JP7009381B2 - 反応性ホットメルトシリコーン充填容器および反応性ホットメルトシリコーンの製造方法 - Google Patents
反応性ホットメルトシリコーン充填容器および反応性ホットメルトシリコーンの製造方法 Download PDFInfo
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- JP7009381B2 JP7009381B2 JP2018548632A JP2018548632A JP7009381B2 JP 7009381 B2 JP7009381 B2 JP 7009381B2 JP 2018548632 A JP2018548632 A JP 2018548632A JP 2018548632 A JP2018548632 A JP 2018548632A JP 7009381 B2 JP7009381 B2 JP 7009381B2
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- organopolysiloxane
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- 229920001296 polysiloxane Polymers 0.000 title claims description 140
- 239000012943 hotmelt Substances 0.000 title claims description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title description 4
- 239000000203 mixture Substances 0.000 claims description 52
- 125000003342 alkenyl group Chemical group 0.000 claims description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 24
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 8
- 150000001451 organic peroxides Chemical class 0.000 claims description 7
- 239000002683 reaction inhibitor Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 4
- 238000004132 cross linking Methods 0.000 claims 1
- -1 siloxane unit Chemical group 0.000 description 56
- 229910004283 SiO 4 Inorganic materials 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
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- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
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- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
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- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 2
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 2
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
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- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical class [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 2
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- CTPYJEXTTINDEM-UHFFFAOYSA-N 1,2-bis(1-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOCC(C)C1=CC=CC=C1C(C)COOC(C)(C)C CTPYJEXTTINDEM-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XRDOCCGDIHPQPF-UHFFFAOYSA-N 2,2,4,4-tetramethylheptaneperoxoic acid Chemical compound CCCC(C)(C)CC(C)(C)C(=O)OO XRDOCCGDIHPQPF-UHFFFAOYSA-N 0.000 description 1
- CRJIYMRJTJWVLU-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 3-(5,5-dimethylhexyl)dioxirane-3-carboxylate Chemical compound CC(C)(C)CCCCC1(C(=O)OC(C)(C)CC(C)(C)C)OO1 CRJIYMRJTJWVLU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- WDIXVQTZULGQNI-UHFFFAOYSA-N 2-ethyl-2-(2-methylbutan-2-ylperoxy)hexanoic acid Chemical compound CCCCC(CC)(C(O)=O)OOC(C)(C)CC WDIXVQTZULGQNI-UHFFFAOYSA-N 0.000 description 1
- ZACVGCNKGYYQHA-UHFFFAOYSA-N 2-ethylhexoxycarbonyloxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOC(=O)OCC(CC)CCCC ZACVGCNKGYYQHA-UHFFFAOYSA-N 0.000 description 1
- YAQDPWONDFRAHF-UHFFFAOYSA-N 2-methyl-2-(2-methylpentan-2-ylperoxy)pentane Chemical compound CCCC(C)(C)OOC(C)(C)CCC YAQDPWONDFRAHF-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NUIZZJWNNGJSGL-UHFFFAOYSA-N 2-phenylpropan-2-yl 2,2-dimethyloctaneperoxoate Chemical compound CCCCCCC(C)(C)C(=O)OOC(C)(C)c1ccccc1 NUIZZJWNNGJSGL-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 1
- CARSMBZECAABMO-UHFFFAOYSA-N 3-chloro-2,6-dimethylbenzoic acid Chemical compound CC1=CC=C(Cl)C(C)=C1C(O)=O CARSMBZECAABMO-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
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- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
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- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
- CSKKAINPUYTTRW-UHFFFAOYSA-N tetradecoxycarbonyloxy tetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCC CSKKAINPUYTTRW-UHFFFAOYSA-N 0.000 description 1
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- 238000009834 vaporization Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J11/02—Non-macromolecular additives
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- H01L23/00—Details of semiconductor or other solid state devices
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Description
(A)アルケニル基を有し、軟化点が50℃以上である分岐鎖状のオルガノポリシロキサンを少なくとも含む、アルケニル基結合オルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノポリシロキサン{(A)成分中のアルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.01~10モルとなる量}、および
(C)触媒量のヒドロシリル化反応用触媒
を含む架橋性シリコーン組成物を容器に充填し、該容器を加熱することにより前記組成物をB-ステージ状に架橋させ、25℃で非流動性であり、120℃での溶融粘度が5,000Pa・s以下の反応性ホットメルトシリコーンを形成することを特徴とする。
(A)アルケニル基を有し、軟化点が50℃以上である分岐鎖状のオルガノポリシロキサンを少なくとも含む、アルケニル基結合オルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノポリシロキサン{(A)成分中のアルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.01~10モルとなる量}、および
(C)触媒量のヒドロシリル化反応用触媒
を含む架橋性シリコーン組成物を容器中で加熱してB-ステージ状に架橋させることを特徴とする。
(A)アルケニル基を有し、軟化点が50℃以上である分岐鎖状のオルガノポリシロキサンを少なくとも含む、アルケニル基結合オルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノポリシロキサン{(A)成分中のアルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.01~10モルとなる量}、および
(C)触媒量のヒドロシリル化反応用触媒
を含む架橋性シリコーン組成物を容器に充填し、該容器を加熱することにより前記組成物をB-ステージ状に架橋させることを特徴とする。なお、この「B-ステージ状」とは、JIS K 6800に定義されているB-ステージ(熱硬化性樹脂の硬化中間体)の状態をいい、架橋性シリコーン組成物を不完全に硬化させることにより、溶剤により膨潤するものの、完全に溶解することがなく、「反応性ホットメルト」とは、室温(25℃)では流動性を失ったような状態であるが、高温(例えば、120℃以上)に加熱すると再び溶融し、次いで硬化するものをいう。
R2 3SiO(R2 2SiO)nSiR2 3
で表される。
反応性ホットメルトシリコーンの120℃の溶融粘度を、ティー・エイ・インスツルメント社製のAR550レオメーターにより、直径20mm、コーン角2°のコーンプレートを用いて、せん断速度1/sで測定した。
所定温度に設定した測定装置(ALPHA TECHNOLOGIES Rheometer MDR 2000P)の固定された下ダイと昇降する上ダイから構成される円盤状のダイ中空部に6gの反応性ホットメルトシリコーンをセットし、上下のダイを密閉した後、振動数1.66Hz、振動角=1°の条件において、トルク値が1dNmに到達するまでの時間を測定し、これを初期トルク値が発現するまでの時間とした。
反応性ホットメルトシリコーンを150℃で2時間プレス成形することによりシート状の硬化物を作製した。このシート状硬化物の硬さをJIS K 6253に規定されるタイプDデュロメータにより測定した。
下記の成分を表1に示した組成(質量部)で均一に混合して架橋性シリコーン組成物を調製した。なお、表1中、SiH/Viは、(A)成分中のビニル基1モルに対する、(B)成分中のケイ素原子結合水素原子のモル数を示す。その後、この架橋性シリコーン組成物を容量30ccのカートリッジ中に充填し、表1に示した条件で加熱し、次いで、室温まで冷却することにより反応性ホットメルトシリコーン充填容器を作製した。
(a-1)成分:式:
ViMe2SiO(MePhSiO)80SiMe2Vi
で表されるメチルフェニルポリシロキサン
(a-2)成分:式:
ViMe2SiO(MePhSiO)18SiMe2Vi
で表されるメチルフェニルポリシロキサン
(a-3)成分:軟化点が100℃である、平均単位式:
(MeViSiO2/2)0.3(PhSiO3/2)0.7
で表されるオルガノポリシロキサン
(a-4)成分:軟化点が150℃である、平均単位式
(MeViSiO2/2)0.10(Me2SiO2/2)0.15(PhSiO3/2)0.75
で表されるオルガノポリシロキサン
(b-1)成分:式:
Me2HSiOPh2SiOSiMe2H
で表されるオルガノポリシロキサン
(c-1)成分:白金-1,3-ジビニル-1,1,3,3-テトラメチルジシロキサン錯体の1,3,5,7-テトラメチル-1,3,5,7-テトラビニルシクロテトラシロキサン溶液(白金金属を0.1重量%含有する溶液)
(f-1)成分:粘度が30mPa・sである分子鎖両末端シラノール基封鎖メチルビニルシロキサンオリゴマーと3-グリシドキシプロピルトリメトキシシランの縮合反応物からなる接着付与剤
上記および下記の成分を表2に示した組成(質量部)で均一に混合して架橋性シリコーン組成物を調製した。なお、表2中、SiH/Viは、(A)成分中のビニル基1モルに対する、(B)成分中のケイ素原子結合水素原子のモル数を示す。その後、この架橋性シリコーン組成物を容量30ccのカートリッジ中に充填し、表2に示した条件で加熱し、次いで室温まで冷却することにより反応性ホットメルトシリコーン充填容器を作製した。
(a-5)成分:軟化点が300℃である、平均単位式:
(Me2ViSiO1/2)0.10(Me3SiO1/2)0.40(SiO4/2)0.50
で表されるオルガノポリシロキサン
(a-6)成分:軟化点が300℃である、平均単位式
(Me2ViSiO1/2)0.04(Me3SiO1/2)0.40(SiO4/2)0.56
で表されるオルガノポリシロキサン
(a-7)成分:式:
ViMe2SiO(Me2SiO)770SiMe2Vi
で表されるジメチルポリシロキサン
(a-8)成分:軟化点が100℃である、平均単位式:
(Me2ViSiO1/2)0.25(PhSiO3/2)0.75
で表されるオルガノポリシロキサン
(b-2)成分:式:
Me2HSiO(Me2SiO)25SiMe2H
で表されるオルガノポリシロキサン
(d-1)成分:1,3,5,7-テトラメチル-1,3,5,7-テトラビニルシクロテトラシロキサン
(d-2)成分:トリス(1,1-ジメチルプロピンオキシ)メチルシラン
(e-1)成分:2,5-ジメチル-2,5-ジ(t-ブチルパオキシ)ヘキサン
(g-1)成分:軟化点100℃である、平均単位式:
(Me3SiO1/2)0.44(SiO4/2)0.56
で表されるオルガノポリシロキサン
2 反応性ホットメルトシリコーン
3 プランジャー
Claims (4)
- (A)アルケニル基を有し、軟化点が50℃以上である分岐鎖状のオルガノポリシロキサンを少なくとも含む、アルケニル基結合オルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノポリシロキサン{(A)成分中のアルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.01~10モルとなる量}、
(C)触媒量のヒドロシリル化反応用触媒、および
(D)反応抑制剤{(A)成分~(C)成分の合計100質量部に対して0.0001~5質量部}
を含む架橋性シリコーン組成物を、カートリッジ、フレキシブル容器、ペール缶、またはドラム缶から選ばれる容器に充填し、該組成物に含まれる低分子量成分や反応抑制剤の揮発を抑制した状態で該容器を加熱することにより前記組成物をB-ステージ状に架橋させ、25℃で非流動性であり、120℃での溶融粘度が5,000Pa・s以下の反応性ホットメルトシリコーンを形成することを特徴とする反応性ホットメルトシリコーン充填容器。 - 架橋性シリコーン組成物が、さらに、(A)成分~(C)成分の合計100質量部に対して0.01~10質量部の(E)有機パーオキサイドを含む、請求項1に記載の反応性ホットメルトシリコーン充填容器。
- (A)アルケニル基を有し、軟化点が50℃以上である分岐鎖状のオルガノポリシロキサンを少なくとも含む、アルケニル基結合オルガノポリシロキサン、
(B)一分子中に少なくとも2個のケイ素原子結合水素原子を有するオルガノポリシロキサン{(A)成分中のアルケニル基1モルに対して、本成分中のケイ素原子結合水素原子が0.01~10モルとなる量}、
(C)触媒量のヒドロシリル化反応用触媒、および
(D)反応抑制剤{(A)成分~(C)成分の合計100質量部に対して0.0001~5質量部}
を含む架橋性シリコーン組成物を、カートリッジ、フレキシブル容器、ペール缶、またはドラム缶から選ばれる容器に充填し、該組成物に含まれる低分子量成分や反応抑制剤の揮発を抑制した状態で加熱してB-ステージ状に架橋させることを特徴とする、25℃で非流動性であり、120℃での溶融粘度が5,000Pa・s以下の反応性ホットメルトシリコーンの製造方法。 - 架橋性シリコーン組成物が、さらに、(A)成分~(C)成分の合計100質量部に対して0.01~10質量部の(E)有機パーオキサイドを含む、請求項3に記載の反応性ホットメルトシリコーンの製造方法。
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WO2015093329A1 (ja) | 2013-12-19 | 2015-06-25 | 東レ・ダウコーニング株式会社 | シリコーン接着性フィルム、および半導体装置 |
WO2016103654A1 (ja) | 2014-12-26 | 2016-06-30 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物、それからなる半導体用封止剤および半導体装置 |
JP2016124967A (ja) | 2014-12-26 | 2016-07-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 |
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TWI765925B (zh) | 2022-06-01 |
JPWO2018084012A1 (ja) | 2019-09-19 |
CN109963911A (zh) | 2019-07-02 |
US20190276684A1 (en) | 2019-09-12 |
EP3536747A4 (en) | 2020-07-01 |
EP3536747A1 (en) | 2019-09-11 |
KR20190080884A (ko) | 2019-07-08 |
WO2018084012A1 (ja) | 2018-05-11 |
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