JP6857497B2 - 自動車用ledランプヒートシンク - Google Patents
自動車用ledランプヒートシンク Download PDFInfo
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- JP6857497B2 JP6857497B2 JP2016546602A JP2016546602A JP6857497B2 JP 6857497 B2 JP6857497 B2 JP 6857497B2 JP 2016546602 A JP2016546602 A JP 2016546602A JP 2016546602 A JP2016546602 A JP 2016546602A JP 6857497 B2 JP6857497 B2 JP 6857497B2
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- JP
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- Prior art keywords
- heat sink
- led lamp
- resin composition
- lamp heat
- automobile
- Prior art date
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- 239000011342 resin composition Substances 0.000 claims description 71
- 239000010439 graphite Substances 0.000 claims description 70
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- 230000005484 gravity Effects 0.000 claims description 11
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- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 3
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- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
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- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 3
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- 239000012760 heat stabilizer Substances 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
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- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
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- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 2
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- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 2
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- 125000005702 oxyalkylene group Chemical group 0.000 description 2
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- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
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- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 1
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- FDZMLNCJBYFJBH-UHFFFAOYSA-N 2-[(2,3-dibromophenoxy)methyl]oxirane Chemical compound BrC1=CC=CC(OCC2OC2)=C1Br FDZMLNCJBYFJBH-UHFFFAOYSA-N 0.000 description 1
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- MFJDFPRQTMQVHI-UHFFFAOYSA-N 3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound O=C1OCOC(=O)C2=CC=C1C=C2 MFJDFPRQTMQVHI-UHFFFAOYSA-N 0.000 description 1
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- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- MDMQWWDIXLMSSR-UHFFFAOYSA-N tetrasilver;silicate Chemical compound [Ag+].[Ag+].[Ag+].[Ag+].[O-][Si]([O-])([O-])[O-] MDMQWWDIXLMSSR-UHFFFAOYSA-N 0.000 description 1
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- 125000000858 thiocyanato group Chemical group *SC#N 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- IELLVVGAXDLVSW-UHFFFAOYSA-N tricyclohexyl phosphate Chemical compound C1CCCCC1OP(OC1CCCCC1)(=O)OC1CCCCC1 IELLVVGAXDLVSW-UHFFFAOYSA-N 0.000 description 1
- OHRVKCZTBPSUIK-UHFFFAOYSA-N tridodecyl phosphate Chemical compound CCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCC)OCCCCCCCCCCCC OHRVKCZTBPSUIK-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- 125000005590 trimellitic acid group Chemical group 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- FDGZUBKNYGBWHI-UHFFFAOYSA-N trioctadecyl phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC FDGZUBKNYGBWHI-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- RXPQRKFMDQNODS-UHFFFAOYSA-N tripropyl phosphate Chemical compound CCCOP(=O)(OCCC)OCCC RXPQRKFMDQNODS-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2507/00—Use of elements other than metals as filler
- B29K2507/04—Carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Description
1)一部または全部が熱伝導性樹脂組成物の射出成形により形成されたLEDモジュールを冷却するためのヒートシンクであって、前記熱伝導性樹脂組成物が、(A)数平均分子量が12,000〜70,000である熱可塑性ポリエステル樹脂(以下、単に「熱可塑性ポリエステル樹脂(A)」と称することがある。)50〜90重量%、および(B)固定炭素量が98質量%以上、且つアスペクト比が21以上である鱗片状黒鉛(以下、単に「鱗片状黒鉛(B)」と称することがある。)10〜50重量%を少なくとも含有し、比重1.4〜1.7、且つ1W/(m・K)以上の面方向の熱伝導率を有する樹脂組成物であることを特徴とする自動車用LEDランプヒートシンク。
2)前記自動車用LEDランプヒートシンク中に含まれる鱗片状黒鉛(B)の体積平均粒子径が1〜500μmであることを特徴とする、1)に記載の自動車用LEDランプヒートシンク。
3)前記熱伝導性樹脂組成物が溶融混練によって製造され、溶融混練前の鱗片状黒鉛の体積平均粒子径が1〜700μm、固定炭素量が98質量%以上、アスペクト比が21以上であることを特徴とする、1)、又は2)に記載の自動車用LEDランプヒートシンク。
4)前記熱可塑性ポリエステル樹脂(A)が、ポリブチレンテレフタレート、ポリエチレンテレフタレート、及びポリエステル−ポリエーテル共重合体からなる群より選択される1種以上のものであることを特徴とする、1)〜3)の何れかに記載の自動車用LEDランプヒートシンク。
5)前記熱伝導性樹脂組成物の厚み方向の熱伝導率が0.5W/(m・K)以上であることを特徴とする、1)〜4)の何れかに記載の自動車用LEDランプヒートシンク。
6)前記自動車用LEDランプヒートシンクの一部が良熱伝導体金属又は炭素材料の何れか一方である、1)〜5)の何れかに記載の自動車用LEDランプヒートシンク。
7)前記良熱伝導体金属と熱伝導性樹脂組成物により形成された自動車用LEDランプヒートシンクが、インサート成形、超音波溶着、または熱融着によって、熱伝導性樹脂組成物からなるヒートシンクの受熱面部に、良熱伝導体金属を接合固定してなる、1)〜5)の何れかに記載の自動車用LEDランプヒートシンク。
8)前記良熱伝導体金属は、アルミニウム、銅、マグネシウム及びこれらの合金からなる群より選ばれる金属であり、熱伝導率40W/(m・K)以上の物質である、6)または7)に記載の自動車用LEDランプヒートシンク。
9)炭素材料は、グラファイトシートであって、面方向の熱伝導率が500W/(m・K)以上である、6)に記載の自動車用LEDヒートシンク。
10)前記自動車用LEDランプヒートシンクは、0.5W/(m・K)以上のサーマルインターフェイスマテリアルを用いたものであって、良熱伝導体金属/サーマルインターフェイスマテリアル/熱伝導性樹脂組成物より構成される、1)〜9)の何れかに記載の自動車用LEDランプヒートシンク。
11)前記自動車用LEDランプヒートシンクの一部が絶縁性を有する樹脂を含む樹脂組成物で構成されることを特徴とする、1)〜10)の何れかに記載の自動車用LEDランプヒートシンク。
12)前記自動車用LEDランプヒートシンクの射出成形用金型内のゲート厚みに対して、該ヒートシンクの基盤部の厚み比(基盤部厚み/ゲート厚み)が2以上であることを特徴とする、1)〜11)の何れかに記載の自動車用LEDランプヒートシンク。
13)前記自動車用LEDランプヒートシンクのゲート痕が、2つ以上であることを特徴とする、1)〜12)の何れかに記載の自動車用LEDランプヒートシンク。
14)1)〜13)の何れかに記載の自動車用LEDリアランプヒートシンク。
15)1)〜13)の何れかに記載の自動車用LEDフロントランプヒートシンク。
16)1)〜13)の何れかに記載の自動車用LEDヘッドランプヒートシンク。
1)熱伝導性樹脂組成物の射出成形体からなる部材を含む自動車用LEDランプヒートシンクであって、該記熱伝導性樹脂組成物は、(A)数平均分子量が12,000〜70,000である熱可塑性ポリエステル樹脂50〜90重量%、および(B)固定炭素量が98質量%以上、且つアスペクト比が21以上である鱗片状黒鉛10〜50重量%を含有し、比重1.4〜1.7、且つ面方向の熱伝導率1W/(m・K)以上であることを特徴とする自動車用LEDランプヒートシンク。
2)鱗片状黒鉛(B)の体積平均粒子径が1〜500μmである、1)に記載の自動車用LEDランプヒートシンク。
3)熱伝導性樹脂組成物は溶融混練物であり、溶融混練前の鱗片状黒鉛の体積平均粒子径が1〜700μm、固定炭素量が98質量%以上、アスペクト比が21以上である、1)又は2)に記載の自動車用LEDランプヒートシンク。
4)熱可塑性ポリエステル樹脂(A)が、ポリブチレンテレフタレート、ポリエチレンテレフタレート、及びポリエステル−ポリエーテル共重合体からなる群より選択される1種以上である、1)〜3)の何れかに記載の自動車用LEDランプヒートシンク。
5)熱伝導性樹脂組成物の厚み方向の熱伝導率が0.5W/(m・K)以上である、1)〜4)の何れかに記載の自動車用LEDランプヒートシンク。
6)金属及び炭素材料から選ばれる少なくとも1種の良熱伝導体からなる部材をさらに含む、1)〜5)の何れかに記載の自動車用LEDランプヒートシンク。
7)熱伝導性樹脂組成物の射出成形体からなる部材であるヒートシンクの受熱面部と、良熱伝導体からなる部材との、インサート成形、超音波溶着または熱融着による接合体である、1)〜5)の何れかに記載の自動車用LEDランプヒートシンク。
8)金属は、アルミニウム、銅、マグネシウム及びこれらの合金からなる群より選ばれる少なくとも1種であって、熱伝導率40W/(m・K)以上である、6)または7)に記載の自動車用LEDランプヒートシンク。
9)炭素材料は、面方向の熱伝導率500W/(m・K)以上のグラファイトシートである、6)に記載の自動車用LEDヒートシンク。
10)熱伝導率0.5W/(m・K)以上のサーマルインターフェイスマテリアルからなる熱伝導層を更に含み、該熱伝導層が、熱伝導性樹脂組成物の射出成形体からなる部材と、良熱伝導体からなる部材との間に介在する、6)〜9)の何れかに記載の自動車用LEDランプヒートシンク。
11)絶縁性材料からなる部材をさらに含む、1)〜10)の何れかに記載の自動車用LEDランプヒートシンク。
12)自動車用LEDランプヒートシンクの射出成形用金型内に熱伝導性樹脂組成物を注入するゲートの厚みと、該自動車用LEDランプヒートシンクの基盤部の厚みとの比(基盤部厚み/ゲート厚み)が2以上である、1)〜11)の何れかに記載の自動車用LEDランプヒートシンク。
13)2つ以上のゲート痕を有する、1)〜12)の何れかに記載の自動車用LEDランプヒートシンク。
14)リアランプに用いられる、1)〜13)の何れかに記載の自動車用LEDランプヒートシンク。
15)フロントランプに用いられる、1)〜13)の何れかに記載の自動車用LEDランプヒートシンク。
16)ヘッドランプに用いられる、1)〜13)の何れかに記載の自動車用LEDランプヒートシンク。
ポリエステル−ポリエーテル共重合体における芳香族ポリエステル単位は、芳香族ジカルボン酸またはそのエステル形成性誘導体とジオールまたはそのエステル形成性誘導体とから得られる重合体ないし共重合体であって、通常、交互重縮合体であり、好ましくは、ポリエチレンテレフタレート単位、ポリブチレンテレプタレート単位、及びポリプロピレンテレフタレート単位からなる群から選ばれる1種以上である。
ポリエステル−ポリエーテル共重合体における変性ポリエーテル単位は、前記一般式(1)で表される単位であり、一般式(1)中のオキシアルキレン単位の繰り返し単位数m、nにつき、(m+n)の数平均は、好ましくは2〜50であり、より好ましくは10〜50であり、さらに好ましくは18〜50である。
熱可塑性ポリエステル樹脂(A):
ポリエチレンテレフタレート(A−1):三菱化学社製 ノバペックス PBKII(商品名)、数平均分子量28,000
ポリエチレンテレフタレート(A−2):三菱化学社製 GS−100(商品名)、数平均分子量22,500
ポリエチレンテレフタレート(A−3)クラレ社製 KS710B−8S(商品名)、数平均分子量61,000
ポリエステル−ポリエーテル共重合体(A−4):
ポリエステル−ポリエーテル共重合体(A−4)としては、以下の方法で製造したものを使用した。
熱可塑性ポリアミド樹脂:ナイロン6、ユニチカ社製 A1020BRL(商品名)
鱗片状黒鉛(B−1):中越黒鉛工業所社製 CPB−80(商品名)、体積平均粒子径300μm、固定炭素量99.9%、アスペクト比100
鱗片状黒鉛(B−2):中越黒鉛工業所社製 BF−40AK(商品名)、体積平均粒子径50μm、固定炭素量99.9%、アスペクト比30
鱗片状黒鉛(B−3):中越黒鉛工業所社製 MD−100C(商品名)、体積平均粒子径170μm、固定炭素量93.6%、アスペクト比80
補強剤(C):
ガラス繊維:日本電気硝子株式会社製T187H/PL(商品名)、単体での熱伝導率1.0W/(m・K)、繊維直径13μm、数平均繊維長3.0mm
成形加工条件:
評価するために使用する成形体の成形加工温度は、使用する熱可塑性樹脂によって異なり、表1に示す成形加工温度で射出成形を行った。また、射出速度150mm/s、射出圧力150MPaに固定して成形を行った。
マイクロトラック粒度分布測定装置(日機装社製 MICROTRAC MT3300EXII)を用いて、水溶媒中に黒鉛粒子を投入し、60秒間超音波振動させた後、測定を行った。成形加工後の黒鉛粒子の体積平均粒子径については、得られた熱伝導性樹脂組成物のペレットを、射出成形機[東洋機械金属(株)製、Si−30IV]を用いて、図3、4に示すヒートシンク(ゲート径:φ1mm)を作製し、620℃で1時間焼成させた後、ヒートシンク中に含まれる黒鉛粒子のみを取り出し、測定を行った。
走査型電子顕微鏡(SEM)(日本電子社製 JSM−6060LA)を用いて、黒鉛粒子100個の面方向の最長径及び最小厚みを測定し、得られた測定値の各平均値を用いて算出した。成形加工後の黒鉛粒子のアスペクト比については、図3、4に示すヒートシンクを用いて同様の方法で算出した。
射出成形によって作製した図3、4のヒートシンクの一部を、p−クロロフェノール(東京化成工業製)とトルエンの体積比3:8混合溶媒に0.25重量%濃度となるように溶解させた後、熱可塑性樹脂のみを抽出し、試料を調製した。標準物質はポリスチレンとし、同様の試料溶液を調製した。高温GPC(Viscotek社製 350 HT−GPC System)にてカラム温度:80℃、流速1.00mL/minの条件で測定した。検出器としては、示差屈折計(RI)を使用した。
熱伝導性樹脂組成物は、押出溶融混練によって作製されるが、その際の押出混練温度は熱可塑性ポリエステル樹脂(A)によって異なり、表1に示す押出バレル温度で押出混練を行った。
得られた熱伝導性樹脂組成物のペレットを用いて、射出成形機[東洋機械金属(株)製、Si−15IV]にて、φ26mm×1mm厚の成形体を作製し、ASTM E1461規格に準拠して、レーザーフラッシュ法熱伝導率測定装置(NETZSCH社製 LFA447)により、室温大気中における面方向と厚み方向の熱伝導率を測定した。
射出成形によって、図3 、4に示すヒートシンクであって、ゲート痕5の断面形状が異なる以外は同じ形状及び同じ寸法である2種類のヒートシンク(1)、(2)を作製した。得られたヒートシンクの基盤部3の厚み方向の熱伝導率を測定した。
ヒートシンク(1)のゲート痕5の断面形状:φ1mmのほぼ円形
ヒートシンク(2)のゲート痕5の断面形状:2mm×2mmのほぼ正方形
φ26mm×1mm厚の成形体を用いて、ISO1183規格に準拠して、水中置換法にて比重を測定した。
得られた熱伝導性樹脂組成物のペレットを、射出成形機[東洋機械金属(株)製、Si−30IV]を用いて、熱伝導性樹脂組成物中に含まれる熱可塑性樹脂の種類に合わせて、表1に示す成形温度、金型温度にし、射出圧力150MPa、射出速度150mm/sでスパイラル状の成形体(10mm幅×1mm厚、ピッチ5mm)における流動長を測定し、次のように成形性を判断した。○:流動長が120mm以上、△:流動長が80〜120mm、×:流動長が80mm未満
HDT(高荷重)射出成形機[東洋機械金属(株)製、Si−30IV]にて、80mm×40mm×4mm厚みの試験片を作製し、ISO75規格に準拠して測定した。
小型高温チャンバー(ESPEC社製、ST−120)を用いて、試験片を大気中、150℃雰囲気下で2000時間放置した。試験前後の試験片の曲げ強度をISO178に準拠して測定し、曲げ強度保持率(2000時間放置後の曲げ強度/初期の曲げ強度)を算出した。
放射率測定器(ジャパンセンサー社製 TSS−5X)を用いて、80mm×40mm×4mm厚みの成形体の放射率を測定した。
射出成形によって作製したφ26mm×1mm厚のサンプルを、23℃、湿度50%雰囲気下で1週間放置させた後、ガラス管(外径80mm×高さ180mm、開口部の外径60mm)の中に、サンプルを3枚いれ、ガラス管開口上にガラス板を載せ、ガラス管とガラス板間の隙間を埋めるためラップでシールをした。このガラス管を120℃のオイルバスに24時間浸け、この際に発生したガスをガラス板に付着させた。その後、このガラス板を濁度計(日本電色工業社製NDH−300A)にてヘイズ値(曇り)を測定し、次のようにフォギング性の判定をした。○:ヘイズ値が5%未満、△:ヘイズ値が5〜10%、×:ヘイズ値が10%以上。ヘイズ値は小さいほど曇りが少なくフォギング性に優れており、ヘイズ値が大きいほどガラスが曇り、フォギング性に劣る。
図5〜7に示す形状のヒートシンク(40×40×40mm)を作製し、ヒートシンクの上面部にアルミ板(20×20、厚み1mm)を設置した。超音波溶着機(エマソン社製 2000Xdt)を用いて、20kHzの超音波振動を振幅設定値80%で3秒間かけリブ部7を溶着させ、超音波溶着性を次のようにして判定した。○:溶着部にバリの発生がない、×:溶着部にバリの発生があり、バリ部を爪で擦ると屑が発生する。
熱可塑性ポリエステル樹脂(A−1)〜(A−4)を、熱風乾燥機を用いて140℃で4時間乾燥し、表2に示された重量比率となるように混合したものを準備した。これに、フェノール系安定剤(株式会社ADEKA製AO−60)およびリン系酸化防止剤(株式会社ADEKA製アデカスタブPEP−36)を樹脂組成物100重量部に対してそれぞれ0.3重量部加えた。この混合物を、株式会社テクノベル製25mm同方向回転完全噛合型二軸押出機MFU25TW−60HG−NH−1300を用いて、吐出量20kg/h、スクリュー回転数150rpm、押出バレル温度を表1に示す温度に設定して溶融混練することで、樹脂組成物のペレットを得た。
得られた樹脂組成物のペレットを射出成形によって、各成形体を作製し、各種評価した。ヒートシンク中に含まれる黒鉛粒子の体積平均粒子径とアスペクト比、及び各種物性値を表2に示す。
表3に示す配合処方に変更した以外は、実施例1と同様にした。ヒートシンク中に含まれる黒鉛粒子の体積平均粒子径とアスペクト比、及び各種物性値を表3に示す。
熱可塑性ポリエステル樹脂を熱可塑性ポリアミド樹脂に変更し、熱風乾燥機を用いて120℃で6時間乾燥し、表3に示された重量比率となるように混合したものを準備した。押出バレル温度、射出成形条件を変更した点以外は、実施例1と同様にした。ヒートシンク中に含まれる黒鉛粒子の体積平均粒子径とアスペクト比、及び各種物性値を表3に示す。
2 回路基板
3 ヒートシンクの基盤部
4 ヒートシンクのフィン
5 ゲート
6 ヒートシンク上面部
7 リブ
8 良熱伝導体金属製部材
Claims (13)
- 一部または全部が熱伝導性樹脂組成物の射出成形により形成されたLEDモジュールを冷却するための自動車用LEDランプヒートシンクであって、
前記自動車用LEDランプヒートシンクが、板状の基盤部と複数のフィンからなるフィン部とを有し、前記の複数のフィンがそれぞれ前記基盤部の一方の表面に対して互いに離隔しながら垂下し、且つ前記基盤部から離れるほどその厚みが薄くなるように構成され、且つ前記基盤部の端面側にゲート痕が配置されており、
前記熱伝導性樹脂組成物が、(A)数平均分子量が12,000〜70,000である熱可塑性ポリエステル樹脂50〜90重量%、および(B)固定炭素量が98質量%以上、且つアスペクト比が21以上である鱗片状黒鉛10〜50重量%を少なくとも含有し、比重1.4〜1.7、且つ1W/(m・K)以上の面方向の熱伝導率を有する樹脂組成物であり、
前記熱伝導性樹脂組成物中の前記鱗片状黒鉛(B)が、体積平均粒子径201〜700μmのものを、前記熱可塑性ポリエステル樹脂(A)と溶融混錬して体積平均粒子径1〜500μmとしたものであり、
前記熱可塑性ポリエステル樹脂がポリエチレンテレフタレート及びポリエステル−ポリエーテル共重合体からなる群より選択される1種以上のものであり、
前記ゲート痕の厚みに対して、前記基盤部の厚み比(基盤部厚み/ゲート痕の厚み)が2以上である
ことを特徴とする自動車用LEDランプヒートシンク。 - 前記熱伝導性樹脂組成物が溶融混練によって製造され、溶融混練前の鱗片状黒鉛のアスペクト比が21以上であることを特徴とする、請求項1に記載の自動車用LEDランプヒートシンク。
- 前記熱伝導性樹脂組成物の厚み方向の熱伝導率が0.5W/(m・K)以上であることを特徴とする、請求項1又は2に記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクの一部が良熱伝導体金属又は炭素材料の何れか一方である、請求項1〜3の何れか1項に記載の自動車用LEDランプヒートシンク。
- 良熱伝導体金属と前記熱伝導性樹脂組成物により形成された自動車LEDランプヒートシンクが、インサート成形、超音波溶着、または熱融着によって、前記熱伝導性樹脂組成物からなるヒートシンクの受熱面部に、前記良熱伝導体金属を接合固定してなる、請求項1〜3の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記良熱伝導体金属は、アルミニウム、銅、マグネシウム及びこれらの合金からなる群より選ばれる金属であり、熱伝導率40W/(m・K)以上の物質である、請求項4または5に記載の自動車用LEDランプヒートシンク。
- 前記炭素材料は、グラファイトシートであって、面方向の熱伝導率が500W/(m・K)以上である、請求項4に記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクは、前記熱伝導性樹脂組成物、前記良熱伝導体金属および熱伝導率0.5W/(m・K)以上のサーマルインターフェイスマテリアルを用いたものであって、前記熱伝導性樹脂組成物と前記良熱伝導体金属との間に前記サーマルインターフェイスマテリアルからなる熱伝導層が介在して構成される、請求項4〜7の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクの一部が絶縁性を有する樹脂を含む樹脂組成物で構成されることを特徴とする、請求項1〜8の何れかに記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクのゲート痕が、2つ以上であることを特徴とする、請求項1〜9の何れか1項に記載の自動車用LEDランプヒートシンク。
- リアランプに用いられる、請求項1〜10の何れか1項に記載の自動車用LEDランプヒートシンク。
- フロントランプに用いられる、請求項1〜10の何れか1項に記載の自動車用LEDランプヒートシンク。
- ヘッドランプに用いられる、請求項1〜10の何れか1項に記載の自動車用LEDランプヒートシンク。
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