JP7139861B2 - 絶縁ゲート型バイポーラトランジスタ - Google Patents
絶縁ゲート型バイポーラトランジスタ Download PDFInfo
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Description
本発明の実施形態に係るIGBTは、図1に示すように、平面パターンで主面の大部分を占める活性領域100、及び活性領域100の内側に設けられた矩形状の電流センスセル101と、を備えるトレンチゲート型のIGBTである。活性領域100及び電流センスセル101は1枚の半導体チップの上に搭載され、活性領域100及び電流センスセル101の周囲には、外縁が矩形状で額縁型のエッジ102が、IGBTの耐圧構造領域として設けられている。
複数のp+型のベースコンタクト領域4gとが交互に配置されている。複数のエミッタ領
域3aのゲートトレンチ及びダミートレンチの長手方向の幅wnは1.0μm~2.0μm程度、複数のベースコンタクト領域4gのゲートトレンチ及びダミートレンチの長手方向の幅wpは0.5μm~1.5μm程度に設定できる。図3中に点線で囲まれた領域内に例示された検出領域101aの内側では、4本のゲートトレンチ12f,12h,12j,12l及び3本のダミートレンチ12g,12i,12kは、複数のエミッタ領域3aに接する部分を含み、エミッタ電位に接続される。
領域2a7及びベース領域2a1に挟まれるように設けられ、キャリアを蓄積してベース領域2a1及びベース領域2a7下部の抵抗を低減させることができ、電子電流をより多く流すことができる。蓄積層5aは、例えばドリフト層1の表面からn型不純物を導入することで実現できる。尚、蓄積層5aが無く、蓄積層5aの上面の位置でドリフト層1の上面がベース領域2a7及びベース領域2a1に接してもよい。
ース領域2b及びエミッタ領域3bを貫通するゲートトレンチが複数本設けられ、それぞれのゲートトレンチの上には層間絶縁膜を介して、エミッタ電極9bがエミッタ領域3b及びベースコンタクト領域4bに接して設けられている。
n+型のエミッタ領域の下辺に沿って延びる水平な仮想線を使用できる。また「引抜領域
」に関しては、平面パターンで、トレンチの並設方向における両端のそれぞれの最外側に位置するゲートトレンチに囲まれた領域として定義できる。
一方、図7に示すように、検出領域201a及び検出領域201aの周囲に設けられた引抜領域201bを有する電流センスセル201を備えたIGBTを比較例として用意した。比較例に係るIGBTの場合、引抜領域201bの面積は、本発明の実施形態における4倍より小さい、検出領域201aの面積の2.5倍程度に抑えられている。また図8に示すように、比較例に係るIGBTでは、引抜領域201bのウェル領域10zの幅wbが、活性領域100のウェル領域11zの幅waの約1/3以下と、狭く構成されている。
本発明の実施形態に係るIGBTは、ウェル領域10aが、エミッタ領域3aと重ならない限り、図10に示すように、ウェル領域10aが検出領域101aと第1引抜領域101bとの境界に位置するゲートトレンチ12fの底部まで延びてもよい。図10中には、ウェル領域10aの検出領域101a側となる内側の端部が、ゲートトレンチ12fの底部の右端に位置した場合の変形例に係るIGBTの内部が例示されている。変形例に係るIGBTの他の構造については、本発明の実施形態に係るIGBTにおける同名の部材とそれぞれ等価であるため重複説明を省略する。変形例に係るIGBTによれば、エミッタ領域3aと重ならない限界の境界位置までウェル領域10aの幅を拡げることで、ゲート-コレクタ間容量Cgcの低減効果を最大化できる。変形例に係るIGBTの他の効果については、本発明の実施形態に係るIGBTの場合と同様である。
本発明は上記の開示した実施形態によって説明したが、この開示の一部をなす論述及び図面は、本発明を限定するものであると理解すべきではない。本開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかになると考えられるべきである。
2a1,2a7 ベース領域
2b ベース領域
3a,3b エミッタ領域
4a,4b,4g ベースコンタクト領域
5a,5b 蓄積層
6a,6b 第1境界層間絶縁膜
7a,7b ゲート配線
8a,8b 第2境界層間絶縁膜
9a,9b エミッタ電極
10,10a,10z ウェル領域
11,11z ウェル領域
12a,12f,12h,12j,12l ゲートトレンチ(第1のトレンチ)
12g,12i,12k ダミートレンチ(第2のトレンチ)
13a,13f 第1の絶縁膜(ゲート絶縁膜)
13g 第2の絶縁膜
14a,14f ゲート電極
14g ダミー電極
15f 層間絶縁膜
15g,15i,15k ダミーコンタクトパッド
16a,16b 連結トレンチ
17f,17h,17j,17l ゲートトレンチ
18f ゲート絶縁膜
19f ゲート電極
20 ゲートランナー
26 コレクタ電極
100 活性領域
101 電流センスセル
101a 検出領域
101b 第1引抜領域
101c 第2引抜領域
102 エッジ
110 ゲートパッド
111 センスパッド
201 電流センスセル
201a 検出領域
201b 引抜領域
w1,w2,w3 電流センスセルと活性領域との間隔
wa,wb ウェル領域の幅
wn エミッタ領域の幅
wp ベースコンタクト領域の幅
wt トレンチ間隔
Claims (9)
- n型のドリフト層と、
前記ドリフト層の表面層に設けられたp型のベース領域と、
前記ベース領域の表面層に設けられた、前記ドリフト層よりも高不純物密度のn型のエミッタ領域と、
前記ベース領域及び前記エミッタ領域を貫通する第1のトレンチの内側に第1の絶縁膜を介して埋め込まれたゲート電極と、
前記ドリフト層の下部に設けられたp型のコレクタ領域と、を有する電流センスセルを備え、
前記電流センスセルは、
前記第1のトレンチのうち前記エミッタ領域に接する部分が含まれ、活性領域に流れる電流を検出する検出領域と、
前記検出領域の周囲に配置され、前記第1のトレンチのうち前記エミッタ領域と接しない部分が含まれ、かつ、前記ドリフト層の表面層に前記第1のトレンチより深く、前記ベース領域よりも高不純物密度のp型の第1のウェル領域を有し、前記第1のウェル領域によって前記コレクタ領域から流れるホール電流を引き抜く引抜領域と、を備え、
平面パターンで、前記引抜領域の面積が前記検出領域の面積の4倍以上、10000倍以下である
ことを特徴とする絶縁ゲート型バイポーラトランジスタ。 - 前記電流センスセルは、前記ベース領域及び前記エミッタ領域を貫通する第2のトレンチの内側に第2の絶縁膜を介して埋め込まれゲート電位以外の電位が接続されるダミー電極を更に備え、
前記第2のトレンチが前記検出領域に含まれていることを特徴とする請求項1に記載の絶縁ゲート型バイポーラトランジスタ。 - 前記引抜領域は、平面パターンで、前記検出領域の周囲を囲む第1引抜領域と、前記第1のトレンチ及び前記第2のトレンチの延びる方向に前記第1引抜領域と隙間を空けて設けられた第2引抜領域と、を備えることを特徴とする請求項2に記載の絶縁ゲート型バイポーラトランジスタ。
- 前記第1引抜領域において、前記第2のトレンチの前記隙間側の端部は、前記第2のトレンチと並設された前記第1のトレンチの前記隙間側の端部より前記第2引抜領域と反対側に一定距離を空けて離間配置され、
前記第1引抜領域に含まれる前記第1のトレンチの前記隙間側の端部と、前記第2引抜領域に含まれる前記第1のトレンチの前記隙間側の端部とが、前記隙間の上に設けられた帯状のゲートランナーによって同時に接続されていることを特徴とする請求項3に記載の絶縁ゲート型バイポーラトランジスタ。 - 前記ダミー電極はエミッタ電位に接続されることを特徴とする請求項4に記載の絶縁ゲート型バイポーラトランジスタ。
- 前記引抜領域から延びる前記第1のウェル領域の幅が、前記活性領域の端部に設けられ前記第1のウェル領域と隣接する第2のウェル領域の幅の1.5倍以上、300倍以下に設定されていることを特徴とする請求項1~5のいずれか一項に記載の絶縁ゲート型バイポーラトランジスタ。
- 前記第1のウェル領域が、前記検出領域と前記引抜領域との境界に位置する前記第1のトレンチの底部まで延びていることを特徴とする請求項1~6のいずれか一項に記載の絶縁ゲート型バイポーラトランジスタ。
- 前記引抜領域の前記第1のトレンチはゲート電位であることを特徴とする請求項1~7のいずれか一項に記載の絶縁ゲート型バイポーラトランジスタ。
- 前記引抜領域の前記第1のトレンチの底部には、前記第1のウェル領域があることを特徴とする請求項1~8のいずれか一項に記載の絶縁ゲート型バイポーラトランジスタ。
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