JP7228468B2 - プリント配線基板の製造方法 - Google Patents
プリント配線基板の製造方法 Download PDFInfo
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
Description
(1)第1の処理工程
CmH(2m+1)-(OC2H4)n-OH(m=1~4の整数、n=1~4の整数)で表されるエチレン系グリコールエーテル、および/またはCxH(2x+1)-(OC3H6)y-OH(x=1~4の整数、y=1~3の整数)で表されるプロピレン系グリコールエーテルと、を含み、pHが7以上である第1の処理液で処理する工程。
(2)第2の処理工程
上記第1の処理工程の後、アミン系シランカップリング剤を含み、pHが7.0以上である第2の処理液で処理する工程。
[1]樹脂基板に無電解めっきを行なって、プリント配線基板を製造する方法であって、
前記無電解めっきの前に、下記第1A工程または第1B工程と、下記第2工程を、順次含むことを特徴とするプリント配線基板の製造方法。
第1A工程:前記樹脂基板の表面に350nm以下の紫外線を照射し、表面粗さRaを0.2μm以下とする工程。
第1B工程:前記樹脂基板に膨潤、50~70℃で1~10分間の粗化、中和を順次行い、表面粗さRaを0.2μm以下とする工程。
第2工程:
アミノ基を有するシランカップリング剤と;C4H9-(OC2H4)n-OH(n=1~4の整数)で表されるエチレン系グリコールブチルエーテル、および/またはC4H9-(OC3H6)n-OH(n=1~4の整数)で表されるプロピレン系グリコールブチルエーテルを用いて、pH3~10にて処理する工程。
[2]前記第2工程の後、無電解めっきの前に、120℃以上で加熱処理する工程を含む上記[1]に記載のプリント配線基板の製造方法。
第1B工程では、膨潤処理、50~70℃で1~10分間の粗化処理、中和処理を行なう。粗化処理の温度が70℃を超えるとRaが高くなってしまう。また、温度が上記範囲であっても処理時間が長いと、やはりRaが高くなってしまう。好ましくは60℃である。
第1A工程では、樹脂基板の表面に350nm以下の紫外線を照射する。本発明者らの検討結果によれば、350nm超の紫外線を照射すると、めっき密着性が低下することが判明した(後記する実施例を参照)。好ましい上限は300nmである。また、好ましい下限は160nmであり、より好ましくは172nmである。
上記工程の後、第2工程を行う。この第2工程では、アミノ基を有するシランカップリング剤と;C4H9-(OC2H4)n-OH(n=1~4の整数)で表されるエチレン系グリコールブチルエーテル、および/またはC4H9-(OC3H6)n-OH(n=1~4の整数)で表されるプロピレン系グリコールブチルエーテルと;を含有する処理液を用いて、pH3~10下にて処理する。
また、上記プロピレン系グリコールブチルエーテルとしては、プロピレングリコールブチルエーテル(n=1)、ジプロピレングリコールブチルエーテル(n=2)、トリプロピレングリコールブチルエーテル(n=3)、テトラプロピレングリコールブチルエーテル(n=4)が挙げられる。
本発明では、上記第2工程の後、無電解めっきの前に、120℃以上の加熱処理を行なっても良い。加熱処理により、めっき密着性が一層向上する。好ましくは130℃以上、より好ましくは140℃以上である。また、その上限は、ガラス転移温度などを考慮すると、おおむね180℃以下であることが好ましい。また加熱時間は所望の作用が有効に発揮される限り特に限定されないが、おおむね、5~30分の範囲に制御することが好ましい。
ここでは、表1および表2に示す手順に従って試料を作製し、本発明で規定する第1A工程(紫外線照射)と第2工程の有用性を検討した。
上記処理液のpHは表1に示すとおりであり、必要に応じて所定のpHとなるように表1に示すpH調整剤を用いた。表1において「pH調整剤」の欄がなしとは、pH調整剤を添加することなしに表1に記載のpHに調整されたことを意味する。
比較のため、グリコールエーテルおよびシランカップリング剤のいずれか一方を添加しなかったものも用意した。
上記試料に1cm幅の切り込みを入れ、JIS-C5012「8.5 めっき密着性」に記載の方法に基づき、90°剥離試験を行ない、ピール強度を測定した。ピール強度は、島津製作所製AUTOGRAPH AGS-Xを用いて測定した。
本実施例では、目視で外観を確認して安定性を評価した。
本実施例では、フェルト沈降法により処理液の浸透性を評価した。浸透性評価のため、縦20mm×横20mm×厚さ3mmのサイズにカットしたフェルト(米島フェルト産業株式会社製JA 3t)を準備した。
また上記例で用いたグリコールブチルエーテルはいずれも、安定性および浸透性が良好であった。
ここでは、表4および表5に示す手順に従って試料を作製し、本発明で規定する第1B工程(デスミア処理の改変)と第2工程の有用性を検討した。
比較のため、シランカップリング剤を添加しなかったものも用意した。
また上記例で用いたグリコールブチルエーテルはいずれも、安定性および浸透性が良好であった。
Claims (1)
- 樹脂基板に無電解めっきを行なって、プリント配線基板を製造する方法であって、
前記無電解めっきの前に、下記第1A工程または第1B工程と、下記第2工程を、順次含むことを特徴とするプリント配線基板の製造方法。
第1A工程:前記樹脂基板の表面に350nm以下の紫外線を照射し、表面粗さRaを0.2μm以下とする工程。
第1B工程:前記樹脂基板に膨潤、50~70℃で1~10分間の粗化、中和を順次行い、表面粗さRaを0.2μm以下とする工程。
第2工程:
アミノ基を有するシランカップリング剤と;C4H9-(OC2H4)n-OH(n=1~4の整数)で表されるエチレン系グリコールブチルエーテル、および/またはC4H9-(OC3H6)n-OH(n=1~4の整数)で表されるプロピレン系グリコールブチルエーテルを用いて、pH3~10にて処理する工程。
加熱処理工程:
前記第2工程の後、無電解めっきの前に、120℃以上で加熱処理する工程。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019099302A JP7228468B2 (ja) | 2019-05-28 | 2019-05-28 | プリント配線基板の製造方法 |
US16/881,427 US11421325B2 (en) | 2019-05-28 | 2020-05-22 | Method for producing a printed wiring board |
KR1020200062856A KR20200136831A (ko) | 2019-05-28 | 2020-05-26 | 프린트 배선 기판의 제조 방법 |
TW109117442A TW202106926A (zh) | 2019-05-28 | 2020-05-26 | 印刷配線基板之製造方法 |
CN202010459837.8A CN112011789A (zh) | 2019-05-28 | 2020-05-27 | 印刷电路板的制备方法 |
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CN113293362B (zh) * | 2021-05-25 | 2022-02-11 | 吉安宏达秋科技有限公司 | 一种化学镀铜膨松液及其制备方法和应用 |
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