JP6741383B2 - トランジスタ及び表示装置 - Google Patents
トランジスタ及び表示装置 Download PDFInfo
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- JP6741383B2 JP6741383B2 JP2017134518A JP2017134518A JP6741383B2 JP 6741383 B2 JP6741383 B2 JP 6741383B2 JP 2017134518 A JP2017134518 A JP 2017134518A JP 2017134518 A JP2017134518 A JP 2017134518A JP 6741383 B2 JP6741383 B2 JP 6741383B2
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- metal oxide
- oxide
- transistor
- insulating film
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- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
- H01L29/78693—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate the semiconducting oxide being amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136222—Colour filters incorporated in the active matrix substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/44—Arrangements combining different electro-active layers, e.g. electrochromic, liquid crystal or electroluminescent layers
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- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Physical Vapour Deposition (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
本実施の形態では、本発明の一態様である金属酸化物について説明する。
図1は、本発明の一態様におけるCAC(Cloud−Aligned Composite)構成を有する金属酸化物の概念図である。なお、本明細書において、本発明の一態様である金属酸化物が、半導体の機能を有する場合、CAC(Cloud−Aligned Composite)−OS(Oxide Semiconductor)と定義する。
続いて、上記金属酸化物を半導体としてトランジスタに用いる場合について、図2を用いて説明する。
以下では、金属酸化物の成膜方法の一例について説明する。
本実施の形態では、本発明の一態様の金属酸化物を有する半導体装置、及び当該半導体装置の作製方法について、図5乃至図16を参照して説明する。
図5(A)は、本発明の一態様の半導体装置であるトランジスタ100Aの上面図であり、図5(B)は、図5(A)に示す一点鎖線X1−X2間における切断面の断面図に相当し、図5(C)は、図5(A)に示す一点鎖線Y1−Y2間における切断面の断面図に相当する。また、図5(D)は、図5(B)に示す領域P1を拡大した断面概念図に相当する。
次に、図5(A)(B)(C)に示すトランジスタ100Aの変形例について、図6乃至図8を用いて説明する。
次に、金属酸化物108を積層構造とした場合のバンド構造について、図16を用いて説明する。
次に、先に説明したトランジスタと異なる態様の構成のトランジスタについて、図9を用いて説明する。
次に、図9(A)(B)(C)に示すトランジスタ200Aの変形例について、図10乃至図12を用いて説明する。
以下では、本実施の形態の半導体装置に含まれる構成要素について、詳細に説明する。
基板102、202の材質などに大きな制限はないが、少なくとも、後の熱処理に耐えうる程度の耐熱性を有している必要がある。例えば、ガラス基板、セラミック基板、石英基板、サファイア基板等を、基板102、202として用いてもよい。また、シリコンや炭化シリコンを材料とした単結晶半導体基板、多結晶半導体基板、シリコンゲルマニウム等の化合物半導体基板、SOI基板等を適用することも可能であり、これらの基板上に半導体素子が設けられたものを、基板102、202として用いてもよい。なお、基板102、202として、ガラス基板を用いる場合、第6世代(1500mm×1850mm)、第7世代(1870mm×2200mm)、第8世代(2200mm×2400mm)、第9世代(2400mm×2800mm)、第10世代(2950mm×3400mm)等の大面積基板を用いることで、大型の表示装置を作製することができる。
第1のゲート電極として機能する導電膜106、206、ソース電極として機能する導電膜112a、220a、ドレイン電極として機能する導電膜112b、220b、接続電極として機能する導電膜112c、第2のゲート電極として機能する導電膜120a、212、及び画素電極として機能する導電膜120bとしては、クロム(Cr)、銅(Cu)、アルミニウム(Al)、金(Au)、銀(Ag)、亜鉛(Zn)、モリブデン(Mo)、タンタル(Ta)、チタン(Ti)、タングステン(W)、マンガン(Mn)、ニッケル(Ni)、鉄(Fe)、コバルト(Co)から選ばれた金属元素、または上述した金属元素を成分とする合金か、上述した金属元素を組み合わせた合金等を用いてそれぞれ形成することができる。
トランジスタの第1のゲート絶縁膜として機能する絶縁膜104、204としては、プラズマ化学気相堆積(PECVD:(Plasma Enhanced Chemical Vapor Deposition))法、スパッタリング法等により、酸化シリコン膜、酸化窒化シリコン膜、窒化酸化シリコン膜、窒化シリコン膜、酸化アルミニウム膜、酸化ハフニウム膜、酸化イットリウム膜、酸化ジルコニウム膜、酸化ガリウム膜、酸化タンタル膜、酸化マグネシウム膜、酸化ランタン膜、酸化セリウム膜および酸化ネオジム膜を一種以上含む絶縁層を、それぞれ用いることができる。なお、絶縁膜104、204としては、上述の材料から選択された単層の絶縁膜、または2層以上の絶縁膜を用いてもよい。
金属酸化物108、208としては、実施の形態1に示す本発明の一態様の金属酸化物を用いることができる。
絶縁膜114、116、210は、トランジスタの第2のゲート絶縁膜として機能する。また、絶縁膜114、116、210は、金属酸化物108、208に酸素を供給する機能を有する。すなわち、絶縁膜114、116、210は、酸素を有する。また、絶縁膜114は、酸素を透過することのできる絶縁膜である。なお、絶縁膜114は、後に形成する絶縁膜116を形成する際の、金属酸化物108へのダメージ緩和膜としても機能する。
絶縁膜118、216は、トランジスタの保護絶縁膜として機能する。
次に、本発明の一態様の半導体装置であるトランジスタ200Cの作製方法について、図13乃至図15を用いて説明する。
本実施の形態では、本発明の一態様の半導体装置を用いた表示装置の表示部等に用いることのできる表示パネルの一例について、図17及び図18を用いて説明する。以下で例示する表示パネルは、反射型の液晶素子と、発光素子との双方を有し、透過モードと反射モードの両方の表示を行うことのできる、表示パネルである。なお、本発明の一態様の金属酸化物、及び当該金属酸化物を有するトランジスタは、表示装置の画素のトランジスタ、または表示装置を駆動させるドライバ、あるいは表示装置にデータを供給するLSI等に好適に用いることができる。
図17は、本発明の一態様の表示パネル600の斜視概略図である。表示パネル600は、基板651と基板661とが貼り合わされた構成を有する。図17では、基板661を破線で明示している。
図18に、図17で例示した表示パネルの、FPC672を含む領域の一部、回路659を含む領域の一部、及び表示部662を含む領域の一部をそれぞれ切断したときの断面の一例を示す。
以下では、上記に示す各構成要素について説明する。
接着層としては、紫外線硬化型等の光硬化型接着剤、反応硬化型接着剤、熱硬化型接着剤、嫌気型接着剤などの各種硬化型接着剤を用いることができる。これら接着剤としてはエポキシ樹脂、アクリル樹脂、シリコーン樹脂、フェノール樹脂、ポリイミド樹脂、イミド樹脂、PVC(ポリビニルクロライド)樹脂、PVB(ポリビニルブチラル)樹脂、EVA(エチレンビニルアセテート)樹脂等が挙げられる。特に、エポキシ樹脂等の透湿性が低い材料が好ましい。また、二液混合型の樹脂を用いてもよい。また、接着シート等を用いてもよい。
接続層としては、異方性導電フィルム(ACF:Anisotropic Conductive Film)や、異方性導電ペースト(ACP:Anisotropic Conductive Paste)などを用いることができる。
着色層に用いることのできる材料としては、金属材料、樹脂材料、顔料または染料が含まれた樹脂材料などが挙げられる。
遮光層として用いることのできる材料としては、カーボンブラック、チタンブラック、金属、金属酸化物、複数の金属酸化物の固溶体を含む複合酸化物等が挙げられる。遮光層は、樹脂材料を含む膜であってもよいし、金属などの無機材料の薄膜であってもよい。また、遮光層に、着色層の材料を含む膜の積層膜を用いることもできる。例えば、ある色の光を透過する着色層に用いる材料を含む膜と、他の色の光を透過する着色層に用いる材料を含む膜との積層構造を用いることができる。着色層と遮光層の材料を共通化することで、装置を共通化できるほか工程を簡略化できるため好ましい。
ここでは、可撓性を有する基板を用いた表示パネルの作製方法の例について説明する。
P2 領域
P3 領域
P4 領域
P5 領域
P6 領域
P7 領域
P8 領域
001 領域
002 領域
100A トランジスタ
100B トランジスタ
100C トランジスタ
100D トランジスタ
102 基板
104 絶縁膜
106 導電膜
108 金属酸化物
108_1 金属酸化物
108_2 金属酸化物
108_3 金属酸化物
112a 導電膜
112b 導電膜
112c 導電膜
114 絶縁膜
116 絶縁膜
118 絶縁膜
120a 導電膜
120b 導電膜
151 開口部
152a 開口部
152b 開口部
200A トランジスタ
200B トランジスタ
200C トランジスタ
200D トランジスタ
202 基板
204 絶縁膜
206 導電膜
208 金属酸化物
208_1a 金属酸化物
208_2a 金属酸化物
208_3a 金属酸化物
208i 領域
208i_1 領域
208i_2 領域
208i_3 領域
208n 領域
210 絶縁膜
210_0 絶縁膜
212 導電膜
212_0 導電膜
216 絶縁膜
218 絶縁膜
220a 導電膜
220b 導電膜
240 マスク
241a 開口部
241b 開口部
243 開口部
600 表示パネル
601 トランジスタ
604 接続部
605 トランジスタ
606 トランジスタ
607 接続部
612 液晶層
613 導電膜
617 絶縁膜
620 絶縁膜
621 絶縁膜
623 導電膜
631 着色層
632 遮光膜
633a 配向膜
633b 配向膜
634 着色層
635 導電膜
640 液晶素子
641 接着層
642 接着層
643 導電膜
644 EL層
645a 導電膜
645b 導電膜
646 絶縁膜
647 絶縁膜
648 導電膜
649 接続層
651 基板
652 導電膜
653 半導体膜
654 導電膜
655 開口
656 偏光板
659 回路
660 発光素子
661 基板
662 表示部
663 導電膜
666 配線
672 FPC
673 IC
681 絶縁膜
682 絶縁膜
683 絶縁膜
684 絶縁膜
685 絶縁膜
686 接続体
687 接続部
Claims (10)
- 金属酸化物と、前記金属酸化物に接する一対の電極と、前記金属酸化物と接する絶縁体と、前記絶縁体を介して前記金属酸化物と重畳するゲート電極と、を有し、
前記金属酸化物は、
第1の領域と第2の領域を有し、
前記第1の領域と前記第2の領域はモザイク状に混合しており、
前記第2の領域の伝導帯下端のエネルギー準位は、前記第1の領域の伝導帯下端のエネルギー準位より0.2eV以上低く、
前記第1の領域のエネルギーギャップは、3.3eV以上4.0eV以下であり、
前記第2の領域のエネルギーギャップは、2.2eV以上2.9eV以下である、
トランジスタ。 - 金属酸化物と、前記金属酸化物に接する一対の電極と、前記金属酸化物と接する絶縁体と、前記絶縁体を介して前記金属酸化物と重畳するゲート電極と、を有し、
前記金属酸化物は、
第1の領域と第2の領域を有し、
前記第1の領域と前記第2の領域はモザイク状に混合しており、
前記第2の領域の伝導帯下端のエネルギー準位は、前記第1の領域の伝導帯下端のエネルギー準位より低く、
前記第1の領域は、M(Mは、Al、Ga、Si、Mg、Zr、Be、及びBから選ばれる少なくとも二種以上)酸化物、M窒化物またはIn−M−Zn酸化物を有し、
前記第2の領域は、In酸化物、またはIn−Zn酸化物を有する、
トランジスタ。 - 金属酸化物と、前記金属酸化物に接する一対の電極と、前記金属酸化物と接する絶縁体と、前記絶縁体を介して前記金属酸化物と重畳するゲート電極と、を有し、
前記金属酸化物は、
第1のエネルギーギャップを有する第1の領域と第2のエネルギーギャップを有する第2の領域と、を有し、
前記第1の領域と前記第2の領域はモザイク状に混合しており、
前記第1の領域の伝導帯下端のエネルギー準位は、前記第2の領域の伝導帯下端のエネルギー準位よりも高く、
前記第1の領域は第1の金属元素の第1の酸化物を含み、
前記第2の領域は第2の金属元素の第2の酸化物を含み、
前記第1の酸化物は、前記第1の金属元素とは異なる第3の元素を含み、
前記第2の酸化物は、前記第2の金属元素とは異なる第3の元素を含み、
前記第1の領域における前記第3の元素の濃度は、前記第2の領域における前記第3の元素の濃度よりも高い、
トランジスタ。 - 請求項3において、
前記第1の金属元素はGaであり、前記第2の金属元素はInであり、前記第3の元素はAl、Si、Mg、Zr、Be、及びBから選ばれる少なくとも二種以上含む、トランジスタ。 - 請求項3または請求項4において、
前記第1の領域は更にInとZnを含み、前記第2の領域は更にZnを含む、トランジスタ。 - 請求項1乃至5のいずれか一項において、
前記金属酸化物は、1nm以上10nm以下の領域において原子配列に周期性を有する、トランジスタ。 - 請求項1乃至6のいずれか一項において、
電子線回折を用いて前記金属酸化物は分析した場合、電子線回折パターン像において、リング状に輝度の高い領域内に、複数のスポットが観察される、トランジスタ。 - 請求項1乃至7のいずれか一項に記載のトランジスタを有する表示装置であって、
表示部を有し、
前記表示部の画素トランジスタとして前記トランジスタを有する、表示装置。 - 請求項1乃至7のいずれか一項に記載のトランジスタを有する表示装置であって、
表示部を有し、
前記表示部の駆動トランジスタとして前記トランジスタを有する、表示装置。 - 請求項1乃至請求項7のいずれか一項に記載のトランジスタを有する表示装置であって、
表示部と、ゲートドライバと、を有し、
前記ゲートドライバが前記トランジスタを有する、表示装置。
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