JP6761419B2 - 速度論的に制限されたナノスケールの拡散ボンド構造及び方法 - Google Patents
速度論的に制限されたナノスケールの拡散ボンド構造及び方法 Download PDFInfo
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- JP6761419B2 JP6761419B2 JP2017533968A JP2017533968A JP6761419B2 JP 6761419 B2 JP6761419 B2 JP 6761419B2 JP 2017533968 A JP2017533968 A JP 2017533968A JP 2017533968 A JP2017533968 A JP 2017533968A JP 6761419 B2 JP6761419 B2 JP 6761419B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0875—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation
- B32B2310/0887—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/18—Titanium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
- Ceramic Products (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
103 電磁ビーム
104 透明材料
106 吸収性不透明材料
108 ボンド界面
280 レーザービーム
282 レーザービームの幅/直径、スポットサイズ
284 スポットの重なり合い
300 急速室温バルク材料ボンドシステム
301 メモリ
302 コントローラ
303 プロセッサ
304 ユーザーインターフェース
305 スキャナ
307 ステージ
308 接合用固定冶具組立体
310 センサ
402 チタン
404 サファイア
406 拡散帯域
410 透過電子顕微鏡(TEM)画像
412 界面ボンド継目
418 走査電子顕微鏡(SEM)画像
420、424 無接合区域
422 接合区域
502 基部
504 X軸運動ステージ
506 Y軸運動ステージ
508 Z軸運動ステージ
510 集束光学部品組立体
512 カメラ組立体
514 位置合わせ光学素子
520 材料保持用組立体
524 係合支持体
528 並進ロッド
530 膨張組立体
532 滑り板
534 オプチカルフラット
538 固定板
539 離間ロッド
540 中央通路
550 保持フレーム
600 チタン
602 サファイア層
704 透明材料
706 吸収性不透明材料
708 中間層
Claims (8)
- ナノスケールの拡散ボンド(412)を有するバルク材料であって、
選択波長の電磁ビームを最小限のエネルギーしか吸収せずに通過させる特性を有しているサファイアからなる透明非金属絶縁体材料であって、前記最小限のエネルギーの吸収量は前記電磁ビームの電磁放射線の総エネルギーの50%未満である前記透明非金属絶縁体材料(104、404、414、602、704)と、
前記電磁ビームからのエネルギーを吸収する特性を有しているチタンからなる吸収性不透明材料(108、402、412、600、706)と、
前記電磁ビームのエネルギーに基づいて前記透明非金属絶縁体材料と前記吸収性不透明材料との間に形成されている1000nm未満の厚さを有している前記拡散ボンド(412)と、を備えているバルク材料。 - バルク材料にナノスケールの拡散ボンド(412)を形成する方法において、
選択波長の電磁ビームを最小限のエネルギーしか吸収せずに通過させる特性を有しているサファイアからなる透明非金属絶縁体材料(104、404、414、602、704)の接合されるべき第1の表面を、前記電磁ビームからのエネルギーを吸収する特性を有しているチタンからなる吸収性不透明材料(108、402、412、600、706)の接合されるべき第2の表面に当てて位置決めする段階であって、前記最小限のエネルギーの吸収量は前記電磁ビームの電磁放射線の総エネルギーの50%未満である、前記位置決めする段階と、
前記の透明非金属絶縁体材料及び吸収性不透明材料へ圧力を印加する段階と、
前記電磁ビームを、前記透明非金属絶縁体材料を通して前記吸収性不透明材料の接合されるべき前記第2の表面へ選択的に送る段階と、
前記電磁ビームを用いて前記ナノスケールの拡散ボンド(412)を作成する段階と、
を備えている方法。 - 請求項1に記載のバルク材料において、前記ボンドは、耐食性、密閉封止、無亀裂、均一、及び生体安定性、のうちの少なくとも1つの特性を有する、バルク材料。
- 請求項1に記載のバルク材料において、前記拡散ボンドは、200nm未満の厚さの界面を含む、バルク材料。
- 請求項4に記載のバルク材料において、前記拡散ボンドは、60nm未満の厚さで且つ界面接合領域内のアモルファス拡散帯域(406)を含む、バルク材料。
- 請求項2に記載の方法において、前記拡散ボンドは、耐食性、密閉封止、無亀裂、均一、及び生体安定性、のうちの少なくとも1つの特性を有する、方法。
- 請求項2に記載の方法において、前記拡散ボンドは、200nm未満の厚さの界面を含む、方法。
- 請求項7に記載の方法において、前記拡散ボンドは、60nm未満の厚さで且つ界面接合領域内のアモルファス拡散帯域(406)を含む、方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462096706P | 2014-12-24 | 2014-12-24 | |
US62/096,706 | 2014-12-24 | ||
US14/976,475 | 2015-12-21 | ||
US14/976,475 US10124559B2 (en) | 2014-12-24 | 2015-12-21 | Kinetically limited nano-scale diffusion bond structures and methods |
PCT/US2015/067390 WO2016106323A1 (en) | 2014-12-24 | 2015-12-22 | Kinetically limited nano-scale diffusion bond structures and methods |
Publications (3)
Publication Number | Publication Date |
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JP2018502040A JP2018502040A (ja) | 2018-01-25 |
JP2018502040A5 JP2018502040A5 (ja) | 2020-04-16 |
JP6761419B2 true JP6761419B2 (ja) | 2020-09-23 |
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JP2017533968A Active JP6761419B2 (ja) | 2014-12-24 | 2015-12-22 | 速度論的に制限されたナノスケールの拡散ボンド構造及び方法 |
Country Status (6)
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US (3) | US10124559B2 (ja) |
EP (1) | EP3237141B1 (ja) |
JP (1) | JP6761419B2 (ja) |
KR (1) | KR102474915B1 (ja) |
CN (1) | CN107107251B (ja) |
WO (1) | WO2016106323A1 (ja) |
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US20210197521A1 (en) | 2021-07-01 |
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