JP6930958B2 - レーザー投影モジュール - Google Patents
レーザー投影モジュール Download PDFInfo
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- JP6930958B2 JP6930958B2 JP2018502060A JP2018502060A JP6930958B2 JP 6930958 B2 JP6930958 B2 JP 6930958B2 JP 2018502060 A JP2018502060 A JP 2018502060A JP 2018502060 A JP2018502060 A JP 2018502060A JP 6930958 B2 JP6930958 B2 JP 6930958B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Description
本開示は、米国仮出願第62/139,409号、発明の名称「レーザー投影モジュール(LASER PROJECTION MODULE)」、2015年3月27日出願の優先権を主張しており、その内容は参照によりその全体が本明細書に組み込まれている。
Claims (11)
- レーザー投影モジュールであって、
上部部分、底部部分、及び1つ以上の側部部分を含んでキャビティを画定するレーザー投影モジュールカバーと、
前記レーザー投影モジュールカバーの前記底部部分に一体化されたカバーリードフレームとを備え、
前記カバーリードフレームは、前記レーザー投影モジュールカバーに対して外側リードフレーム部分及び内側リードフレーム部分を含み、
前記内側リードフレーム部分は、レーザーダイオードアセンブリからのレーザー光が前記内側リードフレーム部分の中央に物理的に結合した屈折レンズを通過するように、前記キャビティ内の前記内側リードフレーム部分の一側に平面方向にオフセットした一領域において前記レーザーダイオードアセンブリに電気的に結合するように構成され、
前記キャビティに結合し、かつ前記レーザーダイオードアセンブリから前記内側リードフレーム部分に沿って遠位に設けられたミラーは、前記屈折レンズを通過した光を前記レーザー投影モジュールカバーの前記上部部分の外側へ反射させるように構成され、
前記カバーリードフレームは、前記レーザー投影モジュールカバーの少なくとも前記底部部分に物理的に結合するように構成されている、レーザー投影モジュール。 - 請求項1のレーザー投影モジュールにおいて、前記レーザーダイオードアセンブリは、レーザーダイオードと、前記レーザーダイオードアセンブリを収容するように構成されたサブマウント上にチップを載置する部分とを含むレーザー投影モジュール。
- 請求項2のレーザー投影モジュールにおいて、前記レーザーダイオードアセンブリは、前記内側リードフレーム部分にワイヤーボンディングされているレーザー投影モジュール。
- 請求項2のレーザー投影モジュールにおいて、前記レーザー投影モジュールカバーの外側にあるように構成された前記レーザーダイオードアセンブリのためのヒートシンクをさらに備えるレーザーダイオード投影モジュール。
- 請求項2のレーザー投影モジュールにおいて、前記レーザー投影モジュールカバーの前記キャビティ内にあるように構成された前記レーザーダイオードアセンブリのためのヒートシンクをさらに備えるレーザーダイオード投影モジュール。
- 請求項5のレーザーダイオード投影モジュールにおいて、前記レーザーダイオードアセンブリへの電気的結合のために露出したダイ取り付けパット部分をさらに備えるレーザーダイオード投影モジュール。
- 請求項1のレーザーダイオード投影モジュールにおいて、前記レーザーダイオードアセンブリは、前記カバーの前記キャビティ内のダイ取り付けパッド部分に結合されたレーザーダイオードサブマウントに結合されたレーザーダイオードを含むレーザー投影モジュール。
- 請求項1のレーザー投影モジュールにおいて、前記レーザー投影モジュールカバーの前記上部部分に物理的に結合され、かつ前記ミラーに光学的に結合された回折光学素子をさらに備えるレーザー投影モジュール。
- 請求項8のレーザー投影モジュールにおいて、前記回折光学素子は、回折レンズ、ビームスプリッタ、回折拡散器及び補正板のうちの1つを含むレーザー投影モジュール。
- 請求項1のレーザー投影モジュールにおいて、前記レーザー投影モジュールカバーの前記上部部分に光学的及び物理的に結合され、かつ前記ミラーの上に光学的に結合された光学カバーをさらに備えるレーザー投影モジュール。
- 請求項1のレーザー投影モジュールにおいて、前記カバーリードフレームは、少なくとも1つの能動リードと、少なくとも1つのダミーリードとを含むレーザー投影モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562139409P | 2015-03-27 | 2015-03-27 | |
US62/139,409 | 2015-03-27 | ||
PCT/US2016/024516 WO2016160704A1 (en) | 2015-03-27 | 2016-03-28 | Laser projection module |
Publications (2)
Publication Number | Publication Date |
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JP2018512745A JP2018512745A (ja) | 2018-05-17 |
JP6930958B2 true JP6930958B2 (ja) | 2021-09-01 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018502044A Active JP7433762B2 (ja) | 2015-03-27 | 2016-03-25 | レーザダイオードモジュール、デバイスおよびサブマウントモジュール上にチップを作製する方法 |
JP2018502060A Active JP6930958B2 (ja) | 2015-03-27 | 2016-03-28 | レーザー投影モジュール |
JP2022111329A Active JP7382458B2 (ja) | 2015-03-27 | 2022-07-11 | レーザダイオードモジュール、デバイスおよびサブマウントモジュール上にチップを作製する方法 |
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JP2018502044A Active JP7433762B2 (ja) | 2015-03-27 | 2016-03-25 | レーザダイオードモジュール、デバイスおよびサブマウントモジュール上にチップを作製する方法 |
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Country Status (8)
Country | Link |
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US (2) | US11431146B2 (ja) |
EP (2) | EP3275057B1 (ja) |
JP (3) | JP7433762B2 (ja) |
KR (2) | KR102458413B1 (ja) |
CN (2) | CN107624205B (ja) |
IL (2) | IL254757B (ja) |
SG (4) | SG11201707952UA (ja) |
WO (2) | WO2016160547A1 (ja) |
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DE102017124147A1 (de) * | 2017-10-17 | 2019-04-18 | Osram Opto Semiconductors Gmbh | Licht emittierendes Bauelement |
KR102617183B1 (ko) | 2017-11-01 | 2023-12-21 | 누부루 인크. | 다중 kW 급 청색 레이저 시스템 |
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EP3572769A4 (en) * | 2018-02-27 | 2020-04-01 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | LASER PROJECTION MODULE, DEPTH CAMERA AND ELECTRONIC DEVICE |
CN108490632B (zh) * | 2018-03-12 | 2020-01-10 | Oppo广东移动通信有限公司 | 激光投射模组、深度相机和电子装置 |
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SG11201707952UA (en) | 2017-10-30 |
EP3274760A1 (en) | 2018-01-31 |
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JP2022133477A (ja) | 2022-09-13 |
IL254763B (en) | 2022-04-01 |
JP2018511186A (ja) | 2018-04-19 |
KR20170130499A (ko) | 2017-11-28 |
CN108012573B (zh) | 2021-09-03 |
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EP3274760A4 (en) | 2018-04-04 |
WO2016160547A1 (en) | 2016-10-06 |
KR20170136545A (ko) | 2017-12-11 |
EP3275057A4 (en) | 2018-12-26 |
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