JP6876540B2 - ダイシングテープ一体型接着性シート - Google Patents
ダイシングテープ一体型接着性シート Download PDFInfo
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- JP6876540B2 JP6876540B2 JP2017124702A JP2017124702A JP6876540B2 JP 6876540 B2 JP6876540 B2 JP 6876540B2 JP 2017124702 A JP2017124702 A JP 2017124702A JP 2017124702 A JP2017124702 A JP 2017124702A JP 6876540 B2 JP6876540 B2 JP 6876540B2
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- Prior art keywords
- dicing tape
- layer
- film
- resin
- adhesive sheet
- Prior art date
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017124702A JP6876540B2 (ja) | 2017-06-27 | 2017-06-27 | ダイシングテープ一体型接着性シート |
KR1020180071879A KR20190001544A (ko) | 2017-06-27 | 2018-06-22 | 다이싱 테이프 일체형 접착성 시트 |
TW107121848A TW201905995A (zh) | 2017-06-27 | 2018-06-26 | 切晶帶一體型接著性片材 |
CN201810680930.4A CN109148350B (zh) | 2017-06-27 | 2018-06-27 | 切割带一体型粘接性片 |
Applications Claiming Priority (1)
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JP2017124702A JP6876540B2 (ja) | 2017-06-27 | 2017-06-27 | ダイシングテープ一体型接着性シート |
Publications (2)
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JP2019009324A JP2019009324A (ja) | 2019-01-17 |
JP6876540B2 true JP6876540B2 (ja) | 2021-05-26 |
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JP2017124702A Active JP6876540B2 (ja) | 2017-06-27 | 2017-06-27 | ダイシングテープ一体型接着性シート |
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JP (1) | JP6876540B2 (zh) |
KR (1) | KR20190001544A (zh) |
CN (1) | CN109148350B (zh) |
TW (1) | TW201905995A (zh) |
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JP7046585B2 (ja) * | 2017-12-14 | 2022-04-04 | 日東電工株式会社 | 接着フィルムおよびダイシングテープ付き接着フィルム |
KR102193721B1 (ko) * | 2019-01-21 | 2020-12-21 | 주식회사 야스 | 점착척의 점착시트 보호 용 커버 필름 |
JP2020145392A (ja) * | 2019-03-08 | 2020-09-10 | 日東電工株式会社 | ダイシングテープ、及び接着フィルム付きダイシングテープ |
WO2020251307A1 (ko) | 2019-06-13 | 2020-12-17 | 주식회사 엘지화학 | 비전도성 필름 및 반도체 적층체의 제조 방법 |
JP7505921B2 (ja) | 2019-06-27 | 2024-06-25 | 日東電工株式会社 | 粘着シート、および粘着シート貼付品の製造方法 |
CN112521878A (zh) * | 2019-09-19 | 2021-03-19 | 日东电工株式会社 | 粘合带 |
JP7471879B2 (ja) * | 2020-03-18 | 2024-04-22 | リンテック株式会社 | フィルム状接着剤及びダイシングダイボンディングシート |
CN111439213A (zh) * | 2020-04-30 | 2020-07-24 | 吉林大学 | 一种用于自动驾驶防雨雪及保温作用的车体、粘结及涂层结构 |
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KR101204197B1 (ko) * | 2003-06-06 | 2012-11-26 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체장치의 제조방법 |
CN101471240B (zh) * | 2003-06-06 | 2011-07-20 | 日立化成工业株式会社 | 粘合片、与切割胶带一体化粘合片以及半导体的制造方法 |
JP4770126B2 (ja) * | 2003-06-06 | 2011-09-14 | 日立化成工業株式会社 | 接着シート |
JP4876451B2 (ja) * | 2005-06-27 | 2012-02-15 | 日立化成工業株式会社 | 接着シート |
KR20120002556A (ko) * | 2007-10-09 | 2012-01-05 | 히다치 가세고교 가부시끼가이샤 | 접착 필름이 부착된 반도체칩의 제조 방법 및 이 제조 방법에 사용되는 반도체용 접착 필름, 및 반도체 장치의 제조 방법 |
WO2009060927A1 (ja) * | 2007-11-08 | 2009-05-14 | Hitachi Chemical Company, Ltd. | 半導体用接着シート及びダイシングテープ一体型半導体用接着シート |
JP5255465B2 (ja) * | 2009-01-29 | 2013-08-07 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP5456642B2 (ja) * | 2009-12-24 | 2014-04-02 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム |
WO2012157671A1 (ja) * | 2011-05-17 | 2012-11-22 | リンテック株式会社 | フィルムおよび粘着シート |
CN103620742B (zh) * | 2011-07-01 | 2016-05-25 | 古河电气工业株式会社 | 粘接膜、切割芯片接合膜及使用该切割芯片接合膜的半导体加工方法 |
JP6330513B2 (ja) * | 2014-06-26 | 2018-05-30 | Dic株式会社 | 延伸剥離用両面粘着テープ及び電子機器 |
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2017
- 2017-06-27 JP JP2017124702A patent/JP6876540B2/ja active Active
-
2018
- 2018-06-22 KR KR1020180071879A patent/KR20190001544A/ko unknown
- 2018-06-26 TW TW107121848A patent/TW201905995A/zh unknown
- 2018-06-27 CN CN201810680930.4A patent/CN109148350B/zh active Active
Also Published As
Publication number | Publication date |
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KR20190001544A (ko) | 2019-01-04 |
TW201905995A (zh) | 2019-02-01 |
JP2019009324A (ja) | 2019-01-17 |
CN109148350A (zh) | 2019-01-04 |
CN109148350B (zh) | 2023-12-15 |
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