JP7225746B2 - 半導体装置の製造方法及び半導体装置 - Google Patents
半導体装置の製造方法及び半導体装置 Download PDFInfo
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- JP7225746B2 JP7225746B2 JP2018229625A JP2018229625A JP7225746B2 JP 7225746 B2 JP7225746 B2 JP 7225746B2 JP 2018229625 A JP2018229625 A JP 2018229625A JP 2018229625 A JP2018229625 A JP 2018229625A JP 7225746 B2 JP7225746 B2 JP 7225746B2
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Description
第1の実施の形態の半導体装置について、図1を用いて説明する。図1は、第1の実施の形態の半導体装置の製造方法を説明するための図である。なお、図1(A)~図1(C)は、半導体装置の製造方法に含まれる工程を説明するための図である。また、図1(D),(E)は、そのような工程を経て製造された半導体装置をそれぞれ示している。
第2の実施の形態では、第1の実施の形態についてより具体的に説明する。このような半導体装置について、図2~図5を用いて説明する。図2は、第2の実施の形態の半導体装置の平面図であり、図3~図5は、第2の実施の形態の半導体装置の断面図である。なお、図2では、封止部材の図示を省略している。図3は、図2の一点鎖線X1-X1における断面図、図4は、図2の一点鎖線X2-X2における断面図、図5は、図2の一点鎖線Y-Yにおける断面図をそれぞれ表している。
2,2a 基板
3,6 樹脂ケース
3a,6a 筐体
3b,6b 底面
3c,6c 第1開口
3d,6d,32b 収納空間
3e,6e 注入経路
4,40,42 封止部材
5,7,10 半導体装置
20 半導体ユニット
21 第1半導体チップ
22 第2半導体チップ
23 回路パターン
24 絶縁基板
25 放熱板
26 接着剤
30 樹脂ケース
31 枠体
32a 収納開口部
32c 第1リード領域
32d 第2リード領域
33~36 リード端子
37 制御IC
38 ゲート
41 タブレット樹脂
50 リード部品
51 連係部材
52 型取部材
52a 傾斜面
60 封止装置
61 載置面
62 ヒータ
63 ポット
64 プランジャ
65 ランナ
66 固定部材
Claims (11)
- 半導体チップが主面に設けられた基板と、前記半導体チップが収納される収納空間を取り囲む筐体を備え、前記筐体の側壁に前記収納空間から外部空間に通じる注入経路が形成され、前記筐体の底面に前記収納空間から前記外部空間に通じる第1開口が形成された樹脂ケースと、を準備する準備工程と、
前記樹脂ケースの前記第1開口に前記基板を取り付けて前記収納空間に前記半導体チップを収納する取り付け工程と、
前記注入経路から封止部材を注入して、前記収納空間を封止する封止工程と、
を有し、
前記準備工程において、
前記樹脂ケースの外形に対応する型が形成されたケース金型に対して棒状の型取部材を含んで前記ケース金型の内部に、前記樹脂ケースを構成する成形部材を注入し、
前記成形部材を固化し、
前記ケース金型を分離し、
前記型取部材を引き抜いて、前記注入経路を備える前記樹脂ケースを構成する、
半導体装置の製造方法。 - 前記注入経路は、前記筐体において、前記主面と平行に形成されている、
請求項1に記載の半導体装置の製造方法。 - 前記樹脂ケースは、前記底面に対向する上面に前記収納空間に通じる第2開口を有し、
前記封止工程において、前記上面から前記第2開口を型で覆って、前記封止部材で前記収納空間を封止する、
請求項1または2に記載の半導体装置の製造方法。 - 前記樹脂ケースは、前記底面に、前記第1開口の周囲に段差を有する基板接合領域を備え、
前記取り付け工程において、前記基板接合領域に、前記基板を取り付ける、
請求項1乃至3のいずれかに記載の半導体装置の製造方法。 - 前記樹脂ケースは、前記側壁を貫いて、一端が前記外部空間に、他端が前記収納空間に配置される外部接続端子をさらに備える、
請求項1に記載の半導体装置の製造方法。 - 前記準備工程において、
前記型取部材と前記外部接続端子とが連係部材により一体化された状態で、前記型取部材と前記外部接続端子を前記ケース金型に含んで前記ケース金型の内部に前記成形部材を注入し、
前記成形部材を固化し、前記ケース金型を分離し、
前記筐体と、前記筐体とそれぞれ一体化した前記型取部材及び前記外部接続端子と、を備えた前記樹脂ケースを、前記ケース金型から取り出した後、
前記連係部材を切断して、前記型取部材を引き抜いて、
前記樹脂ケースを形成する、
請求項5に記載の半導体装置の製造方法。 - 半導体チップが主面に設けられた基板と、前記半導体チップが収納される収納空間を取り囲む筐体を備え、前記筐体の側壁に前記収納空間から外部空間に通じる注入経路が形成され、前記筐体の底面に前記収納空間から前記外部空間に通じる第1開口が形成された樹脂ケースと、を準備する準備工程と、
前記樹脂ケースの前記第1開口に前記基板を取り付けて前記収納空間に前記半導体チップを収納する取り付け工程と、
前記注入経路から封止部材を注入して、前記収納空間を封止する封止工程と、
を有し、
前記注入経路は、前記筐体において、前記収納空間から前記外部空間まで前記主面と平行に形成されている、
半導体装置の製造方法。 - 半導体チップと、
前記半導体チップが主面に設けられた基板と、
前記半導体チップが収納される収納空間を取り囲む筐体を備え、前記筐体の側壁に前記収納空間から外部空間に通じる注入経路と前記筐体の底面に前記収納空間から前記外部空間に通じる第1開口と前記側壁を貫いて、一端が前記外部空間に、他端が前記収納空間に配置される外部接続端子とを有し、前記注入経路と前記外部接続端子とが並んでいる樹脂ケースと、
前記樹脂ケースの前記収納空間及び前記注入経路に充填された封止部材と、
を有する半導体装置。 - 前記樹脂ケースは、前記底面に対向する上面に前記収納空間から前記外部空間に通じる第2開口を有し、
前記封止部材は、さらに、前記第2開口に充填されている、
請求項8に記載の半導体装置。 - 前記樹脂ケースは、前記底面に、前記第1開口の周囲に段差を有する基板接合領域を備え、前記基板接合領域に前記基板が配置されている、
請求項8または9に記載の半導体装置。 - 半導体チップと、
前記半導体チップが主面に設けられた基板と、
前記半導体チップが収納される収納空間を取り囲む筐体を備え、前記筐体の側壁に前記収納空間から外部空間に通じ、前記収納空間から前記外部空間まで前記主面と平行に形成されている注入経路と前記筐体の底面に前記収納空間から前記外部空間に通じる第1開口とを有する樹脂ケースと、
前記樹脂ケースの前記収納空間及び前記注入経路に充填された封止部材と、
を有する半導体装置。
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