A (ja) | 2014-09-11 | 2016-04-21 | 株式会社日立製作所 | 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11121913A (ja) * | 1997-10-20 | 1999-04-30 | Mitsubishi Electric Corp | プリント基板及び半田バンプの形成方法 |
JPH11330146A (ja) * | 1998-05-11 | 1999-11-30 | Hitachi Ltd | 半導体装置およびその製造方法ならびにその製造方法で使用するテープキャリヤ |
JPH11345969A (ja) | 1998-06-01 | 1999-12-14 | Toshiba Corp | 電力用半導体装置 |
-
2020
- 2020-05-21 CN CN202080101002.3A patent/CN115668483A/zh active Pending
- 2020-05-21 US US17/906,695 patent/US20230164915A1/en active Pending
- 2020-05-21 DE DE112020007225.8T patent/DE112020007225T5/de active Pending
- 2020-05-21 JP JP2022524789A patent/JP7233613B2/ja active Active
- 2020-05-21 WO PCT/JP2020/020057 patent/WO2021234892A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237338A (ja) | 2000-02-21 | 2001-08-31 | Nippon Circuit Kogyo Kk | フリップチップボールグリッドアレイ基板及びその製造法 |
JP2012099642A (ja) | 2010-11-02 | 2012-05-24 | Hitachi Metals Ltd | 半導体装置、それを用いた電子部品およびそれらの製造方法 |
JP2016058594A (ja) | 2014-09-11 | 2016-04-21 | 株式会社日立製作所 | 半導体装置、並びにそれを用いたオルタネータ及び電力変換装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7466244B1 (ja) | 2023-03-29 | 2024-04-12 | 株式会社エス・アイ・ルネス | 建物の床面レベルの調整方法 |
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Publication number | Publication date |
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CN115668483A (zh) | 2023-01-31 |
JPWO2021234892A1 (ja) | 2021-11-25 |
WO2021234892A1 (ja) | 2021-11-25 |
DE112020007225T5 (de) | 2023-03-09 |
US20230164915A1 (en) | 2023-05-25 |
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