JP7072462B2 - 半導体装置、焼結金属シートおよび焼結金属シートの製造方法 - Google Patents
半導体装置、焼結金属シートおよび焼結金属シートの製造方法 Download PDFInfo
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- JP7072462B2 JP7072462B2 JP2018142168A JP2018142168A JP7072462B2 JP 7072462 B2 JP7072462 B2 JP 7072462B2 JP 2018142168 A JP2018142168 A JP 2018142168A JP 2018142168 A JP2018142168 A JP 2018142168A JP 7072462 B2 JP7072462 B2 JP 7072462B2
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- sintered metal
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- low porosity
- metal layer
- semiconductor device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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Description
図1Aは、本発明の第1の実施形態に係る半導体装置100の断面構造の例を示した図、図1Bは、本発明の第1の実施形態に係る半導体装置100の上面図の例を示した図である。図1A、図1Bに示すように、半導体装置100は、半導体素子1が焼結金属層2を介して支持基板10に接合されて構成される。ここで、図1Bの半導体装置100の上面図は、半導体素子1が取り外されている状態の上面図を表し、また、図1Aの断面図は、図1Bの平面図のY-Y部分の半導体素子1を含む断面図を表している。
なお、図2Aの左側上段および下段の図は、第1の実施形態に係る半導体装置100の断面構造および上面図であり、実質的には、図1と同じ図である。ただし、その断面構造は、半導体装置100の外縁部の構造として示されている。また、図2Aの右側上段および下段の図は、従来技術に係る半導体装置101の断面構造および上面図であり、その断面構造は、半導体装置101の外縁部の構造として示されている。
図4Aは、本発明の第2の実施形態に係る半導体装置100aの断面構造の例を示した図、図4Bは、本発明の第2の実施形態に係る半導体装置100aの上面図の例を示した図である。図4A、図4Bに示すように、半導体装置100aは、半導体素子1が焼結金属層2を介して支持基板10に接合されて構成される。ここで、図4Bの半導体装置100aの上面図は、半導体素子1が取り外されている状態の上面図を表し、また、図4Aの断面図は、図4Bの平面図のYa-Ya部分の半導体素子1を含む断面図を表している。
図5Aは、本発明の第3の実施形態に係る半導体装置100bの断面構造の例を示した図、図5Bは、本発明の第3の実施形態に係る半導体装置100bの上面図の例を示した図である。図5A、図5Bに示すように、半導体装置100bは、半導体素子1が焼結金属層2を介して支持基板10に接合されて構成される。ここで、図5Bの半導体装置100bの上面図は、半導体素子1が取り外されている状態の上面図を表し、また、図5Aの断面図は、図5Bの平面図のYb-Yb部分の半導体素子1を含む断面図を表している。
図6Aは、本発明の第4の実施形態に係る半導体装置100cの断面構造の例を示した図、図6Bは、本発明の第4の実施形態に係る半導体装置100cの上面図の例を示した図である。図6A、図6Bに示すように、半導体装置100cは、半導体素子1が焼結金属層2を介して支持基板10に接合されて構成される。ここで、図6Bの半導体装置100cの上面図は、半導体素子1が取り外されている状態の上面図を表し、また、図6Aの断面図は、図6Bの平面図のYc-Yc部分の半導体素子1を含む断面図を表している。
図7Aは、本発明の第5の実施形態に係る半導体装置100dの断面構造の例を示した図、図7Bは、本発明の第5の実施形態に係る半導体装置100dの上面図の例を示した図である。図7A、図7Bに示すように、半導体装置100dは、半導体素子1が焼結金属層2を介して支持基板10に接合されて構成される。ここで、図7Bの半導体装置100dの上面図は、半導体素子1が取り外されている状態の上面図を表し、また、図7Aの断面図は、図7Bの平面図のYd-Yd部分の半導体素子1を含む断面図を表している。
図8Aは、本発明の第1の実施形態に係る半導体装置100の製造工程において、焼結金属層2のシートを作製する工程の例を示した図、図8Bは、焼結金属層2の中に低空孔率領域3を形成し、焼結金属シート20を作製する工程の例を示した図、図8Cは、焼結金属シート20を用いて半導体装置100製造する工程の例を示したである。なお、ここでは説明の便宜上、焼結金属層2の中に低空孔率領域3が形成されたもの焼結金属シート20と呼び、低空孔率領域3が形成される前のものを焼結金属層2のシートと呼んで区別しているが、一般的には、両者ともに焼結金属シートと呼ぶべきものである。
2 焼結金属層
3 低空孔率領域
3a 壁状の低空孔率領域
3b 柱状の低空孔率領域
4 導電部材
5 絶縁部材
6 冷却部材
8 亀裂
9 電極
10 支持基板
11 プレート
20 焼結金属シート
21 ペースト材
100,100a,100b,100c,100d 半導体装置
Claims (7)
- 半導体素子が焼結金属層を介して支持基板の上に接合されてなる半導体装置であって、
前記焼結金属層には、接合されたときの前記半導体素子の外縁部よりも内側に当たる領域に、空孔率が他の領域よりも低い低空孔率領域が形成されており、
前記焼結金属層の中には、前記低空孔率領域として、前記焼結金属層を上面側から下面側まで貫く柱状の低空孔率領域が形成されており、
前記柱状の低空孔率領域は、前記半導体素子の外縁部よりも内側領域の直下に当たる前記焼結金属層の領域内の全域にわたって所定の間隔で複数個設けられていること
を特徴とする半導体装置。 - 請求項1に記載の半導体装置であって、
前記焼結金属層の前記低空孔率領域は、前記焼結金属層の前記他の領域と同じ材料で構成されていること
を特徴とする半導体装置。 - 請求項1に記載の半導体装置であって、
前記焼結金属層の中には、前記低空孔率領域として、前記焼結金属層を上面側から下面側まで貫き、平面形状が細長紐状を呈する壁状の低空孔率領域が形成されており、
前記壁状の低空孔率領域は、前記半導体素子の外縁部に沿って、前記半導体素子の中央部直下の領域を取り囲むように形成され、
前記柱状の低空孔率領域は、複数個、前記壁状の低空孔率領域に囲まれた内側の領域に形成されていること
を特徴とする半導体装置。 - 半導体素子と支持基板との間に配置されて、前記半導体素子と前記支持基板とを接合する焼結金属シートであって、
前記半導体素子と前記支持基板とを接合したとき、前記半導体素子の外縁部よりも内側に当たる領域に、空孔率が他の領域よりも低い低空孔率領域が形成されており、
前記焼結金属シートの中には、前記低空孔率領域として、前記焼結金属シートを上面側から下面側まで貫く柱状の低空孔率領域が形成されており、
前記柱状の低空孔率領域は、前記半導体素子の外縁部よりも内側領域の直下に当たる前記焼結金属シートの領域内の全域にわたって所定の間隔で複数個設けられていること
を特徴とする焼結金属シート。 - 請求項4に記載の焼結金属シートであって、
前記低空孔率領域を構成する材料は、前記他の領域を構成する材料と同じであること
を特徴とする焼結金属シート。 - 金属微粒子を含むペースト材を焼成して焼結金属シートを作製する工程と、
前記焼結金属シート上の所定の位置に、前記焼結金属シートを上面および下面から挟むように電極を配置し、前記電極に挟まれた前記焼結金属シートの領域に通電することにより、空孔率が他の領域よりも低い低空孔率領域を形成する工程と、
を有すること
を特徴とする焼結金属シートの製造方法。 - 請求項6に記載の焼結金属シートの製造方法であって、
前記低空孔率領域を形成する工程において、前記焼結金属シート上に前記電極を配置するときには、前記焼結金属シートの外縁部よりも内側の位置に配置すること
を特徴とする焼結金属シートの製造方法。
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