JP7142425B2 - インタポーザ組立体 - Google Patents
インタポーザ組立体 Download PDFInfo
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- JP7142425B2 JP7142425B2 JP2017204566A JP2017204566A JP7142425B2 JP 7142425 B2 JP7142425 B2 JP 7142425B2 JP 2017204566 A JP2017204566 A JP 2017204566A JP 2017204566 A JP2017204566 A JP 2017204566A JP 7142425 B2 JP7142425 B2 JP 7142425B2
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- contact
- interposer
- wall surface
- electronic component
- contact arrangement
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1432—Central processing unit [CPU]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
互いに平行な上面および下面を有し、互いに向き合う第1壁面および第2壁面を形成してそれら上面および下面間に貫通する複数のコンタクト配置孔が形成されたハウジングと、
無負荷時の上下寸法が上面および下面間の厚み寸法よりも長く、コンタクト配置孔の各々に挿し込まれ、第2壁面から離間しつつ、上面に向かって第1の電子部品が押圧されるとともに下面に向かって第2の電子部品が押圧されてコンタクト配置孔内で弾性的に変形し、第1の電子部品と第2の電子部品との間を電気的に繋ぐ複数のインタポーザコンタクトとを備え、
複数のインタポーザコンタクトの各々が、
上下方向に対し交わる幅方向両側に突き出た一対の肩部を有し第1壁面寄りに配置される基部と、
基部の上下両端の各々を起点とし第1壁面側に一旦膨らんでから第2壁面に接触しないように第2壁面に近づく向きに湾曲し上下の各頂点を経由して互いに近づく向きにまで延びた一対の接触アーム部とを有し、
上記ハウジングが、
複数のコンタクト配置孔の各々に形成された、上面からの一対の肩部各々の挿入を許すとともにコンタクト配置孔内に挿し込まれたインタポーザコンタクトの第2壁面側への移動を阻止する一対のスリット部と、
複数のコンタクト配置孔の各々の第1壁面に形成された、コンタクト配置孔内に配置されたインタポーザコンタクトの基部に向かって突き出てインタポーザコンタクトのコンタクト配置孔からの抜けを抑える抜止突部とを備え、
スリット部のうち肩部が配置される部分の、第1壁面と第2壁面とを結ぶ前後方向の幅が肩部の厚みよりも幅広であって、肩部が前後方向および上下方向に、第1の電子部品および第2の電子部品に挟まれる際のインタポーザコンタクトの姿勢調整用の遊びを持ってスリット部に挿入されていることを特徴とする。
20 ハウジング
20A 上面
20B 下面
21 コンタクト配置孔
211 第1壁面
211a 抜止突部
211b 斜面
211c 続く段部
212 第2壁面
213 スリット
214 係止部
30 インタポーザコンタクト
31 基部
311 肩部
32 接触アーム部
321 頂点
322 端点
Claims (3)
- 互いに平行な上面および下面を有し、互いに向き合う第1壁面および第2壁面を形成して該上面および該下面間に貫通する複数のコンタクト配置孔が形成されたハウジングと、
無負荷時の上下寸法が前記上面および前記下面間の厚み寸法よりも長く、前記コンタクト配置孔の各々に挿し込まれ、前記第2壁面から離間しつつ、前記上面に向かって第1の電子部品が押圧されるとともに前記下面に向かって第2の電子部品が押圧されて該コンタクト配置孔内で弾性的に変形し、該第1の電子部品と該第2の電子部品との間を電気的に繋ぐ複数のインタポーザコンタクトとを備え、
前記複数のインタポーザコンタクトの各々が、
上下方向に対し交わる幅方向両側に突き出た一対の肩部を有し前記第1壁面寄りに配置される基部と、
前記基部の上下両端の各々を起点とし前記第1壁面側に一旦膨らんでから前記第2壁面に接触しないように該第2壁面に近づく向きに湾曲し上下の各頂点を経由して互いに近づく向きまで延びた一対の接触アーム部とを有し、
前記ハウジングが、
前記複数のコンタクト配置孔の各々に形成された、前記上面からの前記一対の肩部各々の挿入を許すとともに該コンタクト配置孔内に挿し込まれた前記インタポーザコンタクトの前記第2壁面側への移動を阻止する一対のスリット部と、
前記複数のコンタクト配置孔の各々の前記第1壁面に形成された、該コンタクト配置孔内に配置された前記インタポーザコンタクトの前記基部に向かって突き出て該インタポーザコンタクトの該コンタクト配置孔からの抜けを抑える抜止突部とを備え、
前記スリット部のうち前記肩部が配置される部分の、前記第1壁面と前記第2壁面とを結ぶ前後方向の幅が該肩部の厚みよりも幅広であって、該肩部が該前後方向および上下方向に、前記第1の電子部品および前記第2の電子部品に挟まれる際の前記インタポーザコンタクトの姿勢調整用の遊びを持って該スリット部に挿入されていることを特徴とするインタポーザ組立体。 - 前記一対のスリット部の各々が、前記上面から所定位置まで挿し込まれた前記インタポーザコンタクトの前記肩部に係止して該インタポーザコンタクトの前記下面側への更なる挿込みを阻止する係止部を有することを特徴とする請求項1に記載のインタポーザ組立体。
- 前記インタポーザコンタクトが、無負荷時並びに前記第1の部品および前記第2の部品から押圧を受けている時点のいずれにおいても、前記第2壁面から離間していることを特徴とする請求項1または2に記載のインタポーザ組立体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017204566A JP7142425B2 (ja) | 2017-10-23 | 2017-10-23 | インタポーザ組立体 |
US16/164,006 US10825791B2 (en) | 2017-10-23 | 2018-10-18 | Interposer assembly |
CN201811236106.6A CN109698417B (zh) | 2017-10-23 | 2018-10-23 | 内插器组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017204566A JP7142425B2 (ja) | 2017-10-23 | 2017-10-23 | インタポーザ組立体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019079649A JP2019079649A (ja) | 2019-05-23 |
JP7142425B2 true JP7142425B2 (ja) | 2022-09-27 |
Family
ID=66170719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017204566A Active JP7142425B2 (ja) | 2017-10-23 | 2017-10-23 | インタポーザ組立体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10825791B2 (ja) |
JP (1) | JP7142425B2 (ja) |
CN (1) | CN109698417B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7427382B2 (ja) | 2019-07-23 | 2024-02-05 | タイコエレクトロニクスジャパン合同会社 | インターポーザ |
JP7365099B2 (ja) | 2019-07-23 | 2023-10-19 | タイコエレクトロニクスジャパン合同会社 | インターポーザ |
CN112186387B (zh) * | 2019-10-07 | 2022-04-22 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN114069303B (zh) * | 2021-10-19 | 2023-09-22 | 番禺得意精密电子工业有限公司 | 电连接器及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6315576B1 (en) | 1997-10-30 | 2001-11-13 | Intercon Systems, Inc. | Interposer assembly |
JP2005222924A (ja) | 2004-02-06 | 2005-08-18 | Hon Hai Precision Industry Co Ltd | ソケットコネクタ |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2861663B2 (ja) | 1992-08-31 | 1999-02-24 | 富士通株式会社 | インターポーザコネクタ |
US6217342B1 (en) * | 1997-10-30 | 2001-04-17 | Intercon Systems, Inc. | Interposer assembly |
US6290507B1 (en) | 1997-10-30 | 2001-09-18 | Intercon Systems, Inc. | Interposer assembly |
TW529208B (en) * | 2000-10-13 | 2003-04-21 | J S T Mfg Co Ltd | Electric connector and electric connector with cap |
US6730134B2 (en) | 2001-07-02 | 2004-05-04 | Intercon Systems, Inc. | Interposer assembly |
US6832917B1 (en) | 2004-01-16 | 2004-12-21 | Intercon Systems, Inc. | Interposer assembly |
TWI282645B (en) * | 2004-04-16 | 2007-06-11 | Hon Hai Prec Ind Co Ltd | Electrical contact |
KR20060016726A (ko) * | 2004-08-18 | 2006-02-22 | 에스에무케이 가부시키가이샤 | 커넥터 |
JP4240401B2 (ja) * | 2004-08-18 | 2009-03-18 | Smk株式会社 | コネクタ |
CN2779655Y (zh) * | 2005-03-29 | 2006-05-10 | 番禺得意精密电子工业有限公司 | 电连接器 |
JP3964440B2 (ja) * | 2005-10-07 | 2007-08-22 | タイコエレクトロニクスアンプ株式会社 | コンタクト及び電気コネクタ |
CN100502152C (zh) * | 2005-11-21 | 2009-06-17 | Smk株式会社 | 连接器 |
CN2917029Y (zh) * | 2006-03-14 | 2007-06-27 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
TWI336544B (en) * | 2006-06-05 | 2011-01-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP4973988B2 (ja) * | 2006-06-12 | 2012-07-11 | 山一電機株式会社 | コンタクト及びこれを用いたicソケット |
US7341485B2 (en) * | 2006-07-24 | 2008-03-11 | Hon Hai Precision Ind. Co., Ltd. | Land grid array socket |
CN201285839Y (zh) * | 2008-08-21 | 2009-08-05 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP4911735B2 (ja) * | 2009-08-18 | 2012-04-04 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
US9172161B2 (en) * | 2012-12-12 | 2015-10-27 | Amphenol InterCon Systems, Inc. | Impedance controlled LGA interposer assembly |
CN105098413B (zh) * | 2014-04-17 | 2017-09-29 | 泰科电子(上海)有限公司 | 端子、电连接器、以及电连接器组件 |
US9425525B2 (en) * | 2014-09-22 | 2016-08-23 | Amphenol InterCon Systems, Inc. | Interposer assembly and method |
CN206364218U (zh) * | 2016-12-20 | 2017-07-28 | 番禺得意精密电子工业有限公司 | 电连接器 |
-
2017
- 2017-10-23 JP JP2017204566A patent/JP7142425B2/ja active Active
-
2018
- 2018-10-18 US US16/164,006 patent/US10825791B2/en active Active
- 2018-10-23 CN CN201811236106.6A patent/CN109698417B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6315576B1 (en) | 1997-10-30 | 2001-11-13 | Intercon Systems, Inc. | Interposer assembly |
JP2005222924A (ja) | 2004-02-06 | 2005-08-18 | Hon Hai Precision Industry Co Ltd | ソケットコネクタ |
Also Published As
Publication number | Publication date |
---|---|
JP2019079649A (ja) | 2019-05-23 |
CN109698417A (zh) | 2019-04-30 |
CN109698417B (zh) | 2023-10-27 |
US20190123013A1 (en) | 2019-04-25 |
US10825791B2 (en) | 2020-11-03 |
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