JP6709104B2 - 基板リフトピンアクチュエータ - Google Patents
基板リフトピンアクチュエータ Download PDFInfo
- Publication number
- JP6709104B2 JP6709104B2 JP2016087143A JP2016087143A JP6709104B2 JP 6709104 B2 JP6709104 B2 JP 6709104B2 JP 2016087143 A JP2016087143 A JP 2016087143A JP 2016087143 A JP2016087143 A JP 2016087143A JP 6709104 B2 JP6709104 B2 JP 6709104B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- central shaft
- lift pin
- bellows
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 86
- 239000012530 fluid Substances 0.000 claims description 28
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 33
- 238000000034 method Methods 0.000 description 17
- 239000007789 gas Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000013529 heat transfer fluid Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F3/00—Devices, e.g. jacks, adapted for uninterrupted lifting of loads
- B66F3/24—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated
- B66F3/25—Constructional features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F3/00—Devices, e.g. jacks, adapted for uninterrupted lifting of loads
- B66F3/24—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F3/00—Devices, e.g. jacks, adapted for uninterrupted lifting of loads
- B66F3/24—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated
- B66F3/247—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated pneumatically actuated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
本明細書中に記載の実施形態(インプリメンテーション)は、概して、半導体製造に関し、より具体的には、リフトピンアクチュエータ及びこれを用いた方法に関する。
デバイスの微細化は、基板のフィルム層内に形成されたデバイスパターンのための小さな寸法をより重大にしてきた。基板内にクリティカルディメンジョン(限界寸法)を達成することは、良好な品質のフィルム層、及び基板内で下地のフィルム層への良好な接着性を有することから始まる。半導体デバイスの製造中に、基板は、最終用途に適した材料層及び構造を形成するために様々な処理チャンバ内で多くの操作を受けることができる。例えば、基板は、他の操作の中でもとりわけ、いくつかの堆積、アニーリング、エッチング操作を受けることができる。ロボットは、中で処理するための処理チャンバ内の基板支持アセンブリ上に基板を搬送することができる。基板支持アセンブリは、ロボットによる基板の交換を促進するために、基板支持アセンブリから基板を引き離すように作動させることができるリフトピンを含む。
Claims (15)
- 内部容積を有するハウジングと、
内部容積内に配置され、ハウジングに結合されたトラックと、
トラックに移動自在に結合されたガイドと、
ガイドに結合され、少なくとも部分的に内部容積内に配置された中心シャフトと、
中心シャフトとハウジングとの間のシールと、
内部容積内に配置され、中心シャフトをハウジング内に後退させる弾性力を印加するように構成された弾性部材と、
ハウジングに対して中心シャフトを伸長させるために、弾性部材に対抗する流体力を発生させる流体を内部容積内に導入するように構成された入口ポートとを含むリフトピンアクチュエータ。 - 中心シャフト上に配置されたバンドを含み、中心シャフトに対するバンドの位置は、弾性部材によって中心シャフトに掛けられる弾性力を調整するために調整可能である、請求項1記載のリフトピンアクチュエータ。
- 内部容積内に配置された少なくとも1つの内部ベローズを含み、内部ベローズは、シールを形成し、ベローズは、隣接する内部ベローズ間に配置されたベローズガイドを有し、ベローズガイドは、ハウジングに対する内部ベローズの軸方向のアライメントを維持するように構成される、請求項1記載のリフトピンアクチュエータ。
- ガイドのベアリングは、ばね荷重が掛けられている、請求項1記載のリフトピンアクチュエータ。
- 弾性部材とハウジングとの間に配置されたスリーブを含む、請求項1記載のリフトピンアクチュエータ。
- ハウジングに結合され、中心シャフトの位置を示す指標を提供するように構成されたセンサを含む、請求項1記載のリフトピンアクチュエータ。
- ハウジングは、
トラックをハウジングに取り付けるための締結具にアクセスするための開口部と、
開口部内に配置された取り外し可能なプラグシーリングを含む、請求項1記載のリフトピンアクチュエータ。 - 上で基板を支持するように構成されたワークピース面を有する基板支持体と、
ワークピース面から基板を昇降させるように構成された基板支持体を貫通して配置されたリフトピンと、
リフトピンに結合され、リフトピンを伸縮するように動作可能なリフトピンアクチュエータであって、リフトピンアクチュエータは、
内部容積を有するハウジングと、
内部容積内に配置され、ハウジングに結合されたトラックと、
トラックに移動自在に結合されたガイドと、
ガイドに結合され、少なくとも部分的に内部容積内に配置された中心シャフトと、
中心シャフトとハウジングとの間のシールと、
内部容積内に配置され、中心シャフトをハウジング内に後退させる弾性力を印加するように構成された弾性部材と、
ハウジングに対して中心シャフトを伸長させるために、弾性部材に対抗する流体力を発生させる流体を内部容積内に導入するように構成された入口ポートとを含むリフトピンアクチュエータとを含む基板支持アセンブリ。 - 台座アセンブリであって、
ベースと、
ベースと基板支持体の間に配置されたファシリティプレートを含む台座アセンブリを含む、請求項8記載の基板支持アセンブリ。 - リフトピンアクチュエータは、基板支持アセンブリの台座アセンブリの内部に配置されている、請求項9記載の基板支持アセンブリ。
- リフトピンアクチュエータは、基板支持アセンブリの台座アセンブリの下方に配置されている、請求項9記載の基板支持アセンブリ。
- 中心シャフト上に配置されたバンドを含み、中心シャフトに対するバンドの位置は、弾性部材によって中心シャフトに掛けられた弾性力を調整するために調整可能である、請求項8記載の基板支持アセンブリ。
- 少なくとも1つの内部ベローズは、少なくとも2つの軸方向に整列された内部ベローズを含む、請求項8記載の基板支持アセンブリ。
- 内部容積内に配置された少なくとも1つの内部ベローズを含み、内部ベローズは、シールを形成し、ベローズは、隣接する内部ベローズ間に配置されたベローズガイドを有し、ベローズガイドは、ハウジングに対する内部ベローズの軸方向のアライメントを維持するように構成される、請求項13記載の基板支持アセンブリ。
- 弾性部材とハウジングとの間に配置されたスリーブを含む、請求項8記載の基板支持アセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562197476P | 2015-07-27 | 2015-07-27 | |
US62/197,476 | 2015-07-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017028248A JP2017028248A (ja) | 2017-02-02 |
JP6709104B2 true JP6709104B2 (ja) | 2020-06-10 |
Family
ID=56329370
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016001887U Expired - Fee Related JP3205145U (ja) | 2015-07-27 | 2016-04-25 | 基板リフトピンアクチュエータ |
JP2016087143A Expired - Fee Related JP6709104B2 (ja) | 2015-07-27 | 2016-04-25 | 基板リフトピンアクチュエータ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016001887U Expired - Fee Related JP3205145U (ja) | 2015-07-27 | 2016-04-25 | 基板リフトピンアクチュエータ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10283397B2 (ja) |
JP (2) | JP3205145U (ja) |
KR (2) | KR20170013179A (ja) |
CN (2) | CN106409744A (ja) |
TW (2) | TWI674168B (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI674168B (zh) * | 2015-07-27 | 2019-10-11 | 美商應用材料股份有限公司 | 升降杆致動器、基板材支撐組件、及利用基板材支撐組件的方法 |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US10062599B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
US10381258B2 (en) * | 2015-12-02 | 2019-08-13 | Tokyo Electron Limited | Apparatus of processing workpiece in depressurized space |
US10388558B2 (en) * | 2016-12-05 | 2019-08-20 | Tokyo Electron Limited | Plasma processing apparatus |
KR101990542B1 (ko) * | 2017-06-02 | 2019-06-18 | 주식회사 트리셀 | 기판 지지부재용 볼 부싱 |
US20190043744A1 (en) * | 2017-08-01 | 2019-02-07 | Applied Materials, Inc. | Active monitoring system for substrate breakage prevention |
US10784142B2 (en) * | 2018-01-09 | 2020-09-22 | Varian Semiconductor Equipment Associates, Inc. | Lift pin system for wafer handling |
JP7116558B2 (ja) | 2018-03-02 | 2022-08-10 | 株式会社Screenホールディングス | 基板処理装置及び基板処理システム |
CN109192696B (zh) * | 2018-08-10 | 2021-06-08 | 北京北方华创微电子装备有限公司 | 升降针***、真空反应腔室以及半导体加工设备 |
DE102018007307A1 (de) | 2018-09-17 | 2020-03-19 | Vat Holding Ag | Stifthubvorrichtung |
JP7329960B2 (ja) * | 2019-05-14 | 2023-08-21 | 東京エレクトロン株式会社 | 載置台およびプラズマ処理装置 |
CN110477679A (zh) * | 2019-08-30 | 2019-11-22 | 重庆市飞龙实木家俱有限公司 | 用于流动展示的展台展箱一体化结构 |
US11798833B2 (en) * | 2020-02-26 | 2023-10-24 | Applied Materials, Inc. | Methods of use of a servo control system |
US11415230B2 (en) | 2020-03-31 | 2022-08-16 | Applied Material, Inc. | Slit valve pneumatic control |
US12020977B2 (en) * | 2021-03-12 | 2024-06-25 | Applied Materials, Inc. | Lift pin assembly |
TW202320152A (zh) * | 2021-11-02 | 2023-05-16 | 美商蘭姆研究公司 | 升降銷止擋件 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3635811A (en) * | 1967-11-06 | 1972-01-18 | Warner Lambert Co | Method of applying a coating |
US5203445A (en) * | 1990-03-17 | 1993-04-20 | Tokyo Electron Sagami Limited | Carrier conveying apparatus |
JPH05102288A (ja) * | 1991-10-09 | 1993-04-23 | Nissin Electric Co Ltd | 冷却クランプ装置 |
JP2602563Y2 (ja) * | 1993-02-24 | 2000-01-17 | 株式会社安川電機 | ウエハ押上げ装置 |
JP3223291B2 (ja) * | 1993-02-26 | 2001-10-29 | 東京エレクトロン株式会社 | 静電チャック試料台 |
US5950693A (en) * | 1993-04-28 | 1999-09-14 | Advanced Delivery & Chemical Systems, Ltd. | Bulk chemical delivery system |
US5387288A (en) * | 1993-05-14 | 1995-02-07 | Modular Process Technology Corp. | Apparatus for depositing diamond and refractory materials comprising rotating antenna |
JPH0774231A (ja) * | 1993-08-31 | 1995-03-17 | Tokyo Electron Ltd | 処理装置及びその使用方法 |
JPH07161800A (ja) * | 1993-12-13 | 1995-06-23 | Kokusai Electric Co Ltd | 基板支持装置 |
US5951776A (en) * | 1996-10-25 | 1999-09-14 | Applied Materials, Inc. | Self aligning lift mechanism |
US6613214B2 (en) * | 1998-11-30 | 2003-09-02 | Applied Materials, Inc. | Electric contact element for electrochemical deposition system and method |
US6305677B1 (en) * | 1999-03-30 | 2001-10-23 | Lam Research Corporation | Perimeter wafer lifting |
DE50111378D1 (de) * | 2000-06-27 | 2006-12-14 | Brooks Pri Automation Switzerl | Vorrichtung und verfahren zur reinigung von in der produktion von halbleiterelementen benutzten objekten |
US20030075387A1 (en) * | 2001-10-22 | 2003-04-24 | Chung-Chiang Wang | Wafer loading device |
US20040177813A1 (en) * | 2003-03-12 | 2004-09-16 | Applied Materials, Inc. | Substrate support lift mechanism |
JP4616748B2 (ja) * | 2005-10-11 | 2011-01-19 | 株式会社新川 | ダイピックアップ装置 |
JP4597894B2 (ja) * | 2006-03-31 | 2010-12-15 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
JP2008078283A (ja) * | 2006-09-20 | 2008-04-03 | Olympus Corp | 基板支持装置 |
KR100980448B1 (ko) * | 2008-06-30 | 2010-09-07 | 엘아이지에이디피 주식회사 | 평판표시소자 제조장치의 리프트 핀 모듈 |
US8633423B2 (en) * | 2010-10-14 | 2014-01-21 | Applied Materials, Inc. | Methods and apparatus for controlling substrate temperature in a process chamber |
US10090181B2 (en) * | 2011-03-01 | 2018-10-02 | Applied Materials, Inc. | Method and apparatus for substrate transfer and radical confinement |
JP6180541B2 (ja) * | 2012-11-30 | 2017-08-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 処理チャンバガス流装置、システム、及び方法 |
TWI674168B (zh) * | 2015-07-27 | 2019-10-11 | 美商應用材料股份有限公司 | 升降杆致動器、基板材支撐組件、及利用基板材支撐組件的方法 |
-
2016
- 2016-04-19 TW TW105112165A patent/TWI674168B/zh active
- 2016-04-19 TW TW105205493U patent/TWM539571U/zh not_active IP Right Cessation
- 2016-04-21 US US15/135,496 patent/US10283397B2/en not_active Expired - Fee Related
- 2016-04-25 JP JP2016001887U patent/JP3205145U/ja not_active Expired - Fee Related
- 2016-04-25 JP JP2016087143A patent/JP6709104B2/ja not_active Expired - Fee Related
- 2016-07-13 CN CN201610548298.9A patent/CN106409744A/zh active Pending
- 2016-07-13 CN CN201620734063.4U patent/CN206022340U/zh active Active
- 2016-07-26 KR KR1020160094631A patent/KR20170013179A/ko unknown
- 2016-07-26 KR KR2020160004288U patent/KR20170000490U/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP3205145U (ja) | 2016-07-07 |
CN106409744A (zh) | 2017-02-15 |
JP2017028248A (ja) | 2017-02-02 |
US20170032997A1 (en) | 2017-02-02 |
TW201703918A (zh) | 2017-02-01 |
CN206022340U (zh) | 2017-03-15 |
KR20170013179A (ko) | 2017-02-06 |
TWI674168B (zh) | 2019-10-11 |
US10283397B2 (en) | 2019-05-07 |
TWM539571U (zh) | 2017-04-11 |
KR20170000490U (ko) | 2017-02-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6709104B2 (ja) | 基板リフトピンアクチュエータ | |
US10468282B2 (en) | Method and apparatus for substrate transfer and radical confinement | |
KR102009595B1 (ko) | 플라즈마 처리 챔버에서 갭 높이 및 평탄화 조정을 제공하는 기판 서포트 | |
US8083891B2 (en) | Plasma processing apparatus and the upper electrode unit | |
JP5432686B2 (ja) | プラズマ処理装置 | |
US8623172B2 (en) | Gas flow path structure and substrate processing apparatus | |
JP5188385B2 (ja) | プラズマ処理装置及びプラズマ処理装置の運転方法 | |
KR101540930B1 (ko) | 리니어 액추에이터 및 진공 제어 장치 | |
US20170009343A1 (en) | Atomic layer deposition apparatus and atomic layer deposition system | |
JP6650841B2 (ja) | 基板昇降機構、基板載置台および基板処理装置 | |
US20120097908A1 (en) | Low force substrate lift | |
US20100043975A1 (en) | Movable gas introduction structure and substrate processing apparatus having same | |
JP2019533313A (ja) | 可撓性機器フロントエンドモジュールインターフェース、環境制御された機器フロントエンドモジュール、及び組み付け方法 | |
KR102640515B1 (ko) | 플라즈마 처리 장치 | |
KR20170080501A (ko) | 반도체 프로세싱 장치 내에서 샤워헤드 틸팅을 동적으로 조정하기 위한 액추에이터 | |
US20220415702A1 (en) | Semiconductor processing chamber with dual-lift mechanism for edge ring elevation management | |
JP2016066684A (ja) | ゲートバルブ及び基板処理システム | |
KR100857547B1 (ko) | 배치형 애싱/에칭 공정챔버 | |
KR102102922B1 (ko) | 기판처리장치 | |
KR20230063099A (ko) | 소모품 교체가 가능한 기판 처리 장치 | |
CN114207804A (zh) | 基板支持组合体及基板处理装置 | |
JP2019179939A (ja) | 製造装置 | |
KR20060126019A (ko) | 반도체 건식식각 장비의 액츄에이터 | |
CN111033695A (zh) | 内壁和基板处理装置 | |
JP2017059747A (ja) | 製造装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190417 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200422 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200519 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200522 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6709104 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |