JP6696777B2 - アクチュエータ装置 - Google Patents
アクチュエータ装置 Download PDFInfo
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- JP6696777B2 JP6696777B2 JP2016009889A JP2016009889A JP6696777B2 JP 6696777 B2 JP6696777 B2 JP 6696777B2 JP 2016009889 A JP2016009889 A JP 2016009889A JP 2016009889 A JP2016009889 A JP 2016009889A JP 6696777 B2 JP6696777 B2 JP 6696777B2
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- 239000007769 metal material Substances 0.000 claims description 64
- 230000006866 deterioration Effects 0.000 description 19
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0075—For improving wear resistance
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/045—Optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0154—Torsion bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0181—See-saws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/058—Rotation out of a plane parallel to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Description
Claims (9)
- 支持部と、
可動部と、
前記可動部が所定の軸線周りに揺動可能となるように、前記軸線上において前記可動部を前記支持部に連結する連結部と、
前記連結部上に設けられた第1配線と、
前記支持部上に設けられた第2配線と、
前記第1配線及び前記第2配線の一方の配線のうち前記支持部上に位置する第1接続部分における前記支持部の反対側の表面を露出させる第1開口を有し、前記第1接続部分の角を覆う絶縁層と、を備え、
前記第1配線を構成する第1金属材料は、前記第2配線を構成する第2金属材料よりも剛性が高く、
前記第1配線及び前記第2配線の他方の配線は、前記第1開口において前記第1接続部分の前記表面に接続されており、
前記絶縁層における前記支持部の反対側の表面のうち前記第1接続部分の前記角に対応する領域は、前記支持部の反対側に向けて凸状に湾曲している、アクチュエータ装置。 - 前記第1接続部分は、前記軸線から所定の距離離れている、請求項1記載のアクチュエータ装置。
- 前記距離は、前記連結部の最小幅の1/2倍よりも大きい、請求項2記載のアクチュエータ装置。
- 前記第1配線の断面積は、前記第2配線の断面積よりも大きい、請求項1〜3のいずれか一項記載のアクチュエータ装置。
- 前記第1配線の幅は、前記第2配線の幅よりも大きい、請求項4記載のアクチュエータ装置。
- 前記第1開口は、前記第1接続部分の前記角から離れている、請求項1〜5のいずれか一項記載のアクチュエータ装置。
- 前記可動部に設けられたコイルと、
前記コイルに磁界を作用させる磁界発生部と、
前記可動部上に設けられ、前記コイルと電気的に接続された第3配線と、を更に備え、
前記絶縁層は、前記第1配線及び前記第3配線の一方の配線のうち前記可動部上に位置する第2接続部分における前記可動部の反対側の表面を露出させる第2開口を有し、前記第2接続部分の角を覆っており、
前記第1金属材料は、前記第3配線を構成する第3金属材料よりも剛性が高く、
前記第1配線及び前記第3配線の他方の配線は、前記第2開口において前記第2接続部分の前記表面に接続されている、請求項1〜6のいずれか一項記載のアクチュエータ装置。 - 前記支持部及び前記可動部を支持する枠部を更に備え、
前記支持部は、前記軸線と交差する軸線周りに揺動可能となるように、前記枠部に連結されている、請求項1〜7のいずれか一項記載のアクチュエータ装置。 - 前記可動部に設けられたミラーを更に備える、請求項1〜8のいずれか一項記載のアクチュエータ装置。
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016009889A JP6696777B2 (ja) | 2016-01-21 | 2016-01-21 | アクチュエータ装置 |
EP16886528.5A EP3407110B1 (en) | 2016-01-21 | 2016-12-22 | Actuator device |
US16/070,562 US10589985B2 (en) | 2016-01-21 | 2016-12-22 | Actuator device |
PCT/JP2016/088436 WO2017126289A1 (ja) | 2016-01-21 | 2016-12-22 | アクチュエータ装置 |
CN201680079450.1A CN108474938B (zh) | 2016-01-21 | 2016-12-22 | 致动器装置 |
KR1020187012576A KR20180105114A (ko) | 2016-01-21 | 2016-12-22 | 액츄에이터 장치 |
EP22181244.9A EP4092476A1 (en) | 2016-01-21 | 2016-12-22 | Actuator device |
CN202011562410.7A CN112731652B (zh) | 2016-01-21 | 2016-12-22 | 致动器装置 |
US16/789,795 US11339050B2 (en) | 2016-01-21 | 2020-02-13 | Actuator device |
US17/725,804 US11952265B2 (en) | 2016-01-21 | 2022-04-21 | Actuator device |
US18/581,466 US20240190699A1 (en) | 2016-01-21 | 2024-02-20 | Actuator device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016009889A JP6696777B2 (ja) | 2016-01-21 | 2016-01-21 | アクチュエータ装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020076678A Division JP7065146B2 (ja) | 2020-04-23 | 2020-04-23 | アクチュエータ装置 |
Publications (2)
Publication Number | Publication Date |
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JP2017129782A JP2017129782A (ja) | 2017-07-27 |
JP6696777B2 true JP6696777B2 (ja) | 2020-05-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016009889A Active JP6696777B2 (ja) | 2016-01-21 | 2016-01-21 | アクチュエータ装置 |
Country Status (6)
Country | Link |
---|---|
US (4) | US10589985B2 (ja) |
EP (2) | EP3407110B1 (ja) |
JP (1) | JP6696777B2 (ja) |
KR (1) | KR20180105114A (ja) |
CN (2) | CN108474938B (ja) |
WO (1) | WO2017126289A1 (ja) |
Families Citing this family (15)
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JP7015653B2 (ja) * | 2017-08-10 | 2022-02-03 | 浜松ホトニクス株式会社 | 光モジュール、及び、光モジュールの製造方法 |
JP6585147B2 (ja) * | 2017-12-01 | 2019-10-02 | 浜松ホトニクス株式会社 | アクチュエータ装置 |
CN115051526A (zh) | 2017-12-01 | 2022-09-13 | 浜松光子学株式会社 | 致动器装置 |
JP1680755S (ja) | 2018-05-01 | 2021-03-08 | ||
JP1680385S (ja) * | 2018-05-01 | 2021-03-01 | ||
USD903614S1 (en) | 2018-05-01 | 2020-12-01 | Hamamatsu Photonics K.K. | Laser beam reflector |
USD907085S1 (en) * | 2018-05-01 | 2021-01-05 | Hamamatsu Photonics K.K. | Laser beam reflector |
JP1680507S (ja) * | 2018-05-01 | 2021-03-08 | ||
JP1639597S (ja) * | 2018-05-01 | 2019-08-19 | ||
JP1625135S (ja) * | 2018-05-01 | 2019-03-18 | ||
JP1680386S (ja) * | 2018-05-01 | 2021-03-01 | ||
JP1625495S (ja) | 2018-05-01 | 2019-03-18 | ||
JP1680388S (ja) * | 2018-05-01 | 2021-03-01 | ||
JP1680387S (ja) * | 2018-05-01 | 2021-03-01 | ||
EP3876265B1 (en) * | 2018-10-31 | 2023-07-12 | Hamamatsu Photonics K.K. | Damascene interconnect structure, actuator device, and method of manufacturing damascene interconnect structure |
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-
2016
- 2016-01-21 JP JP2016009889A patent/JP6696777B2/ja active Active
- 2016-12-22 US US16/070,562 patent/US10589985B2/en active Active
- 2016-12-22 EP EP16886528.5A patent/EP3407110B1/en active Active
- 2016-12-22 EP EP22181244.9A patent/EP4092476A1/en active Pending
- 2016-12-22 KR KR1020187012576A patent/KR20180105114A/ko unknown
- 2016-12-22 CN CN201680079450.1A patent/CN108474938B/zh active Active
- 2016-12-22 CN CN202011562410.7A patent/CN112731652B/zh active Active
- 2016-12-22 WO PCT/JP2016/088436 patent/WO2017126289A1/ja active Application Filing
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2020
- 2020-02-13 US US16/789,795 patent/US11339050B2/en active Active
-
2022
- 2022-04-21 US US17/725,804 patent/US11952265B2/en active Active
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2024
- 2024-02-20 US US18/581,466 patent/US20240190699A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2017126289A1 (ja) | 2017-07-27 |
US20240190699A1 (en) | 2024-06-13 |
EP3407110A1 (en) | 2018-11-28 |
CN108474938A (zh) | 2018-08-31 |
JP2017129782A (ja) | 2017-07-27 |
EP4092476A1 (en) | 2022-11-23 |
US20190016589A1 (en) | 2019-01-17 |
US10589985B2 (en) | 2020-03-17 |
CN112731652B (zh) | 2023-09-05 |
US11339050B2 (en) | 2022-05-24 |
CN108474938B (zh) | 2021-01-19 |
KR20180105114A (ko) | 2018-09-27 |
US20220242721A1 (en) | 2022-08-04 |
EP3407110B1 (en) | 2022-08-17 |
EP3407110A4 (en) | 2019-09-25 |
US20200180944A1 (en) | 2020-06-11 |
US11952265B2 (en) | 2024-04-09 |
CN112731652A (zh) | 2021-04-30 |
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