JP6847208B2 - カメラモジュール検査装置 - Google Patents

カメラモジュール検査装置 Download PDF

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Publication number
JP6847208B2
JP6847208B2 JP2019519270A JP2019519270A JP6847208B2 JP 6847208 B2 JP6847208 B2 JP 6847208B2 JP 2019519270 A JP2019519270 A JP 2019519270A JP 2019519270 A JP2019519270 A JP 2019519270A JP 6847208 B2 JP6847208 B2 JP 6847208B2
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Japan
Prior art keywords
probe
camera module
grounding
signal
conductive block
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English (en)
Japanese (ja)
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JP2019537707A (ja
Inventor
キム，ヒ−チョル
Original Assignee
リーノ インダストリアル インコーポレイテッド
リーノ インダストリアル インコーポレイテッド
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Publication of JP2019537707A publication Critical patent/JP2019537707A/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2019519270A 2016-11-29 2017-11-23 カメラモジュール検査装置 Active JP6847208B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020160160670A KR101906575B1 (ko) 2016-11-29 2016-11-29 카메라모듈 검사장치
KR10-2016-0160670 2016-11-29
PCT/KR2017/013411 WO2018101674A1 (en) 2016-11-29 2017-11-23 Camera module test device

Publications (2)

Publication Number Publication Date
JP2019537707A JP2019537707A (ja) 2019-12-26
JP6847208B2 true JP6847208B2 (ja) 2021-03-31

Family

ID=62242517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019519270A Active JP6847208B2 (ja) 2016-11-29 2017-11-23 カメラモジュール検査装置

Country Status (5)

Country Link
JP (1) JP6847208B2 (ko)
KR (1) KR101906575B1 (ko)
CN (1) CN109983769B (ko)
TW (1) TWI644110B (ko)
WO (1) WO2018101674A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112213533A (zh) * 2019-07-10 2021-01-12 三赢科技（深圳）有限公司 针座结构及采用该针座结构的测试治具
KR20230052081A (ko) 2021-10-12 2023-04-19 김광일 보이스 코일 모터를 포함한 카메라 모듈 테스트용 소켓 장치
CN115190233B (zh) * 2022-08-15 2024-05-28 维沃移动通信有限公司 摄像头模组和电子设备

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003207078A1 (en) * 2002-02-07 2003-09-02 Yokowo Co., Ltd. Capacity load type probe, and test jig using the same
JP4242199B2 (ja) * 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット
US20060066328A1 (en) * 2004-09-30 2006-03-30 Probelogic, Inc. Buckling beam probe test assembly
WO2006062911A1 (en) * 2004-12-08 2006-06-15 K & S Interconnect, Inc. Test socket and method for making
TWI323503B (en) * 2005-12-12 2010-04-11 Optopac Co Ltd Apparatus, unit and method for testing image sensor packages
JP2008070146A (ja) * 2006-09-12 2008-03-27 Yokowo Co Ltd 検査用ソケット
CN101221194B (zh) * 2007-01-09 2011-11-16 旺矽科技股份有限公司 高频探针
JP5193200B2 (ja) * 2007-06-22 2013-05-08 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
TWI372248B (en) * 2008-08-21 2012-09-11 King Yuan Electronics Co Ltd A pogo tower and fabrication method thereof
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
JP2010175371A (ja) * 2009-01-29 2010-08-12 Yokowo Co Ltd 検査ソケット
KR20100095142A (ko) * 2009-02-20 2010-08-30 리노공업주식회사 검사용 소켓
JP2010243303A (ja) * 2009-04-04 2010-10-28 Advanced Systems Japan Inc 低熱膨張インターポーザ
CN101865938A (zh) * 2009-04-14 2010-10-20 南茂科技股份有限公司 探针卡组件及其中的探针座
KR100985500B1 (ko) * 2009-08-17 2010-10-26 리노공업주식회사 검사용 소켓
JP2011086453A (ja) * 2009-10-14 2011-04-28 Unitechno Inc 高周波検査ソケット
JP5788767B2 (ja) * 2011-11-07 2015-10-07 株式会社日本マイクロニクス プローブブロックとそれを備えるプローブカード並びにプローブ装置
KR101703688B1 (ko) * 2012-05-02 2017-02-07 리노공업주식회사 테스트 소켓
KR101534778B1 (ko) * 2014-01-24 2015-07-09 리노공업주식회사 검사장치
KR101552552B1 (ko) * 2014-08-22 2015-09-14 리노공업주식회사 테스트 소켓
TWM514004U (zh) * 2015-07-30 2015-12-11 Cheng Yun Technology Co Ltd 積體電路的檢測裝置及檢測設備

Also Published As

Publication number Publication date
CN109983769B (zh) 2020-12-29
WO2018101674A1 (en) 2018-06-07
TWI644110B (zh) 2018-12-11
KR20180060781A (ko) 2018-06-07
KR101906575B1 (ko) 2018-10-11
JP2019537707A (ja) 2019-12-26
CN109983769A (zh) 2019-07-05
TW201819942A (zh) 2018-06-01

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