JP6793111B2 - 自動車アプリケーションのためのled光源 - Google Patents
自動車アプリケーションのためのled光源 Download PDFInfo
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- JP6793111B2 JP6793111B2 JP2017502830A JP2017502830A JP6793111B2 JP 6793111 B2 JP6793111 B2 JP 6793111B2 JP 2017502830 A JP2017502830 A JP 2017502830A JP 2017502830 A JP2017502830 A JP 2017502830A JP 6793111 B2 JP6793111 B2 JP 6793111B2
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- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000000926 separation method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000013307 optical fiber Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
- G02B6/0006—Coupling light into the fibre
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
- G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/60—Light sources with three-dimensionally disposed light-generating elements on stacked substrates
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
- G02B6/06—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres the relative position of the fibres being the same at both ends, e.g. for transporting images
- G02B6/08—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres the relative position of the fibres being the same at both ends, e.g. for transporting images with fibre bundle in form of plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Claims (10)
- 第1LED光源および第2LED光源を含む光源であって、
前記第1LED光源および前記第2LED光源のそれぞれは、
光を生成するように適合された半導体ダイオード構造体と、
前記半導体ダイオード構造体の上面に垂直な光出力方向において前記半導体ダイオード構造体から光を出力するように適合されている前記半導体ダイオード構造体の前記上面に備えられた光出力部と、
を含み、
前記光出力部は、対応するLED光源の1つのコーナーに置かれており、前記光出力部の1つのコーナーと2つのエッジが、該LED光源の1つのコーナーと2つのエッジに対応しており、
前記第2LED光源は、前記光出力方向から見たときに、前記第1LED光源および前記第2LED光源の前記光出力部が一列に並ばないように、かつ、前記第1LED光源および前記第2LED光源が前記光出力部以外において少なくとも部分的にオーバーラップしているように、前記光出力方向において前記第1LED光源の上方に配置されており、
前記光出力方向から見たときに、前記光出力部の全体の面積は、前記半導体ダイオード構造体の全体の面積よりも小さく、
前記第1LED光源および第2LED光源のうち少なくとも一つは、さらに、前記半導体ダイオード構造体の側面を少なくとも部分的に取り囲んでおり、かつ、前記半導体ダイオード構造体からの光を前記光出力部に向かって反射するように適合されている光反射構造体、を含み、
前記光反射構造体は、前記光反射構造体の中に形成された前記光出力部としての開口部、を含み、
前記光反射構造体の中に形成された前記開口部を有する前記第1LED光源および第2LED光源のうち少なくとも一つの前記半導体ダイオード構造体は、光強化材料を含む、
光源。 - 前記第1LED光源および前記第2LED光源の前記光出力部は、前記光出力方向から見たときに、オーバーラップしていない、
請求項1に記載の光源。 - 前記第1LED光源および前記第2LED光源の前記光出力部について、前記光出力方向から見たときに、隣り合うエッジ間には、前記光出力方向に対して垂直な横方向に分離が存在し、
前記横方向の分離は、前記光出力部の横方向の幅の10%より小さい、
請求項1または2に記載の光源。 - 前記第1LED光源および第2LED光源のうち少なくとも一つの前記光出力部は、光強化材料を含む、
請求項1乃至3いずれか一項に記載の光源。 - 前記第1LED光源は、さらに、前記第1LED光源の前記光出力部の上面に置かれた複数の上方投射光ファイバーを含む、
請求項1乃至4いずれか一項に記載の光源。 - 請求項1乃至5いずれか一項に記載の光源を有する、自動車照明。
- 請求項1乃至5いずれか一項に記載の光源を有する、プロジェクター照明。
- 第1LED光源および第2LED光源を含む光源を製造する方法であって、
前記第1LED光源および前記第2LED光源のそれぞれは、
光を生成するように適合された半導体ダイオード構造体と、
前記半導体ダイオード構造体の上面に垂直な光出力方向において前記半導体ダイオード構造体から光を出力するように適合されている前記半導体ダイオード構造体の前記上面に備えられた光出力部であり、前記光出力方向から見たときに、前記光出力部の全体の面積は、前記半導体ダイオード構造体の全体の面積よりも小さい、光出力部と、
を含み、
前記光出力部は、対応するLED光源の1つのコーナーに置かれており、前記光出力部の1つのコーナーと2つのエッジが、該LED光源の1つのコーナーと2つのエッジに対応しており、
前記第1LED光源および第2LED光源のうち少なくとも一つは、さらに、前記半導体ダイオード構造体の側面を少なくとも部分的に取り囲んでおり、かつ、前記半導体ダイオード構造体からの光を前記光出力部に向かって反射するように適合されている光反射構造体、を含み、
光反射構造体を有する前記第1LED光源および第2LED光源のうち少なくとも一つの前記光出力部は、前記光反射構造体の中に形成された前記光出力部としての開口部、を含み、
前記方法は、
前記第2LED光源を、前記光出力方向から見たときに、前記第1LED光源および前記第2LED光源の前記光出力部が一列に並ばないように、かつ、前記第1LED光源および前記第2LED光源が前記光出力部以外において少なくとも部分的にオーバーラップするように、前記光出力方向において前記第1LED光源の上方に配置するステップ、
を含み、
前記光反射構造体の中に形成された前記開口部を有する前記第1LED光源および第2LED光源のうち少なくとも一つの前記半導体ダイオード構造体は、光強化材料を含む、
方法。 - 前記配置するステップは、
記第1LED光源および前記第2LED光源の前記光出力部が、前記光出力方向から見たときに、オーバーラップしていないように配置するステップ、を含む、
請求項8に記載の方法。 - 前記配置するステップは、
前記第1LED光源および前記第2LED光源の前記光出力部について、前記光出力方向から見たときに、隣り合うエッジ間に、前記光出力方向に対して垂直な横方向に分離が存在するように、前記第1LED光源および前記第2LED光源を配置するステップ、を含み、
前記横方向の分離は、前記光出力部の横方向の幅の10%より小さい、
請求項8または9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14177598.1 | 2014-07-18 | ||
EP14177598 | 2014-07-18 | ||
PCT/EP2015/066452 WO2016009061A1 (en) | 2014-07-18 | 2015-07-17 | Led light source for automotive application |
Publications (2)
Publication Number | Publication Date |
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JP2017522734A JP2017522734A (ja) | 2017-08-10 |
JP6793111B2 true JP6793111B2 (ja) | 2020-12-02 |
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JP2017502830A Active JP6793111B2 (ja) | 2014-07-18 | 2015-07-17 | 自動車アプリケーションのためのled光源 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9991238B2 (ja) |
EP (1) | EP3170202B1 (ja) |
JP (1) | JP6793111B2 (ja) |
KR (1) | KR102406383B1 (ja) |
CN (1) | CN106489204B (ja) |
WO (1) | WO2016009061A1 (ja) |
Families Citing this family (2)
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KR101989099B1 (ko) | 2017-06-14 | 2019-06-13 | 엘지전자 주식회사 | 차량용 램프 및 차량 |
US10629566B1 (en) * | 2019-01-28 | 2020-04-21 | GM Global Technology Operations LLC | Seamlessly integrated soft OLEDs |
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US20060291203A1 (en) * | 2005-06-27 | 2006-12-28 | Munisamy Anandan | Fiber mixed R-G-B white emitting LED package |
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-
2015
- 2015-07-17 EP EP15738914.9A patent/EP3170202B1/en active Active
- 2015-07-17 US US15/325,693 patent/US9991238B2/en active Active
- 2015-07-17 JP JP2017502830A patent/JP6793111B2/ja active Active
- 2015-07-17 WO PCT/EP2015/066452 patent/WO2016009061A1/en active Application Filing
- 2015-07-17 CN CN201580039040.XA patent/CN106489204B/zh active Active
- 2015-07-17 KR KR1020177004511A patent/KR102406383B1/ko active IP Right Grant
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Publication number | Publication date |
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EP3170202A1 (en) | 2017-05-24 |
CN106489204B (zh) | 2020-12-22 |
KR102406383B1 (ko) | 2022-06-08 |
US20170200708A1 (en) | 2017-07-13 |
JP2017522734A (ja) | 2017-08-10 |
KR20170035982A (ko) | 2017-03-31 |
WO2016009061A1 (en) | 2016-01-21 |
US9991238B2 (en) | 2018-06-05 |
CN106489204A (zh) | 2017-03-08 |
EP3170202B1 (en) | 2021-05-19 |
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