JP6951786B2 - ヒートシンク - Google Patents

ヒートシンク Download PDF

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Publication number
JP6951786B2
JP6951786B2 JP2019538800A JP2019538800A JP6951786B2 JP 6951786 B2 JP6951786 B2 JP 6951786B2 JP 2019538800 A JP2019538800 A JP 2019538800A JP 2019538800 A JP2019538800 A JP 2019538800A JP 6951786 B2 JP6951786 B2 JP 6951786B2
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JP
Japan
Prior art keywords
cooling
layer
heat sink
path
back surface
Prior art date
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JP2019538800A
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English (en)
Japanese (ja)
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JPWO2019043801A1 (ja
Inventor
鈴木　裕
裕 鈴木
齋藤　隆
隆 齋藤
真吾 五十嵐
真吾 五十嵐
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Welcon
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Welcon
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Publication of JPWO2019043801A1 publication Critical patent/JPWO2019043801A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2019538800A 2017-08-29 2017-08-29 ヒートシンク Active JP6951786B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/031029 WO2019043801A1 (ja) 2017-08-29 2017-08-29 ヒートシンク

Publications (2)

Publication Number Publication Date
JPWO2019043801A1 JPWO2019043801A1 (ja) 2020-10-15
JP6951786B2 true JP6951786B2 (ja) 2021-10-20

Family

ID=65525131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019538800A Active JP6951786B2 (ja) 2017-08-29 2017-08-29 ヒートシンク

Country Status (5)

Country Link
US (2) US11948860B2 (zh)
EP (1) EP3678174B1 (zh)
JP (1) JP6951786B2 (zh)
CN (1) CN111052360B (zh)
WO (1) WO2019043801A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102648693B1 (ko) * 2022-12-16 2024-03-19 최병규 반도체 소자 테스트 장치
KR102648699B1 (ko) * 2022-12-16 2024-03-19 최병규 반도체 소자 테스트 장치

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WO2020031753A1 (ja) * 2018-08-09 2020-02-13 富士電機株式会社 冷却器、半導体モジュール
CN111479442B (zh) * 2020-03-25 2022-03-29 中航光电科技股份有限公司 一种阵列微射流及微通道复合冷板
US20210242108A1 (en) * 2021-03-26 2021-08-05 Intel Corporation Technologies for liquid cooling systems
KR102593733B1 (ko) * 2021-05-27 2023-10-25 주식회사 아모그린텍 히트싱크 일체형 세라믹 기판 및 그 제조방법
JP7231668B2 (ja) * 2021-06-10 2023-03-01 Ｎｅｃプラットフォームズ株式会社 冷却部品
US20230007809A1 (en) * 2021-07-02 2023-01-05 Rohde & Schwarz Gmbh & Co. Kg Heat management arrangement, method of manufacturing and electronic device
CN114280443A (zh) * 2021-11-03 2022-04-05 浙江大学杭州国际科创中心 一种功率芯片歧管式微通道换热器测试装置
CN114630566A (zh) * 2022-03-14 2022-06-14 西安交通大学 一种多层分流液冷板
CN115966533B (zh) * 2022-12-01 2023-09-05 山东大学 一种带有逆流区的歧管式微通道散热器
CN115881666B (zh) * 2022-12-01 2023-09-05 山东大学 一种逆流式新型复合微通道热沉

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US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
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US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
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JP3651677B2 (ja) * 2002-07-12 2005-05-25 株式会社東芝 発熱素子冷却装置及び電子機器
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
JP2004270970A (ja) 2003-03-05 2004-09-30 Denso Corp 冷却装置
US7075959B1 (en) * 2003-11-14 2006-07-11 Hamilton Sundstrand Corporation Cooling device for diode pumped laser
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
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JP5969898B2 (ja) 2012-11-12 2016-08-17 浜松ホトニクス株式会社 ヒートシンク
WO2014184912A1 (ja) 2013-05-15 2014-11-20 三菱電機株式会社 積層型ヘッダー、熱交換器、及び、空気調和装置
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WO2017047825A1 (ja) * 2015-09-18 2017-03-23 株式会社ティラド 積層型ヒートシンク
WO2017047824A1 (ja) * 2015-09-18 2017-03-23 株式会社ティラド 積層コア型ヒートシンク
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US10770372B2 (en) * 2016-09-23 2020-09-08 Altera Corporation Fluid routing devices and methods for cooling integrated circuit packages
US10136550B2 (en) * 2016-09-30 2018-11-20 International Business Machines Corporation Cold plate device for a two-phase cooling system
WO2018117962A1 (en) * 2016-12-19 2018-06-28 Agency For Science, Technology And Research Heat sinks and methods for fabricating a heat sink
JP6922612B2 (ja) * 2017-09-27 2021-08-18 富士通株式会社 クーリングプレート、及び情報処理装置
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JP2020150170A (ja) * 2019-03-14 2020-09-17 富士通株式会社 冷却プレート、冷却装置及び電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102648693B1 (ko) * 2022-12-16 2024-03-19 최병규 반도체 소자 테스트 장치
KR102648699B1 (ko) * 2022-12-16 2024-03-19 최병규 반도체 소자 테스트 장치

Also Published As

Publication number Publication date
US20200258815A1 (en) 2020-08-13
EP3678174B1 (en) 2022-11-16
EP3678174A4 (en) 2021-04-07
JPWO2019043801A1 (ja) 2020-10-15
EP3678174A1 (en) 2020-07-08
CN111052360A (zh) 2020-04-21
US20240203828A1 (en) 2024-06-20
US11948860B2 (en) 2024-04-02
CN111052360B (zh) 2023-08-04
WO2019043801A1 (ja) 2019-03-07

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