JP7121158B2 - インモールドエレクトロニクスアセンブリ及びその製造方法 - Google Patents
インモールドエレクトロニクスアセンブリ及びその製造方法 Download PDFInfo
- Publication number
- JP7121158B2 JP7121158B2 JP2021064939A JP2021064939A JP7121158B2 JP 7121158 B2 JP7121158 B2 JP 7121158B2 JP 2021064939 A JP2021064939 A JP 2021064939A JP 2021064939 A JP2021064939 A JP 2021064939A JP 7121158 B2 JP7121158 B2 JP 7121158B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electronics assembly
- film layer
- circuit
- mold electronics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000004033 plastic Substances 0.000 claims description 80
- 239000004020 conductor Substances 0.000 claims description 22
- 238000005034 decoration Methods 0.000 claims description 20
- 238000007639 printing Methods 0.000 claims description 14
- 238000001746 injection moulding Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
- B29C2045/14532—Joining articles or parts of a single article injecting between two sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
- B29C2045/1454—Joining articles or parts of a single article injecting between inserts not being in contact with each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Push-Button Switches (AREA)
Description
110 装飾層
111 貫通孔
200 機能モジュール
210 回路層
220 電子素子
221 表示ユニット
222 タッチユニット
300 プラスチック層
400 引出し端子
410 導電性材料
420 フレキシブル回路板
430 ピンヘッダー
431 接続足部
432 ピン先端部
433 コイル部
434 挿入孔
435 保護ハウジング
500 第1フィルム層
510 ホール
600 上面
610 表示領域
620 タッチ領域
700 裏面
800 絶縁層
910 上型
920 下型
921 溝
Claims (10)
- インモールドエレクトロニクスアセンブリであって、
前記インモールドエレクトロニクスアセンブリの上面に設けられ、前記上面は表示領域とタッチ領域とを含み、前記表示領域と前記タッチ領域とは重なる第1フィルム層と、
回路層と、前記回路層と電気的に接続されている電子素子とを含む機能モジュールと、
前記機能モジュールを封止するように構成されたプラスチック層と、
一端が前記回路層と電気的に接続されており、他端が前記インモールドエレクトロニクスアセンブリの裏面に引き出されている引出し端子と、
前記インモールドエレクトロニクスアセンブリの裏面に設けられた第2フィルム層と、
を備え、
前記プラスチック層は前記第1フィルム層と前記第2フィルム層との間にあり、前記回路層は前記第2フィルム層の前記プラスチック層に近い側にあり、
前記電子素子は表示ユニットとタッチユニットとを含み、前記表示ユニット及び前記タッチユニットはいずれも前記回路層に電気的に接続されており、前記タッチユニットは前記第2フィルム層の前記プラスチック層に近い側にあり、前記表示ユニットと前記タッチユニットとは積層して設置されており、前記表示ユニットと前記タッチユニットとの間に絶縁層が設けられている、
ことを特徴とするインモールドエレクトロニクスアセンブリ。 - 前記第1フィルム層の前記上面から離れる側には、装飾層が設けられている
ことを特徴とする請求項1に記載のインモールドエレクトロニクスアセンブリ。 - 前記装飾層において前記表示領域に対応する位置に貫通孔が開けられている、
ことを特徴とする請求項2に記載のインモールドエレクトロニクスアセンブリ。 - 前記回路層は前記第1フィルム層の前記上面から離れる側に設けられており、前記プラスチック層は、前記回路層の前記第1フィルム層から離れる側に設けられて前記回路層及び前記電子素子を封止するように構成されている、
ことを特徴とする請求項1に記載のインモールドエレクトロニクスアセンブリ。 - 前記第1フィルム層の前記上面から離れる側に装飾層が設けられ、前記回路層は前記装飾層の前記第1フィルム層から離れる側に設けられ、前記プラスチック層は、前記回路層の前記装飾層から離れる側に設けられて前記装飾層と前記機能モジュールと前記引出し端子の一部とを封止するように構成されている、
ことを特徴とする請求項1に記載のインモールドエレクトロニクスアセンブリ。 - 前記引出し端子はピンヘッダーであり、前記ピンヘッダーは接続足部とピン先端部とを含み、前記接続足部は前記回路層と電気的に接続されており、前記ピン先端部は、前記プラスチック層から突き出して、前記インモールドエレクトロニクスアセンブリの裏面から突き出している、
ことを特徴とする請求項5に記載のインモールドエレクトロニクスアセンブリ。 - 前記接続足部及び前記ピン先端部の一部は前記プラスチック層に埋め込まれている
ことを特徴とする請求項6に記載のインモールドエレクトロニクスアセンブリ。 - 前記引出し端子は接続足部とコイル部と保護ハウジングとを含み、前記接続足部と前記コイル部とは電気的に接続されており、前記コイル部内に挿入孔が形成されており、前記保護ハウジングは前記コイル部の外側に嵌っており、前記保護ハウジングは、前記プラスチック層から突き出して前記インモールドエレクトロニクスアセンブリの裏面から突き出している、
ことを特徴とする請求項6に記載のインモールドエレクトロニクスアセンブリ。 - 第1フィルム層の一側に装飾層を印刷することと、
第2フィルム層にホールを開け、前記ホール内に導電性材料を充填することと、
前記第2フィルム層の一側に回路層と導電層とを印刷し、前記導電層をパターニングすることで前記回路層と電気的に接続されるタッチユニットを形成し、前記回路層が前記導電性材料に電気的に接続されることと、
表示ユニットを前記回路層と電気的に接続することと、
射出成形によって前記第1フィルム層と前記第2フィルム層との間にプラスチック層を形成することで、前記装飾層、前記回路層、前記表示ユニット及び前記タッチユニットを封止することと、
前記導電性材料の前記回路層から離れる側の一端をフレキシブル回路板にボンディングすることと、を含み、
前記表示ユニット、前記タッチユニット及び前記回路層を前記第2フィルム層の前記プラスチック層に近い側に形成する、
ことを特徴とするインモールドエレクトロニクスアセンブリの製造方法。 - 前記装飾層に貫通孔を開け、2つの表示ユニットを前記貫通孔の対向両側に設け、または、前記表示ユニットを前記貫通孔の下に設ける、
ことを特徴とする請求項9に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010354699.7 | 2020-04-29 | ||
CN202010354699.7A CN111524883B (zh) | 2020-04-29 | 2020-04-29 | 膜内电子组件及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021173998A JP2021173998A (ja) | 2021-11-01 |
JP7121158B2 true JP7121158B2 (ja) | 2022-08-17 |
Family
ID=71904732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021064939A Active JP7121158B2 (ja) | 2020-04-29 | 2021-04-06 | インモールドエレクトロニクスアセンブリ及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210345490A1 (ja) |
EP (1) | EP3904038A1 (ja) |
JP (1) | JP7121158B2 (ja) |
CN (1) | CN111524883B (ja) |
TW (1) | TWI771966B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7158259B2 (ja) | 2018-11-26 | 2022-10-21 | 株式会社第一興商 | カラオケ用マラカス |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111897454A (zh) * | 2020-07-24 | 2020-11-06 | 业成科技(成都)有限公司 | 发光组件及其制作方法、电子装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009177117A (ja) | 2007-12-25 | 2009-08-06 | Toshiba Lighting & Technology Corp | 表示装置 |
JP2016189450A (ja) | 2014-07-18 | 2016-11-04 | 株式会社半導体エネルギー研究所 | 回路基板の作製方法、発光装置の作製方法、及び発光装置 |
US20170142827A1 (en) | 2015-11-13 | 2017-05-18 | Avexir Technologies Corporation | Electronic device and dynamic random access memory thereof |
US20190069408A1 (en) | 2017-08-25 | 2019-02-28 | Tactotek Oy | Multilayer structure for hosting electronics and related method of manufacture |
US10225932B1 (en) | 2018-08-27 | 2019-03-05 | Tactotek Oy | Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement |
WO2019073581A1 (ja) | 2017-10-12 | 2019-04-18 | 株式会社ワンダーフューチャーコーポレーション | 電子部品搭載容器及び電子部品実装構造 |
US20190386403A1 (en) | 2018-06-18 | 2019-12-19 | Dupont Electronics, Inc. | Flexible electrically conductive pastes and devices made therewith |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4885151U (ja) * | 1971-12-04 | 1973-10-16 | ||
JPH01283617A (ja) * | 1988-05-11 | 1989-11-15 | Fuji Xerox Co Ltd | 操作表示装置 |
JP3039355B2 (ja) * | 1996-02-06 | 2000-05-08 | ソニー株式会社 | フィルム回路の製造方法 |
JPH095769A (ja) * | 1995-06-21 | 1997-01-10 | Rohm Co Ltd | 電子素子の配線接続構造 |
EP2194489A1 (fr) * | 2008-12-02 | 2010-06-09 | EM Microelectronic-Marin SA | Carte électronique ayant des moyens de commande |
US8804344B2 (en) * | 2011-06-10 | 2014-08-12 | Scott Moncrieff | Injection molded control panel with in-molded decorated plastic film |
WO2013174418A1 (de) * | 2012-05-22 | 2013-11-28 | Würth Elektronik GmbH & Co. KG | Verfahren zum herstellen einer elektronischen baugruppe |
CN203178633U (zh) * | 2012-11-13 | 2013-09-04 | 深圳市天时通科技有限公司 | 触控显示模组 |
CN104252269A (zh) * | 2014-09-18 | 2014-12-31 | 京东方科技集团股份有限公司 | 一种触摸屏、其制作方法及显示装置 |
TWM509378U (zh) * | 2014-12-03 | 2015-09-21 | Futurelabs Entpr Co Ltd | 觸控顯示裝置 |
MX2018003866A (es) * | 2015-09-28 | 2018-06-15 | Tactotek Oy | Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos. |
CN106951125B (zh) * | 2017-03-30 | 2019-09-13 | 上海天马微电子有限公司 | 一种触控显示面板及触控显示装置 |
US10057989B1 (en) * | 2017-04-10 | 2018-08-21 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
US10688916B2 (en) * | 2018-05-10 | 2020-06-23 | Dura Operating, Llc | Multiple resin over-mold for printed circuit board electronics and light guide |
US10656323B1 (en) * | 2018-08-22 | 2020-05-19 | Dura Operating, Llc | Preformed light guide with pockets for light emitting diodes mounted to a printed circuit board |
US10485094B1 (en) * | 2018-08-27 | 2019-11-19 | Tactotek Oy | Multilayer structure with embedded sensing functionalities and related method of manufacture |
CN110430663B (zh) * | 2019-08-07 | 2022-08-30 | 深圳市恒翊科技有限公司 | 一种双层膜内电子电路结构体 |
-
2020
- 2020-04-29 CN CN202010354699.7A patent/CN111524883B/zh active Active
-
2021
- 2021-03-15 EP EP21162652.8A patent/EP3904038A1/en active Pending
- 2021-03-16 US US17/203,451 patent/US20210345490A1/en active Pending
- 2021-03-30 TW TW110111590A patent/TWI771966B/zh active
- 2021-04-06 JP JP2021064939A patent/JP7121158B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009177117A (ja) | 2007-12-25 | 2009-08-06 | Toshiba Lighting & Technology Corp | 表示装置 |
JP2016189450A (ja) | 2014-07-18 | 2016-11-04 | 株式会社半導体エネルギー研究所 | 回路基板の作製方法、発光装置の作製方法、及び発光装置 |
US20170142827A1 (en) | 2015-11-13 | 2017-05-18 | Avexir Technologies Corporation | Electronic device and dynamic random access memory thereof |
US20190069408A1 (en) | 2017-08-25 | 2019-02-28 | Tactotek Oy | Multilayer structure for hosting electronics and related method of manufacture |
WO2019073581A1 (ja) | 2017-10-12 | 2019-04-18 | 株式会社ワンダーフューチャーコーポレーション | 電子部品搭載容器及び電子部品実装構造 |
US20190386403A1 (en) | 2018-06-18 | 2019-12-19 | Dupont Electronics, Inc. | Flexible electrically conductive pastes and devices made therewith |
US10225932B1 (en) | 2018-08-27 | 2019-03-05 | Tactotek Oy | Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7158259B2 (ja) | 2018-11-26 | 2022-10-21 | 株式会社第一興商 | カラオケ用マラカス |
Also Published As
Publication number | Publication date |
---|---|
TWI771966B (zh) | 2022-07-21 |
TW202143808A (zh) | 2021-11-16 |
US20210345490A1 (en) | 2021-11-04 |
CN111524883A (zh) | 2020-08-11 |
EP3904038A1 (en) | 2021-11-03 |
CN111524883B (zh) | 2022-09-20 |
JP2021173998A (ja) | 2021-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7121158B2 (ja) | インモールドエレクトロニクスアセンブリ及びその製造方法 | |
CN106061350B (zh) | 内窥镜头部和内窥镜 | |
CN101620486B (zh) | 电子装置和触摸传感器膜 | |
CN109070414B (zh) | 电极图案一体化成型品及其制造方法 | |
CN105808000A (zh) | Oled显示装置及制作方法 | |
CN106203403B (zh) | 指纹模组及具有其的移动终端 | |
CN106203404B (zh) | 指纹模组及具有其的移动终端 | |
CN103295670B (zh) | 透明导电膜 | |
CN114555319B (zh) | 成型品、电气产品以及成型品的制造方法 | |
CN105898982B (zh) | 一种高压柔性线路板及多层柔性线路板 | |
CN105765808B (zh) | 电子电路单元及其制造方法 | |
CN207458013U (zh) | 触控薄膜、触控组件、触摸屏及电子设备 | |
CN112183396B (zh) | 显示组件和显示装置 | |
CN203814038U (zh) | 一种过电流及过热保护的电路板 | |
CN104365177A (zh) | 有机电致发光元件和照明装置 | |
CN204289871U (zh) | 连接器 | |
CN209044561U (zh) | 触摸屏和电子装置 | |
JP6175368B2 (ja) | センサーパネル及びセンサーパネルの製造方法 | |
CN203338796U (zh) | 透明导电膜 | |
CN216448120U (zh) | 一种新型imd面板 | |
CN215417670U (zh) | 一种新型抗干扰耐曲折的排线 | |
CN203481489U (zh) | 线缆连接器组件 | |
CN212569729U (zh) | 导电膜 | |
KR101654648B1 (ko) | 소자와 터치센서를 일체화한 터치 키패드 | |
CN115857722A (zh) | 一种一体式触摸面板的生产工艺 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210406 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220301 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220526 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220726 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220804 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7121158 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |