JP7125244B2 - プロセスキットリングアダプタ - Google Patents
プロセスキットリングアダプタ Download PDFInfo
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- JP7125244B2 JP7125244B2 JP2021569058A JP2021569058A JP7125244B2 JP 7125244 B2 JP7125244 B2 JP 7125244B2 JP 2021569058 A JP2021569058 A JP 2021569058A JP 2021569058 A JP2021569058 A JP 2021569058A JP 7125244 B2 JP7125244 B2 JP 7125244B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Chemical Vapour Deposition (AREA)
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Description
ブロック918において、第1のプロセスキットリングアダプタは、(例えば、搬送ロボットにより)処理チャンバに搬送される。
(例えば、ファクトリインターフェースロボットのエンドエフェクタによりリフトされることにより)、真空チャックから除去される(処理システムの処理チャンバ内での第2のプロセスキットリングの交換ため)。第2のプロセスキットリングアダプタの下面のフィーチャはエンドエフェクタの上面の凹部と相互接続し、第2のプロセスキットリングアダプタの下面の摩擦パッドはエンドエフェクタの上面と接触することができる。
Claims (20)
- 剛性キャリアを備えたプロセスキットリングアダプタであって、剛性キャリアは、
プロセスキットリングを支持するための第1の遠端部及び第2の遠端部を含む上面と
ウエハを支持するように構成されたエンドエフェクタとインターフェースする第1の領域を含む下面を含み、
下面は真空チャックとインターフェースするように構成された中実の平面中央領域を含み、
プロセスキットリングを支持するプロセスキットリングアダプタは処理システム内でエンドエフェクタ上で搬送されるように構成されたプロセスキットリングアダプタ。 - 上面はほぼ平坦であり、
プロセスキットリングは、ほぼ平坦な上面の上部にスタックされ、
剛性キャリアは、第1の遠端部に近接する上面に配置され、プロセスキットリングの水平方向の動きを防ぐ2つ以上のピンコンタクトを含む、請求項1に記載のプロセスキットリングアダプタ。 - 2つ以上のピンコンタクトが、プロセスキットリングの回転を防止する、請求項2に記載のプロセスキットリングアダプタ。
- 2つ以上のピンコンタクトの各々は第1の摩擦係数を有する傾斜側壁を備え、プロセスキットリングが剛性キャリアの上面の第1の遠端部の目標位置にスライドすることを可能にし、
第1の遠端部は第1の摩擦係数よりも大きい第2の摩擦係数を有し、プロセスキットリングの水平方向の動きを防ぐ、請求項2に記載のプロセスキットリングアダプタ。 - 剛性キャリアの下面に配置された複数の摩擦パッドであって、真空チャックの第1の上面又はエンドエフェクタの第2の上面とインターフェースし、真空チャック又はエンドエフェクタに対するプロセスキットリングアダプタの水平方向の動きを回避する摩擦パッドを備えた、請求項1に記載のプロセスキットリングアダプタ。
- 剛性キャリアは、
プレートと、
プレート上に配置された第1の補強構造を含み、
第1の補強構造は、剛性キャリアの第1の遠端部から、第1の遠端部に対向する剛性キャリアの第2の遠端部まで延びる、請求項1に記載のプロセスキットリングアダプタ。 - 剛性キャリアの第1の遠端部は、第1の補強構造の第1の遠端部であり、
剛性キャリアの第2の遠端部は、第1の補強構造の第2の遠端部であり、
第1の補強構造の第1の遠端部は、プロセスキットを受容するための第1のノッチを形成し、
第1の補強構造の第2の遠端部は、プロセスキットを受容するための第2のノッチを形成する、請求項6に記載のプロセスキットリングアダプタ。 - 下面は、エンドエフェクタとインターフェースするガイドテーパーであるか又はエンドエフェクタと係合する凹部を形成する遠端部を含む、請求項1に記載のプロセスキットリングアダプタ。
- プロセスキットリングアダプタにより形成された1つ以上のスロット、突出したアライメントフィーチャ、又は剛性キャリアの上面に配置された基準であって、プロセスキットリングアダプタのマシンビジョンアライメントを容易にするものを備える請求項1に記載のプロセスキットリングアダプタ。
- プロセスキットリングアダプタは、ウエハをリフトするように構成されたキャリアリフトピンとアライメントする1つ以上のリフトピンインターフェースを備え、
プロセスキットリングアダプタは、プロセスキットリングをプロセスキットリングアダプタからリフトするプロセスキットリングリフトピンとの干渉を回避している間に、プロセスキットリングを支持するように形成されている、請求項1に記載のプロセスキットリングアダプタ。 - プロセスキットリングアダプタは、a)登録フィーチャ側壁を含むプロセスキットリングの内側側壁と、b)プロセスキットリングアダプタとの間にギャップを提供するように構成され、これにより、リボンセンサのビームが剛性にキャリアより遮断されず、プロセスキットリングの登録フィーチャ側壁を検出することが可能になる、請求項1に記載のプロセスキットリングアダプタ。
- プロセスキットリングアダプタであって、
プロセスキットリングを支持するための第1の遠端部及び第2の遠端部を含む第1の補強構造と、
第1の補強構造の下面に結合され、真空チャックとインターフェースする中実の平坦な下面を形成する真空インターフェース構造を含み、
プロセスキットリングを支持するプロセスキットリングアダプタは、処理システム内でエンドエフェクタ上で搬送されるように構成されたプロセスキットリングアダプタ。 - 支持構造を含み、
プロセスキットリングは支持構造上に配置され、支持構造は第1の遠端部及び第2の遠端部に配置され、
支持構造は、円形の内周と、外周を含み、外周は、第1の湾曲したエッジ、第1の湾曲したエッジに対向する第2の湾曲したエッジ、第1の平行なエッジ、及び第1の平行なエッジに平行な第2の平行なエッジを含む、請求項12に記載のプロセスキットリングアダプタ。 - 第1の遠端部が第1のノッチを形成し、第2の遠端部が第2のノッチを形成し、プロセスキットリングが第1のノッチ及び第2のノッチに埋設される、請求項12に記載のプロセスキットリングアダプタ。
- 第1の補強構造及び真空インターフェース構造に構造的に結合され、ウエハを支持するように構成されたエンドエフェクタとインターフェースする突出部構造を備えた、請求項12に記載のプロセスキットリングアダプタ。
- 第1の補強構造及び真空インターフェース構造に構造的に結合され、ウエハをリフトするように構成されたキャリアリフトピンとインターフェースする受容部構造を備えた、請求項12に記載のプロセスキットリングアダプタ。
- 処理システムのロボットアーム上のエンドエフェクタを使用して、プロセスキットリングアダプタ及びプロセスキットリングアダプタの第1の遠端部及び第2の遠端部に配置されたプロセスキットリングをリフトする工程であって、エンドエフェクタの第1の上面はプロセスキットリングアダプタの下面とインターフェースする工程と、
エンドエフェクタを使用して、プロセスキットリングアダプタを真空チャック上に配置する工程であって、プロセスキットリングアダプタの下面の平坦中央領域が真空チャックとインターフェースする工程と、
真空チャックを使用して、プロセスキットリングアダプタ及びプロセスキットリングを回転し、プロセスキットリングをアライメントする工程と、
エンドエフェクタを使用して、プロセスキットリングアダプタとプロセスキットリングを真空チャックからリフトして、処理システムの処理チャンバ内でプロセスキットリングを交換する工程を含む方法。 - プロセスキットリングをスキャンして、プロセスキットリングの内側の端部に配置された登録フィーチャを認識して、プロセスキットリングをアライメントする工程を含み、
プロセスキットリングアダプタは、プロセスキットリングの内側の端部とプロセスキットリングアダプタの間にクリアランスを提供するように形状設定され、これにより、リボンセンサのビームがプロセスキットリングアダプタにより遮断されず、プロセスキットリングの登録フィーチャを検出可能とする、請求項17に記載の方法。 - プロセスキットリングとプロセスキットリングアダプタの間に挿入された保持フィーチャを介して、プロセスキットエンクロージャシステム内のプロセスキットリングアダプタ上でプロセスキットリングを保持する工程を含む、請求項17に記載の方法。
- レーザセンターファインディング(LCF)ビーム軌道法を実行して、プロセスキットリングアダプタのx―yアライメントのLCFエッジキャプチャを実行する工程と、
プロセスキットリングアダプタの第2の上面の遠端部に配置された基準を使用して、マシンビジョンアラインメントを実行し、プロセスキットリングアダプタをアライメントする工程の1つ以上の工程を含む、請求項17に記載の方法。
Priority Applications (1)
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