JP6733394B2 - 接着シート、及び半導体装置の製造方法。 - Google Patents
接着シート、及び半導体装置の製造方法。 Download PDFInfo
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- JP6733394B2 JP6733394B2 JP2016145703A JP2016145703A JP6733394B2 JP 6733394 B2 JP6733394 B2 JP 6733394B2 JP 2016145703 A JP2016145703 A JP 2016145703A JP 2016145703 A JP2016145703 A JP 2016145703A JP 6733394 B2 JP6733394 B2 JP 6733394B2
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- silane coupling
- epoxy resin
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Images
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L2224/73265—Layer and wire connectors
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Description
本実施形態に係るエポキシ樹脂は、分子内に少なくとも2個のエポキシ基を有するものであれば特に限定されない。エポキシ樹脂としては、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂等の二官能エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂等のノボラック型エポキシ樹脂、多官能エポキシ樹脂及び脂環式エポキシ樹脂が挙げられる。これらは、1種を単独で又は2種以上を組み合わせて用いることができる。
本実施形態に係るエポキシ樹脂硬化剤としては、フェノール系エポキシ樹脂硬化剤を用いることができる。エポキシ樹脂硬化剤は1種を単独で又は2種以上を組み合わせて用いることができる。
本実施形態に係るエポキシ基含有(メタ)アクリル共重合体は、グリシジルアクリレート又はグリシジルメタクリレート等の官能性モノマーを含有するモノマーを重合して得ることができる。上記官能性モノマーはエポキシ樹脂と非相溶であるため、硬化後にエポキシ樹脂と(メタ)アクリル共重合体とがそれぞれ分離し、接着剤層の耐リフロークラック性及び耐熱性を向上することができる。
本実施形態に係る接着剤組成物にはイミン系シランカップリング剤が含まれる。本明細書において、イミン系シランカップリング剤とは、下記一般式(1)で表される部分構造を有するシランカップリング剤を意味する。
本実施形態の接着剤組成物は、無機フィラーをさらに含有することができる。無機フィラーとしては、例えば、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、酸化アルミニウム、窒化アルミニウム、ホウ酸アルミウィスカ、窒化ホウ素、結晶性シリカ、及び非晶性シリカが挙げられる。これらは、1種又は2種以上を併用することができる。接着剤層の熱伝導性を向上する観点から、無機フィラーとして、酸化アルミニウム、窒化アルミニウム、窒化ホウ素、結晶性シリカ又は非晶性シリカを含有することが好ましい。接着剤層の溶融粘度の調整、及び接着剤組成物にチキソトロピック性を付与する観点から、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、酸化アルミニウム、結晶性シリカ又は非晶性シリカを含有することが好ましい。
表1に示す配合割合(質量部)の各成分を、溶剤であるシクロヘキサノンと共に配合して、接着剤組成物を調製した。まず、エポキシ基含有(メタ)アクリル共重合体として、アクリルゴム(日立化成株式会社製、商品名:KS800H、Mw:100万、ブチルアクリレート/エチルアクリレート/アクリロニトリル/グリシジルメタクリレートの質量比:39.4/29.3/30.3/3)100.0質量部、アクリルゴム(ナガセケムテック株式会社製、商品名:HTR−860P−3、Mw:80万、Tg:15℃、ブチルアクリレート/エチルアクリレート/アクリロニトリル/グリシジルメタクリレートの質量比:39.4/29.3/30.3/3)100.0質量部、エポキシ樹脂として、クレゾールノボラック型エポキシ樹脂(東都化成株式会社製、商品名:YDCN−700−10、エポキシ当量:210)18.0質量部、エポキシ樹脂硬化剤として、フェノール樹脂(三井化学株式会社製、商品名:XLC−LL、水酸基当量:174)15.0質量部、イミン系シランカップリング剤として、3−トリエトキシシリル−N−(1,3ジメチルーブチリデン)プロピルアミン(信越化学株式会社製、商品名:KBE−9103)8.5質量部、無機フィラーとして、真球状シリカ(株式会社アドマテックス製、商品名:アドマナノ、平均粒径:約0.300μm)100.0質量部及びシクロヘキサノン550質量部を攪拌混合した。これらを混合した後、真空脱気して接着剤組成物のワニスを得た。
イミン系シランカップリング剤をウレイドシランカップリング剤である3−ウレイドプロピルトリエトキシシラン(モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、商品名:A−1160)に変更した以外は、実施例1と同様にして接着シートを作製した。
接着シートの対基板接着強度は万能型ボンドテスター(デイジ・ジャパン株式会社製、商品名:series−4000)を用いて測定した。
接着シートの接着剤層の貯蔵弾性率は動的粘弾性測定装置(レオロジ株式会社製、商品名:DVEレオスペクトラ)を用いて測定した。
接着シートの接着剤層にダイシングシートを貼り付け、基材フィルムを剥離した後、接着剤層のもう一方の面に75μm厚の半導体ウェハを熱板上でラミネートした。その後、ダイシング工程を経て半導体ウェハを個片化して、7.5mm×7.5mmの接着剤層付き半導体チップとした。
Claims (7)
- エポキシ樹脂と、エポキシ樹脂硬化剤と、エポキシ基含有(メタ)アクリル共重合体と、イミン系シランカップリング剤と、を含有する接着剤組成物をシート状に形成した接着剤層を備え、
前記接着剤組成物における、前記エポキシ基含有(メタ)アクリル共重合体の質量に対する、前記エポキシ樹脂と前記エポキシ樹脂硬化剤との合計質量の比が、0.05〜0.50である、接着シート。 - 前記接着剤組成物における前記イミン系シランカップリング剤の含有量が、前記接着剤組成物の固形分全量を基準として0.5〜5質量%である、請求項1又は2に記載の接着シート。
- 前記エポキシ基含有(メタ)アクリル共重合体は、−50〜30℃のガラス転移温度を有する重量平均分子量が10万以上の共重合体である、請求項1〜3のいずれか一項に記載の接着シート。
- 前記接着剤組成物がさらに、平均粒径が0.005〜0.5μmである無機フィラーを、前記無機フィラーを除いた前記接着剤組成物の固形分全量100質量部に対して、1〜50質量部含有する、請求項1〜4のいずれか一項に記載の接着シート。
- 前記接着剤層の厚みが3〜30μmである、請求項1〜5のいずれか一項に記載の接着シート。
- 半導体素子と支持部材とを、請求項1〜6のいずれか一項に記載の接着シートにおける前記接着剤層を介して熱圧着するダイボンディング工程と、
前記半導体素子と前記支持部材とを、加熱しながらワイヤで電気的に接続するワイヤボンディング工程と、
前記半導体素子を樹脂で封止する封止工程と、
を有する半導体装置の製造方法。
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