JP6683000B2 - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof Download PDF

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JP6683000B2
JP6683000B2 JP2016093884A JP2016093884A JP6683000B2 JP 6683000 B2 JP6683000 B2 JP 6683000B2 JP 2016093884 A JP2016093884 A JP 2016093884A JP 2016093884 A JP2016093884 A JP 2016093884A JP 6683000 B2 JP6683000 B2 JP 6683000B2
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light emitting
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JP2017204502A (en
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雄祐 川野
雄祐 川野
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Nichia Corp
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Nichia Corp
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本開示は、発光装置及びその製造方法に関する。   The present disclosure relates to a light emitting device and a method for manufacturing the same.

高輝度な照明光を得るため、あるいは演色性の良好な照明光を得るために、基板上に、ＬＥＤ（発光ダイオード）などの発光素子を複数配置した発光装置が提案されている。
例えば、特許文献１〜特許文献３には、基板上に、複数の発光素子を配置する領域を囲む枠体と、当該発光素子の配置領域を複数の領域に区画する仕切り部とを設け、区画した領域を、それぞれ２種類以上の異なる色の発光領域とし、これらの発光領域からの光を混色することで、所望の発光色を発する発光装置が記載されている。
また、特許文献４には、発光素子の上面側に反射部材を設けることで、発光素子の側面から光を取り出し、外側が光反射体で覆われた遮光体を発光素子間に設けて、発光素子の側面からの光を反射させることで、発光装置の上面側から放射される光の光量ムラを低減する照明装置が記載されている。 A light-emitting device in which a plurality of light-emitting elements such as LEDs (light-emitting diodes) are arranged on a substrate has been proposed in order to obtain high-luminance illumination light or illumination light with good color rendering.
For example, in Patent Documents 1 to 3, a frame body that surrounds a region in which a plurality of light emitting elements are arranged and a partition section that divides the region in which the light emitting elements are arranged into a plurality of regions are provided on a substrate. There is described a light emitting device which emits a desired light emission color by mixing the light emission areas of two or more different kinds of light emission areas with each other.
Further, in Patent Document 4, by providing a reflection member on the upper surface side of the light emitting element, light is extracted from the side surface of the light emitting element, and a light shield whose outside is covered with a light reflector is provided between the light emitting elements to emit light. There is described an illuminating device that reduces unevenness in the amount of light emitted from the upper surface side of a light emitting device by reflecting light from the side surface of an element.

特開２０１４−３６０６３号公報JP, 2014-36063, A 特開２０１４−２２９７５９号公報JP, 2014-229759, A 国際公開第２０１３／０１５０５８号International Publication No. 2013/015058 特開２０１５−９５４８８号公報JP, 2005-95488, A

特許文献１若しくは特許文献２に記載された発光装置、又は特許文献４に記載された照明装置において、色ムラや輝度ムラを更に低減するには、複数の発光素子が配置された発光領域の光出射側の全体を覆うように、更に透光部材や光拡散板を設ける必要がある。
また、特許文献３に記載された発光装置は、光出射面側に凸形状の透光部材を備えているが、発光素子の配置によっては、色ムラや輝度ムラを更に改善する余地がある。 In the light emitting device described in Patent Document 1 or Patent Document 2 or the illumination device described in Patent Document 4, in order to further reduce color unevenness and brightness unevenness, light in a light emitting region in which a plurality of light emitting elements are arranged is used. It is necessary to further provide a light transmissive member or a light diffusion plate so as to cover the entire emission side.
Further, the light emitting device described in Patent Document 3 includes a convex translucent member on the light emitting surface side, but there is room for further improvement in color unevenness and brightness unevenness depending on the arrangement of the light emitting elements.

本開示に係る実施形態は、基板上に複数の発光素子が配置された発光装置において、出射光の色ムラや輝度ムラを低減することを課題とする。また、出射光の色ムラや輝度ムラを低減可能な発光装置を簡便に製造することを課題とする。   An embodiment of the present disclosure has an object to reduce color unevenness and brightness unevenness of emitted light in a light emitting device in which a plurality of light emitting elements are arranged on a substrate. Another object is to simply manufacture a light emitting device capable of reducing color unevenness and brightness unevenness of emitted light.

本開示の実施形態に係る発光装置は、基板と、前記基板上に設けられる環状の第１部材と、前記第１部材の内側に配置される第１発光素子及び第２発光素子と、前記基板上であって前記第１部材の内側に前記第１部材と接するように設けられており、前記第１部材の内側を、少なくとも１つの前記第１発光素子が配置される第１領域と、少なくとも１つの前記第２発光素子が配置される第２領域と、を含む複数の領域に区画し、透光性領域を有する第２部材と、前記第１発光素子及び前記第２発光素子を被覆する封止部材と、を有し、前記第２部材の高さは、前記第１部材の高さよりも高く、前記封止部材は、前記第１部材と前記第２部材とで挟まれた領域において、前記第２部材側の高さが前記第１部材側の高さよりも高いように構成される。   A light emitting device according to an embodiment of the present disclosure includes a substrate, an annular first member provided on the substrate, a first light emitting element and a second light emitting element arranged inside the first member, and the substrate. At least one first region in which the at least one first light-emitting element is arranged, and at least one of the first light-emitting elements is provided inside the first member so as to be in contact with the first member. A second member having a light-transmissive region, which is divided into a plurality of regions including a second region in which one of the second light emitting devices is arranged, and covers the first light emitting device and the second light emitting device. A sealing member, the height of the second member is higher than the height of the first member, and the sealing member is in a region sandwiched between the first member and the second member. , The height of the second member side is higher than the height of the first member side .

本開示の実施形態に係る発光装置の製造方法は、基板上に少なくとも１つの第１発光素子及び少なくとも１つの第２発光素子を実装する工程と、前記基板上に前記第１発光素子及び前記第２発光素子を囲む第１部材を形成する工程と、前記基板上であって、前記第１発光素子と前記第２発光素子の間に、前記第１発光素子が配置された第１領域と前記第２発光素子が配置された第２領域とを区画し、透光性領域を有する第２部材を、前記第１部材と接するように形成する工程と、前記第１領域と前記第２領域とに、前記第１発光素子及び前記第２発光素子を被覆するように封止部材を充填する工程と、を有し、前記第２部材の高さが、前記第１部材の高さよりも高くなるように形成し、前記封止部材は、ポッティング法によって未硬化の樹脂材料を充填することで、前記第１部材と前記第２部材とで挟まれた領域において、前記第２部材側の高さが前記第１部材側の高さよりも高くなるように形成する。   A method of manufacturing a light emitting device according to an embodiment of the present disclosure includes a step of mounting at least one first light emitting element and at least one second light emitting element on a substrate, and the first light emitting element and the first light emitting element on the substrate. And a step of forming a first member surrounding the second light emitting element, and a first region on the substrate in which the first light emitting element is disposed between the first light emitting element and the second light emitting element. A step of forming a second member having a translucent area so as to be in contact with the first member by partitioning the second area in which the second light emitting element is arranged; and the first area and the second area. And a step of filling a sealing member so as to cover the first light emitting element and the second light emitting element, and the height of the second member is higher than the height of the first member. And the sealing member is made of uncured resin by the potting method. By filling the charge, in a region sandwiched between the first member and the second member, the height of the second member side is formed to be higher than the height of the first member.

本開示の実施形態に係る発光装置によれば、基板上に複数の発光素子が配置された発光装置において、出射光の色ムラや輝度ムラを低減することが可能である。
本開示の実施形態に係る発光装置の製造方法によれば、出射光の色ムラや輝度ムラが低減可能な発光装置を簡便に製造することができる。 According to the light emitting device according to the embodiment of the present disclosure, it is possible to reduce color unevenness and brightness unevenness of emitted light in a light emitting device in which a plurality of light emitting elements are arranged on a substrate.
According to the method for manufacturing a light emitting device according to the embodiment of the present disclosure, it is possible to easily manufacture a light emitting device capable of reducing color unevenness and brightness unevenness of emitted light.

図１Ａは、第１実施形態に係る発光装置の構成を示す概略斜視図である。FIG. 1A is a schematic perspective view showing the configuration of the light emitting device according to the first embodiment. 図１Ｂは、第１実施形態に係る発光装置の構成を示す概略平面図である。FIG. 1B is a schematic plan view showing the configuration of the light emitting device according to the first embodiment. 図１Ｃは、第１実施形態に係る発光装置において、第１部材及び第２部材と、これらの部材で区画された第１領域及び第２領域との関係を示す概略平面図である。FIG. 1C is a schematic plan view showing the relationship between the first member and the second member and the first region and the second region partitioned by these members in the light emitting device according to the first embodiment. 図１Ｄは、第１実施形態に係る発光装置の構成を示す概略断面図であり、図１ＢのＩＤ−ＩＤ線における断面を示す。FIG. 1D is a schematic cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a cross section taken along the line ID-ID of FIG. 1B. 図１Ｅは、第１実施形態に係る発光装置の構成を示す概略断面図であり、図１ＢのＩＥ−ＩＥ線における断面を示す。FIG. 1E is a schematic cross-sectional view showing the configuration of the light emitting device according to the first embodiment, and shows a cross section taken along line IE-IE of FIG. 1B. 図２は、第１実施形態に係る発光装置に用いられる発光素子の構成を示す概略断面図である。FIG. 2 is a schematic cross-sectional view showing the configuration of the light emitting element used in the light emitting device according to the first embodiment. 図３は、第１実施形態に係る発光装置において、光取り出しを説明するための概略断面図である。FIG. 3 is a schematic cross-sectional view for explaining light extraction in the light emitting device according to the first embodiment. 図４は、第１実施形態に係る発光装置の製造方法の手順を示すフローチャートである。FIG. 4 is a flowchart showing the procedure of the method for manufacturing the light emitting device according to the first embodiment. 図５Ａは、第１実施形態に係る発光装置の製造方法における基板準備工程を示す概略断面図である。FIG. 5A is a schematic cross-sectional view showing a substrate preparing step in the method for manufacturing the light emitting device according to the first embodiment. 図５Ｂは、第１実施形態に係る発光装置の製造方法における発光素子実装工程を示す概略断面図である。FIG. 5B is a schematic sectional view showing a light emitting element mounting step in the method for manufacturing the light emitting device according to the first embodiment. 図５Ｃは、第１実施形態に係る発光装置の製造方法における第１部材形成工程を示す概略断面図である。FIG. 5C is a schematic cross-sectional view showing the first member forming step in the method for manufacturing the light emitting device according to the first embodiment. 図５Ｄは、第１実施形態に係る発光装置の製造方法における第２部材形成工程を示す概略断面図である。FIG. 5D is a schematic cross-sectional view showing the second member forming step in the method for manufacturing the light emitting device according to the first embodiment. 図５Ｅは、第１実施形態に係る発光装置の製造方法における第１封止部材形成工程を示す断面図である。FIG. 5E is a sectional view showing a first sealing member forming step in the method for manufacturing the light emitting device according to the first embodiment. 図５Ｆは、第１実施形態に係る発光装置の製造方法における第２封止部材形成工程を示す概略断面図である。FIG. 5F is a schematic cross-sectional view showing the second sealing member forming step in the method for manufacturing the light emitting device according to the first embodiment. 図６Ａは、第２実施形態に係る発光装置の構成を示す概略平面図である。FIG. 6A is a schematic plan view showing the configuration of the light emitting device according to the second embodiment. 図６Ｂは、第２実施形態に係る発光装置の構成を示す概略断面図であり、図６ＡのＶＩＢ−ＶＩＢ線における断面を示す。FIG. 6B is a schematic cross-sectional view showing the configuration of the light emitting device according to the second embodiment, and shows a cross section taken along line VIB-VIB of FIG. 6A. 図７Ａは、第３実施形態に係る発光装置の構成を示す概略平面図である。FIG. 7A is a schematic plan view showing the configuration of the light emitting device according to the third embodiment. 図７Ｂは、第３実施形態に係る発光装置の構成を示す概略断面図であり、図７ＡのＶＩＩＢ−ＶＩＩＢ線における断面を示す。FIG. 7B is a schematic cross-sectional view showing the configuration of the light emitting device according to the third embodiment, and shows a cross section taken along line VIIB-VIIB of FIG. 7A. 図８Ａは、第４実施形態に係る発光装置の構成を示す概略平面図である。FIG. 8A is a schematic plan view showing the configuration of the light emitting device according to the fourth embodiment. 図８Ｂは、第４実施形態に係る発光装置の構成を示す概略断面図であり、図８ＡのＶＩＩＩＢ−ＶＩＩＩＢ線における断面を示す。FIG. 8B is a schematic cross-sectional view showing the configuration of the light emitting device according to the fourth embodiment and shows a cross section taken along the line VIIIB-VIIIB of FIG. 8A. 図９Ａは、第５実施形態に係る発光装置においての構成を示す概略平面図である。FIG. 9A is a schematic plan view showing the configuration of the light emitting device according to the fifth embodiment. 図９Ｂは、第５実施形態に係る発光装置の構成を示す概略断面図であり、図９ＡのＩＸＢ−ＩＸＢ線における断面を示す。FIG. 9B is a schematic cross-sectional view showing the configuration of the light emitting device according to the fifth embodiment, and shows a cross section taken along line IXB-IXB of FIG. 9A. 図１０Ａは、第６実施形態に係る発光装置の構成を示す概略平面図である。FIG. 10A is a schematic plan view showing the configuration of the light emitting device according to the sixth embodiment. 図１０Ｂは、第６実施形態に係る発光装置の構成を示す概略断面図であり、図１０ＡのＸＢ−ＸＢ線における断面を示す。FIG. 10B is a schematic cross-sectional view showing the configuration of the light emitting device according to the sixth embodiment and shows a cross section taken along line XB-XB of FIG. 10A.

以下、実施形態に係る発光装置及びその製造方法について、図面を参照しながら説明する。なお、各図面が示す部材の寸法、形状、位置関係等は、説明を明確にするため誇張していることがある。更に以下の説明において、同一の名称、符号については、原則として同一もしくは同質の部材を示しており、詳細な説明を適宜省略する。以下に記載される実施形態は、各構成等を適宜組み合わせて適用できる。   Hereinafter, a light emitting device and a method for manufacturing the same according to embodiments will be described with reference to the drawings. The dimensions, shapes, positional relationships, etc. of the members shown in the drawings may be exaggerated for clarity of explanation. Further, in the following description, the same names and reference numerals basically indicate the same or similar members, and detailed description thereof will be appropriately omitted. The embodiments described below can be applied by appropriately combining the configurations and the like.

＜第１実施形態＞
［発光装置の構成］
第１実施形態に係る発光装置の構成について、図１Ａ〜図１Ｅを参照して説明する。
なお、説明の便宜上、図１Ｂに示した平面図は、第１部材３及び第２部材４の外形を二点鎖線で示し、第１封止部材５ａ及び第２封止部材５ｂの外形を破線で示し、これらの部材を透視して示している。
また、図１Ｃにおいては、基板２の基体２１、第１部材３及び第２部材４を実線で示し、封止部材５を破線で示し、他の部材は省略している。また、第１領域２ａ及び第２領域２ｂを、それぞれ右上がりの斜線のハッチング及び左上がりの斜線のハッチングを施して示している。 <First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device according to the first embodiment will be described with reference to FIGS. 1A to 1E.
For convenience of explanation, in the plan view shown in FIG. 1B, the outer shapes of the first member 3 and the second member 4 are indicated by alternate long and two short dashes lines, and the outer shapes of the first sealing member 5a and the second sealing member 5b are indicated by broken lines. , And these members are shown through.
Further, in FIG. 1C, the base body 21, the first member 3, and the second member 4 of the substrate 2 are shown by solid lines, the sealing member 5 is shown by broken lines, and other members are omitted. Further, the first region 2a and the second region 2b are shown by hatching diagonal lines rising to the right and hatching diagonal lines rising to the left, respectively.

第１実施形態に係る発光装置１００は、図１Ｂに示されるように、平板状の基板２上に１つ以上の第１発光素子１ａと１つ以上の第２発光素子１ｂとが配置されたＣＯＢ（Chip on Board）型の発光装置である。
第１実施形態に係る発光装置１００は、平面視において、矩形の基板２上に円環状の第１部材３と、その内側に配置された直線状の第２部材４と、が設けられており、第１部材３で囲まれた領域が透光性領域を有する第２部材４によって２つの領域に区画されている。図１Ｂ及び図１Ｃにおいて、右側の領域である第１領域２ａ内には、複数の第１発光素子１ａが配置されている。また、左側の領域である第２領域２ｂ内には、複数の第２発光素子１ｂが配置されている。また、図１Ａ及び図１Ｄに示されるように、第１部材３の内側の領域には、封止部材５が設けられている。より詳細には、第１領域２ａには、第１封止部材５ａが設けられ、第１発光素子１ａが封止されている。第２領域２ｂには、第２封止部材５ｂが設けられ、第２発光素子１ｂが封止されている。
第１実施形態では、第１封止部材５ａ、第２部材４の透光性領域である第２層４２，第３層４３、及び第２封止部材５ｂを合わせた導光部材６が、中央部に向かって高くなる凸形状に構成されている。従って、第１発光素子１ａ及び第２発光素子１ｂから発されて導光部材６から出射される光は、中央部方向へ集光される。更に、導光部材６が凸形状であることで、第１発光素子１ａ及び第２発光素子１ｂから発された光は、導光部材６内を伝播しながら混光される。以上のように、第１実施形態の発光装置１００では、第１発光素子１ａ及び第２発光素子１ｂから発された光を効率的に集光、混光できるため、第１封止部材５ａ及び第２封止部材５ｂ上に更に透光部材や光拡散板等を設けることなく、出射光の色ムラや輝度ムラを低減することができる。
以下、各部材について詳細に説明する。 In the light emitting device 100 according to the first embodiment, as shown in FIG. 1B, one or more first light emitting elements 1a and one or more second light emitting elements 1b are arranged on a flat substrate 2. It is a COB (Chip on Board) type light emitting device.
The light emitting device 100 according to the first embodiment is provided with the annular first member 3 and the linear second member 4 arranged inside the rectangular substrate 2 in a plan view. The region surrounded by the first member 3 is divided into two regions by the second member 4 having the translucent region. In FIG. 1B and FIG. 1C, a plurality of first light emitting elements 1a are arranged in the first region 2a, which is the right region. A plurality of second light emitting elements 1b are arranged in the second area 2b, which is the left area. Further, as shown in FIGS. 1A and 1D, a sealing member 5 is provided in a region inside the first member 3. More specifically, the first sealing member 5a is provided in the first region 2a to seal the first light emitting element 1a. The second sealing member 5b is provided in the second region 2b to seal the second light emitting element 1b.
In the first embodiment, the light guide member 6 in which the first sealing member 5a, the second layer 42, which is the translucent region of the second member 4, the third layer 43, and the second sealing member 5b are combined, It is formed in a convex shape that rises toward the center. Therefore, the light emitted from the first light emitting element 1a and the second light emitting element 1b and emitted from the light guide member 6 is condensed in the central portion direction. Further, since the light guide member 6 has a convex shape, the light emitted from the first light emitting element 1a and the second light emitting element 1b is mixed while propagating in the light guide member 6. As described above, in the light emitting device 100 of the first embodiment, the light emitted from the first light emitting element 1a and the light emitted from the second light emitting element 1b can be efficiently collected and mixed, so that the first sealing member 5a and It is possible to reduce the color unevenness and the brightness unevenness of the emitted light without further providing a translucent member, a light diffusion plate, or the like on the second sealing member 5b.
Hereinafter, each member will be described in detail.

（第１発光素子、第２発光素子）
第１発光素子１ａ及び第２発光素子１ｂとして、例えばＬＥＤチップを用いることができる。図面においては、第１発光素子１ａと第２発光素子１ｂとは、同じ構成を有しているが、互いに異なる形状であってもよく、また、互いに異なる色の光を発光するものであってもよい。
第１実施形態では、第１発光素子１ａは、基板２の上面の第１領域２ａ内に、複数個が略均等な間隔で配置されている。また、第２発光素子１ｂは、基板２の上面の第２領域２ｂ内に、複数個が略均等な間隔で配置されている。このように、基板の上面に発光素子が略均等な間隔で配置されていることで、発光装置の出射光の輝度ムラを抑えることができる。 (First light emitting element, second light emitting element)
For example, LED chips can be used as the first light emitting element 1a and the second light emitting element 1b. In the drawings, the first light emitting element 1a and the second light emitting element 1b have the same configuration, but may have different shapes, and emit light of different colors. Good.
In the first embodiment, the plurality of first light emitting elements 1a are arranged in the first region 2a on the upper surface of the substrate 2 at substantially equal intervals. A plurality of second light emitting elements 1b are arranged in the second region 2b on the upper surface of the substrate 2 at substantially equal intervals. Since the light emitting elements are arranged on the upper surface of the substrate at substantially equal intervals in this manner, it is possible to suppress uneven brightness of the emitted light of the light emitting device.

第１実施形態では、図１Ｂ及び図１Ｄに示されるように、第１発光素子１ａ及び第２発光素子１ｂは、シリコーン樹脂などの絶縁性の接合部材を用いて、電極が設けられる面と反対側の面が基板２の上面に接合されている。また、第１実施形態では、第１発光素子１ａ及び第２発光素子１ｂは、ワイヤ８を用いて、基板２の第１配線２２と第２配線２３との間、及び第３配線２４と第４配線２５との間に、２組に分かれてそれぞれ直列に電気的に接続されている。このとき、２組の直列回路のそれぞれに含まれる第１発光素子１ａ及び第２発光素子１ｂの個数は等しくても、異なっていてもよい。   In the first embodiment, as shown in FIGS. 1B and 1D, the first light emitting element 1a and the second light emitting element 1b are made of an insulating bonding member such as a silicone resin and are opposite to the surface on which the electrodes are provided. The side surface is joined to the upper surface of the substrate 2. In addition, in the first embodiment, the first light emitting element 1a and the second light emitting element 1b use the wire 8 between the first wiring 22 and the second wiring 23 of the substrate 2 and between the third wiring 24 and the second wiring 23. Two sets are electrically connected in series with the four wires 25. At this time, the numbers of the first light emitting element 1a and the second light emitting element 1b included in each of the two series circuits may be the same or different.

第１実施形態では、第１発光素子１ａの発光強度は、第１配線２２と第２配線２３との間の電流又は電圧を制御することで変えることができ、第２発光素子１ｂの発光強度は、第３配線２４と第４配線２５との間の電流又は電圧を制御することで変えることができるように構成されている。つまり、第１発光素子１ａと第２発光素子１ｂとは、発光強度を互いに独立して調整することができる。第１領域２ａの発光色と第２領域２ｂの発光色が互いに異なるように構成し、更に第１発光素子１ａと第２発光素子１ｂとの発光強度を独立して調整可能に構成することで、発光装置１００の発光色を調色可能とすることができる。
なお、第１発光素子１ａ及び第２発光素子１ｂの配列、接続態様はこれに限定されず、適宜変更することができる。 In the first embodiment, the emission intensity of the first light emitting element 1a can be changed by controlling the current or voltage between the first wiring 22 and the second wiring 23, and the emission intensity of the second light emitting element 1b can be changed. Can be changed by controlling the current or voltage between the third wiring 24 and the fourth wiring 25. That is, the light emitting intensity of the first light emitting element 1a and the second light emitting element 1b can be adjusted independently of each other. The emission color of the first region 2a and the emission color of the second region 2b are different from each other, and the emission intensity of the first light emitting element 1a and the second light emitting element 1b are independently adjustable. It is possible to adjust the emission color of the light emitting device 100.
The arrangement and connection mode of the first light emitting element 1a and the second light emitting element 1b are not limited to this, and can be changed as appropriate.

なお、第１発光素子１ａ及び第２発光素子１ｂの個数は、それぞれ１個以上あればよい。また、第１発光素子１ａ及び第２発光素子１ｂの配置間隔は、略均等でなくてもよく、適宜所望の間隔で配置されていてもよい。更に、第１発光素子１ａ及び第２発光素子１ｂは基板２にフリップチップ実装されていてもよい。また、第１発光素子１ａ及び第２発光素子１ｂの電気的な接続方法は特に限定されず、１組で又は３組以上に分かれて直列接続されてもよく、並列接続又は並列接続と直列接続とを組み合わせて電気的に接続されてもよい。   The number of the first light emitting element 1a and the number of the second light emitting element 1b may be one or more. Further, the arrangement intervals of the first light emitting element 1a and the second light emitting element 1b may not be substantially equal, and may be appropriately arranged at desired intervals. Further, the first light emitting element 1a and the second light emitting element 1b may be flip-chip mounted on the substrate 2. In addition, the electrical connection method of the first light emitting element 1a and the second light emitting element 1b is not particularly limited, and may be connected in series in one set or in three or more sets, or parallel connection or parallel connection and series connection. May be combined and electrically connected.

第１発光素子１ａは、第１封止部材５ａによって封止され、第１封止部材５ａに波長変換物質が含まれている場合は、発光した光の一部又は全部が波長変換物質によって波長変換される。また、第２発光素子１ｂは、第２封止部材５ｂによって封止され、第２封止部材５ｂに波長変換物質が含まれている場合は、発光した光の一部又は全部が波長変換物質によって波長変換される。
第１封止部材５ａ内を伝播する光の一部及び第２封止部材５ｂ内を伝播する光の一部は、第２部材４の透光性領域を透過して、互いに封止部材５の他方の領域内に伝播する。従って、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とは、封止部材５内で混光し易くなり、それらの光が封止部材５の上面から外部に取り出される。 The 1st light emitting element 1a is sealed by the 1st sealing member 5a, and when the 1st sealing member 5a contains the wavelength conversion substance, a part or all of the emitted light is wavelength-converted by the wavelength conversion substance. To be converted. Further, the second light emitting element 1b is sealed by the second sealing member 5b, and when the second sealing member 5b contains a wavelength conversion substance, part or all of the emitted light is a wavelength conversion substance. The wavelength is converted by.
A part of the light propagating in the first sealing member 5a and a part of the light propagating in the second sealing member 5b pass through the translucent region of the second member 4 and are mutually sealed. Propagate into the other region of. Therefore, the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b are easily mixed in the sealing member 5, and the light is emitted from the upper surface of the sealing member 5 to the outside. Taken out.

なお、第１発光素子１ａに由来する光には、第１発光素子１ａが発光した光と、当該光が第１封止部材５ａ中に含有されている波長変換物質によって波長変換された後の光と、が含まれる。また、第２発光素子１ｂに由来する光には、第２発光素子１ｂが発光した光と、当該光が第２封止部材５ｂ中に含有されている波長変換物質によって波長変換された後の光と、が含まれる。   The light emitted from the first light emitting element 1a includes the light emitted by the first light emitting element 1a and the light after the wavelength is converted by the wavelength converting substance contained in the first sealing member 5a. Light and. In addition, the light emitted from the second light emitting element 1b includes the light emitted by the second light emitting element 1b and the light after the wavelength is converted by the wavelength conversion substance contained in the second sealing member 5b. Light and.

ここで、第１発光素子１ａ及び第２発光素子１ｂの構成例について図２を参照して説明する。なお、前記したように、第１発光素子１ａと第２発光素子１ｂとは、互いに異なる形状、異なる発光色であってもよいが、図２に示した発光素子１を例として、第１発光素子１ａ及び第２発光素子１ｂに共通する構成の概略について説明する。   Here, a configuration example of the first light emitting element 1a and the second light emitting element 1b will be described with reference to FIG. As described above, the first light emitting element 1a and the second light emitting element 1b may have different shapes and different emission colors, but the first light emitting element 1 shown in FIG. The outline of the configuration common to the element 1a and the second light emitting element 1b will be described.

発光素子１は、素子基板１１の一方の主面上に、ｎ型半導体層１２ｎと活性層１２ａとｐ型半導体層１２ｐとを積層した半導体積層体１２を備えるＬＥＤチップである。また、半導体積層体１２は、ｎ側電極１３及びｐ側電極１５に外部電源を接続して通電することにより発光するようになっている。   The light emitting element 1 is an LED chip including a semiconductor laminated body 12 in which an n-type semiconductor layer 12n, an active layer 12a, and a p-type semiconductor layer 12p are laminated on one main surface of an element substrate 11. Further, the semiconductor laminated body 12 is adapted to emit light by connecting an external power source to the n-side electrode 13 and the p-side electrode 15 and energizing them.

半導体積層体１２には、ｐ型半導体層１２ｐ及び活性層１２ａが部分的に存在しない領域、つまりｎ型半導体層１２ｎが半導体積層体１２の上面側に露出した領域である露出部１２ｂを有する。露出部１２ｂにはｎ側電極１３が設けられ、ｎ型半導体層１２ｎと電気的に接続されている。なお、露出部１２ｂは、ｎ側電極１３及び絶縁膜１６で被覆されているが、便宜的に「露出部」と呼ぶ。
ｐ型半導体層１２ｐの上面の略全面には、良好な導電性と良好な透光性とを有する全面電極１４が設けられており、更に全面電極１４の一部にｐ側電極１５が設けられている。また、半導体積層体１２の表面は、ｎ側電極１３及びｐ側電極１５の上面を除き、絶縁膜１６によって被覆されている。ｎ側電極１３及びｐ側電極１５の上面に設けられた絶縁膜１６の開口部１６ｎ，１６ｐが、ワイヤ８や導電性の接合部材などを用いて外部と接続するための領域である。 The semiconductor stacked body 12 has a region where the p-type semiconductor layer 12p and the active layer 12a are not partially present, that is, an exposed portion 12b which is a region where the n-type semiconductor layer 12n is exposed on the upper surface side of the semiconductor stacked body 12. An n-side electrode 13 is provided on the exposed portion 12b and is electrically connected to the n-type semiconductor layer 12n. Although the exposed portion 12b is covered with the n-side electrode 13 and the insulating film 16, it is referred to as an "exposed portion" for convenience.
A substantially entire surface of the upper surface of the p-type semiconductor layer 12p is provided with a full-surface electrode 14 having good conductivity and good translucency, and a p-side electrode 15 is provided at a part of the full-surface electrode 14. ing. The surface of the semiconductor laminated body 12 is covered with an insulating film 16 except for the upper surfaces of the n-side electrode 13 and the p-side electrode 15. The openings 16n and 16p of the insulating film 16 provided on the upper surfaces of the n-side electrode 13 and the p-side electrode 15 are regions for connecting to the outside using the wire 8 or a conductive bonding member.

半導体積層体１２（ｎ型半導体層１２ｎ、活性層１２ａ及びｐ型半導体層１２ｐ）は、ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ（０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）で表される窒化物半導体を好適に用いることができる。また、素子基板１１、ｎ側電極１３、全面電極１４、ｐ側電極１５、絶縁膜１６は、前記した半導体積層体１２とともに、この分野で好適に用いられる材料が適宜に選択される。なお、素子基板１１は除去されていてもよい。 The semiconductor laminate 12 (n-type semiconductor layer 12n, the active layer 12a and the p-type semiconductor layer 12p) are represented by In X Al Y Ga 1-X -Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) A nitride semiconductor can be preferably used. Further, for the element substrate 11, the n-side electrode 13, the entire surface electrode 14, the p-side electrode 15, and the insulating film 16, materials suitably used in this field together with the above-described semiconductor laminated body 12 are appropriately selected. The element substrate 11 may be removed.

（基板）
基板２は、第１発光素子１ａや第２発光素子１ｂなどの電子部品を実装するための基板であり、基体２１と、基体２１の上面に設けられた配線パターンである第１配線２２、第２配線２３、第３配線２４及び第４配線２５と、を備えている。第１実施形態では、図１Ａ及び図１Ｂに示されるように、基板２は矩形平板状であるが、これに限らない。例えば、基板２の外形は、円形、矩形以外の多角形であってもよい。 (substrate)
The substrate 2 is a substrate for mounting electronic components such as the first light emitting element 1a and the second light emitting element 1b, and includes a base 21, a first wiring 22, which is a wiring pattern provided on the upper surface of the base 21, and The second wiring 23, the third wiring 24, and the fourth wiring 25 are provided. In the first embodiment, as shown in FIGS. 1A and 1B, the substrate 2 has a rectangular flat plate shape, but is not limited to this. For example, the outer shape of the substrate 2 may be a polygon other than a circle and a rectangle.

基体２１は、絶縁性材料を用いることが好ましく、かつ、第１発光素子１ａ及び第２発光素子１ｂから放出される光や外光などが透過しにくい材料を用いることが好ましい。また、ある程度の強度を有する材料を用いることが好ましい。具体的には、Ａｌ２Ｏ３、ＡｌＮなどのセラミックス、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ＢＴレジン（bismaleimide triazine resin）、ポリフタルアミド（ＰＰＡ）などの樹脂が挙げられる。また、基体２１の上面の、少なくとも第１発光素子１ａ及び第２発光素子１ｂを実装する領域は、良好な光反射性を有することが好ましく、例えば、Ａｇ、Ａｌなどの金属や、白色顔料を含有した白色樹脂などを用いた光反射層を設けることが好ましい。 The base 21 is preferably made of an insulating material, and is preferably made of a material through which light emitted from the first light emitting element 1a and the second light emitting element 1b or external light is difficult to pass. Further, it is preferable to use a material having a certain strength. Specific examples thereof include ceramics such as Al 2 O 3 and AlN, phenol resins, epoxy resins, polyimide resins, resins such as BT resin (bismaleimide triazine resin), and polyphthalamide (PPA). Further, it is preferable that at least a region on the upper surface of the base body 21 on which the first light emitting element 1a and the second light emitting element 1b are mounted has good light reflectivity. For example, a metal such as Ag or Al, or a white pigment is used. It is preferable to provide a light reflecting layer using the contained white resin or the like.

第１実施形態では、第１配線２２及び第３配線２４は正電極（アノード）であり、それぞれ外部電源と接続するためのパッド部２２ａ，２４ａと、第１発光素子１ａ、第２発光素子１ｂ及び保護素子７と接続するための配線部２２ｂ，２４ｂとを有している。第１実施形態の配線部２２ｂ，２４ｂは、図１Ｂにおいて、それぞれ右上の領域及び左上の領域に設けられたパッド部２２ａ，２４ａから分岐して、第１部材３の上半分の右側及び左側の部分に沿って四分円弧状に延伸するように設けられている。また、パッド部２４ａ又はパッド部２２ａの近傍に、正電極（アノード）であることを識別するためのアノードマークＡＭが設けられていてもよい。   In the first embodiment, the first wiring 22 and the third wiring 24 are positive electrodes (anodes), and the pad portions 22a and 24a for connecting to an external power source, the first light emitting element 1a, and the second light emitting element 1b, respectively. And wiring portions 22b and 24b for connecting to the protection element 7. The wiring portions 22b and 24b of the first embodiment branch from the pad portions 22a and 24a provided in the upper right region and the upper left region, respectively, in FIG. It is provided so as to extend in a quadrant arc shape along the portion. Further, an anode mark AM for identifying the positive electrode (anode) may be provided near the pad portion 24a or the pad portion 22a.

第１実施形態では、第２配線２３及び第４配線２５は負電極（カソード）であり、それぞれ外部電源と接続するためのパッド部２３ａ，２５ａと、第１発光素子１ａ、第２発光素子１ｂ及び保護素子７と接続するための配線部２３ｂ，２５ｂとを有している。第１実施形態の配線部２３ｂ，２５ｂは、図１Ｂにおいて、それぞれ右下の領域及び左下の領域に設けられたパッド部２３ａ，２５ａから分岐して、第１部材３の下半分の右側及び左側の部分に沿って四分円弧状に延伸するように設けられている。   In the first embodiment, the second wiring 23 and the fourth wiring 25 are negative electrodes (cathodes), and the pad portions 23a and 25a for connecting to an external power source, the first light emitting element 1a, and the second light emitting element 1b, respectively. And wiring portions 23b and 25b for connecting to the protection element 7. The wiring portions 23b and 25b of the first embodiment branch from the pad portions 23a and 25a provided in the lower right region and the lower left region, respectively, in FIG. 1B, and the right and left sides of the lower half of the first member 3 are separated. It is provided so as to extend in the shape of a quadrant arc along the portion.

第１実施形態では、配線部２２ｂ及び配線部２３ｂは、ワイヤ８を用いて、第１発光素子１ａと電気的に接続されている。また、図１Ｂに示されるように、保護素子７が、配線部２２ｂの一端に半田などの導電性の接合部材を用いて機械的及び電気的に接続されるとともに、ワイヤ８を用いて配線部２３ｂと電気的に接続されていてもよい。配線部２２ｂ及び配線部２３ｂと同様に、配線部２４ｂ及び配線部２５ｂは、ワイヤ８を用いて、第２発光素子１ｂと電気的に接続されている。また、保護素子７が、配線部２４ｂと配線部２５ｂとの間に電気的に接続されていてもよい。
第１配線２２、第２配線２３、第３配線２４及び第４配線２５としては、例えば、Ｃｕ，Ａｕ，Ａｇ，Ａｌなどの金属膜を用いることができる。
なお、第１配線２２、第２配線２３、第３配線２４及び第４配線２５は、図１Ｂに示した例に限定されず、第１発光素子１ａ及び第２発光素子１ｂの配列の態様や電気的な接続の態様に応じて適宜な配線パターンとすることができる。また、第１発光素子１ａ及び第２発光素子１ｂが、フリップチップ型で実装できるように構成することもできる。 In the first embodiment, the wiring portion 22b and the wiring portion 23b are electrically connected to the first light emitting element 1a using the wire 8. Further, as shown in FIG. 1B, the protection element 7 is mechanically and electrically connected to one end of the wiring portion 22b using a conductive joining member such as solder, and the wiring portion is connected using the wire 8. 23b may be electrically connected. Similar to the wiring portion 22b and the wiring portion 23b, the wiring portion 24b and the wiring portion 25b are electrically connected to the second light emitting element 1b using the wire 8. Further, the protection element 7 may be electrically connected between the wiring portion 24b and the wiring portion 25b.
As the first wiring 22, the second wiring 23, the third wiring 24, and the fourth wiring 25, for example, a metal film of Cu, Au, Ag, Al or the like can be used.
The first wiring 22, the second wiring 23, the third wiring 24, and the fourth wiring 25 are not limited to the example shown in FIG. 1B, and the arrangement mode of the first light emitting element 1a and the second light emitting element 1b and An appropriate wiring pattern can be formed according to the mode of electrical connection. Also, the first light emitting element 1a and the second light emitting element 1b can be configured to be mounted in a flip chip type.

（第１部材）
第１部材３は、基板２の上面において、第１発光素子１ａ及び第２発光素子１ｂが配置された領域の外側を囲む。第１実施形態では、図１Ｂに示されるように、第１部材３は、配線部２２ｂ，２３ｂ，２４ｂ，２５ｂの四分円弧状の部分を封止するように、当該配線部２２ｂ，２３ｂ，２４ｂ，２５ｂよりも幅広で、円環状に設けられている。第１部材３は、遮光性を有することが好ましく、更に、第１発光素子１ａ及び第２発光素子１ｂの高さよりも高くなるように設けることが好ましい。これにより、第１発光素子１ａ及び第２発光素子１ｂの光を上方に反射させることができ、発光装置１００の上面から効率的に出射させることができる。 (First member)
The first member 3 surrounds the upper surface of the substrate 2 outside the region in which the first light emitting element 1a and the second light emitting element 1b are arranged. In the first embodiment, as shown in FIG. 1B, the first member 3 is configured so that the wiring portions 22b, 23b, 23b, 23b, 23b, 23b, 23b, 25b, 25b are sealed so as to seal the portions of the wiring portions 22b, 23b, 24b, 25b. It is wider than 24b and 25b and is provided in an annular shape. The first member 3 preferably has a light-shielding property, and is preferably provided so as to be higher than the height of the first light emitting element 1a and the second light emitting element 1b. Accordingly, the light of the first light emitting element 1a and the light of the second light emitting element 1b can be reflected upward, and the light can be efficiently emitted from the upper surface of the light emitting device 100.

第１部材３が、光反射性を有するように構成する場合は、光吸収性を有するように構成する場合と比べて、封止部材５内を横方向に外側に向かって伝播する光を反射して、封止部材５の上面側から取り出すようにできる。このため、発光装置１００の光取り出し効率を高めることができる。
また、第１部材３は、光吸収性を有するように構成する場合は、封止部材５内を横方向に向かって伝播する光を吸収して、封止部材５の上面以外からの光取り出しを抑制することができる。このため、発光面とその他の領域との輝度のコントラストが高い「見切り性」の良好な発光装置１００とすることができる。 When the first member 3 is configured to have light reflectivity, compared with the case where the first member 3 is configured to have light absorbency, light that propagates laterally outward in the sealing member 5 is reflected. Then, it can be taken out from the upper surface side of the sealing member 5. Therefore, the light extraction efficiency of the light emitting device 100 can be improved.
Further, when the first member 3 is configured to have a light absorbing property, the first member 3 absorbs light propagating in the sealing member 5 in the lateral direction, and extracts light from other than the upper surface of the sealing member 5. Can be suppressed. For this reason, it is possible to provide the light emitting device 100 having a good “partition property” in which the brightness contrast between the light emitting surface and the other region is high.

第１部材３の材料としては、耐久性と形成のし易さの観点から、例えば、エポキシ樹脂、シリコーン樹脂などの樹脂材料を好適に用いることができる。また、樹脂等の母材に、例えば、ＴｉＯ２、Ａｌ２Ｏ３、ＳｉＯ２などの光反射性物質の粒子を含有させることで、光反射性を付与することができる。また、樹脂等の母材に、カーボンブラックやグラファイトなどの光吸収性物質の粒子を含有させることで、光吸収性を付与することができる。 As a material of the first member 3, a resin material such as an epoxy resin or a silicone resin can be preferably used from the viewpoint of durability and ease of formation. Further, by incorporating particles of a light-reflecting substance such as TiO 2 , Al 2 O 3 , and SiO 2 into a base material such as a resin, light reflectivity can be imparted. Further, by incorporating particles of a light absorbing substance such as carbon black or graphite into a base material such as a resin, it is possible to impart light absorbing properties.

（第２部材）
第１実施形態の第２部材４は、図１Ｂに示すように、基板２の上面において、第１発光素子１ａが配置された第１領域２ａと第２発光素子１ｂが配置された第２領域２ｂとを区画するように、第１発光素子１ａと第２発光素子１ｂとの間に設けられている。第２部材４は、第１発光素子１ａ及び第２発光素子１ｂの光が混光可能なように、透光性領域を有する。また、第１実施形態の第２部材４は、その２箇所（すなわち第１実施形態では第２部材４の両端部）がそれぞれ第１部材３と接するように設けられており、当該２箇所の一方から他方に向かって延伸するように線状に設けられている。より詳細には、第１実施形態の第２部材４は、直線状に設けられている。つまり、第１実施形態において、第２部材４は、第１部材３で囲まれた円形領域を、右側の半円領域である第１領域２ａと、左側の半円領域である第２領域２ｂとの２つの領域に区画している。 (Second member)
As shown in FIG. 1B, the second member 4 of the first embodiment includes, on the upper surface of the substrate 2, a first region 2a in which the first light emitting element 1a is arranged and a second region in which the second light emitting element 1b is arranged. It is provided between the first light emitting element 1a and the second light emitting element 1b so as to partition it from 2b. The second member 4 has a translucent region so that the lights of the first light emitting element 1a and the second light emitting element 1b can be mixed. Further, the second member 4 of the first embodiment is provided so that its two positions (that is, both ends of the second member 4 in the first embodiment) are in contact with the first member 3, respectively. It is linearly provided so as to extend from one side to the other side. More specifically, the second member 4 of the first embodiment is linearly provided. That is, in the first embodiment, the second member 4 includes a circular region surrounded by the first member 3, a first region 2a that is a right semicircular region and a second region 2b that is a left semicircular region. It is divided into two areas.

直線状の第２部材４は、図１Ｅに示すように、その両端部よりも中央部の方が高くなっており、断面視で略台形状に設けられている。また、直線状の第２部材４の両端部は第１部材３以上の高さで設けられ、中央部は第１部材３よりも高くなるように設けられている。すなわち、第１部材３と第２部材４とからなる枠体は、外側の高さよりも中央部の高さの方が高くなるように設けられている。   As shown in FIG. 1E, the linear second member 4 has a central portion higher than both end portions thereof, and is provided in a substantially trapezoidal shape in a sectional view. Further, both ends of the linear second member 4 are provided at a height equal to or higher than the first member 3, and the central portion is provided so as to be higher than the first member 3. That is, the frame body including the first member 3 and the second member 4 is provided such that the height of the central portion is higher than the height of the outer side.

第１部材３と第２部材４とで区画される第１領域２ａ及び第２領域２ｂには、それぞれ第１封止部材５ａ及び第２封止部材５ｂが設けられている。第１封止部材５ａ及び第２封止部材５ｂは、第１部材３の頂部３ａ及び第２部材４の頂部４ａの近傍まで被覆するように設けられているが、頂部３ａ，４ａは露出している。
ここで、「頂部」とは、図１Ｄに示すように、第１部材３、第２部材４のそれぞれの延伸方向に垂直な面による断面における頂点を、それぞれの部材の延伸方向に連結した線のことである。言い換えれば、第１部材３及び第２部材４が、円環状や線状に配置されている場合には、その稜線のことである。また、第１部材３及び第２部材４の断面が矩形や台形のように上端が平坦な場合は、その平坦な領域が頂部３ａ，４ａである。この場合は、平坦な頂部３ａ，４ａの少なくとも一部が露出していればよい。 A first sealing member 5a and a second sealing member 5b are provided in the first region 2a and the second region 2b, which are partitioned by the first member 3 and the second member 4, respectively. The first sealing member 5a and the second sealing member 5b are provided so as to cover the vicinity of the top portion 3a of the first member 3 and the top portion 4a of the second member 4, but the top portions 3a and 4a are exposed. ing.
Here, as shown in FIG. 1D, the “top” is a line connecting the vertices in the cross section of the first member 3 and the second member 4 in the plane perpendicular to the extending direction of the respective members in the extending direction of the respective members. That is. In other words, when the first member 3 and the second member 4 are arranged in an annular shape or a linear shape, they are the ridgelines thereof. In addition, when the cross sections of the first member 3 and the second member 4 have a flat upper end such as a rectangle or a trapezoid, the flat regions are the tops 3a and 4a. In this case, it suffices if at least a part of the flat tops 3a and 4a is exposed.

第１実施形態の第２部材４は、複数の層が積層されてなり、第１層４１、第２層４２及び第３層４３が積層された積層構造を有している。最下層である直線状の第１層４１は、その両端部が第１部材３と接し、第１部材３と略同じ高さに設けられている。直線状の第２層４２は、第１層４１上に重なるように設けられ、第１層４１よりも延伸方向の長さが短く、その両端部が第１部材３と離間するように設けられている。直線状の第３層４３は、第２層４２上に重なり、第２層４２よりも長さが短く設けられている。従って、直線状の第２部材４は、上層ほど短くなるように設けられた積層構造を有しており、その両端部よりも中央部の方が高くなるように構成されている。   The second member 4 of the first embodiment has a laminated structure in which a plurality of layers are laminated and a first layer 41, a second layer 42, and a third layer 43 are laminated. Both ends of the linear first layer 41, which is the lowermost layer, are in contact with the first member 3 and are provided at substantially the same height as the first member 3. The linear second layer 42 is provided so as to overlap the first layer 41, has a shorter length in the stretching direction than the first layer 41, and is provided so that both ends thereof are separated from the first member 3. ing. The linear third layer 43 overlaps the second layer 42 and has a shorter length than the second layer 42. Therefore, the linear second member 4 has a laminated structure provided so as to be shorter toward the upper layer, and is configured such that the central portion is higher than both end portions thereof.

最下層である第１層４１は、遮光性を有することが好ましく、遮光性として特に光反射性を有することが好ましい。また、第１層４１の上端は、第１発光素子１ａ及び第２発光素子１ｂの上端よりも高くなるように設けることが好ましい。これによって、第１発光素子１ａの側面から出射した光と、第２発光素子１ｂの側面から出射した光とが、互いに他方の発光素子近傍の領域に直接透過しないようにすることができる。特に第１封止部材５ａと第２封止部材５ｂとに、互いに異なる色を発光する波長変換物質を含有し、当該波長変換物質が、第１発光素子１ａ及び第２発光素子１ｂの近傍に偏在するように含有されている場合に有用である。第１領域２ａ及び第２領域２ｂにおいて、一方の領域で生成された光が、他方の領域の波長変換物質によって波長変換されることを抑制することができるため、例えば、一方の領域の発光素子のみを発光させる場合でも、発光装置１００を所望の発光色に調整し易くなる。   The first layer 41, which is the lowermost layer, preferably has a light shielding property, and particularly has a light reflecting property as a light shielding property. Further, it is preferable that the upper end of the first layer 41 is provided so as to be higher than the upper ends of the first light emitting element 1a and the second light emitting element 1b. This makes it possible to prevent the light emitted from the side surface of the first light emitting element 1a and the light emitted from the side surface of the second light emitting element 1b from directly transmitting to the regions near the other light emitting element. Particularly, the first sealing member 5a and the second sealing member 5b contain wavelength conversion substances that emit different colors, and the wavelength conversion substances are provided in the vicinity of the first light emitting element 1a and the second light emitting element 1b. It is useful when it is contained so as to be unevenly distributed. In the first region 2a and the second region 2b, it is possible to suppress the wavelength conversion of the light generated in one region by the wavelength conversion substance in the other region, and thus, for example, the light emitting element in one region. Even if only one emits light, it becomes easy to adjust the light emitting device 100 to a desired emission color.

また、第１実施形態において、第２部材４の上層部である第２層４２及び第３層４３は、高い透光性を有することが好ましい。上層部である第２層４２及び第３層４３を透光性領域とすることによって、第１領域２ａの第１封止部材５ａ内を伝播する光と、第２領域２ｂの第２封止部材５ｂ内を伝播する光とが、互いに他方の領域に伝播することができる。これによって、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とを、封止部材５全体で混光させ易くなる。   In addition, in the first embodiment, it is preferable that the second layer 42 and the third layer 43, which are the upper layers of the second member 4, have high translucency. By making the second layer 42 and the third layer 43, which are upper layers, the light-transmissive regions, the light propagating in the first sealing member 5a in the first region 2a and the second sealing in the second region 2b. Light propagating in the member 5b can propagate to the other region. This makes it easier to mix the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b in the entire sealing member 5.

第２部材４の材料としては、前記した第１部材３と同様の材料を用いることができる。なお、光反射性物質や光吸収性物質を含有しない前記の樹脂材料を用いることで、良好な透光性を有する透光性領域（第１実施形態では、第２層４２及び第３層４３）を形成することができる。   As the material of the second member 4, the same material as that of the first member 3 described above can be used. By using the resin material containing no light-reflecting substance or light-absorbing substance, the light-transmitting region having good light-transmitting property (in the first embodiment, the second layer 42 and the third layer 43). ) Can be formed.

なお、第２部材４は、積層せずに１層のみでもよく、２層や４層以上に積層してもよい。また、第２部材４が積層構造を有する場合において、第１層４１が遮光性を有さずに、透光性を有していてもよい。また、第２部材４が１層である場合は、全体が透光性を有するように構成する。   The second member 4 may have only one layer without being laminated, or may have two layers or four or more layers. When the second member 4 has a laminated structure, the first layer 41 may have a light-transmitting property without having a light-shielding property. Further, when the second member 4 is a single layer, it is configured so that the whole has translucency.

また、前記したように、平面視で、第１部材３は円環状であり、第２部材４は直線状であるが、これに限らず、第１部材３は平面視で矩形環状などの多角形環状や楕円環状などであってもよく、第２部材４は平面視で曲線や折れ線、多角形、円形、楕円などであってもよい。第１領域２ａ及び第２領域２ｂの平面形状は、半円の他、第１部材３及び第２部材４の平面形状によって半楕円、又は矩形、台形などの多角形に変更することができる。
また、第１部材３で囲まれた領域を区画する第２部材は、複数個であってもよい。第２部材の他の形態については、第２実施形態〜第６実施形態として後記する。 Further, as described above, the first member 3 has an annular shape and the second member 4 has a linear shape in a plan view, but the present invention is not limited to this, and the first member 3 has a rectangular annular shape or the like in a plan view. The second member 4 may have a rectangular ring shape, an elliptic ring shape, or the like, and the second member 4 may have a curved line, a polygonal line, a polygonal shape, a circular shape, an oval shape, or the like in a plan view. The planar shape of the first region 2a and the second region 2b can be changed to a semi-ellipse or a polygon such as a rectangle or a trapezoid depending on the planar shape of the first member 3 and the second member 4 in addition to the semicircle.
Further, a plurality of second members partitioning the area surrounded by the first member 3 may be provided. Other forms of the second member will be described later as second to sixth embodiments.

（封止部材）
第１実施形態では、図１Ｂ及び図１Ｃに示されるように、封止部材５は、第１部材３と第２部材４とによって、右側に区画された第１領域２ａに設けられる第１封止部材５ａと、左側に区画された第２領域２ｂに設けられる第２封止部材５ｂとから構成されている。封止部材５は、基板２上の第１領域２ａ及び第２領域２ｂ内に配置された第１発光素子１ａ、第２発光素子１ｂ及びワイヤ８を封止して、これらの部材を、塵芥、水分、ガス、外力などから保護するためのものである。 (Sealing member)
In the first embodiment, as shown in FIGS. 1B and 1C, the sealing member 5 is a first seal provided in the first region 2a partitioned by the first member 3 and the second member 4 on the right side. It is composed of a stop member 5a and a second sealing member 5b provided in the second region 2b partitioned on the left side. The sealing member 5 seals the first light emitting element 1a, the second light emitting element 1b, and the wire 8 arranged in the first region 2a and the second region 2b on the substrate 2, and cleans these members. , To protect from moisture, gas and external force.

また、封止部材５は、必要に応じて、蛍光体等の波長変換物質の粒子を含有させてもよい。更に、含有させる波長変換物質の発光色は、第１領域２ａと第２領域２ｂとで異なるようにしてもよく、一方の領域にのみ波長変換物質を含有させるようにしてもよい。封止部材５に波長変換物質の粒子を含有させる場合は、当該粒子が封止部材５の底部、すなわち、第１発光素子１ａ又は第２発光素子１ｂの表面近傍に偏在して分布するように設けることが好ましい。これによって、波長変換の効率を高めることができる。   Moreover, the sealing member 5 may contain particles of a wavelength conversion substance such as a phosphor, if necessary. Further, the emission color of the wavelength conversion substance to be contained may be different between the first region 2a and the second region 2b, or the wavelength conversion substance may be contained in only one region. When the sealing member 5 contains particles of the wavelength conversion substance, the particles are unevenly distributed near the bottom of the sealing member 5, that is, near the surface of the first light emitting element 1a or the second light emitting element 1b. It is preferable to provide. Thereby, the efficiency of wavelength conversion can be improved.

前記したように、第１発光素子１ａの発光色と、第２発光素子１ｂの発光色とは同じでもよいし、異なるようにしてもよい。また、第１封止部材５ａに含有させる波長変換物質の発光色と、第２封止部材５ｂに含有させる波長変換物質の発光色とは同じでもよいし、異なるようにしてもよい。更に、波長変換物質を第１封止部材５ａ又は第２封止部材５ｂの一方にのみ含有させるようにしてもよい。発光装置１００としての発光色は、これらの部材の発光色の組み合わせに応じて、様々な色調を実現することができる。   As described above, the emission color of the first light emitting element 1a and the emission color of the second light emitting element 1b may be the same or different. Further, the emission color of the wavelength conversion substance contained in the first sealing member 5a and the emission color of the wavelength conversion substance contained in the second sealing member 5b may be the same or different. Further, the wavelength conversion substance may be contained in only one of the first sealing member 5a and the second sealing member 5b. The emission color of the light emitting device 100 can realize various color tones according to the combination of the emission colors of these members.

封止部材５は、第１部材３及び第２部材４で囲まれた領域に設けられ、第１部材３の頂部３ａ及び第２部材４の頂部４ａの近傍の高さまで設けられている。従って、封止部材５は、第１部材３で囲まれた領域の第１部材３側、すなわち外側の高さよりも、第２部材４側、すなわち中央部の高さの方が高くなるように設けられている。   The sealing member 5 is provided in a region surrounded by the first member 3 and the second member 4, and is provided up to a height in the vicinity of the top 3 a of the first member 3 and the top 4 a of the second member 4. Therefore, in the sealing member 5, the height of the second member 4 side, that is, the central portion is higher than the height of the region surrounded by the first member 3 on the first member 3 side, that is, the outside. It is provided.

第１封止部材５ａ及び第２封止部材５ｂは、第２部材４の透光性領域、すなわち第１実施形態では第２層４２及び第３層４３と合わせて、凸形状の導光部材６とみなすことができる。導光部材６が凸形状であることで、導光部材６内を伝播する光は効率的に混合される。更に、導光部材６が凸形状であることで、導光部材６の上面から出射される光は、その光軸Ｃ方向に集光される。以上のように、第１発光素子１ａ及び第２発光素子１ｂの光が効率的に混合及び集光されるので、第１封止部材５ａ及び第２封止部材５ｂ上に更に透光部材や光拡散板等を設けることなく、発光装置１００の色ムラや輝度ムラなどを低減することができる。なお、第１封止部材５ａ、第２部材４の透光性領域及び第２封止部材５ｂは、同程度の屈折率を有する材料で構成されることが好ましい。これによって、第１封止部材５ａ、第２部材４の透光性領域及び第２封止部材５ｂの間に光学的な界面が形成されないため、第１封止部材５ａ、第２部材４の透光性領域及び第２封止部材５ｂの間で光が伝播し易くなる。
更に、第１実施形態では、第１封止部材５ａ及び第２封止部材５ｂの上面が、第１部材３側から第２部材４側に高くなる傾斜面又は凹曲面となっている。このような形状とすることで、例えば、上面が凸曲面の第１封止部材及び第２封止部材である場合と比べて、導光部材６の上面から出射される光が中央部方向に集光され易く、色ムラや輝度ムラをより低減した発光装置とすることができる。 The first sealing member 5a and the second sealing member 5b are combined with the translucent region of the second member 4, that is, the second layer 42 and the third layer 43 in the first embodiment, and have a convex shape. It can be considered as 6. Since the light guide member 6 has a convex shape, the light propagating in the light guide member 6 is efficiently mixed. Further, since the light guide member 6 has a convex shape, the light emitted from the upper surface of the light guide member 6 is condensed in the optical axis C direction. As described above, the light emitted from the first light emitting element 1a and the light emitted from the second light emitting element 1b are efficiently mixed and condensed, so that a light-transmissive member or a light-transmissive member is formed on the first sealing member 5a and the second sealing member 5b. It is possible to reduce color unevenness and brightness unevenness of the light emitting device 100 without providing a light diffusion plate or the like. The first sealing member 5a, the translucent region of the second member 4, and the second sealing member 5b are preferably made of materials having the same refractive index. As a result, an optical interface is not formed between the first sealing member 5a, the light-transmissive region of the second member 4 and the second sealing member 5b, so that the first sealing member 5a and the second member 4 have the same structure. Light easily propagates between the transparent region and the second sealing member 5b.
Further, in the first embodiment, the upper surfaces of the first sealing member 5a and the second sealing member 5b are inclined surfaces or concave curved surfaces that are higher from the first member 3 side to the second member 4 side. With such a shape, for example, the light emitted from the upper surface of the light guide member 6 is directed toward the central portion as compared with the case where the upper surface is the first sealing member and the second sealing member having convex curved surfaces. It is possible to obtain a light emitting device in which light is easily collected and color unevenness and brightness unevenness are further reduced.

また、第１実施形態では、第２部材４の延伸方向に垂直な方向の発光装置１００の断面（図１Ｄ）と、第２部材４の延伸方向に平行な方向の発光装置１００の断面（図１Ｅ）と、において、導光部材６の形状が異なる。これは、導光部材６の頂部となる第２部材４を、第１部材の内側で一方向（又は多方向）に延伸するように設けたことによる。第１実施形態において、導光部材６の頂部を所望の位置や領域に設けることで、第２部材４の平面形状を適宜変更することができ、それぞれの方向において配光が異なる発光装置を提供することができる。   In the first embodiment, the cross section of the light emitting device 100 in the direction perpendicular to the extending direction of the second member 4 (FIG. 1D) and the cross section of the light emitting device 100 in the direction parallel to the extending direction of the second member 4 (FIG. 1D). 1E), the shape of the light guide member 6 is different. This is because the second member 4, which is the top of the light guide member 6, is provided so as to extend in one direction (or multiple directions) inside the first member. In the first embodiment, by providing the top portion of the light guide member 6 at a desired position or area, the planar shape of the second member 4 can be appropriately changed, and a light emitting device having different light distribution in each direction is provided. can do.

封止部材５の材料としては、高い透光性、耐候性及び耐光性を有するものが好ましく、例えば、シリコーン樹脂、エポキシ樹脂、ユリア樹脂などの熱硬化性樹脂を好適に用いることができる。
波長変換物質は、第１封止部材５ａに含有させる場合には第１発光素子１ａからの光を吸収し、第２封止部材５ｂに含有させる場合には第２発光素子１ｂからの光を吸収し、波長変換するものを用いることができる。また、封止部材５に含有させる波長変換物質は、封止部材５に用いられる樹脂材料よりも比重が大きいものが好ましい。波長変換物質の比重が樹脂材料の比重よりも大きいと、製造過程において波長変換物質の粒子を封止部材５中で沈降させて、第１発光素子１ａ又は第２発光素子１ｂの表面近傍に偏在するように配置することができる。 As a material of the sealing member 5, a material having high translucency, weather resistance and light resistance is preferable, and for example, a thermosetting resin such as a silicone resin, an epoxy resin or a urea resin can be preferably used.
The wavelength conversion substance absorbs light from the first light emitting element 1a when included in the first sealing member 5a, and absorbs light from the second light emitting element 1b when included in the second sealing member 5b. What absorbs and wavelength-converts can be used. Further, the wavelength conversion substance contained in the sealing member 5 preferably has a larger specific gravity than the resin material used in the sealing member 5. When the specific gravity of the wavelength conversion substance is larger than that of the resin material, particles of the wavelength conversion substance are settled in the sealing member 5 in the manufacturing process, and are unevenly distributed near the surface of the first light emitting element 1a or the second light emitting element 1b. Can be arranged to

波長変換物質として、具体的には、例えば、ＹＡＧ（Ｙ３Ａｌ５Ｏ１２：Ｃｅ）やシリケートなどの黄色蛍光体、あるいは、ＣＡＳＮ（ＣａＡｌＳｉＮ３：Ｅｕ）やＫＳＦ（Ｋ２ＳｉＦ６：Ｍｎ）などの赤色蛍光体、量子ドット等を挙げることができる。
また、封止部材５に、その他のフィラーを含有させるようにしてもよい。その他のフィラーとしては、例えば、ＳｉＯ２、ＴｉＯ２、Ａｌ２Ｏ３、ＺｒＯ２、ＭｇＯなどの粒子を好適に用いることができる。その他、例えば、有機や無機の着色染料や着色顔料を含有させるようにしてもよい。 Specific examples of the wavelength conversion substance include yellow phosphors such as YAG (Y 3 Al 5 O 12 : Ce) and silicate, CASN (CaAlSiN 3 : Eu) and KSF (K 2 SiF 6 : Mn). Examples include red phosphors, quantum dots, and the like.
Moreover, you may make it the sealing member 5 contain another filler. As the other filler, for example, particles of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , MgO or the like can be preferably used. In addition, for example, an organic or inorganic coloring dye or coloring pigment may be contained.

（保護素子）
保護素子７は、第１発光素子１ａ及び第２発光素子１ｂを静電放電から保護するなどの目的で設けられる。
保護素子７としては、例えば、ツェナーダイオード、バリスタ、抵抗、キャパシタなどを用いることができる。なお、保護素子は有していなくてもよい。 (Protection element)
The protection element 7 is provided for the purpose of protecting the first light emitting element 1a and the second light emitting element 1b from electrostatic discharge.
As the protection element 7, for example, a Zener diode, a varistor, a resistor, a capacitor or the like can be used. Note that the protective element may not be included.

（ワイヤ）
ワイヤ８は、第１発光素子１ａ同士、第２発光素子１ｂ同士、第１発光素子１ａと配線部２２ｂ及び配線部２３ｂとの間、並びに第２発光素子１ｂと配線部２４ｂ及び配線部２５ｂとの間、を電気的に接続するための配線部材である。また、ワイヤ８は、保護素子７と配線部２３ｂ，２５ｂとを電気的に接続するために用いてもよい。ワイヤ８としては、良好な導電性を有するＣｕ，Ａｕ，Ａｇ，Ａｌなどの金属又はこれらの金属を主成分とする合金を用いた金属ワイヤを好適に用いることができる。 (Wire)
The wire 8 includes the first light emitting elements 1a, the second light emitting elements 1b, the first light emitting element 1a and the wiring portion 22b and the wiring portion 23b, and the second light emitting element 1b, the wiring portion 24b and the wiring portion 25b. Is a wiring member for electrically connecting between. Further, the wire 8 may be used to electrically connect the protection element 7 and the wiring portions 23b and 25b. As the wire 8, a metal wire using a metal such as Cu, Au, Ag, or Al having good conductivity or an alloy containing these metals as a main component can be preferably used.

［発光装置の動作］
次に、第１実施形態に係る発光装置１００の動作について、図３を参照して説明する。図３は、図１Ｄと同じく、図１ＢのＩＤ−ＩＤ線における断面を示しているが、ワイヤ８など、一部の部材の記載を省略している。
図３では、第１発光素子１ａに由来する光Ｌ１〜Ｌ５の光路が示されている。また、図３に示した断面図において、第１発光素子１ａ、第２発光素子１ｂ、第１部材３、第２部材４、第１封止部材５ａ及び第２封止部材５ｂは、略左右対称に配置されている。このため、第２発光素子１ｂに由来する光の光路は、第１発光素子１ａに由来する光Ｌ１〜Ｌ５と略左右対称となる。従って、図３には、右半分の領域に配置されている第１発光素子１ａに由来する光の代表的な光路のみを模式的に示している。 [Operation of light emitting device]
Next, the operation of the light emitting device 100 according to the first embodiment will be described with reference to FIG. Similar to FIG. 1D, FIG. 3 shows a cross section taken along the line ID-ID in FIG. 1B, but illustration of some members such as the wire 8 is omitted.
In FIG. 3, the optical paths of the lights L1 to L5 originating from the first light emitting element 1a are shown. In the cross-sectional view shown in FIG. 3, the first light emitting element 1a, the second light emitting element 1b, the first member 3, the second member 4, the first sealing member 5a and the second sealing member 5b are substantially left and right. They are arranged symmetrically. Therefore, the optical path of the light originating from the second light emitting element 1b is substantially left-right symmetric with the light L1 to L5 originating from the first light emitting element 1a. Therefore, in FIG. 3, only a representative optical path of light originating from the first light emitting element 1a arranged in the right half region is schematically shown.

なお、封止部材５及び第２部材４の透光性領域によって構成される凸形状の導光部材６の光軸Ｃは、前記した各部材が配置された領域の中心軸と一致するように設けられている。
また、第１部材３及び第２部材４の最下層である第１層４１は光反射性を有し、第２部材４の上層部である第２層４２及び第３層４３は透光性を有する。また、第１封止部材５ａ、第２封止部材５ｂ、第２部材の第２層４２及び第３層４３は、屈折率が同じであるものとする。 It should be noted that the optical axis C of the convex light guide member 6 constituted by the light-transmitting regions of the sealing member 5 and the second member 4 should coincide with the central axis of the region where the above-mentioned members are arranged. It is provided.
The first layer 41, which is the lowermost layer of the first member 3 and the second member 4, has light reflectivity, and the second layer 42 and the third layer 43, which are upper layers of the second member 4, are translucent. Have. In addition, the first sealing member 5a, the second sealing member 5b, the second layer 42 and the third layer 43 of the second member have the same refractive index.

まず、基板２の第１配線２２のパッド部２２ａ及び第２配線２３のパッド部２３ａ、並びに第３配線２４のパッド部２４ａ及び第４配線２５のパッド部２５ａに、それぞれ外部電源を接続することで、配線部２２ｂ，２３ｂ及びワイヤ８を介して各第１発光素子１ａに、配線部２４ｂ，２５ｂ及びワイヤ８を介して各第２発光素子１ｂに、それぞれ電力が供給されて発光する。   First, an external power source should be connected to the pad portion 22a of the first wiring 22 and the pad portion 23a of the second wiring 23, the pad portion 24a of the third wiring 24, and the pad portion 25a of the fourth wiring 25 of the substrate 2, respectively. Then, power is supplied to each first light emitting element 1a via the wiring portions 22b and 23b and the wire 8 and to each second light emitting element 1b via the wiring portions 24b and 25b and the wire 8 to emit light.

第１実施形態に係る発光装置１００では、第１発光素子１ａが発した光は、そのままの波長で、又は第１封止部材５ａ中の波長変換物質によって波長変換されて、第１封止部材５ａ内を伝播する。第１封止部材５ａ内を上方に向かって伝播する光Ｌ１，Ｌ２は、凸形状の導光部材６の集光作用によって、その光軸Ｃに近づくように屈折して第１封止部材５ａの上面から外部に取り出される。   In the light emitting device 100 according to the first embodiment, the light emitted from the first light emitting element 1a is wavelength-converted at the wavelength as it is or by the wavelength conversion substance in the first sealing member 5a, and thus the first sealing member is obtained. Propagate in 5a. The light beams L1 and L2 propagating upward in the first sealing member 5a are refracted so as to approach the optical axis C by the converging action of the convex light guide member 6, and the first sealing member 5a. Is taken out from the upper surface of the.

第１実施形態に係る発光装置１００では、第１発光素子１ａに由来し、第２領域２ｂに向かってやや上方に伝播する光Ｌ３は、第２部材４の透明な第２層４２又は第３層４３を透過し、更に第２封止部材５ｂ内に伝播する。第２封止部材５ｂ内に伝播した光Ｌ３は、第２封止部材５ｂの上面から外部に取り出される。また、光Ｌ３は、凸形状の導光部材６の集光作用によって、光軸Ｃ側に近づくように屈折して外部に取り出される。   In the light emitting device 100 according to the first embodiment, the light L3 that originates from the first light emitting element 1a and propagates slightly upward toward the second region 2b is the transparent second layer 42 or the third layer 42 of the second member 4. It penetrates the layer 43 and further propagates into the second sealing member 5b. The light L3 propagating in the second sealing member 5b is extracted from the upper surface of the second sealing member 5b to the outside. Further, the light L3 is refracted so as to approach the optical axis C side by the light condensing action of the convex light guide member 6, and is extracted to the outside.

第１実施形態に係る発光装置１００では、第１発光素子１ａに由来し、第２領域２ｂに向かって水平に近い角度で伝播する光Ｌ４は、第２部材４の光反射性を有する第１層４１で上方に反射され、第１封止部材５ａの上面から外部に取り出される。また、光Ｌ４は、凸形状の導光部材６の集光作用によって、光軸Ｃ側に近づくように屈折して外部に取り出される。   In the light emitting device 100 according to the first embodiment, the light L4 that originates from the first light emitting element 1a and propagates toward the second region 2b at an angle close to horizontal is the first light having the light reflectivity of the second member 4. It is reflected upward by the layer 41 and is taken out from the upper surface of the first sealing member 5a to the outside. Further, the light L4 is refracted toward the optical axis C side by the light condensing action of the convex light guide member 6, and is extracted to the outside.

第１実施形態に係る発光装置１００では、第１発光素子１ａに由来し、第１領域２ａの外側の第１部材３側に向かって水平方向に近い角度で伝播する光Ｌ５は、光反射性の第１部材３によって上方に反射され、第１封止部材５ａの上面から外部に取り出される。
なお、第２発光素子１ｂに由来する光も、第１発光素子１ａに由来する光と同様にして、外部に取り出される。 In the light emitting device 100 according to the first embodiment, the light L5 that is derived from the first light emitting element 1a and propagates toward the first member 3 side outside the first region 2a at an angle close to the horizontal direction is light reflective. Is reflected upward by the first member 3 and is taken out from the upper surface of the first sealing member 5a.
The light emitted from the second light emitting element 1b is also extracted to the outside in the same manner as the light emitted from the first light emitting element 1a.

第１実施形態に係る発光装置１００では、以上のように、第１封止部材５ａ、第２部材４の透光性領域及び第２封止部材５ｂによって構成される導光部材６が凸形状であることで、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とが、当該導光部材６内で混光され易くなる。更に、導光部材６が凸形状であることで、出射光は光軸Ｃ方向に集光されるため、導光部材６の上面から出射する光は、当該光軸Ｃ方向及びその近傍において効果的に混光される。従って、発光面の色ムラや輝度ムラが低減された発光装置１００とすることができる。   In the light emitting device 100 according to the first embodiment, as described above, the light guide member 6 configured by the first sealing member 5a, the translucent region of the second member 4, and the second sealing member 5b has a convex shape. Therefore, the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b are easily mixed in the light guide member 6. Further, since the light guide member 6 has a convex shape, the emitted light is condensed in the optical axis C direction, so that the light emitted from the upper surface of the light guide member 6 is effective in the optical axis C direction and in the vicinity thereof. Light is mixed. Therefore, it is possible to obtain the light emitting device 100 in which the color unevenness and the brightness unevenness of the light emitting surface are reduced.

また、第１封止部材５ａ及び第２封止部材５ｂの少なくとも一方が波長変換物質を含有し、当該波長変換物質がそれぞれ対応する領域の第１発光素子１ａ及び第２発光素子１ｂの表面近傍に偏在するように分布していることが好ましい。この場合は、第１発光素子１ａから出射される直接光と、第２発光素子１ｂから出射される直接光とが、第２部材４の第１層４１によって遮光されることで、互いに他領域に設けられた波長変換物質によって波長変換されないようにすることができる。このため、第１発光素子１ａが発した光と、第１封止部材５ａ中の波長変換物質が発した光と、第２発光素子１ｂが発した光と、第２封止部材５ｂ中の波長変換物質が発した光とが、所望の割合で混光され易くなる。   In addition, at least one of the first sealing member 5a and the second sealing member 5b contains a wavelength converting substance, and the vicinity of the surface of the first light emitting element 1a and the second light emitting element 1b in the regions corresponding to the wavelength converting substance, respectively. It is preferable that they are distributed so as to be unevenly distributed. In this case, the direct light emitted from the first light emitting element 1a and the direct light emitted from the second light emitting element 1b are shielded by the first layer 41 of the second member 4, so that they are in different regions from each other. It is possible to prevent wavelength conversion by the wavelength conversion substance provided in the. Therefore, the light emitted by the first light emitting element 1a, the light emitted by the wavelength conversion material in the first sealing member 5a, the light emitted by the second light emitting element 1b, and the light emitted by the second sealing member 5b. The light emitted by the wavelength conversion substance is likely to be mixed at a desired ratio.

なお、第１発光素子１ａの発光色と第２発光素子１ｂの発光色とが同じ、又は、第１封止部材５ａに含有される波長変換物質の発光色と第２封止部材５ｂに含有される波長変換物質の発光色とが同じ、又はそれらの両方の場合であっても、前記したような凸形状の導光部材６による混光、集光作用により、発光素子同士の明るさや微小な色差によるムラ、波長変換物質の分布の偏りなどによって生じるムラも低減することができる。   The emission color of the first light emitting element 1a and the emission color of the second light emitting element 1b are the same, or the emission color of the wavelength conversion substance contained in the first sealing member 5a and the second sealing member 5b are contained. Even if the emission color of the wavelength conversion substance is the same or both, the brightness and the minuteness of the light emitting elements are small due to the light mixing and condensing action by the convex light guide member 6 as described above. It is possible to reduce unevenness due to different color differences and unevenness caused by uneven distribution of the wavelength conversion substance.

［発光装置の製造方法］
次に、第１実施形態に係る発光装置の製造方法について、図４〜図５Ｆを参照して説明する。第１実施形態に係る発光装置の製造方法は、図４に示されるように基板準備工程Ｓ１１と、発光素子実装工程Ｓ１２と、枠体形成工程Ｓ１３と、封止部材形成工程Ｓ１４とが含まれている。
枠体形成工程Ｓ１３は、第１部材形成工程Ｓ１３１と、第２部材形成工程Ｓ１３２とを含んでいる。また、第１実施形態に係る発光装置の製造方法では、封止部材形成工程Ｓ１４は、第１封止部材形成工程Ｓ１４１と、第２封止部材形成工程Ｓ１４２とを含んでいる。 [Method of manufacturing light emitting device]
Next, a method for manufacturing the light emitting device according to the first embodiment will be described with reference to FIGS. 4 to 5F. The method for manufacturing a light emitting device according to the first embodiment includes a substrate preparing step S11, a light emitting element mounting step S12, a frame forming step S13, and a sealing member forming step S14 as shown in FIG. ing.
The frame body forming step S13 includes a first member forming step S131 and a second member forming step S132. In the method for manufacturing a light emitting device according to the first embodiment, the sealing member forming step S14 includes a first sealing member forming step S141 and a second sealing member forming step S142.

基板準備工程Ｓ１１は、図５Ａに示すように、絶縁性の基体２１の上面に第１配線２２及び第２配線２３が形成された基板２を準備する工程である。これらの配線は、例えば、基体２１の上面全体に金属膜を形成し、当該金属膜上に配線パターンとして残す領域を被覆するマスクを設け、露出した金属膜をエッチングすることで形成するサブトラクティブ法などで形成することができる。
なお、本明細書において、準備工程とは、基板２を前記のような方法で製造することに限定されず、購入などにより入手することも含むものである。 The substrate preparation step S11 is a step of preparing the substrate 2 in which the first wiring 22 and the second wiring 23 are formed on the upper surface of the insulating base 21 as shown in FIG. 5A. These wirings are formed by, for example, forming a metal film on the entire upper surface of the base 21, providing a mask on the metal film to cover a region left as a wiring pattern, and etching the exposed metal film. And the like.
In the present specification, the preparation step is not limited to manufacturing the substrate 2 by the method as described above, and includes obtaining it by purchase or the like.

発光素子実装工程Ｓ１２は、図５Ｂに示すように、第１発光素子１ａ及び第２発光素子１ｂを、基板２に実装する工程である。この工程において、まず、第１発光素子１ａ及び第２発光素子１ｂを、それぞれ基板２の上面の第１領域２ａ及び第２領域２ｂ内の所定の位置に、半田やダイボンド樹脂などの導電性又は絶縁性の接合部材を用いて接合する。全ての第１発光素子１ａ及び第２発光素子１ｂを基板２と接合した後に、第１実施形態の製造方法では、ワイヤ８を用いて、第１発光素子１ａ及び第２発光素子１ｂ同士、第１発光素子１ａと第１配線２２の配線部２２ｂ及び第２配線２３の配線部２３ｂとの間を、それぞれ電気的に接続する。
なお、この工程において、保護素子７も基板２に実装することができる。 The light emitting element mounting step S12 is a step of mounting the first light emitting element 1a and the second light emitting element 1b on the substrate 2 as shown in FIG. 5B. In this step, first, the first light emitting element 1a and the second light emitting element 1b are placed on the upper surface of the substrate 2 at predetermined positions in the first region 2a and the second region 2b, respectively, by using a conductive material such as solder or die-bonding resin. Bonding is performed using an insulating bonding member. After all the first light emitting elements 1a and the second light emitting elements 1b are bonded to the substrate 2, in the manufacturing method of the first embodiment, the wires 8 are used to connect the first light emitting element 1a and the second light emitting element 1b to each other. The 1 light emitting element 1a and the wiring portion 22b of the first wiring 22 and the wiring portion 23b of the second wiring 23 are electrically connected to each other.
In this step, the protection element 7 can also be mounted on the substrate 2.

枠体形成工程Ｓ１３は、第１部材３を形成する第１部材形成工程Ｓ１３１と、第２部材４を形成する第２部材形成工程Ｓ１３２とが含まれる。第１部材３及び第２部材４は、熱硬化性樹脂を用いて形成することが好ましい。熱硬化性樹脂を用いることで、金型を用いることなく、所望の形状の枠体を描画等により簡便に形成することができる。
以下、熱硬化性樹脂を用いた第１部材３及び第２部材４の形成方法について説明する。 The frame body forming step S13 includes a first member forming step S131 for forming the first member 3 and a second member forming step S132 for forming the second member 4. The first member 3 and the second member 4 are preferably formed by using a thermosetting resin. By using the thermosetting resin, a frame body having a desired shape can be easily formed by drawing or the like without using a mold.
Hereinafter, a method of forming the first member 3 and the second member 4 using the thermosetting resin will be described.

まず、第１部材形成工程Ｓ１３１において、図５Ｃに示すように、第１部材３を形成する。この工程において、まず、ディスペンサ９１を用いて、第１発光素子１ａ及び第２発光素子１ｂを囲むように、好ましくは遮光性物質を含有する液状の樹脂材料を供給する。このとき用いられる液状の樹脂材料は、第１部材３の高さが第１発光素子１ａの高さよりも高く形成できるように、且つ、円弧状に設けられた配線を被覆可能な幅で形成できるように、所望の粘度に調整されている。その後、加熱処理を施して樹脂材料を硬化させることで、第１部材３が形成される。
なお、液状の樹脂材料の粘度は、当該樹脂材料に用いられる溶剤量や適宜なフィラーの添加量によって調整することができる。液状の樹脂材料の粘度を調整する方法は、後記する第２部材４、第１封止部材５ａ及び第２封止部材５ｂの形成においても同様である。 First, in the first member forming step S131, as shown in FIG. 5C, the first member 3 is formed. In this step, first, a dispenser 91 is used to supply a liquid resin material preferably containing a light-shielding substance so as to surround the first light emitting element 1a and the second light emitting element 1b. The liquid resin material used at this time can be formed such that the height of the first member 3 can be formed higher than the height of the first light emitting element 1a and the wiring provided in the arc shape can be covered. Thus, the viscosity is adjusted to a desired value. Then, the first member 3 is formed by applying heat treatment to cure the resin material.
The viscosity of the liquid resin material can be adjusted by the amount of solvent used in the resin material and the amount of an appropriate filler added. The method of adjusting the viscosity of the liquid resin material is the same in the formation of the second member 4, the first sealing member 5a, and the second sealing member 5b described later.

次に、第２部材形成工程Ｓ１３２において、図５Ｄに示すように、第２部材４を形成する。第１実施形態の製造方法では、第１層４１、第２層４２及び第３層４３を順次に積層することで、第１部材３の高さよりも高い第２部材４を形成する。
まず、ディスペンサ９２を用いて、第１部材３で囲まれた領域内の第１発光素子１ａと第２発光素子１ｂとの間に、好ましくは遮光性物質を含有する液状の樹脂材料を直線状に供給する。このとき、液状の樹脂は、その両端部が第１部材３と接するように、且つ、その上端が第１部材３の上端以下の高さとなるように設けることが好ましい。その後、加熱処理を施して樹脂材料を硬化させることで、最下層の第１層４１を形成する。
次に、ディスペンサ９２を用いて、第１層４１の上に、透光性を有する液状の樹脂材料を、直線状に、且つ、その両端部が第１部材３と離間するように（すなわち、第１層４１よりも延伸方向の長さが短くなるように）供給し、加熱処理を施すことで、第２層４２を形成する。更に、第２層４２と同じ樹脂材料を用いて、同様にして、第２層４２上に第２層４２よりも長さが短い第３層４３を形成することで、透光性領域を形成する。
なお、第１層４１、第２層４２及び第３層４３に施す加熱処理は、熱硬化性樹脂を仮硬化させる条件で行うようにし、第３層４３を積層後に、熱硬化性樹脂を本硬化させる条件で加熱処理を施すようにしてもよい。これによって、第１層４１、第２層４２及び第３層４３を強固に接合させることができる。 Next, in the second member forming step S132, the second member 4 is formed as shown in FIG. 5D. In the manufacturing method of the first embodiment, the first layer 41, the second layer 42, and the third layer 43 are sequentially laminated to form the second member 4 that is higher than the height of the first member 3.
First, using the dispenser 92, a liquid resin material containing a light-shielding substance is preferably linearly formed between the first light emitting element 1a and the second light emitting element 1b in the region surrounded by the first member 3. Supply to. At this time, it is preferable that the liquid resin is provided so that both ends thereof are in contact with the first member 3 and that the upper end thereof has a height equal to or lower than the upper end of the first member 3. Then, heat treatment is performed to cure the resin material, thereby forming the lowermost first layer 41.
Next, using the dispenser 92, a liquid resin material having a light-transmitting property is linearly formed on the first layer 41 so that both ends thereof are separated from the first member 3 (that is, The second layer 42 is formed by supplying it so that the length in the stretching direction is shorter than that of the first layer 41 and performing heat treatment. Further, the same resin material as that for the second layer 42 is used, and in the same manner, a third layer 43 having a shorter length than the second layer 42 is formed on the second layer 42, thereby forming a translucent region. To do.
The heat treatment applied to the first layer 41, the second layer 42, and the third layer 43 is performed under the condition that the thermosetting resin is temporarily cured, and after the third layer 43 is laminated, the thermosetting resin is applied to the main layer. You may make it heat-process on the conditions which harden. Thereby, the 1st layer 41, the 2nd layer 42, and the 3rd layer 43 can be joined firmly.

なお、第２部材４を形成するための液状の樹脂材料の粘度を、第１部材３を形成するための液状の樹脂材料の粘度よりも高くなるように調整することで、第２部材４を１層構成で第１部材３よりも高く形成することもできる。   The second member 4 is adjusted by adjusting the viscosity of the liquid resin material for forming the second member 4 to be higher than the viscosity of the liquid resin material for forming the first member 3. It can be formed higher than the first member 3 in a one-layer structure.

また、第１部材形成工程Ｓ１３１と、第２部材形成工程Ｓ１３２とは、何れを先に行ってもよいが、高さの低い第１部材３を先に形成することが好ましい。高さの高い第２部材４を先に形成すると、第１部材３を形成するための樹脂材料を供給するディスペンサ９１のノズルの移動の際に、ディスペンサ９２のノズルと当該第２部材４とが干渉する不具合が生じることがある。第１部材形成工程Ｓ１３１を先に行うことで、このような不具合を回避することができる。
また、第１部材３と第２部材４の第１層４１とを、遮光性物質を含有する同じ材料を用いて同時に形成し、その後に、透光性を有する材料を用いて第２部材４の第２層４２及び第３層４３（透光性領域）を形成するようにしてもよい。これにより、第１部材３と第２部材４とを効率的に形成することができる。 Further, either of the first member forming step S131 and the second member forming step S132 may be performed first, but it is preferable to form the first member 3 having a low height first. If the second member 4 having a high height is formed first, when the nozzle of the dispenser 91 that supplies the resin material for forming the first member 3 moves, the nozzle of the dispenser 92 and the second member 4 concerned. Interfering problems may occur. By performing the first member forming step S131 first, such a problem can be avoided.
In addition, the first member 3 and the first layer 41 of the second member 4 are simultaneously formed using the same material containing a light-shielding substance, and then the second member 4 is formed using a material having a light-transmitting property. The second layer 42 and the third layer 43 (translucent region) may be formed. Thereby, the 1st member 3 and the 2nd member 4 can be formed efficiently.

次に、封止部材形成工程Ｓ１４において、封止部材５を形成する。封止部材形成工程Ｓ１４には、第１封止部材５ａを形成する第１封止部材形成工程Ｓ１４１と、第２封止部材５ｂを形成する第２封止部材形成工程Ｓ１４２とが含まれる。第１封止部材５ａ及び第２封止部材５ｂは、第１部材３及び第２部材４の高さやパターンを適宜変更し、第１部材３と第２部材の間に透光性樹脂を充填することで、所望の形状に形成することができる。従って、金型を用いる成形等に比べ、形状の変更がし易く、比較的簡便に所望の凸形状の導光部材６を形成可能である。例えば、高さが高い第２部材４を形成すれば、単に第１部材の内側に透光性樹脂等を充填して封止部材を形成した場合に比べて、容易に高い凸形状の導光部材６を形成できる。従って、より集光効果が高く、色ムラや輝度ムラが低減可能な発光装置を形成することができる。
以下、熱硬化性樹脂を用いた第１封止部材５ａ及び第２封止部材５ｂの形成方法について説明する。 Next, in the sealing member forming step S14, the sealing member 5 is formed. The sealing member forming step S14 includes a first sealing member forming step S141 for forming the first sealing member 5a and a second sealing member forming step S142 for forming the second sealing member 5b. For the first sealing member 5a and the second sealing member 5b, the heights and patterns of the first member 3 and the second member 4 are appropriately changed, and a translucent resin is filled between the first member 3 and the second member. By doing so, a desired shape can be formed. Therefore, the shape of the light guide member 6 can be easily changed, and the desired light guide member 6 having a desired convex shape can be formed relatively easily as compared with molding using a mold. For example, when the second member 4 having a high height is formed, the light guide having a high convex shape can be easily formed as compared with the case where the inside of the first member is simply filled with a transparent resin or the like to form the sealing member. The member 6 can be formed. Therefore, it is possible to form a light emitting device that has a higher light-collecting effect and can reduce color unevenness and brightness unevenness.
Hereinafter, a method of forming the first sealing member 5a and the second sealing member 5b using the thermosetting resin will be described.

第１実施形態の製造方法では、まず、第１封止部材形成工程Ｓ１４１において、図５Ｅに示すように、第１部材３と第２部材４とで囲まれた右側の領域である第１領域２ａに第１封止部材５ａを形成することで、第１発光素子１ａ及び第１領域２ａ内に配線されているワイヤ８を封止する。   In the manufacturing method of the first embodiment, first, in the first sealing member forming step S141, as shown in FIG. 5E, a first region which is a right region surrounded by the first member 3 and the second member 4 is formed. By forming the first sealing member 5a on 2a, the wire 8 wired in the first light emitting element 1a and the first region 2a is sealed.

この工程では、まず、ディスペンサ９３を用いて、第１領域２ａ内に未硬化、すなわち液状の樹脂材料を充填する。このとき用いられる液状の樹脂材料は、必要に応じて波長変換物質の粒子を含有し、適度な粘度に調整されている。ここで、適度な粘度とは、第１部材３の頂部３ａ及び第２部材４の頂部４ａが露出し、かつ、頂部３ａ，４ａの近傍まで樹脂材料を供給した際に、第１部材３と第２部材４とで挟まれた領域内で、第１部材３側から第２部材４側に向かって高くなる傾斜面又は凹曲面を形成可能な粘度である。また、第１部材３と第２部材４との間の距離に応じて、適度な粘度が定められる。
その後、波長変換物質の粒子を含有する場合は、好ましくは当該粒子が沈降するのを待ってから、加熱処理を施して樹脂材料を硬化させることで、第１封止部材５ａが形成される。 In this step, first, the dispenser 93 is used to fill the first region 2a with an uncured, ie, liquid resin material. The liquid resin material used at this time contains particles of the wavelength conversion substance as necessary and is adjusted to have an appropriate viscosity. Here, the appropriate viscosity means that when the top 3a of the first member 3 and the top 4a of the second member 4 are exposed and the resin material is supplied to the vicinity of the tops 3a, 4a, The viscosity is such that an inclined surface or a concave curved surface that becomes higher from the first member 3 side toward the second member 4 side can be formed in the region sandwiched by the second member 4. Moreover, an appropriate viscosity is determined according to the distance between the first member 3 and the second member 4.
After that, when the particles of the wavelength conversion substance are contained, it is preferable to wait for the particles to settle, and then perform a heat treatment to cure the resin material, thereby forming the first sealing member 5a.

次に、第２封止部材形成工程Ｓ１４２において、図５Ｆに示すように、第２部材４の内側の領域である第２領域２ｂに、第２封止部材５ｂを形成することで、第２発光素子１ｂ及び第２領域２ｂ内に配線されているワイヤ８を封止する。
この工程では、まず、ディスペンサ９４を用いて、第２領域２ｂ内に液状の樹脂材料を充填する。このとき用いられる液状の樹脂材料は、必要に応じて波長変換物質の粒子を含有し、第１封止部材５ａと同様に適度な粘度に調整されている。
その後に、波長変換物質の粒子を含有する場合は、好ましくは当該粒子が沈降するのを待ってから、加熱処理を施して樹脂材料を硬化させることで、第２封止部材５ｂが形成される。 Next, in the second sealing member forming step S142, as shown in FIG. 5F, by forming the second sealing member 5b in the second region 2b which is the region inside the second member 4, the second sealing member 5b is formed. The wire 8 wired in the light emitting element 1b and the second region 2b is sealed.
In this step, first, the dispenser 94 is used to fill the second region 2b with a liquid resin material. The liquid resin material used at this time contains particles of a wavelength conversion substance as needed, and is adjusted to have an appropriate viscosity like the first sealing member 5a.
After that, when the particles of the wavelength conversion substance are contained, it is preferable to wait for the particles to settle, and then perform the heat treatment to cure the resin material to form the second sealing member 5b. .

なお、第１封止部材形成工程Ｓ１４１と第２封止部材形成工程Ｓ１４２とは、何れを先に行ってもよく、同時に行うようにしてもよい。
また、第１部材形成工程Ｓ１３１、第２部材形成工程Ｓ１３２、第１封止部材形成工程Ｓ１４１及び第２封止部材形成工程Ｓ１４２において、それぞれ第１部材３、第２部材４、第１封止部材５ａ及び第２封止部材５ｂを形成する熱硬化性樹脂を仮硬化させておき、これらの部材が全て形成されてから熱硬化性樹脂を本硬化させるための加熱処理を施すようにしてもよい。これによって、これらの部材を強固に接合させることができる。
以上のように、第１部材３及び第２部材４の形状やパターンを適宜変更することで、所望の凸形状の導光部材６を形成することができるので、出射光の色ムラや輝度ムラが低減可能な発光装置１００を比較的簡便に製造することができる。 Note that either the first sealing member forming step S141 or the second sealing member forming step S142 may be performed first, or may be performed simultaneously.
In the first member forming step S131, the second member forming step S132, the first sealing member forming step S141, and the second sealing member forming step S142, the first member 3, the second member 4, and the first sealing, respectively. Even if the thermosetting resin forming the member 5a and the second sealing member 5b is pre-cured and the heat treatment for main curing the thermosetting resin is performed after all these members are formed. Good. Thereby, these members can be firmly joined.
As described above, the light guide member 6 having a desired convex shape can be formed by appropriately changing the shapes and patterns of the first member 3 and the second member 4, so that the color unevenness and the brightness unevenness of the emitted light can be formed. It is possible to manufacture the light emitting device 100 capable of reducing the light emission relatively easily.

＜第２実施形態＞
次に、第２実施形態に係る発光装置について、図６Ａ及び図６Ｂを参照して説明する。
なお、図６Ａの平面図では、基板２の基体２１と、第１部材３及び第２部材４Ａと、封止部材５Ａとを示し、他の部材は記載を省略している。第１発光素子１ａ及び第２発光素子１ｂは、それぞれ第２実施形態における第１領域２ａ及び第２領域２ｂに配置されるものとする。
後記する第３実施形態から第６実施形態に係る発光装置の構成を示す平面図である図７Ａ、図８Ａ、図９Ａ及び図１０Ａについても、図６Ａ及び図６Ｂと同様の態様で図示する。 <Second Embodiment>
Next, the light emitting device according to the second embodiment will be described with reference to FIGS. 6A and 6B.
In the plan view of FIG. 6A, the base 21 of the substrate 2, the first member 3 and the second member 4A, and the sealing member 5A are shown, and the other members are omitted. The 1st light emitting element 1a and the 2nd light emitting element 1b shall be arrange | positioned at the 1st area | region 2a and 2nd area | region 2b in 2nd Embodiment, respectively.
7A, 8A, 9A, and 10A, which are plan views showing the configurations of the light emitting devices according to the third to sixth embodiments, which will be described later, are also illustrated in the same manner as in FIGS. 6A and 6B.

第２実施形態に係る発光装置１００Ａは、平面視において、基板２の上面に円環状に設けられた第１部材３で囲まれた領域が、直線状の２つの第２部材４Ａによって３つの領域に区画されている。２つの第２部材４Ａは、互いに略平行に延伸するように配置されている。第２実施形態に係る発光装置１００Ａでは、図６Ａにおいて、左側の領域と右側の領域とを第１領域２ａとし、中央の領域を第２領域２ｂとする。左右の２つの領域に分かれている第１領域２ａには、それぞれ１つ以上の第１発光素子１ａが配置され、第１発光素子１ａは、それぞれ第１封止部材５Ａａによって封止されている。
また、中央の第２領域２ｂには、１つ以上の第２発光素子１ｂが配置され、第２発光素子１ｂは、それぞれ第２封止部材５Ａｂによって封止されている。 In the light emitting device 100A according to the second embodiment, in a plan view, a region surrounded by the first member 3 annularly provided on the upper surface of the substrate 2 has three regions by the two linear second members 4A. It is divided into The two second members 4A are arranged so as to extend substantially parallel to each other. In the light emitting device 100A according to the second embodiment, in FIG. 6A, the left side region and the right side region are referred to as a first region 2a, and the central region is referred to as a second region 2b. One or more first light emitting elements 1a are arranged in each of the first areas 2a which are divided into two left and right areas, and each of the first light emitting elements 1a is sealed by a first sealing member 5Aa. .
Further, one or more second light emitting elements 1b are arranged in the second region 2b at the center, and the second light emitting elements 1b are each sealed by the second sealing member 5Ab.

また、発光装置１００Ａの第２部材４Ａは、図６Ｂに示すように、遮光性の第１層４１と透光性の第２層４２とが積層された２層構造を有しており、第２層４２が設けられている中央部が両端部よりも高くなっている。
第１封止部材５Ａａは、２つの第１領域２ａのそれぞれに設けられており、第１部材３側の高さよりも第２部材４Ａ側の高さの方が高くなるように設けられている。本実施形態の発光装置１００Ａは、第１部材３及び第２部材４Ａからなる枠体が、図６Ａに示すように、平面視で左右対称になるように配置されている。図６Ｂに示す断面において、第２部材４Ａ間に設けられている第２封止部材５Ａｂは、中央部が両端部よりも高くなるように、すなわち、凸形状に設けられている。従って、２つの第１封止部材５Ａａ、第２封止部材５Ａｂ及び２つの第２部材４Ａの透光性領域である第２層４２は、１つの凸形状の導光部材６Ａを構成している。 Further, as shown in FIG. 6B, the second member 4A of the light emitting device 100A has a two-layer structure in which the first layer 41 having a light shielding property and the second layer 42 having a light transmitting property are stacked. The central portion where the two layers 42 are provided is higher than both end portions.
The first sealing member 5Aa is provided in each of the two first regions 2a, and is provided such that the height on the second member 4A side is higher than the height on the first member 3 side. . In the light emitting device 100A of the present embodiment, the frame body including the first member 3 and the second member 4A is arranged so as to be bilaterally symmetrical in a plan view, as shown in FIG. 6A. In the cross section shown in FIG. 6B, the second sealing member 5Ab provided between the second members 4A is provided such that the central portion is higher than both end portions, that is, the convex shape. Therefore, the two first sealing members 5Aa, the second sealing members 5Ab, and the second layer 42 that is a light-transmitting region of the two second members 4A form one convex light guide member 6A. There is.

なお、第２領域２ｂにおいて、凸形状の第２封止部材５Ａｂに代えて、図６Ｂにおいて破線で示した凹形状の第２封止部材５Ａｘを設けるようにしてもよい。この場合は、導光部材６Ａは、中央部が凹んだ凸形状となるが、導光部材６Ａの上面からの出射光を混光し易くすることが可能である。   In addition, in the 2nd area | region 2b, it may be made to replace with the convex-shaped 2nd sealing member 5Ab and to provide the concave-shaped 2nd sealing member 5Ax shown with the broken line in FIG. 6B. In this case, the light guide member 6A has a convex shape with a depressed central portion, but it is possible to easily mix the light emitted from the upper surface of the light guide member 6A.

第２実施形態に係る発光装置１００Ａは、２つの第１封止部材５Ａａ、第２封止部材５Ａｂ及び２つの第２部材４Ａの透光性領域である第２層４２から構成される導光部材６Ａが凸形状であることで、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とが導光部材６Ａ内で伝播し、混光される。そして、導光部材６Ａ内を伝播する光は、光取り出し面である導光部材６Ａの上面から外部に取り出される。更に、外部に取り出された光は、導光部材６Ａが凸形状であることで、その光軸方向、すなわち第２実施形態では、第２封止部材５Ａｂの頂部を通る軸方向に集光される。従って、出射光の色ムラや輝度ムラが低減された発光装置１００Ａを提供することができる。   The light emitting device 100A according to the second embodiment includes two first sealing members 5Aa, two second sealing members 5Ab, and two second members 4A, which are light-transmissive regions and a second layer 42 that is a light guide region. Since the member 6A has a convex shape, light originating from the first light emitting element 1a and light originating from the second light emitting element 1b propagate in the light guide member 6A and are mixed. The light propagating in the light guide member 6A is extracted to the outside from the upper surface of the light guide member 6A, which is the light extraction surface. Further, since the light guide member 6A has a convex shape, the light extracted to the outside is condensed in the optical axis direction thereof, that is, in the axial direction passing through the top of the second sealing member 5Ab in the second embodiment. It Therefore, it is possible to provide the light emitting device 100A in which the color unevenness and the brightness unevenness of the emitted light are reduced.

第２実施形態に係る発光装置１００Ａは、第２部材４Ａ及び第２封止部材５Ａｂを、それぞれ２つずつ備えること以外は、第１実施形態に係る発光装置１００と同様である。従って、第１実施形態の製造方法と同様にして、対応する各部材を形成することで第２実施形態に係る発光装置１００Ａを製造することができるため、詳細な説明は省略する。   The light emitting device 100A according to the second embodiment is the same as the light emitting device 100 according to the first embodiment except that two second members 4A and two second sealing members 5Ab are provided. Therefore, the light emitting device 100A according to the second embodiment can be manufactured by forming corresponding members in the same manner as in the manufacturing method of the first embodiment, and thus detailed description thereof will be omitted.

＜第３実施形態＞
次に、第３実施形態に係る発光装置について、図７Ａ及び図７Ｂを参照して説明する。
第３実施形態に係る発光装置１００Ｂでは、平面視において、基板２の上面に円環状に設けられた第１部材３で囲まれた領域が、互いに異なる方向に延伸し、一点で交差する複数の第２部材４Ｂによって、複数の領域に区画されている。第３実施形態では、直線状の２つの第２部材４Ｂが互いに直交することで、第１部材３で囲まれた領域が４つの領域に区画されている。従って、第３実施形態において区画された４つの領域は、何れも、平面視で中心角が９０°の扇形である。第３実施形態に係る発光装置１００Ｂは、平面視で、２つの第２部材４Ｂの交点である中心点周りに、交互に第１領域２ａと第２領域２ｂとが配置されている。
なお、２つの第２部材４Ｂの交わる角度は、９０°に限らず、扇形の中心角が異なる複数の領域に区画するようにしてもよい。 <Third Embodiment>
Next, a light emitting device according to the third embodiment will be described with reference to FIGS. 7A and 7B.
In the light emitting device 100B according to the third embodiment, in plan view, regions surrounded by the first member 3 provided in an annular shape on the upper surface of the substrate 2 extend in different directions and intersect at a single point. It is divided into a plurality of regions by the second member 4B. In the third embodiment, the two linear second members 4B are orthogonal to each other, whereby the region surrounded by the first member 3 is divided into four regions. Therefore, each of the four areas partitioned in the third embodiment is a fan shape having a central angle of 90 ° in plan view. In the light emitting device 100B according to the third embodiment, the first regions 2a and the second regions 2b are alternately arranged around the center point that is the intersection of the two second members 4B in plan view.
Note that the angle at which the two second members 4B intersect is not limited to 90 °, and may be divided into a plurality of regions having different fan-shaped central angles.

２つの第１領域２ａには、それぞれ１つ以上の第１発光素子１ａが配置され、第１発光素子１ａは、それぞれ第１封止部材５Ｂａによって封止されている。また、２つの第２領域２ｂには、それぞれ１つ以上の第２発光素子１ｂが配置され、第２発光素子１ｂは、それぞれ第２封止部材５Ｂｂによって封止されている。
第２部材４Ｂは、第１実施形態の第２部材４と同様に、遮光性の第１層４１と、透光性の第２層４２及び第３層４３とが積層された３層構造を有している。また、２つの第２部材４Ｂは、それぞれ両端部が第１部材３と接しており、両端部よりも中央部が高くなるように設けられている。
また、２つの第１封止部材５Ｂａ、２つの第２封止部材５Ｂｂ及び２つの第２部材４Ｂの透光性領域である第２層４２及び第３層４３は、１つの凸形状の導光部材６Ｂを構成している。これにより、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とが導光部材６Ｂ内を伝播し、混光される。更に、導光部材６Ｂが凸形状であることで、導光部材６Ｂの外部に取り出された光は、その光軸方向、すなわち第３実施形態では、第２部材４Ｂ同士の交差点を通る軸方向に集光される。従って、出射光の色ムラや輝度ムラが低減された発光装置１００Ｂを提供することができる。 One or more first light emitting elements 1a are arranged in each of the two first regions 2a, and each of the first light emitting elements 1a is sealed by the first sealing member 5Ba. Further, one or more second light emitting elements 1b are arranged in each of the two second regions 2b, and each of the second light emitting elements 1b is sealed by the second sealing member 5Bb.
Similarly to the second member 4 of the first embodiment, the second member 4B has a three-layer structure in which a light-shielding first layer 41 and a light-transmitting second layer 42 and a third layer 43 are stacked. Have Both ends of each of the two second members 4B are in contact with the first member 3, and the central portion is higher than both ends.
In addition, the second layer 42 and the third layer 43, which are the light-transmitting regions of the two first sealing members 5Ba, the two second sealing members 5Bb, and the two second members 4B, have one convex shape. It constitutes the optical member 6B. Thereby, the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b propagate in the light guide member 6B and are mixed. Further, since the light guide member 6B has a convex shape, the light extracted to the outside of the light guide member 6B is in the optical axis direction thereof, that is, in the third embodiment, the axial direction passing through the intersection of the second members 4B. Is focused on. Therefore, it is possible to provide the light emitting device 100B in which the color unevenness and the brightness unevenness of the emitted light are reduced.

第２実施形態のように、直線状の２つの第２部材４Ａ同士を離間させて互いに平行に配置する場合に比べて、直線状の２つの第２部材４Ｂを互いに交差するように配置することで、第１部材３で囲まれた領域内を、より多くの領域に区画することができる。
なお、第１領域２ａと第２領域２ｂとは、中心点周りに交互に配置することに限定されないが、交互に配置することにより、対称性が高くなるため、発光装置１００Ｂの出射光の色ムラや輝度ムラをより低減することができる。 As compared to the case where the two linear second members 4A are spaced apart from each other and arranged in parallel to each other as in the second embodiment, the two linear second members 4B are arranged to intersect each other. Thus, the area surrounded by the first member 3 can be divided into more areas.
Note that the first region 2a and the second region 2b are not limited to being alternately arranged around the center point, but by alternately arranging them, the symmetry becomes high, and thus the color of the emitted light of the light emitting device 100B is increased. It is possible to further reduce unevenness and uneven brightness.

第３実施形態に係る発光装置１００Ｂは、第２部材４Ｂ、第１封止部材５Ｂａ、第２封止部材５Ｂｂが、それぞれ２つずつ備えること以外は、第１実施形態に係る発光装置１００と同様である。従って、第１実施形態の製造方法と同様にして、対応する各部材を形成することで第３実施形態に係る発光装置１００Ｂを製造することができるため、詳細な説明は省略する。
なお、第２部材形成工程Ｓ１３２において、２つの第２部材４Ａの交点では、２つの第２部材４Ａを形成するための樹脂材料が重なるように設けてもよいが、交点における樹脂材料の重複を避けて、十字状に樹脂材料を配置するようにしてもよい。 The light emitting device 100B according to the third embodiment is the same as the light emitting device 100 according to the first embodiment except that two second members 4B, two first sealing members 5Ba, and two second sealing members 5Bb are provided. It is the same. Therefore, the light emitting device 100B according to the third embodiment can be manufactured by forming corresponding members in the same manner as in the manufacturing method of the first embodiment, and thus detailed description thereof will be omitted.
In addition, in the second member forming step S132, the resin materials for forming the two second members 4A may be provided so as to overlap each other at the intersection of the two second members 4A. Alternatively, the resin material may be arranged in a cross shape.

＜第４実施形態＞
次に、第４実施形態に係る発光装置について、図８Ａ及び図８Ｂを参照して説明する。
第４実施形態に係る発光装置１００Ｃは、平面視において、基板２の上面に円環状に設けられた第１部材３で囲まれた領域内に、楕円環状の第２部材４Ｃが設けられている。第２部材４Ｃは、平面視における外形形状である楕円の長軸の両端部が、それぞれ第１部材３と接するように設けられており、第１部材３で囲まれた領域が３つの領域に区画されている。 <Fourth Embodiment>
Next, a light emitting device according to the fourth embodiment will be described with reference to FIGS. 8A and 8B.
In a light emitting device 100C according to the fourth embodiment, an elliptical annular second member 4C is provided in a region surrounded by the first member 3 provided in an annular shape on the upper surface of the substrate 2 in a plan view. . The second member 4C is provided such that both ends of the major axis of the ellipse, which is the outer shape in plan view, are in contact with the first member 3, respectively, and the region surrounded by the first member 3 is divided into three regions. It is partitioned.

本実施形態では、楕円環状に配置された第２部材４Ｃの内部を第２領域２ｂとし、第１部材３と第２部材４Ｃとで囲まれた２つの領域を第１領域２ａとしている。
２つの第１領域２ａには、それぞれ１つ以上の第１発光素子１ａが配置され、第１発光素子１ａは、それぞれ第１封止部材５Ｃａによって封止されている。また、第２領域２ｂには、１つ以上の第２発光素子１ｂが配置され、第２発光素子１ｂは、第２封止部材５Ｃｂによって封止されている。 In the present embodiment, the inside of the second member 4C arranged in an elliptic ring is defined as the second region 2b, and the two regions surrounded by the first member 3 and the second member 4C are defined as the first region 2a.
One or more first light emitting elements 1a are arranged in each of the two first regions 2a, and each of the first light emitting elements 1a is sealed by the first sealing member 5Ca. Further, at least one second light emitting element 1b is arranged in the second region 2b, and the second light emitting element 1b is sealed by the second sealing member 5Cb.

第２部材４Ｃは、第２実施形態の第２部材４Ａと同様に、遮光性の第１層４１と、透光性の第２層４２とが積層された２層構造を有しており、第１部材３よりも高くなるように設けられている。第２部材４Ｃは、第１部材３で囲まれた領域の中心に近いほど高くなるように、第２層４２を第１部材３で囲まれた領域の中心に近い領域のみに配置するようにしてもよい。また、第２部材４Ｃを、３層以上の積層構造とし、第１部材３で囲まれた領域の中心に近い領域ほど積層数を増加させて高さを変えるようにしてもよい。   Like the second member 4A of the second embodiment, the second member 4C has a two-layer structure in which a light-shielding first layer 41 and a light-transmitting second layer 42 are laminated, It is provided so as to be higher than the first member 3. The second member 4C is arranged such that the second layer 42 is arranged only in a region close to the center of the region surrounded by the first member 3 so that the second member 4C becomes higher as it approaches the center of the region surrounded by the first member 3. May be. Alternatively, the second member 4C may have a laminated structure of three or more layers, and the height may be changed by increasing the number of laminated layers closer to the center of the area surrounded by the first member 3.

第１封止部材５Ｃａは、２つの第１領域２ａのそれぞれに設けられており、第１部材３側の高さよりも第２部材４Ｃ側の高さの方が高くなるように設けられている。本実施形態の発光装置１００Ｃは、第１部材３及び第２部材４Ｃからなる枠体が、図８Ａに示すように、平面視で左右対称になるように配置されている。図８Ｂに示す断面において、第２部材４Ｃ間に設けられている第２封止部材５Ｃｂは、中央部が両端部よりも高くなるように、すなわち、凸形状に設けられている。
従って、２つの第１封止部材５Ｃａ、第２封止部材５Ｃｂ及び第２部材４Ｃの透光性領域である第２層４２は、１つの凸形状の導光部材６Ｃを構成している。 The first sealing member 5Ca is provided in each of the two first regions 2a, and is provided such that the height on the second member 4C side is higher than the height on the first member 3 side. . In the light emitting device 100C of the present embodiment, the frame body including the first member 3 and the second member 4C is arranged so as to be bilaterally symmetrical in a plan view, as shown in FIG. 8A. In the cross section shown in FIG. 8B, the second sealing member 5Cb provided between the second members 4C is provided so that the central portion is higher than both end portions, that is, the convex shape.
Therefore, the 2nd layer 42 which is a translucent area | region of the two 1st sealing member 5Ca, the 2nd sealing member 5Cb, and the 2nd member 4C comprises one convex light guide member 6C.

なお、第２領域２ｂにおいて、凸形状の第２封止部材５Ｃｂに代えて、図８Ｂにおいて破線で示した凹形状の第２封止部材５Ｃｘを設けるようにしてもよい。この場合は、導光部材６Ｃは、中央部が凹んだ凸形状となるが、導光部材６Ｃの上面からの出射光を混光し易くすることが可能である。
また、発光装置１００Ｃは、第２部材４Ｃを楕円環状とすることにより、第２実施形態に係る発光装置１００Ａよりも、第２封止部材５Ｃｂの頂部の領域を小さく形成することが可能である。従って、導光部材６Ｃの集光効果を高めることができ、発光装置１００Ｃの色ムラや輝度ムラを低減することが可能である。 In addition, in the 2nd area | region 2b, you may make it provide with the concave-shaped 2nd sealing member 5Cx shown by the broken line in FIG. 8B instead of the convex-shaped 2nd sealing member 5Cb. In this case, the light guide member 6C has a convex shape with a depressed central portion, but it is possible to easily mix the light emitted from the upper surface of the light guide member 6C.
Further, in the light emitting device 100C, by making the second member 4C have an elliptical ring shape, it is possible to form the region of the top of the second sealing member 5Cb smaller than that of the light emitting device 100A according to the second embodiment. . Therefore, it is possible to enhance the light condensing effect of the light guide member 6C, and it is possible to reduce color unevenness and brightness unevenness of the light emitting device 100C.

第４実施形態に係る発光装置１００Ｃは、２つの第１封止部材５Ｃａ、第２封止部材５Ｃｂ及び第２部材４Ｃの透光性領域である第２層４２から構成される導光部材６Ｃが凸形状であることで、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とが導光部材６Ｃ内を伝播し、混光される。更に、導光部材６Ｃが凸形状であることで、導光部材６Ｃの外部に取り出された光は、導光部材６Ｃの光軸方向、すなわち第４実施形態では、第２封止部材５Ｃｂの頂部を通る軸方向に集光される。従って、出射光の色ムラや輝度ムラが低減された発光装置１００Ｃを提供することができる。   The light emitting device 100C according to the fourth embodiment is a light guide member 6C including two first sealing members 5Ca, a second sealing member 5Cb, and a second layer 42 that is a translucent region of the second member 4C. With the convex shape, the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b propagate in the light guide member 6C and are mixed. Further, since the light guide member 6C has a convex shape, the light extracted to the outside of the light guide member 6C is directed in the optical axis direction of the light guide member 6C, that is, in the fourth embodiment, the light of the second sealing member 5Cb. It is focused axially through the top. Therefore, it is possible to provide the light emitting device 100C in which the color unevenness and the brightness unevenness of the emitted light are reduced.

第４実施形態に係る発光装置１００Ｃは、第２部材４Ｃが楕円環状に設けられ、第２封止部材５Ｃｂを２つ備えること以外は、第１実施形態に係る発光装置１００と同様である。従って、第１実施形態の製造方法と同様にして、対応する各部材を形成することで第４実施形態に係る発光装置１００Ｃを製造することができるため、詳細な説明は省略する。   The light emitting device 100C according to the fourth embodiment is the same as the light emitting device 100 according to the first embodiment except that the second member 4C is provided in an elliptical ring shape and includes two second sealing members 5Cb. Therefore, the light emitting device 100C according to the fourth embodiment can be manufactured by forming corresponding members in the same manner as in the manufacturing method according to the first embodiment, and thus detailed description thereof will be omitted.

＜第５実施形態＞
次に、第５実施形態に係る発光装置について、図９Ａ及び図９Ｂを参照して説明する。
第５実施形態に係る発光装置１００Ｄは、平面視において、基板２の上面に円環状に設けられた第１部材３で囲まれた領域が、直線状の４つの第２部材４Ｄによって、縦方向及び横方向にそれぞれ３分割され、全部で９つの領域に格子状に区画されている。４つの第２部材４Ｄは、２つずつが互いに略平行に配置されている。また、第２部材４Ｄの略平行な２つずつの組同士は、互いに略直交するように配置されている。第５実施形態に係る発光装置１００Ｄでは、図９Ａにおいて、格子状に区画された９つの領域を、市松模様（チェッカーフラグ模様）となるように第１領域２ａと第２領域２ｂとに区画されている。
４つの第１領域２ａには、それぞれ１つ以上の第１発光素子１ａが配置され、第１発光素子１ａは、それぞれ第１封止部材５Ｄａによって封止されている。また、中央に区画されている領域を含む５つの第２領域２ｂには、それぞれ１つ以上の第２発光素子１ｂが配置され、第２発光素子１ｂは、それぞれ第２封止部材５Ｄｂによって封止されている。 <Fifth Embodiment>
Next, a light emitting device according to the fifth embodiment will be described with reference to FIGS. 9A and 9B.
In the light emitting device 100D according to the fifth embodiment, the area surrounded by the first member 3 annularly provided on the upper surface of the substrate 2 in the plan view is formed by the four linear second members 4D in the vertical direction. And laterally divided into three parts, respectively, and divided into a total of nine regions in a grid pattern. Two of the four second members 4D are arranged substantially parallel to each other. In addition, two pairs of the second members 4D that are substantially parallel to each other are arranged so as to be substantially orthogonal to each other. In the light emitting device 100D according to the fifth embodiment, in FIG. 9A, the nine regions partitioned in a grid pattern are partitioned into a first region 2a and a second region 2b in a checkered pattern (checkered flag pattern). ing.
One or more first light emitting elements 1a are arranged in each of the four first regions 2a, and each of the first light emitting elements 1a is sealed by the first sealing member 5Da. Further, one or more second light emitting elements 1b are arranged in each of the five second areas 2b including the area partitioned in the center, and each of the second light emitting elements 1b is sealed by the second sealing member 5Db. It has been stopped.

また、発光装置１００Ｄは、図９Ｂに示すように、第２部材４Ｄが、遮光性の第１層４１と透光性の第２層４２とが積層された２層構造を有しており、第２層４２が設けられている中央部が両端部よりも高くなるように構成されている。
第１封止部材５Ｄａは、４つの第１領域２ａのそれぞれに設けられており、第１部材３と第２部材４Ｄとで挟まれた領域において、第１部材３側の高さよりも第２部材４Ｄ側の高さの方が高くなるように設けられている。
また、第２封止部材５Ｄｂは、中央に区画された領域に設けられているものを除き、第１部材３と第２部材４Ｄとで挟まれた領域において、第１部材３側の高さよりも第２部材４Ｄ側の高さの方が高くなるように設けられている。また、中央に区画された領域に設けられている第２封止部材５Ｄｂは、中央部が周辺部よりも高くなるように、すなわち凸形状に設けられている。
従って、４つの第１封止部材５Ｄａ、５つの第２封止部材５Ｄｂ及び４つの第２部材４Ｄの透光性領域である第２層４２は、１つの凸形状の導光部材６Ｄを構成している。 Further, in the light emitting device 100D, as shown in FIG. 9B, the second member 4D has a two-layer structure in which the first layer 41 having a light shielding property and the second layer 42 having a light transmitting property are laminated, The central portion where the second layer 42 is provided is configured to be higher than both end portions.
The first sealing member 5Da is provided in each of the four first regions 2a, and in the region sandwiched by the first member 3 and the second member 4D, the first sealing member 5Da is second in height from the first member 3 side. The height of the member 4D is higher than that of the member 4D.
In addition, the second sealing member 5Db, except for the one provided in the centrally divided region, is closer to the first member 3 side in the region sandwiched between the first member 3 and the second member 4D. Is also provided such that the height on the second member 4D side is higher. Further, the second sealing member 5Db provided in the region partitioned in the center is provided so that the central portion is higher than the peripheral portion, that is, the convex shape.
Therefore, the 2nd layer 42 which is a translucent area | region of 4 1st sealing members 5Da, 5 2nd sealing members 5Db, and 4 2nd members 4D comprises 1 convex-shaped light guide member 6D. are doing.

なお、中央に区画された第２領域２ｂにおいて、凸形状の第２封止部材５Ｄｂに代えて、図９Ｂにおいて破線で示した凹形状の第２封止部材５Ｄｘを設けるようにしてもよい。この場合は、導光部材６Ｄは、中央部が凹んだ凸形状となるが、導光部材６Ｃの上面からの出射光を混光し易くすることが可能である。   In addition, in the 2nd area | region 2b divided into the center, you may make it provide with the concave-shaped 2nd sealing member 5Dx shown with the broken line in FIG. 9B instead of the convex-shaped 2nd sealing member 5Db. In this case, the light guide member 6D has a convex shape with a depressed central portion, but it is possible to easily mix the light emitted from the upper surface of the light guide member 6C.

第５実施形態に係る発光装置１００Ｄは、第１封止部材５Ｄａ、第２封止部材５Ｄｂ及び第２部材４Ｄの透光性領域である第２層４２から構成される導光部材６Ｄが凸形状であることで、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とが導光部材６Ｄ内を伝播し、混光される。更に、導光部材６Ｄが凸形状であることで、導光部材６Ｄから外部に取り出された光は、導光部材６Ｄの光軸方向、すなわち第５実施形態では、中央に配置された第２封止部材５Ｄｂの頂部を通る軸方向に集光される。従って、出射光の色ムラや輝度ムラが低減された発光装置１００Ｄを提供することができる。   In the light emitting device 100D according to the fifth embodiment, the light guide member 6D configured by the first sealing member 5Da, the second sealing member 5Db, and the second layer 42 that is the translucent region of the second member 4D is convex. Due to the shape, the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b propagate in the light guide member 6D and are mixed. Further, since the light guide member 6D has a convex shape, the light extracted from the light guide member 6D to the outside is in the optical axis direction of the light guide member 6D, that is, in the fifth embodiment, the second light is disposed in the center. The light is focused in the axial direction passing through the top of the sealing member 5Db. Therefore, it is possible to provide the light emitting device 100D in which the color unevenness and the brightness unevenness of the emitted light are reduced.

第５実施形態に係る発光装置１００Ｄは、第２部材４Ｄを４つ、第１封止部材５Ｄａを４つ、第２封止部材５Ｄｂを５つ備えること以外は、第１実施形態に係る発光装置１００と同様である。従って、第１実施形態の製造方法と同様にして、対応する各部材を形成することで第５実施形態に係る発光装置１００Ｄを製造することができるため、詳細な説明は省略する。   The light emitting device 100D according to the fifth embodiment includes the four second members 4D, the four first sealing members 5Da, and the five second sealing members 5Db, except that the light emitting device 100D according to the fifth embodiment emits light. Similar to device 100. Therefore, the light emitting device 100D according to the fifth embodiment can be manufactured by forming corresponding members in the same manner as in the manufacturing method of the first embodiment, and thus detailed description thereof will be omitted.

＜第６実施形態＞
次に、第６実施形態に係る発光装置について、図１０Ａ及び図１０Ｂを参照して説明する。
第６実施形態に係る発光装置１００Ｅは、平面視において、基板２の上面に円環状に設けられた第１部材３で囲まれた領域が、その内側に設けられた第１部材３よりも小さな円環状の第２部材４Ｅによって、２つの領域に区画されている。第６実施形態の第２部材４Ｅは、平面視で第１部材３の円環に内接するように設けられている。 <Sixth Embodiment>
Next, a light emitting device according to the sixth embodiment will be described with reference to FIGS. 10A and 10B.
In the light emitting device 100E according to the sixth embodiment, the area surrounded by the first member 3 annularly provided on the upper surface of the substrate 2 is smaller than the first member 3 provided inside thereof in a plan view. It is divided into two regions by the annular second member 4E. The second member 4E of the sixth embodiment is provided so as to be inscribed in the ring of the first member 3 in a plan view.

本実施形態では、円環状に配置された第２部材４Ｅの内部を第２領域２ｂとし、第１部材３と第２部材４Ｃとで囲まれた領域を第１領域２ａとしている。
第１領域２ａには、１つ以上の第１発光素子１ａが配置され、第１発光素子１ａは、それぞれ第１封止部材５Ｅａによって封止されている。また、第２領域２ｂには、１つ以上の第２発光素子１ｂが配置され、第２発光素子１ｂは、第２封止部材５Ｅｂによって封止されている。 In the present embodiment, the inside of the second member 4E arranged in an annular shape is the second region 2b, and the region surrounded by the first member 3 and the second member 4C is the first region 2a.
One or more first light emitting elements 1a are arranged in the first region 2a, and each of the first light emitting elements 1a is sealed by the first sealing member 5Ea. Further, at least one second light emitting element 1b is arranged in the second region 2b, and the second light emitting element 1b is sealed by the second sealing member 5Eb.

第２部材４Ｅは、遮光性の第１層４１と、透光性の第２層４２とが積層された２層構造を有しており、第１部材３よりも高くなるように設けられている。第２層４２は、第１層４１上に、円環状に積層されている。つまり、第２部材４Ｅは、第１部材３よりも高い一定の高さに設けられている。   The second member 4E has a two-layer structure in which a light-shielding first layer 41 and a light-transmitting second layer 42 are laminated, and is provided so as to be higher than the first member 3. There is. The second layer 42 is laminated on the first layer 41 in an annular shape. That is, the second member 4E is provided at a constant height higher than that of the first member 3.

なお、第２部材４Ｅは、第１部材３で囲まれた領域の中心に近いほど高くなるように、第２層４２を第１部材３で囲まれた領域の中心に近い領域のみに配置するようにしてもよい。また、第２部材４Ｅを、３層以上の積層構造とし、第１部材３で囲まれた領域の中心に近い領域ほど積層数を増加させて高さを変えるようにしてもよい。   It should be noted that the second member 4E arranges the second layer 42 only in a region close to the center of the region surrounded by the first member 3 such that the second member 4E becomes higher as it approaches the center of the region surrounded by the first member 3. You may do it. Alternatively, the second member 4E may have a laminated structure of three or more layers, and the height may be changed by increasing the number of laminated layers in a region closer to the center of the region surrounded by the first member 3.

第１封止部材５Ｅａは、第１領域２ａに設けられており、第１部材３側の高さよりも第２部材４Ｅ側の高さの方が高くなるように設けられている。本実施形態の発光装置１００Ｅは、第１部材３及び第２部材４Ｅからなる枠体が、図１０Ａに示すように、平面視で上下対称になるように配置されている。図１０Ｂに示す断面において、第２領域２ｂに設けられている第２封止部材５Ｅｂは、中央部が両端部よりも高くなるように、すなわち、凸形状に設けられている。
従って、第１封止部材５Ｅａ、第２封止部材５Ｅｂ及び第２部材４Ｅの透光性領域である第２層４２は、１つの凸形状の導光部材６Ｅを構成している。 The first sealing member 5Ea is provided in the first region 2a, and is provided such that the height on the second member 4E side is higher than the height on the first member 3 side. In the light emitting device 100E of the present embodiment, the frame body including the first member 3 and the second member 4E is arranged so as to be vertically symmetrical in plan view as shown in FIG. 10A. In the cross section shown in FIG. 10B, the second sealing member 5Eb provided in the second region 2b is provided such that the central portion is higher than both end portions, that is, the convex shape.
Therefore, the first sealing member 5Ea, the second sealing member 5Eb, and the second layer 42, which is the translucent region of the second member 4E, constitutes one convex light guide member 6E.

なお、第２領域２ｂにおいて、凸形状の第２封止部材５Ｅｂに代えて、図１０Ｂにおいて破線で示した凹形状の第２封止部材５Ｅｘを設けるようにしてもよい。この場合は、導光部材６Ｅは、中央部が凹んだ凸形状となるが、封止部材５Ｃの上面からの出射光を混光し易くすることが可能である。   In addition, in the 2nd area | region 2b, instead of the convex-shaped 2nd sealing member 5Eb, you may make it provide the concave-shaped 2nd sealing member 5Ex shown by the broken line in FIG. 10B. In this case, the light guide member 6E has a convex shape with a depressed central portion, but it is possible to easily mix the light emitted from the upper surface of the sealing member 5C.

第６実施形態に係る発光装置１００Ｅは、第１封止部材５Ｅａ、第２封止部材５Ｅｂ及び第２部材４Ｅの透光性領域である第２層４２から構成される導光部材６Ｅが凸形状であることで、第１発光素子１ａに由来する光と、第２発光素子１ｂに由来する光とが導光部材６Ｅ内を伝播し、混光される。更に、導光部材６Ｅが凸形状であることで、導光部材６Ｅから外部に取り出された光は、導光部材６Ｅの光軸方向、すなわち第６実施形態では、第２封止部材５Ｅｂの頂部を通る軸方向に集光される。従って、出射光の色ムラや輝度ムラが低減された発光装置１００Ｅを提供することができる。   In the light emitting device 100E according to the sixth embodiment, the light guide member 6E including the first sealing member 5Ea, the second sealing member 5Eb, and the second layer 42 that is the light transmissive region of the second member 4E is convex. With the shape, the light originating from the first light emitting element 1a and the light originating from the second light emitting element 1b propagate in the light guide member 6E and are mixed. Furthermore, since the light guide member 6E has a convex shape, the light extracted from the light guide member 6E to the outside is in the optical axis direction of the light guide member 6E, that is, in the sixth embodiment, the light of the second sealing member 5Eb. It is focused axially through the top. Therefore, it is possible to provide the light emitting device 100E in which the color unevenness and the brightness unevenness of the emitted light are reduced.

第６実施形態に係る発光装置１００Ｅは、第２部材４Ｅが円環状に設けられ、１箇所で第１部材３と接すること以外は、第１実施形態に係る発光装置１００と同様である。従って、第１実施形態の製造方法と同様にして、対応する各部材を形成することで第６実施形態に係る発光装置１００Ｅを製造することができるため、詳細な説明は省略する。   The light emitting device 100E according to the sixth embodiment is the same as the light emitting device 100 according to the first embodiment except that the second member 4E is provided in an annular shape and is in contact with the first member 3 at one location. Therefore, the light emitting device 100E according to the sixth embodiment can be manufactured by forming corresponding members in the same manner as in the manufacturing method of the first embodiment, and thus detailed description thereof will be omitted.

（その他の変形例）
第１実施形態〜第６実施形態として、第１部材と第２部材とからなる枠体によって発光領域が複数に区画された発光装置の例を示したが、区画の仕方はこれらに限定されるものではない。例えば、第１部材で囲まれる領域は、円形に限らず、楕円形、矩形、その他の多角形などであってもよい。第２部材は、線状や環状であってもよい。また、線状や環状の第２部材を複数用いたり、形状の異なる複数の第２部材を組み合わせて用いたりして、複数の領域に区画するようにしてもよい。また、３以上の領域に区画する場合は、発光色が異なる３種類以上の領域として用いるようにしてもよい。
また、第２部材は、２層構造又は３層構造に限らず、１層や４層以上であってもよい。 (Other modifications)
As the first to sixth embodiments, examples of the light emitting device in which the light emitting region is divided into a plurality of portions by the frame body including the first member and the second member have been shown, but the dividing method is limited to these. Not a thing. For example, the area surrounded by the first member is not limited to a circle, but may be an ellipse, a rectangle, or another polygon. The second member may be linear or annular. Alternatively, a plurality of linear or annular second members may be used, or a plurality of second members having different shapes may be used in combination to partition the regions into a plurality of regions. Further, in the case of partitioning into three or more regions, they may be used as three or more regions having different emission colors.
The second member is not limited to the two-layer structure or the three-layer structure, and may have one layer or four or more layers.

以上、本発明に係る発光装置及びその製造方法について、発明を実施するための形態により具体的に説明したが、本発明の趣旨はこれらの記載に限定されるものではなく、特許請求の範囲の記載に基づいて広く解釈されなければならない。また、これらの記載に基づいて種々変更、改変などしたものも本発明の趣旨に含まれることはいうまでもない。   The light emitting device and the method for manufacturing the same according to the present invention have been specifically described above with reference to the modes for carrying out the invention, but the gist of the present invention is not limited to these descriptions, and the scope of the claims is not limited. It should be broadly construed based on the statement. Further, it goes without saying that various changes and modifications based on these descriptions are also included in the spirit of the present invention.

本開示の実施形態に係る発光装置は、ＬＥＤ電球やスポットライトなどの各種照明器具、液晶ディスプレイのバックライト光源、大型ディスプレイ、広告や行き先案内などの各種表示装置、更には、デジタルビデオカメラ、ファクシミリ、コピー機、スキャナなどにおける画像読取装置、プロジェクタ装置など、種々の光源に利用することができる。   A light emitting device according to an embodiment of the present disclosure includes various lighting devices such as an LED bulb and a spotlight, a backlight light source of a liquid crystal display, a large-sized display, various display devices such as advertisements and destination guidance, a digital video camera, and a facsimile. The present invention can be used for various light sources such as an image reading device in a copying machine and a scanner, a projector device, and the like.

１ 発光素子
１１ 素子基板
１２ 半導体積層体
１２ｎ ｎ型半導体層
１２ａ 活性層
１２ｐ ｐ型半導体層
１２ｂ 露出部
１３ ｎ側電極
１４ 全面電極
１５ ｐ側電極
１６ 絶縁膜
１６ｎ，１６ｐ 開口部
１ａ 第１発光素子
１ｂ 第２発光素子
２ 基板
２ａ 第１領域
２ｂ 第２領域
２１ 基体
２２ 第１配線
２２ａ パッド部
２２ｂ 配線部
２３ 第２配線
２３ａ パッド部
２３ｂ 配線部
２４ 第３配線
２４ａ パッド部
２４ｂ 配線部
２５ 第４配線
２５ａ パッド部
２５ｂ 配線部
３ 第１部材
３ａ 頂部
４，４Ａ，４Ｂ，４Ｃ，４Ｄ，４Ｅ 第２部材
４ａ，４Ａａ，４Ｂａ，４Ｃａ，４Ｄａ，４Ｅａ 頂部
４１ 第１層
４２ 第２層
４３ 第３層
５，５Ａ，５Ｂ，５Ｃ，５Ｄ，５Ｅ 封止部材
５ａ，５Ａａ，５Ｂａ，５Ｃａ，５Ｄａ，５Ｅａ 第１封止部材
５ｂ，５Ａｂ，５Ｂｂ，５Ｃｂ，５Ｄｂ，５Ｅｂ 第２封止部材
５Ａｘ，５Ｃｘ，５Ｄｘ，５Ｅｘ 第２封止部材
６，６Ａ，６Ｂ，６Ｃ，６Ｄ，６Ｅ 導光部材
７ 保護素子
８ ワイヤ
９１〜９４ ディスペンサ
１００，１００Ａ，１００Ｂ，１００Ｃ，１００Ｄ，１００Ｅ 発光装置
ＡＭ アノードマーク REFERENCE SIGNS LIST 1 light emitting element 11 element substrate 12 semiconductor laminated body 12n n type semiconductor layer 12a active layer 12p p type semiconductor layer 12b exposed part 13 n side electrode 14 whole electrode 15 p side electrode 16 insulating film 16n, 16p opening 1a first light emitting element 1b 2nd light emitting element 2 board | substrate 2a 1st area | region 2b 2nd area | region 21 base | substrate 22 1st wiring 22a pad part 22b wiring part 23 2nd wiring 23a pad part 23b wiring part 24 3rd wiring 24a pad part 24b wiring part 25 4th Wiring 25a Pad part 25b Wiring part 3 1st member 3a Top part 4,4A, 4B, 4C, 4D, 4E 2nd member 4a, 4Aa, 4Ba, 4Ca, 4Da, 4Ea Top part 41 1st layer 42 2nd layer 43 3rd Layer 5, 5A, 5B, 5C, 5D, 5E Sealing member 5a, 5Aa, 5Ba, 5Ca, 5Da, 5Ea First sealing Material 5b, 5Ab, 5Bb, 5Cb, 5Db, 5Eb Second sealing member 5Ax, 5Cx, 5Dx, 5Ex Second sealing member 6, 6A, 6B, 6C, 6D, 6E Light guide member 7 Protective element 8 Wire 91 to 9 94 Dispenser 100, 100A, 100B, 100C, 100D, 100E Light emitting device AM Anode mark

Claims (22)

基板と、
前記基板上に設けられる環状の第１部材と、
前記第１部材の内側に配置される第１発光素子及び第２発光素子と、
前記基板上であって前記第１部材の内側に前記第１部材と接するように設けられており、前記第１部材の内側を、少なくとも１つの前記第１発光素子が配置される第１領域と、少なくとも１つの前記第２発光素子が配置される第２領域と、を含む複数の領域に区画し、透光性領域を有する第２部材と、
前記第１発光素子及び前記第２発光素子を被覆する封止部材と、を有し、
前記第２部材は、最下層として設けられる第１層と、前記第１層上に設けられる第２層と、を有する複数の層が積層されてなり、
前記第２部材の高さは、前記第１部材の高さよりも高く、
前記第１層は、遮光性であり、前記第１部材以下の高さで、両端部が前記第１部材と接するように設けられ、
前記第２層は、前記第１層よりも延伸方向の長さが短く前記第１部材と離間するように設けられ、
前記封止部材は、前記第１部材と前記第２部材とで挟まれた領域において、前記第２部材側の高さが前記第１部材側の高さよりも高い発光装置。 Board,
An annular first member provided on the substrate,
A first light emitting device and a second light emitting device disposed inside the first member;
It is provided on the substrate inside the first member so as to be in contact with the first member, and the inside of the first member is a first region in which at least one first light emitting element is arranged. A second member having a light-transmitting region, which is divided into a plurality of regions including at least one second region in which the second light-emitting element is arranged,
A sealing member that covers the first light emitting element and the second light emitting element,
The second member is formed by stacking a plurality of layers including a first layer provided as a lowermost layer and a second layer provided on the first layer,
The height of the second member is higher than the height of the first member,
The first layer has a light-shielding property, is provided at a height equal to or lower than the first member, and has both ends contacting the first member,
The second layer has a shorter length in the stretching direction than the first layer and is provided so as to be separated from the first member,
The said sealing member is a light-emitting device with the height of the said 2nd member side being higher than the height of the said 1st member side in the area | region pinched by the said 1st member and the said 2nd member. 前記封止部材は、前記第１部材側から前記第２部材側に向かって高くなる傾斜面を有する請求項１に記載の発光装置。   The light-emitting device according to claim 1, wherein the sealing member has an inclined surface that becomes higher from the first member side toward the second member side. 前記第１部材及び前記第２部材の頂部が、前記封止部材から露出している請求項１又は請求項２に記載の発光装置。   The light-emitting device according to claim 1, wherein the tops of the first member and the second member are exposed from the sealing member. 前記第２部材は、平面視で前記第１部材内の２箇所と接する請求項１乃至請求項３の何れか一項に記載の発光装置。   The said 2nd member is a light-emitting device as described in any one of Claim 1 thru | or 3 which contacts two places in the said 1st member by planar view. 前記第２部材は、平面視で前記第１部材と接する前記２箇所の一方から他方に向かって延伸するように、線状に設けられている請求項４に記載の発光装置。   The light emitting device according to claim 4, wherein the second member is linearly provided so as to extend from one of the two positions contacting the first member toward the other in a plan view. 前記線状は、直線状である請求項５に記載の発光装置。   The light emitting device according to claim 5, wherein the linear shape is a linear shape. 前記第２部材は、前記線状の両端部よりも中央部が高くなるように設けられている請求項５又は請求項６に記載の発光装置。   The light emitting device according to claim 5, wherein the second member is provided so that a central portion thereof is higher than both ends of the linear shape. 前記第２部材は、前記線状における延伸方向に沿った断面の形状が、略台形である請求項５乃至請求項７の何れか一項に記載の発光装置。The light-emitting device according to claim 5, wherein the second member has a substantially trapezoidal cross-sectional shape along the extending direction in the linear shape. 互いに交差する複数の前記第２部材を備え、前記第１部材の内側を複数の領域に区画する請求項５乃至請求項８の何れか一項に記載の発光装置。 Comprising a plurality of said second members crossing each other, the light emitting device according to any one of claims 5 to 8 for partitioning the inside of the first member into a plurality of regions. 複数の前記第２部材は、互いに異なる方向に延伸し、一点で交差するように設けられる請求項９に記載の発光装置。 The light emitting device according to claim 9 , wherein the plurality of second members are provided so as to extend in mutually different directions and intersect at one point. 互いに平行に延伸する複数の前記第２部材を備え、前記第１部材の内側を複数の領域に区画する請求項５乃至請求項８の何れか一項に記載の発光装置。 Comprising a plurality of said second member extending parallel to each other, the light emitting device according to any one of claims 5 to 8 for partitioning the inside of the first member into a plurality of regions. 前記複数の層は、前記第２層上に、前記第２層よりも延伸方向の長さが短い第３層を更に有する請求項１乃至請求項１１の何れか一項に記載の発光装置。 The light emitting device according to any one of claims 1 to 11, wherein the plurality of layers further include a third layer on the second layer, the third layer having a shorter length in the stretching direction than the second layer. 前記第１発光素子の発光色と、前記第２発光素子の発光色とが異なる請求項１乃至請求項１２の何れか一項に記載の発光装置。 Wherein the emission color of the first light-emitting element, a light-emitting device according to any one of the second light emitting element emitting colors are different claims 1 to 12. 前記封止部材は、前記第１領域に配置される第１封止部材と、前記第２領域に配置される第２封止部材と、を有する請求項１乃至請求項１３の何れか一項に記載の発光装置。 The said sealing member has the 1st sealing member arrange | positioned at the said 1st area | region, and the 2nd sealing member arrange | positioned at the said 2nd area | region, The claim | item 1 thru | or 13 any one of Claim 1 thru | or 13. The light-emitting device according to. 前記第１封止部材と前記第２封止部材には、それぞれ発光色が異なる波長変換物質が含まれている請求項１４に記載の発光装置。 The light emitting device according to claim 14 , wherein the first sealing member and the second sealing member each include a wavelength conversion substance having a different emission color. 前記第１封止部材と前記第２封止部材の何れか一方にのみ波長変換物質が含まれている請求項１４に記載の発光装置。 The light emitting device according to claim 14 , wherein only one of the first sealing member and the second sealing member contains a wavelength conversion substance. 前記第１部材は、遮光性である請求項１乃至請求項１６の何れか一項に記載の発光装置。 Said first member, the light emitting device according to any one of claims 1 to 16 which is a light-shielding. 前記第１部材の高さが、前記第１発光素子及び前記第２発光素子の高さよりも高い請求項１乃至請求項１７の何れか一項に記載の発光装置。 The light emitting device according to any one of claims 1 to 17 , wherein a height of the first member is higher than heights of the first light emitting element and the second light emitting element. 基板上に少なくとも１つの第１発光素子及び少なくとも１つの第２発光素子を実装する工程と、
前記基板上に前記第１発光素子及び前記第２発光素子を囲む第１部材を形成する工程と、
前記基板上であって、前記第１発光素子と前記第２発光素子の間に、前記第１発光素子が配置された第１領域と前記第２発光素子が配置された第２領域とを区画し、透光性領域を有する第２部材を、前記第１部材と接するように形成する工程と、
前記第１領域と前記第２領域とに、前記第１発光素子及び前記第２発光素子を被覆するように封止部材を充填する工程と、を有し、
前記第２部材は、最下層として設けられる第１層と、前記第１層上に設けられる第２層とを有する複数の層を積層して形成し、
前記第１層は、遮光性であり、前記第１部材以下の高さで、両端部が前記第１部材と接するように形成し、
前記第２層は、前記第１層よりも延伸方向の長さが短く前記第１部材と離間するように形成し、
前記第２部材の高さが、前記第１部材の高さよりも高くなるように形成し、
前記封止部材は、ポッティング法によって未硬化の樹脂材料を充填することで、前記第１部材と前記第２部材とで挟まれた領域において、前記第２部材側の高さが前記第１部材側の高さよりも高くなるように形成する発光装置の製造方法。 Mounting at least one first light emitting element and at least one second light emitting element on the substrate;
Forming a first member on the substrate, the first member surrounding the first light emitting device and the second light emitting device;
On the substrate, a first area in which the first light emitting element is arranged and a second area in which the second light emitting element is arranged are partitioned between the first light emitting element and the second light emitting element. And forming a second member having a light-transmitting region so as to be in contact with the first member,
Filling the first region and the second region with a sealing member so as to cover the first light emitting element and the second light emitting element,
The second member is formed by stacking a plurality of layers including a first layer provided as a lowermost layer and a second layer provided on the first layer,
The first layer is light-shielding, has a height equal to or lower than that of the first member, and is formed so that both ends thereof are in contact with the first member,
The second layer has a shorter length in the stretching direction than the first layer and is formed so as to be separated from the first member,
The height of the second member is formed to be higher than the height of the first member,
The sealing member is filled with an uncured resin material by a potting method, so that the height of the second member side is the first member in a region sandwiched between the first member and the second member. A method for manufacturing a light-emitting device, which is formed so as to be higher than the side height. 前記第１部材を前記第２部材よりも先に形成する請求項１９に記載の発光装置の製造方法。 20. The method for manufacturing a light emitting device according to claim 19 , wherein the first member is formed before the second member. 前記第２部材は、線状に形成し、前記線状における延伸方向に沿った断面の形状が、略台形となるように形成する請求項１９又は請求項２０に記載の発光装置の製造方法。21. The method for manufacturing a light emitting device according to claim 19, wherein the second member is formed in a linear shape, and a cross section of the linear member along the extending direction has a substantially trapezoidal shape. 前記複数の層は、前記第２層上に、前記第２層よりも長さが短い第３層を更に積層することで形成する請求項１９乃至請求項２１の何れか一項に記載の発光装置の製造方法。 22. The light emission according to claim 19 , wherein the plurality of layers are formed by further stacking a third layer having a length shorter than that of the second layer on the second layer. Device manufacturing method.
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