JP7155205B2 - 三次元プリンティングのための装置、システムおよび方法 - Google Patents
三次元プリンティングのための装置、システムおよび方法 Download PDFInfo
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- JP7155205B2 JP7155205B2 JP2020130547A JP2020130547A JP7155205B2 JP 7155205 B2 JP7155205 B2 JP 7155205B2 JP 2020130547 A JP2020130547 A JP 2020130547A JP 2020130547 A JP2020130547 A JP 2020130547A JP 7155205 B2 JP7155205 B2 JP 7155205B2
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- B23K2103/00—Materials to be soldered, welded or cut
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Description
本出願は2013年4月29日に出願された米国仮出願第61/817,311号に基づく優先権を主張し、当該米国仮出願に記載された全ての記載内容を援用するものである。
本書で言及されている全ての出版物、特許、及び特許出願は、各個別の出版物、特許、又は特許出願が特定的に且つ個別に、参照することによって組み込まれると記載されているのと同じ程度まで、参照することによってここに組み込まれる。
この開示は、物体(又は部分)のコンピューターデザインからの直接的作成において、材料を溶融又は除去するために方向づけられたエネルギーを材料の層に当てるための装置、システム及び方法を提供する。これは、三次元物体を層ごとのやりかたで作成即ちプリントすることに使用することができる。本書で提供される方法は粉末材料の機構部品としての硬化を完遂させたり、硬化を完遂するために後処理が必要な部品として結合剤を融解したりすることに使用することができる。
(制御システム)
(実施例)
Claims (24)
- 部品を成形するシステムであって、
a.400nmより長く750nmより短い波長と少なくとも100Wの出力とを有する可視光のビームを発生するレーザー光源と、
b.前記ビームと光学連通している金属の固形基材を保持するための部位と、
c.前記レーザー光源の下流にあるスキャニングモジュールであって、前記ビームの前記部位に対するスキャニング動作を発生するように構成されており、前記スキャニング動作は前記部品のための予め定められたパターンに対応している、スキャニングモジュールと、
d.前記レーザー光源及び前記スキャニングモジュールと動作的に接続されたコンピューター制御システムであって、(i)前記スキャニング動作を制御し、(ii)前記部位における前記ビームの出力を制御するようにされたコンピューター制御システムと、
を備え、
e.当該システムは、前記部位における前記ビームが、70μm以下のスポットサイズの単一のスポットを形成して、前記金属の固形基材を熔解、軟化、又はその両方をして前記金属の固形基材から前記部品を形成するようにされた、システム。 - 部品を形成するシステムであって、
a.複数のレーザービームレットを発生する複数のレーザーダイオード、及び前記複数のレーザービームレットを結合させて400nmより長く750nmより短い波長を有する可視光のビームを提供するための手段、を有するレーザー光源と、
b.前記ビームと光学連通している金属の固形基材を保持するための部位であって、前記ビームが当該部位において少なくとも100Wの出力を有する、部位と、
c.前記レーザー光源の下流にあるスキャニングモジュールであって、前記ビームの前記部位に対するスキャニング動作を発生するように構成されており、前記スキャニング動作は前記部品のための予め定められたパターンに対応している、スキャニングモジュールと、
d.前記レーザー光源及び前記スキャニングモジュールと動作的に接続されたコンピューター制御システムであって、(i)前記スキャニング動作を制御し、(ii)前記部位における前記ビームの出力を制御するようにされたコンピューター制御システムと、
を備え、
e.当該システムは、前記部位における前記ビームが、70μm以下のスポットサイズの単一のスポットを形成して、前記金属の固形基材を熔解、軟化、又はその両方をして前記金属の固形基材から前記部品を形成するようにされた、システム。 - 前記金属の固形基材が、アルミニウム、鉄鋼、チタニウム、銅、青銅、金、及びこれら材料の合金からなる群から選択された、請求項1又は2に記載のシステム。
- 前記波長が青色である、請求項1乃至3のいずれか一項に記載のシステム。
- 前記ビームの出力が200Wより大きい、請求項1乃至4のいずれか一項に記載のシステム。
- 前記ビームの出力が500Wより大きい、請求項1乃至4のいずれか一項に記載のシステム。
- 前記ビームの出力が1000Wより大きい、請求項1乃至4のいずれか一項に記載のシステム。
- 表面粗さが透過電子顕微鏡法で測定して0.1nmから50nmの前記部品を形成するようにされた、請求項1乃至7のいずれか一項に記載のシステム。
- 表面粗さが透過電子顕微鏡法で測定して0.1nmから10nmの前記部品を形成するようにされた、請求項1乃至7のいずれか一項に記載のシステム。
- 前記ビームが高輝度である、請求項1乃至9のいずれか一項に記載のシステム。
- 前記ビームが前記部位において高輝度である、請求項10に記載のシステム。
- 前記ビームが1.0より大きいM2と単一横モードとを有する、請求項1乃至11のいずれか一項に記載のシステム。
- 前記ビームが1.1より大きいM2と単一横モードとを有する、請求項1乃至11のいずれか一項に記載のシステム。
- 前記ビームがシングルモードである、請求項1乃至13のいずれか一項に記載のシステム。
- 前記ビームが前記部位においてシングルモードである、請求項14に記載のシステム。
- 前記部位に焦平面を有する、請求項1乃至15のいずれか一項に記載のシステム。
- 前記部位における前記ビームが、35μm、70μm、及び1μm未満からなる群から選択されたスポットサイズを有するようにされた、請求項1乃至16のいずれか一項に記載のシステム。
- 前記コンピューター制御システムによる前記出力の制御が、前記ビームを変調することを含む、請求項1乃至17のいずれか一項に記載のシステム。
- 前記変調の速度が、50kHz、100kHz、200kHz、300kHz、400kHz、500kHz、1GHz、2GHz、3GHz、4GHz、5GHz、及び10GHzの群から選択された、請求項18に記載のシステム。
- 前記部位がビルドボリュームを画定し、当該システムは、あるビルド速度を提供し、且つある表面粗さを有する前記部品を形成するようにされており、当該システムにおける前記可視光のビームに代えてIR波長のビームを有することを除いて当該システムと同一である別のシステムと比較したときに、(i)前記ビルド速度が前記別のシステムよりも2.5倍以上速い、(ii)前記ビルドボリュームが前記別のシステムよりも150倍以上大きい、及び(iii)前記表面粗さが前記別のシステムよりも2倍以上よい、ことのうちの少なくとも一つをなし得るようにされている、請求項1乃至19のいずれか一項に記載のシステム。
- 前記部位がビルドボリュームを画定し、当該システムは、あるビルド速度を提供し、且つある表面品質を有する前記部品を形成するようにされており、当該システムにおける前記可視光のビームに代えてIR波長のビームを有することを除いて当該システムと同一である別のシステムと比較したときに、(i)前記ビルド速度が前記別のシステムよりも速い、(ii)前記ビルドボリュームが前記別のシステムよりも大きい、及び(iii)前記表面品質が前記別のシステムよりもよい、ことのうちの少なくとも二つをなし得るようにされている、請求項1乃至19のいずれか一項に記載のシステム。
- 部品を形成するシステムであって:
a.青色の波長と少なくとも500Wの出力を有する青色のビームを発生するレーザー光源と、
b.前記ビームと光学連通している金属の固形基材を保持するための部位であって、前記金属の固形基材はアルミニウム、ニッケル、鉄鋼、チタニウム、銅、青銅、金、及びこれら材料の合金からなる群から選択されている、部位と、
c.前記レーザー光源の下流にあるスキャニングモジュールであって、前記ビームの前記部位に対するスキャニング動作を発生するように構成されており、前記スキャニング動作は予め定められたパターンに対応している、スキャニングモジュールと、
d.前記レーザー光源及び前記スキャニングモジュールと動作的に接続されたコンピューター制御システムであって、(i)前記スキャニング動作を制御し、(ii)前記部位における前記ビームを変調するするようにされたコンピューター制御システムと、
を備え、
e.当該システムは、前記部位における前記ビームが、70μm以下のスポットサイズの単一のスポットを形成して、前記金属の固形基材を溶解、軟化、又はその両方をして前記金属の固形基材から前記部品を形成するようにされ、
f.当該システムがビルドボリュームを画定し、当該システムは、あるビルド速度を提供し、且つある表面粗さを有する前記部品を形成するようにされており、当該システムにおける前記青色のビームに代えてIR波長のビームを有することを除いて当該システムと同一である別のシステムと比較したときに、(i)前記ビルド速度が前記別のシステムよりも速い、(ii)前記ビルドボリュームが前記別のシステムよりも大きい、及び(iii)前記表面粗さが前記別のシステムよりもよい、ことのうちの少なくとも二つをなし得るようにされている、システム。 - 前記ビームの出力が1000Wより大きい、請求項22に記載のシステム。
- 前記レーザー光源が、複数のレーザービームレットを発生させる複数のレーザーダイオードと、前記複数のレーザービームレットを結合させて前記青色のビームを提供するための手段とを備える、請求項22又は23に記載のシステム。
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