JP6686167B2 - 表面導電性積層シート及び電子部品包装容器 - Google Patents
表面導電性積層シート及び電子部品包装容器 Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 title claims description 16
- 239000002344 surface layer Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920005990 polystyrene resin Polymers 0.000 claims description 29
- 150000001993 dienes Chemical class 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 21
- 239000011342 resin composition Substances 0.000 claims description 14
- 239000006229 carbon black Substances 0.000 claims description 13
- 229920002554 vinyl polymer Polymers 0.000 claims description 11
- 241000428199 Mustelinae Species 0.000 claims description 10
- 229920005672 polyolefin resin Polymers 0.000 claims description 10
- 229920001400 block copolymer Polymers 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 239000011231 conductive filler Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 10
- 239000004793 Polystyrene Substances 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- 229920002223 polystyrene Polymers 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 229920005669 high impact polystyrene Polymers 0.000 description 5
- 239000004797 high-impact polystyrene Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000006230 acetylene black Substances 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000003795 desorption Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- 238000007666 vacuum forming Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 1
- ZMYIIHDQURVDRB-UHFFFAOYSA-N 1-phenylethenylbenzene Chemical group C=1C=CC=CC=1C(=C)C1=CC=CC=C1 ZMYIIHDQURVDRB-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- APMOEFCWQRJOPS-UHFFFAOYSA-N 5-ethenyl-1,5-dimethylcyclohexa-1,3-diene Chemical compound CC1=CC=CC(C)(C=C)C1 APMOEFCWQRJOPS-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2553/00—Packaging equipment or accessories not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
- Packages (AREA)
Description
また、表面導電性積層シートの引張弾性率は1600〜2200MPa、1650〜2100MPa、又は1650〜2000MPaであってもよい。
また、表面導電性積層シートの耐折強度は少なくとも50回、少なくとも400回、少なくとも600回、少なくとも800回、又は少なくとも1000回であってもよい。
各評価はシートの押出方向にサンプリングし、次に示す方法によって行った。
(1)マルテンス硬度
シートサンプルについてISO14577に準拠し、東陽テクニカ社製Nano Indenter G200を用いて表面中任意の5点を測定し、その平均値をマルテンス硬度とした。この時、圧子の接近速度500nm/s、最大試験荷重5mNで測定を行った。
(2)引張弾性率
シートサンプルについてJIS−K−7127に準拠し、東洋精機製作所製ストログラフVE―1Dを用いて試験片タイプ5で測定した。
(3)耐折強度
シートサンプルについてJIS−P−8115(2001年)に準拠し、長さ150mm、幅15mm、厚さ0.2mmの試験片を作製し、東洋精機製作所製MIT耐折疲労試験機を用いてMIT耐折強度の測定を行った。この時、折り曲げ角度135度、折り曲げ速度175回毎分、測定荷重250gにて試験を行った。
(4)表面抵抗値
三菱化学アナリテック社製ハイレスタ−UX(MCP−HT800)を用いて測定した。
(5)共役ジエン含有量
耐衝撃ポリスチレン中の共役ジエン含有量はゴム変性ポリスチレンで一般的に用いられている赤外吸収スペクトル法で、960cm−1、910cm−1における吸光度を測定して求めた。
(6)体積平均粒子径
分散粒子の体積平均粒子径は、耐衝撃性ポリスチレン0.5gをジメチルホルムアミド100gに溶解し、日科機社製コールターカウンター(LS−230)を用いて測定した。
カーボンブラックとして、デンカ社製のアセチレンブラック粒状を用いた。
オレフィン系樹脂として、エチレン−アクリル酸エチル共重合体樹脂(以下、EEAという)は、アクリル酸エチル含有量(JIS−K−7192に準じ測定)=18%、メルトフローインデックス(JIS−K−7192に準じ測定)=5.0g/10分のものを用いた。また、高密度ポリエチレン樹脂(以下、HDPEという)は、メルトフローインデックス(JIS−K−6922−2に準じ測定)=0.20g/10分のものを用いた。
芳香族ビニル−共役ジエン系ブロック共重合体の水素添加樹脂として、スチレン−エチレン−ブチレン−スチレンブロック共重合体(以下、SEBSという)は、メルトフローインデックス(JIS−K−7192に準じ測定)=4.0g/10分、スチレンとブタジエンの質量%比率は60:40のものを用いた。
表面層用として、表2に示すようにポリスチレン樹脂と耐衝撃性ポリスチレン樹脂A、カーボンブラック、EEA、HDPE、SEBSを各々29:31:20:9:8:3の割合となるように計量し、高速混合機により均一混合した後、φ45mmベント式二軸押出機を用いて混練し、ストランドカット法によりペレット化し導電性樹脂組成物を得た。
一方、基材層用として、表2に示すようにポリスチレン樹脂及び耐衝撃性ポリスチレン樹脂Bを各々43:57の割合となるように計量し、高速混合機により均一にした混合物を得た。
前記のペレット状の導電性樹脂組成物、及びポリスチレン樹脂と耐衝撃性ポリスチレン樹脂Bとの均一混合物を用い、基材層の両面に表面層がほぼ同じ肉厚となる様に、基材層用としてφ65mm押出機(L/D=28)、表面層用としてφ40mm押出機(L/D=26)及び500mm幅のTダイを用いたフィードブロック法により積層し、表面層と基材層の厚み比率が1:18:1で全体の肉厚が0.2mmとなる表面導電性積層シートを得た。
前記実施例1の方法に従い、表面導電性積層シートを得た。各原料及びそれらの混合割合を表2及び表3に示す。
Claims (7)
- 共役ジエン含有量が3.0〜8.2質量%であるポリスチレン系樹脂からなるシート基材層の両面に、共役ジエン含有量が2.0〜7.4質量%であるポリスチレン系樹脂、及び導電性フィラーを含む導電性樹脂組成物からなる表面層が積層され、マルテンス硬度が50〜130N/mm2である表面導電性積層シート。
- 前記導電性フィラーがカーボンブラックである請求項1に記載の表面導電性積層シート。
- 表面層の導電性樹脂組成物が、オレフィン系樹脂及び芳香族ビニル−共役ジエン系ブロック共重合体の水素添加樹脂をさらに含む、請求項2に記載の表面導電性積層シート。
- 前記表面層が、ポリスチレン系樹脂46〜85質量%、カーボンブラック13〜23質量%、オレフィン系樹脂1.5〜20質量%、及び芳香族ビニル−共役ジエン系ブロック共重合体の水素添加樹脂0.5〜11質量%を含有する請求項3に記載の表面導電性積層シート。
- 前記基材層および表面層に用いるポリスチレン系樹脂に含有する共役ジエンの体積平均粒子径が0.5〜4.0μmである請求項1から4の何れか一項に記載の表面導電性積層シート。
- 請求項1から5の何れか一項に記載の表面導電性積層シートから成形されてなる電子部品包装容器。
- キャリアテープ又は電子部品搬送用トレイである請求項6に記載の電子部品包装容器。
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JP2016214012 | 2016-11-01 | ||
JP2016214012 | 2016-11-01 | ||
PCT/JP2017/039258 WO2018084129A1 (ja) | 2016-11-01 | 2017-10-31 | 表面導電性積層シート及び電子部品包装容器 |
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KR (1) | KR102564612B1 (ja) |
CN (1) | CN110139755B (ja) |
MY (1) | MY193213A (ja) |
PH (1) | PH12019500955A1 (ja) |
SG (1) | SG11201903634WA (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20220005474A (ko) | 2019-04-26 | 2022-01-13 | 덴카 주식회사 | 적층 시트 및 전자 부품 포장 용기 그리고 전자 부품 포장체 |
EP4043212A4 (en) * | 2020-03-19 | 2023-07-19 | Denka Company Limited | MULTI-LAYER FILM, CONTAINER, CARRIER TAPE AND PACKAGING BODY FOR ELECTRONIC COMPONENTS |
KR20210143024A (ko) * | 2020-05-19 | 2021-11-26 | 한화솔루션 주식회사 | 점착성 및 전기 전도성이 우수한 다층 성형품 및 이에 의해 운송되는 전자제품 |
WO2023189190A1 (ja) * | 2022-03-28 | 2023-10-05 | デンカ株式会社 | 樹脂シート、容器、キャリアテープ、及び電子部品包装体 |
WO2023189186A1 (ja) * | 2022-03-28 | 2023-10-05 | デンカ株式会社 | 樹脂シート、容器、キャリアテープ、及び電子部品包装体 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3209394B2 (ja) | 1995-09-19 | 2001-09-17 | 電気化学工業株式会社 | 導電性複合プラスチックシート及び容器 |
JP3276818B2 (ja) | 1995-09-19 | 2002-04-22 | 電気化学工業株式会社 | 導電性複合プラスチックシート及び容器 |
JP3381488B2 (ja) * | 1995-11-06 | 2003-02-24 | 三菱化学株式会社 | 熱可塑性エラストマー組成物及び複合成形体 |
JP3190241B2 (ja) | 1995-12-21 | 2001-07-23 | 電気化学工業株式会社 | 電子部品包装用導電性複合プラスチックシート及び容器 |
JP4321986B2 (ja) * | 2001-06-22 | 2009-08-26 | 電気化学工業株式会社 | 導電性樹脂組成物 |
US20040115381A1 (en) * | 2002-12-12 | 2004-06-17 | Chevron Phillips Chemical Company, Lp | Method for manufacturing articles with materials containing tapered polymers |
JP2004276479A (ja) * | 2003-03-18 | 2004-10-07 | Sumitomo Bakelite Co Ltd | 表面導電性複合プラスチックシート及び電子部品搬送用容器 |
US20050250897A1 (en) * | 2004-03-03 | 2005-11-10 | Chi Lin Technology Co., Ltd. | Conductive plastic composition |
DE602005027583D1 (de) * | 2004-09-07 | 2011-06-01 | Denki Kagaku Kogyo Kk | Leitende verbundfolien |
WO2006030871A1 (ja) * | 2004-09-16 | 2006-03-23 | Denki Kagaku Kogyo Kabushiki Kaisha | 複合シート |
JP2006150729A (ja) * | 2004-11-29 | 2006-06-15 | Dainippon Ink & Chem Inc | 導電性シート及び成形品 |
JP2006212851A (ja) * | 2005-02-02 | 2006-08-17 | Denki Kagaku Kogyo Kk | 熱可塑性樹脂積層シート及びその成形体 |
JP2006231542A (ja) * | 2005-02-22 | 2006-09-07 | Dainippon Ink & Chem Inc | 帯電防止性積層シート及びその成形品 |
JP2011517112A (ja) * | 2008-04-10 | 2011-05-26 | ワールド・プロパティーズ・インコーポレイテッド | 結合性が改良された回路材料およびその製造方法と製造物品 |
SG189310A1 (en) * | 2010-10-07 | 2013-05-31 | Denki Kagaku Kogyo Kk | Electronic component packaging sheet, and formed article thereof |
KR101908154B1 (ko) * | 2011-01-28 | 2018-10-15 | 덴카 주식회사 | 전자 부품 포장용 적층 시트 및 그 성형체 |
CN104960292B (zh) * | 2015-06-17 | 2017-01-25 | 浙江洁美电子科技股份有限公司 | 电子元器件收纳载带的封装带及其制备方法 |
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- 2017-10-31 WO PCT/JP2017/039258 patent/WO2018084129A1/ja active Application Filing
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- 2017-10-31 CN CN201780081734.9A patent/CN110139755B/zh active Active
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Also Published As
Publication number | Publication date |
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SG11201903634WA (en) | 2019-05-30 |
WO2018084129A1 (ja) | 2018-05-11 |
CN110139755A (zh) | 2019-08-16 |
KR20190078599A (ko) | 2019-07-04 |
JPWO2018084129A1 (ja) | 2019-09-19 |
TWI738905B (zh) | 2021-09-11 |
CN110139755B (zh) | 2021-04-09 |
JP2020114675A (ja) | 2020-07-30 |
KR102564612B1 (ko) | 2023-08-07 |
MY193213A (en) | 2022-09-26 |
TW201829197A (zh) | 2018-08-16 |
PH12019500955A1 (en) | 2019-12-02 |
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