JP6107415B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP6107415B2
JP6107415B2 JP2013108632A JP2013108632A JP6107415B2 JP 6107415 B2 JP6107415 B2 JP 6107415B2 JP 2013108632 A JP2013108632 A JP 2013108632A JP 2013108632 A JP2013108632 A JP 2013108632A JP 6107415 B2 JP6107415 B2 JP 6107415B2
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light emitting
emitting device
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JP2014229759A (en
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祐太 岡
祐太 岡
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Nichia Corp
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本発明は、複数の発光素子が搭載された発光装置に関する。   The present invention relates to a light emitting device on which a plurality of light emitting elements are mounted.

半導体発光素子を搭載した発光装置は、小型で電力効率が良く鮮やかな色の発光をする。また、球切れの心配がなく、初期駆動特性に優れ、振動やオン・オフ点灯の繰り返しにも強い。このような優れた特性を有するため、発光ダイオード（ＬＥＤ）やレーザーダイオード（ＬＤ）等は各種の光源として利用され、その用途に応じた多種多様な構造が知られている。   A light-emitting device equipped with a semiconductor light-emitting element emits light with a small color, high power efficiency, and vivid colors. In addition, there is no fear of ball breakage, excellent initial drive characteristics, and resistance to vibration and repeated on / off lighting. Because of such excellent characteristics, light-emitting diodes (LEDs), laser diodes (LDs), and the like are used as various light sources, and a wide variety of structures are known according to their applications.

その構造の一つに、ＣＯＢ（Chip on Board）構造の発光装置が挙げられる。この発光装置では、平板形状の基板に、多数の発光素子を比較的短い間隔で配列して載置する。さらに、発光素子の電極と基板上のリード電極（インナーリード）を電気的に接続し、発光素子やボンディングワイヤを被覆するように実装領域を透光性の樹脂で封止する。このように、数十個以上の発光素子を高密度（狭ピッチ）で搭載するため、ＬＥＤ電球やスポットライト等の照明器具として、１台で広い照射領域から強い光を照射するような大型の面型発光装置に特に好適に用いられている。   One of the structures is a light emitting device having a COB (Chip on Board) structure. In this light-emitting device, a large number of light-emitting elements are arranged and placed on a flat substrate at relatively short intervals. Further, the electrode of the light emitting element and the lead electrode (inner lead) on the substrate are electrically connected, and the mounting region is sealed with a translucent resin so as to cover the light emitting element and the bonding wire. In this way, in order to mount dozens or more of light emitting elements at high density (narrow pitch), as a lighting fixture such as an LED bulb or a spotlight, a large light source that emits strong light from a wide irradiation area with one unit. It is particularly suitably used for a surface light emitting device.

また、演色性を向上させるために、複数の種類の波長変換部材を封止部材に含有させる発光装置が知られている。このような発光装置において、異なる波長変換部材間の波長変換の繰り返しによる光取り出し効率の低下を抑制するために、波長変換部材の領域を区画し、区画された領域に異なる波長変換部材を配置する発光装置が提案されている。   Moreover, in order to improve color rendering, the light-emitting device which contains several types of wavelength conversion members in a sealing member is known. In such a light emitting device, in order to suppress a decrease in light extraction efficiency due to repeated wavelength conversion between different wavelength conversion members, the wavelength conversion member region is partitioned, and different wavelength conversion members are disposed in the partitioned regions. Light emitting devices have been proposed.

特許文献１には、１層の蛍光体層からなる波長変換部材を、蛍光体の発光スペクトルが他の蛍光体の励起スペクトルに重なる場合に、異なった区画に含有されるように区分けした発光装置が開示されている（図７参照）。   Patent Document 1 discloses a light-emitting device in which a wavelength conversion member composed of a single phosphor layer is divided so as to be contained in different compartments when the emission spectrum of the phosphor overlaps with the excitation spectrum of another phosphor. Is disclosed (see FIG. 7).

特許文献２には、青色光で励起されて赤色光を発する蛍光体を含んだ赤色蛍光体領域、および赤色と異なる光を発する別の蛍光体を含む非赤色蛍光体領域を有する蛍光体層を備えた照明装置が示されている。ここで、異なる蛍光体を含む隣接した蛍光体層の間には、反射性能を有する遮光性の仕切り板が形成されている。さらにこの照明装置では、空気層が存在しないように透光性材料からなる封止部材で装置基板と蛍光体層の間が満たされた構成となっている。   Patent Document 2 includes a phosphor layer having a red phosphor region including a phosphor that emits red light when excited by blue light, and a non-red phosphor region including another phosphor that emits light different from red. A lighting device is shown. Here, a light-shielding partition plate having reflection performance is formed between adjacent phosphor layers containing different phosphors. Furthermore, this lighting device has a configuration in which the space between the device substrate and the phosphor layer is filled with a sealing member made of a light-transmitting material so that no air layer exists.

前述のような発光装置とすることで、演色性に優れた白色光の照明装置とでき、隣接した異なる蛍光体層間における光の干渉を妨げ、蛍光体層の光入射面での光の反射損を抑制できるので、光の取り出し効率を向上させることができる。   By using the light emitting device as described above, a white light illuminating device having excellent color rendering can be obtained, which prevents interference of light between adjacent different phosphor layers and causes light reflection loss at the light incident surface of the phosphor layer. Therefore, the light extraction efficiency can be improved.

特開２００５−３１１１３６号公報JP 2005-31136 A 特開２００９−６００９４号公報JP 2009-60094 A

しかしながら、このように波長変換部材の領域を区画する枠体等の仕切りを設ける場合には制限がある。すなわち、枠体は通常、光の輝度や演色性を考慮し、発光素子の数や位置に応じて実装基板の所望の位置に設けられるため、形成の自由度が極めて低い。また、所望の発光素子間や発光素子上に形成する際、枠体が形成される表面は必ずしも平坦でないので、枠体の形成が困難であり精度が問題になることがある。さらに、封止樹脂等で発光素子を埋設してその上方に仕切りを設ける場合、その構成部材が遮光性であると、その遮光性の仕切りで光が妨げられ、光の取り出し効率が低下するとともに、照射面に影（暗い部分）ができるために輝度が均一とならず、所望の発光装置を得ることが難しい。   However, there is a limitation in the case of providing a partition such as a frame body that partitions the region of the wavelength conversion member in this way. In other words, the frame body is usually provided at a desired position on the mounting substrate in accordance with the number and position of the light emitting elements in consideration of the luminance and color rendering properties of light, so that the degree of freedom of formation is extremely low. Moreover, when forming between desired light emitting elements or on a light emitting element, since the surface in which a frame is formed is not necessarily flat, formation of a frame is difficult and accuracy may become a problem. Further, when the light emitting element is embedded with sealing resin or the like and a partition is provided above the light emitting element, if the constituent member is light shielding, light is blocked by the light shielding partition and the light extraction efficiency is reduced. Since a shadow (dark part) is formed on the irradiated surface, the luminance is not uniform, and it is difficult to obtain a desired light emitting device.

本発明は前記問題点に鑑みてなされたものであり、光の取り出しに優れ、区画する仕切りの位置、数、形状、発光領域に占める範囲等を自由に選択可能な発光装置を提供することを目的とする。   The present invention has been made in view of the above problems, and provides a light-emitting device that is excellent in light extraction and that can freely select the position, number, shape, range, etc. of the light-emitting area. Objective.

本発明に係る発光装置は、基板に載置された複数の発光素子と、複数の発光素子を被覆する第１透光性部材と、前記第１透光性部材の上に形成された第２透光性部材と、前記第２透光性部材を複数の領域に分離する第３透光性部材と、を有することを特徴とする。   A light emitting device according to the present invention includes a plurality of light emitting elements mounted on a substrate, a first light transmissive member covering the plurality of light emitting elements, and a second formed on the first light transmissive member. It has a translucent member and a third translucent member that separates the second translucent member into a plurality of regions.

本発明に係る発光装置によれば、光の取り出しに優れ、区画する仕切りの形成が容易な発光装置とすることができる。   According to the light emitting device of the present invention, it is possible to provide a light emitting device that is excellent in light extraction and that can easily form a partition.

図１は本発明の実施形態１に係る発光装置の全体構成を示す斜視図である。FIG. 1 is a perspective view showing an overall configuration of a light emitting device according to Embodiment 1 of the present invention. 図２ａは図１に示す発光装置の平面視図であり、第１透光性部材は図示していない。また、配線部が見えるように、枠体は輪郭のみで透過して示している。図２ｂは図２ａのＡ−Ａ断面における断面図である。FIG. 2a is a plan view of the light emitting device shown in FIG. 1, and the first light transmissive member is not shown. Further, the frame body is shown by only the outline so that the wiring portion can be seen. 2b is a cross-sectional view taken along the line AA of FIG. 2a. 図３ａは本発明の実施形態に係る発光装置の平面視図であり、第１透光性部材は図示していない。また、配線部が見えるように、枠体は輪郭のみで透過して示している。図３ｂは図３ａのＡ−Ａ断面における断面図であり、ボンディングワイヤは省略している。FIG. 3A is a plan view of the light emitting device according to the embodiment of the present invention, and the first light transmissive member is not shown. Further, the frame body is shown by only the outline so that the wiring portion can be seen. FIG. 3b is a cross-sectional view taken along the line AA of FIG. 3a, and bonding wires are omitted. 図４ａは本発明の実施形態に係る発光装置の平面視図であり、第１透光性部材は図示していない。図４ｂは図４ａのＡ−Ａ断面における断面図である。図４ａ，図４ｂともにボンディングワイヤは省略している。FIG. 4A is a plan view of the light emitting device according to the embodiment of the present invention, and the first light transmissive member is not shown. 4b is a cross-sectional view taken along the line AA of FIG. 4a. The bonding wires are omitted in both FIGS. 4a and 4b. 図５ａは本発明の実施形態に係る発光装置の平面視図であり、第１透光性部材は図示していない。また、配線部が見えるように、枠体は輪郭のみで透過して示している。図５ｂは図５ａのＡ−Ａ断面における断面図であり、ボンディングワイヤは省略している。FIG. 5A is a plan view of the light emitting device according to the embodiment of the present invention, and the first light transmissive member is not shown. Further, the frame body is shown by only the outline so that the wiring portion can be seen. FIG. 5b is a cross-sectional view taken along the line AA of FIG. 5a, and the bonding wires are omitted. 図６ａ〜ｅは本発明の実施形態に係る発光装置の平面視図であり、枠体、第２透光性部材、第３透光性部材のみを表したものである。第３透光性部材の形状の実施例を示している。6A to 6E are plan views of the light emitting device according to the embodiment of the present invention, and show only the frame, the second light transmissive member, and the third light transmissive member. The Example of the shape of a 3rd translucent member is shown.

以下、発明の実施形態について図面を参照して説明する。ただし、以下に説明する発光装置に特定されるものではなく、構成部品の寸法・材質・形状・相対的配置等は特定的な記載がない限りは単なる説明例にすぎず、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。さらに、同一の名称、符号は原則として同一もしくは同質の部材を示しており、詳細説明を適宜省略する。本発明を構成する各要素および実施形態は、特に排除する記載がない限り、適宜組み合わせ、変更、改変等して適用できる。   Embodiments of the invention will be described below with reference to the drawings. However, it is not specified for the light-emitting device described below, and the dimensions, materials, shapes, relative arrangements, etc. of the components are merely illustrative examples unless otherwise specified, and the members shown in each drawing The size, positional relationship, etc. may be exaggerated for clarity of explanation. Further, in principle, the same names and symbols indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Each element and embodiment constituting the present invention can be applied in appropriate combinations, changes, modifications, etc. unless otherwise specified.

＜実施形態１＞
図１は、本発明の実施形態１に係る発光装置１００の斜視図を示しており、図２ａは本実施形態に係る発光装置１００の平面図、図２ｂはＡ−Ａ断面における断面図である。本実施形態の発光装置１００では、矩形平面状の基板１Ａの上面中央部に搭載された複数の発光素子７を囲むように矩形の環（四角環）状の枠体５が設けられ、枠体５の内側に複数の発光素子７を被覆するように第１透光性部材３が形成されている。そして、図２ａ及び図２ｂに示すように第１透光性部材３の上に第３透光性部材９が設けられ、枠体５と第３透光性部材９の間および第３透光性部材９の内側に第２透光性部材６が形成されている。図２ｂに示すように、発光素子７は第１透光性部材３に被覆され、枠体５の内側を発光領域２１として光を上方の第２透光性部材６および第３透光性部材９方向へ照射する。発光装置１００は、基板１Ａ上面の枠体５の外側に、発光素子７の駆動電圧を外部から印加するための一対のパッド電極２０として、正極２３および負極２４の各パッド部２３ａ，２４ａが金属で形成されている。基板上には識別マークや認識マーク（不図示）を設けていてもよく、識別マークであるアノードマークやカソードマークは、正負電極２０が識別可能なように各々の電極の近傍に設けられる。認識マークは、発光装置１００の製造において、基板１Ａに発光素子７を実装する位置の目印である。マークの形状や位置は仕様によって適宜選択できる。 <Embodiment 1>
1 is a perspective view of a light emitting device 100 according to Embodiment 1 of the present invention, FIG. 2a is a plan view of the light emitting device 100 according to this embodiment, and FIG. 2b is a cross-sectional view taken along the line AA. . In the light emitting device 100 of the present embodiment, a rectangular ring (square ring) -shaped frame body 5 is provided so as to surround a plurality of light emitting elements 7 mounted on the central portion of the upper surface of the rectangular planar substrate 1A. A first translucent member 3 is formed so as to cover a plurality of light emitting elements 7 inside 5. 2a and 2b, a third light transmissive member 9 is provided on the first light transmissive member 3, and between the frame 5 and the third light transmissive member 9 and the third light transmissive member. A second translucent member 6 is formed inside the conductive member 9. As shown in FIG. 2 b, the light emitting element 7 is covered with the first light transmissive member 3, and the second light transmissive member 6 and the third light transmissive member are disposed on the inner side of the frame 5 with the light emitting region 21. Irradiate in 9 directions. In the light emitting device 100, the pad portions 23a and 24a of the positive electrode 23 and the negative electrode 24 are made of metal as a pair of pad electrodes 20 for applying a driving voltage of the light emitting element 7 from the outside to the outside of the frame 5 on the upper surface of the substrate 1A. It is formed with. Identification marks and recognition marks (not shown) may be provided on the substrate, and anode marks and cathode marks, which are identification marks, are provided in the vicinity of the respective electrodes so that the positive and negative electrodes 20 can be identified. The recognition mark is a mark of a position where the light emitting element 7 is mounted on the substrate 1A in the manufacture of the light emitting device 100. The shape and position of the mark can be appropriately selected depending on the specification.

本実施形態に係る発光装置１００は、発光領域２１の全体の平面視形状が図２ａにおいて縦長の長方形（角丸長方形）とされている。また、発光装置１００は導電配線２３ｂ，２４ｂに電気的に接続された保護素子Ｈを備える。発光素子７および保護素子Ｈは、ボンディングワイヤ８にて導電配線２３ｂ，２４ｂと接続される。   In the light emitting device 100 according to the present embodiment, the entire planar view shape of the light emitting region 21 is a vertically long rectangle (rounded rectangle) in FIG. 2A. In addition, the light emitting device 100 includes a protection element H that is electrically connected to the conductive wirings 23b and 24b. The light emitting element 7 and the protection element H are connected to the conductive wirings 23 b and 24 b by the bonding wire 8.

第１透光性部材３の上には、枠体５よりも一回り小さい透光性の四角環形状の第３透光性部材９を備え、これにより発光領域２１において、第２透光性部材６が、内側の第１領域６ａと、その外側の第２領域６ｂとに区画される。本実施形態では、第１領域６ａは第２透光性部材６の略中央に位置するように設けられている。このように配置することで、領域内で光の拡散が均一になるので、容易に所望の発光とすることができる。第３透光性部材９は図２ａ及び図２ｂで示すように、配列された発光素子７を埋設する第１透光性部材３の上面の平坦面に設けられるので、発光素子７の配置にかかわらず所望の位置に形成できる。言い換えると、発光素子７は第３透光性部材９の形成に配慮することなく等間隔で配列することができる。また、第３透光性部材９が透光性であるため、発光素子７の上にあっても出射光を遮らずに光の取り出しを維持しつつ、第２透光性部材６を区画することが可能である。なお、第１透光性部材３や枠体５で、発光素子７、ワイヤ８、保護素子Ｈ、ワイヤが接続される導電配線２３ｂ，２４ｂ等を埋設するので、塵芥、水分、外部応力等から保護することができる。   On the first translucent member 3, there is provided a translucent square ring-shaped third translucent member 9 that is slightly smaller than the frame 5, whereby the second translucency is formed in the light emitting region 21. The member 6 is partitioned into an inner first region 6a and an outer second region 6b. In the present embodiment, the first region 6 a is provided so as to be positioned substantially at the center of the second light transmissive member 6. By arranging in this way, the diffusion of light becomes uniform within the region, so that desired light emission can be easily achieved. As shown in FIGS. 2 a and 2 b, the third light transmissive member 9 is provided on the flat surface of the upper surface of the first light transmissive member 3 in which the arranged light emitting elements 7 are embedded. Regardless, it can be formed at a desired position. In other words, the light emitting elements 7 can be arranged at equal intervals without considering the formation of the third light transmissive member 9. Moreover, since the 3rd translucent member 9 is translucent, the 2nd translucent member 6 is partitioned, maintaining extraction of light, without blocking | interrupting emitted light even if it exists on the light emitting element 7. FIG. It is possible. Since the first light transmissive member 3 and the frame 5 embed the light emitting element 7, the wire 8, the protective element H, the conductive wiring 23b, 24b to which the wire is connected, etc., from dust, moisture, external stress, etc. Can be protected.

以下、発光装置１００を構成する要素について詳細に説明する。   Hereinafter, the elements constituting the light emitting device 100 will be described in detail.

（基板）
基板１Ａは、発光装置１００の基材で発光素子７等を配置する支持体であり、図２ａに示すように矩形平板状に形成されている。基板１Ａは、一般的な半導体素子のＣＯＢパッケージ用の基板と同様に、ある程度の強度を有する絶縁性材料であることが好ましく、光透過率の低い材料で形成されると好適である。具体的には、セラミックス（Ａｌ２Ｏ３，ＡｌＮ等）、あるいはフェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ＢＴレジン（bismaleimide triazine resin）、ポリフタルアミド（ＰＰＡ）等の樹脂が挙げられる。また、表面に絶縁層を形成した金属基板であってもよい。なお、基板１Ａの形状および大きさは限定されず、発光装置１００の形態や用途に応じて適宜設計される。基板１Ａは、発光装置１００において発光領域２１（枠体５の内側）に、それより一回り小さいまたは略同じ広さの実装領域２２が区画される。本実施形態では、いずれも発光領域２１と実装領域２２が略同じ広さであることとする。実装領域２２は、発光素子７を配置するための領域であり、第１透光性部材３で被覆される。基板１Ａの上面には、前記した正極２３および負極２４の一対の電極２０や各種マークの他に、各々の発光素子７が載置される位置に後述する反射層２９が形成されていてもよい。 (substrate)
The substrate 1A is a support body on which the light emitting elements 7 and the like are arranged as a base material of the light emitting device 100, and is formed in a rectangular flat plate shape as shown in FIG. 2a. The substrate 1A is preferably an insulating material having a certain degree of strength, as is the case with a substrate for a COB package of a general semiconductor element, and is preferably formed of a material with low light transmittance. Specific examples thereof include ceramics (Al 2 O 3 , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like. Moreover, the metal substrate which formed the insulating layer on the surface may be sufficient. The shape and size of the substrate 1A are not limited, and are appropriately designed according to the form and use of the light emitting device 100. In the light emitting device 100, the substrate 1 </ b> A has a light emitting region 21 (inside the frame body 5) in which a mounting region 22 having a size slightly smaller than or approximately the same as that is partitioned. In the present embodiment, it is assumed that the light emitting area 21 and the mounting area 22 are substantially the same size. The mounting region 22 is a region for arranging the light emitting element 7 and is covered with the first light transmissive member 3. On the upper surface of the substrate 1A, in addition to the pair of electrodes 20 of the positive electrode 23 and the negative electrode 24 and various marks, a reflective layer 29 described later may be formed at a position where each light emitting element 7 is placed. .

（導電部材（正極および負極））
正極２３および負極２４は、一対の電極２０として、基板１Ａの上面に、実装領域２２を挟んで対向するように離間した２つの金属層として形成される。一対の電極２０は、それぞれ外部から発光素子７の駆動電圧を印加するためのパッド部２３ａ，２４ａ、発光素子７のパッド電極とパッド部２３ａ，２４ａを電気的に接続するための導電配線２３ｂ，２４ｂからなる。パッド部２３ａ，２４ａの形状・大きさ・位置は、発光装置１００において露出していれば特に限定されない。導電配線２３ｂ，２４ｂは、一部が枠体５と重なるように形成されており、その重なった部分において、端に配置された発光素子７がワイヤボンディングにて接続可能なように、実装領域２２の周囲に所定の間隔を空けてカギ型に形成される。導電配線２３ｂ，２４ｂは、パッド部２３ａ，２４ａから延出し、実装領域２２の周囲に沿うように略Ｌ字状に形成される。 (Conductive members (positive electrode and negative electrode))
The positive electrode 23 and the negative electrode 24 are formed as a pair of electrodes 20 on the upper surface of the substrate 1 </ b> A as two metal layers separated so as to face each other with the mounting region 22 interposed therebetween. The pair of electrodes 20 includes pad portions 23a and 24a for applying a driving voltage for the light emitting element 7 from the outside, and conductive wirings 23b for electrically connecting the pad electrodes of the light emitting element 7 and the pad portions 23a and 24a, respectively. 24b. The shape, size, and position of the pad portions 23 a and 24 a are not particularly limited as long as they are exposed in the light emitting device 100. The conductive wirings 23b and 24b are formed so as to partially overlap the frame body 5, and in the overlapping part, the mounting region 22 is connected so that the light emitting element 7 arranged at the end can be connected by wire bonding. Are formed in the shape of a key with a predetermined interval around them. The conductive wirings 23 b and 24 b extend from the pad portions 23 a and 24 a and are formed in a substantially L shape so as to follow the periphery of the mounting region 22.

一対の電極２０はＡｕ，Ｃｕ，Ａｌ等の金属層で形成され、ワイヤ８にＡｕが適用されることが多いことから、導電配線２３ｂ，２４ｂも同じＡｕ膜で形成すると、強固に接合し易く好ましい。あるいはＣｕ膜等にＡｕ膜を積層してもよく、異なる金属を２層以上積層してもよい。これらの金属は、無電解メッキまたは電解メッキで形成することが好ましく、また同時に各種マーク等を形成することも可能である。厚みは特に限定されないが、約１μｍ〜５０μｍ程度であると好ましく、ワイヤボンディングの条件やリード電極としての抵抗等に応じて適宜設計される。   The pair of electrodes 20 is formed of a metal layer such as Au, Cu, Al, and Au is often applied to the wire 8. Therefore, if the conductive wirings 23b and 24b are also formed of the same Au film, it is easy to firmly bond them. preferable. Alternatively, an Au film may be laminated on a Cu film or the like, or two or more different metals may be laminated. These metals are preferably formed by electroless plating or electrolytic plating, and it is also possible to form various marks at the same time. The thickness is not particularly limited, but is preferably about 1 μm to 50 μm, and is appropriately designed according to wire bonding conditions, resistance as a lead electrode, and the like.

（反射層）
反射層２９は、発光装置１００の発光効率を向上させるために、発光素子７から下方へ出射した光を発光装置上面へ照射させる反射膜であり、例えば図２ｂに部分拡大図として示されるように基板１Ａの表面であって発光素子７ｂが搭載される領域に配置される。材料は光反射率の高い金属であれば特に限定されない。両面電極構造の発光素子が搭載される場合は、下面側の電極が電気的に反射層に接続されていてもよい。フェースダウン（ＦＤ）実装では、反射層２９は発光素子７の各々が載置される位置に、発光素子７の平面視形状よりも一回り大きく、かつ互いに短絡しないように間隔を空けて形成されるが、フェースアップ（ＦＵ）実装では間隔を設ける必要はなく、実装領域２２の全面に形成してもかまわない。反射層は、Ａｇ，Ａｕが好ましく、可視光に対する反射率が高いＡｇが特に好ましい。ＡｕはＡｇよりも光を吸収し易いが、例えば電極２０と共にＡｕメッキ膜で反射層を形成した後、その表面にＴｉＯ２膜を形成することで、光反射率を高くすることができる。反射層の厚みは特に限定されず、メッキで電極２０と同じ厚みに形成すると好ましいが、別工程にて各々別のメッキ膜を形成してもよい。 (Reflective layer)
The reflective layer 29 is a reflective film that irradiates the upper surface of the light emitting device with light emitted downward from the light emitting element 7 in order to improve the light emission efficiency of the light emitting device 100. For example, as shown in FIG. It is disposed on the surface of the substrate 1A and in a region where the light emitting element 7b is mounted. The material is not particularly limited as long as it is a metal having a high light reflectance. When a light emitting element having a double-sided electrode structure is mounted, the electrode on the lower surface side may be electrically connected to the reflective layer. In the face-down (FD) mounting, the reflective layer 29 is formed at a position where each of the light emitting elements 7 is placed and is slightly larger than the shape of the light emitting elements 7 in plan view and spaced apart so as not to short-circuit each other. However, in face-up (FU) mounting, it is not necessary to provide a gap, and it may be formed over the entire mounting region 22. The reflective layer is preferably Ag or Au, and particularly preferably Ag having a high reflectance with respect to visible light. Although Au absorbs light more easily than Ag, for example, after forming a reflective layer with an Au plating film together with the electrode 20, a light reflectivity can be increased by forming a TiO 2 film on the surface thereof. The thickness of the reflective layer is not particularly limited and is preferably formed by plating to the same thickness as that of the electrode 20, but separate plating films may be formed in separate steps.

（発光素子）
発光素子７は、電圧を印加することで自ら発光する半導体素子であり、図２ｂに示すように、基板１Ａの実装領域２２に接合部材２７によって複数配置されている。接合部材としては、例えば樹脂や半田ペーストを用いることができる。図２に示す例では、発光装置１００からの照射光が面内で一様の輝度を示すように、５行×８列の合計４０個の発光素子７が一定間隔で配列されている。本実施形態の発光素子７の各々は、平面視矩形状でフェースアップ（ＦＵ）実装に対応しており、ｐ電極およびｎ電極はワイヤボンディングにてワイヤ８と接続されている。さらに、横方向に沿って配置された複数の発光素子７が直列接続され、隣り合う発光素子７のｐ電極とｎ電極がワイヤ８によって電気的に接続されている。このような直列接続とすると、Ｖｆの異なる複数の発光素子を用いても、各発光素子７に流れる電流を均一化して発光強度をほぼ同程度にでき好ましい。また、直列回路に隣り合う発光素子を並列接続して１つの発光素子の組とし、その組同士を直列接続する梯子状の配線（ラダー）にすることで、各種電源に対応した発光装置１００とすることもできる。 (Light emitting element)
The light-emitting element 7 is a semiconductor element that emits light by applying a voltage, and a plurality of light-emitting elements 7 are arranged in the mounting region 22 of the substrate 1A by bonding members 27 as shown in FIG. 2b. As the joining member, for example, a resin or a solder paste can be used. In the example shown in FIG. 2, a total of 40 light emitting elements 7 of 5 rows × 8 columns are arranged at regular intervals so that the light emitted from the light emitting device 100 exhibits uniform luminance in the plane. Each of the light emitting elements 7 of the present embodiment is rectangular in plan view and corresponds to face-up (FU) mounting, and the p electrode and the n electrode are connected to the wire 8 by wire bonding. Further, a plurality of light emitting elements 7 arranged in the lateral direction are connected in series, and the p electrode and the n electrode of the adjacent light emitting elements 7 are electrically connected by a wire 8. Such a series connection is preferable because even if a plurality of light emitting elements having different V f are used, the current flowing through each light emitting element 7 can be made uniform to make the light emission intensity substantially the same. Moreover, the light emitting device 100 corresponding to various power sources can be obtained by connecting the light emitting elements adjacent to the series circuit in parallel to form one light emitting element set, and forming the ladder-like wiring (ladder) connecting the sets in series. You can also

発光素子７としては、具体的には発光ダイオードを用いるのが好ましく、用途に応じて任意の波長のものを選択することができる。例えば、青色（発光波長４３０ｎｍ〜４９０ｎｍ）、緑色（発光波長４９０ｎｍ〜５７０ｎｍ）の発光素子７としては、窒化物系半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）等を用いることができる。また、赤色（発光波長６２０ｎｍ〜７５０ｎｍ）の発光素子７としては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰ等を用いることができる。 Specifically, it is preferable to use a light-emitting diode as the light-emitting element 7, and a light-emitting element having an arbitrary wavelength can be selected according to the application. For example, as the light emitting element 7 of blue (emission wavelength 430 nm to 490 nm) and green (emission wavelength 490 nm to 570 nm), a nitride-based semiconductor (In X Al Y Ga 1-XY N, 0 ≦ X, 0 ≦ Y X + Y ≦ 1) or the like can be used. As the red light emitting element 7 (emission wavelength: 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used.

ここで、本実施形態においては、後記するように第２透光性部材６および第３透光性部材９に蛍光体等の波長変換部材を含有するため、それらを効率良く励起できる短波長の発光が可能な窒化物半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）を用いることが好ましい。例えば、青色の発光素子７と黄色蛍光体と赤色蛍光体とを組み合わせてこれらの発光を混合することで、演色性の高い白色光を得ることができる。また、後記する第２領域６ｂと第３透光性部材９は同心形状なので、外側の領域を比較的幅広にして、数多くの発光素子７を配置することが好ましい。ただし、第２領域６ｂと第３透光性部材９は同心形状でなくてもよく、第３透光性部材９は第２透光性部材６を仕切る形状となっていれば特に限定されない。発光素子７の成分組成や発光色、サイズ、個数等も上記に限定されず、目的に応じて適宜選択することができる。高出力化のためには、発光素子７の個数は、例えば１０個以上、２０〜４００個の範囲内とすることが好ましい。また、発光素子７は、可視光領域の光だけではなく、紫外線や赤外線を出力する素子で構成することもできる。 Here, in the present embodiment, as described later, since the second translucent member 6 and the third translucent member 9 contain a wavelength conversion member such as a phosphor, they have a short wavelength that can excite them efficiently. emission capable nitride semiconductor (In X Al Y Ga 1- X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably used. For example, white light with high color rendering can be obtained by combining the blue light-emitting element 7, a yellow phosphor, and a red phosphor and mixing these emissions. In addition, since the second region 6b and the third translucent member 9 which will be described later are concentric, it is preferable to arrange a large number of light emitting elements 7 with a relatively wide outer region. However, the second region 6b and the third translucent member 9 may not be concentric, and the third translucent member 9 is not particularly limited as long as the second translucent member 6 has a shape that partitions the second translucent member 6. The component composition, emission color, size, number, and the like of the light-emitting element 7 are not limited to the above, and can be appropriately selected depending on the purpose. In order to increase the output, the number of light emitting elements 7 is preferably in the range of, for example, 10 or more and 20 to 400. Moreover, the light emitting element 7 can also be comprised with the element which outputs not only the light of a visible light range but an ultraviolet-ray and infrared rays.

（保護素子）
保護素子Ｈは、ツェナーダイオードやコンデンサ等であり過電圧印加による発光素子７の破壊を防止するために搭載される。保護素子Ｈは、発光素子７からの出射光を遮らないように照射領域の外に配置されることが望ましく、枠体５に埋設されることが好ましい。 (Protective element)
The protection element H is a Zener diode, a capacitor, or the like, and is mounted to prevent the light emitting element 7 from being destroyed due to overvoltage application. The protective element H is desirably disposed outside the irradiation region so as not to block the light emitted from the light emitting element 7, and is preferably embedded in the frame 5.

（ワイヤ）
ワイヤ８は、発光素子７や保護素子Ｈのような電子部品を正極および負極の導電配線２３ｂ，２４ｂへ電気的に接続するための導電性の配線である。材料としては、ワイヤボンディングで一般的に使用されるＡｕ，Ｃｕ，Ｐｔ，Ａｌまたはそれらの合金等が用いられる。特に熱伝導性に優れ、発光素子７の電極材料に一般的に適用されるＡｕが好ましい。ワイヤ８の径は特に限定されず、材料・抵抗・ワイヤボンディングの条件・発光素子７や保護素子Ｈの仕様等に応じて適宜選択される。 (Wire)
The wire 8 is a conductive wiring for electrically connecting electronic components such as the light emitting element 7 and the protection element H to the positive and negative conductive wirings 23b and 24b. As the material, Au, Cu, Pt, Al or their alloys generally used in wire bonding are used. In particular, Au is preferable because it is excellent in thermal conductivity and is generally applied to the electrode material of the light-emitting element 7. The diameter of the wire 8 is not particularly limited, and is appropriately selected according to the material, resistance, wire bonding conditions, specifications of the light emitting element 7 and the protection element H, and the like.

（枠体）
枠体５は、基板１Ａ上に発光装置１００の発光領域全体を区画し、第１透光性部材３および第２透光性部材６を内側に充填するための堰である。枠体５は、本実施形態のように１層から成っていても、多層構造とされていてもよい。本実施形態のように１層とすると、形成工程が複雑にならない上に、多層とする場合のように積層された枠体どうしの剥離が起こらないので、発光装置の強度を維持できる。なお、図２ａでは、導電配線２３ｂ，２４ｂが確認できるように、枠体５は透過して輪郭のみを図示している。 (Frame)
The frame 5 is a weir for partitioning the entire light emitting region of the light emitting device 100 on the substrate 1A and filling the first light transmissive member 3 and the second light transmissive member 6 inside. The frame 5 may be composed of one layer as in the present embodiment, or may have a multilayer structure. When the number of layers is one as in this embodiment, the formation process is not complicated and the laminated frames are not peeled off as in the case of multiple layers, so that the strength of the light emitting device can be maintained. In FIG. 2a, only the outline is shown through the frame 5 so that the conductive wirings 23b and 24b can be confirmed.

枠体５は、第１透光性部材３と共にワイヤ８等を埋設してこれを保護する。従って、枠体５は図２ａに示すように、実装領域２２を囲うように導電配線２３ｂ，２４ｂを被覆する領域に矩形環状に形成され、これらに接続するワイヤ８、導電配線２３ｂ上の保護素子Ｈを埋設する。枠体５は、その内壁面で発光素子７の側方からの出射光を上方へ反射させて発光効率を向上させるための反射部材としても作用するので、発光素子７からの発光や外光を透過し難い白色であると特に好ましい。母材に対して屈折率差の大きい反射材料（例えばＴｉＯ２，Ａｌ２Ｏ３，ＺｒＯ２，ＭｇＯ等）を含有させると、さらに高反射率とすることができる。また、透光性部材で形成されて、発光装置１００の照射領域から側方へも光が照射される構成とすることもできる。 The frame body 5 embeds a wire 8 and the like together with the first translucent member 3 to protect it. Accordingly, as shown in FIG. 2a, the frame 5 is formed in a rectangular ring shape in a region covering the conductive wirings 23b and 24b so as to surround the mounting region 22, and the wire 8 connected thereto and the protective element on the conductive wiring 23b. H is buried. The frame 5 also acts as a reflecting member for reflecting the emitted light from the side of the light emitting element 7 upward on its inner wall surface to improve the light emission efficiency. It is particularly preferable that the white color hardly penetrates. When a reflective material (for example, TiO 2 , Al 2 O 3 , ZrO 2 , MgO, etc.) having a large refractive index difference with respect to the base material is contained, the reflectance can be further increased. Alternatively, the light-emitting device 100 may be configured so that light is irradiated from the irradiation region to the side.

枠体５は絶縁体であり、基板１Ａと同様にある程度の強度を有していることが好ましい。さらに、枠体５は先に設けられたワイヤ８を変形させないように、基板１Ａ上へ液状やペースト状で成形してそのまま凝固できる材料を用いると好適である。堰として十分な高さに形成するために、ペースト状すなわち高粘度の液状の材料が好ましく、熱硬化性樹脂や熱可塑性樹脂が挙げられ、具体的には、フェノール樹脂、エポキシ樹脂、ＢＴレジン、ＰＰＡ、シリコーン樹脂等が挙げられる。   The frame body 5 is an insulator, and preferably has a certain degree of strength like the substrate 1A. Further, it is preferable to use a material that can be solidified as it is by forming it in a liquid or paste form on the substrate 1A so that the wire 5 previously provided is not deformed. In order to form a sufficient height as the weir, a paste-like or highly viscous liquid material is preferable, and examples thereof include a thermosetting resin and a thermoplastic resin. Specifically, a phenol resin, an epoxy resin, a BT resin, Examples thereof include PPA and silicone resin.

枠体５の高さは、第１透光性部材３および第２透光性部材６をその内側に充填して形成するため、基板１Ａの表面から第１透光性部材３と第２透光性部材６の上面までの高さと略同じまたはそれ以上であると好ましい。また、発光素子７の側方からの出射光がそのまま発光装置１００の外に出射しないように、反射面を形成する高さにする。そして、第１透光性部材３が枠体５に這い上がった場合でも、枠体５の上面まで達しない程度の十分な高さを有していると、波長変換されない光が漏れ出さないので好ましい。また、枠体５の幅は特に規定せず、導電配線２３ｂ，２４ｂを被覆し、かつ所望の高さに形成することができればよい。   The height of the frame 5 is formed by filling the inside of the first light-transmissive member 3 and the second light-transmissive member 6, so that the first light-transmissive member 3 and the second light-transmissive member 3 are formed from the surface of the substrate 1 </ b> A. It is preferable that the height to the upper surface of the optical member 6 is substantially the same or higher. Further, the height of the reflection surface is formed so that the light emitted from the side of the light emitting element 7 does not exit the light emitting device 100 as it is. Even when the first translucent member 3 crawls up to the frame body 5, if it has a sufficient height not to reach the upper surface of the frame body 5, light that is not wavelength-converted does not leak out. preferable. The width of the frame 5 is not particularly limited as long as it can cover the conductive wirings 23b and 24b and be formed at a desired height.

（第１透光性部材）
本発明の発光装置１００は、図２ｂに示すように、発光素子７およびワイヤ８を封止して保護し、上面に第３透光性部材９および第２透光性部材６を形成するために、発光素子７からの光を透過する第１透光性部材３を備える。詳しくは、枠体５の内側の基板１Ａ上に液状の樹脂材料を充填して、発光素子７およびワイヤ８を埋設する高さに形成する。 (First translucent member)
As shown in FIG. 2b, the light emitting device 100 of the present invention seals and protects the light emitting element 7 and the wire 8, and forms the third light transmissive member 9 and the second light transmissive member 6 on the upper surface. In addition, the first translucent member 3 that transmits light from the light emitting element 7 is provided. Specifically, a liquid resin material is filled on the substrate 1 </ b> A inside the frame body 5, and is formed to a height at which the light emitting element 7 and the wire 8 are embedded.

第２透光性部材６（波長変換部材）を区画する仕切りである第３透光性部材９を、第１透光性部材３を設けずに発光素子７が実装された基板１Ａ上に直接形成する場合、発光素子７やワイヤ８等が障害となり、第３透光性部材９は必ずしも平坦面上に形成できず、設置には制限がある。発光素子７の配列も、第３透光性部材９の形成を配慮して限定される場合があり、色むらや輝度むらを抑えつつ演色性を維持することは難しい。しかしながら、本発明のように、まず枠体５内を第１透光性部材３で満たすことで、第３透光性部材９の設置面を略平坦にすることができ、第３透光性部材９の形成の自由度を高めることができる。従って、第１透光性部材３は、第３透光性部材９の形成が容易になる程度に発光素子７とワイヤ８を埋設していればかまわないが、発光素子７とワイヤ８が完全に被覆されて露出しないような高さで形成されることがより好ましい。また、図５のように、全ての発光素子７が第１透光性部材３に被覆（または第２透光性部材６が上方に配置）されていなくてもよく、所望の発光に応じて適宜選択できる。   The third translucent member 9, which is a partition that partitions the second translucent member 6 (wavelength conversion member), is directly provided on the substrate 1 </ b> A on which the light emitting element 7 is mounted without providing the first translucent member 3. When forming, the light emitting element 7, the wire 8, etc. become obstacles, and the 3rd translucent member 9 cannot necessarily be formed on a flat surface, and there exists a restriction | limiting in installation. The arrangement of the light emitting elements 7 may also be limited in consideration of the formation of the third light transmissive member 9, and it is difficult to maintain the color rendering while suppressing the color unevenness and the brightness unevenness. However, as in the present invention, by first filling the inside of the frame 5 with the first translucent member 3, the installation surface of the third translucent member 9 can be made substantially flat, and the third translucent member can be obtained. The degree of freedom in forming the member 9 can be increased. Therefore, the first light-transmissive member 3 may be embedded with the light-emitting element 7 and the wire 8 to such an extent that the third light-transmissive member 9 can be easily formed. More preferably, it is formed at such a height that it is covered with and not exposed. Further, as shown in FIG. 5, all the light emitting elements 7 may not be covered with the first light transmissive member 3 (or the second light transmissive member 6 is disposed above), and according to the desired light emission. It can be selected as appropriate.

第１透光性部材３には、発光ダイオード等を搭載した一般的な発光装置の封止に用いられる透光性樹脂材料を適用でき、具体的には、シリコーン樹脂、エポキシ樹脂、ユリア樹脂等が挙げられる。また、枠体５が堰になるので比較的低粘度の樹脂材料で形成することができ、１つ（または少数）の発光素子を搭載する表面実装型（ＳＭＤ）の発光装置に比べて、本実施形態のように数十個の発光素子を実装するＣＯＢ型の発光装置１００のような、広い発光領域２１の封止において特に好適である。また、これらの樹脂材料に光拡散材を含有させると好ましい。そうすることで、発光素子７からの出射光が、枠体５と樹脂材料中の光拡散材によって上方（波長変換部材）へ均等に反射し、色むらや輝度むらの少ない発光装置１００とすることができる。その他、フィラーや着色材等を含んでいてもよく、発光装置１００の形態や用途に応じて適宜選択される。   The first translucent member 3 can be made of a translucent resin material used for sealing a general light emitting device on which a light emitting diode or the like is mounted. Specifically, a silicone resin, an epoxy resin, a urea resin, etc. Is mentioned. Further, since the frame body 5 serves as a weir, it can be formed of a resin material having a relatively low viscosity, and can be compared with a surface mount type (SMD) light emitting device in which one (or a small number) of light emitting elements are mounted. It is particularly suitable for sealing a wide light emitting region 21 like the COB type light emitting device 100 in which several tens of light emitting elements are mounted as in the embodiment. Moreover, it is preferable that these resin materials contain a light diffusing material. By doing so, the light emitted from the light emitting element 7 is uniformly reflected upward (wavelength conversion member) by the frame 5 and the light diffusing material in the resin material, and the light emitting device 100 with less color unevenness and luminance unevenness is obtained. be able to. In addition, a filler, a coloring material, or the like may be included, and is appropriately selected according to the form and use of the light emitting device 100.

（第３透光性部材）
第３透光性部材９は、第２透光性部材６を少なくとも第１領域６ａと第２領域６ｂに区画して形成するための堰であり、光を透過する材料で第１透光性部材３の上面に形成される。透光性であるため、発光素子７の上方にあっても発光素子７からの出射光を遮ることがなく、第１透光性部材３の平坦な上面に設置されることから、形成が容易であり、自由に設置することが可能である。すなわち、発光素子７の配列に合わせることなく所望の平面視形状に形成することができる。言い換えると、第３透光性部材９の形成する位置を避けて発光素子７を配置する必要がなく、第１領域６ａと第２領域６ｂの境界においても一定間隔で配列できるため、発光領域２１における輝度むらが低減される。さらに、発光素子７の搭載作業の効率が低下せず、ワイヤ８の接続も容易になり好ましい。第３透光性部材９はその輪郭線が発光素子７の配列に沿うように、枠体５と同様に四角環形状に形成され、中心が発光領域２１全体と略一致する長方形の第１領域６ａと、これを囲む四角環形状の第２領域６ｂを区画していると好ましい。また、本実施形態では、第３透光性部材９を枠体５と同心形状としたが、図６のように、十字、アスタリスク、格子形状等、第１透光性部材上で第２透光性部材を分離していれば、その形状は特に限定されない。十字、アスタリスク形状では、直線で構成される第３透光性部材３９が円形の発光領域を４分割または８分割するように区画しており、区画された鏡映対称な領域が同じ発光色であると配色の均衡がとれ好ましい。つまり、区画された第２透光性部材３６の左上と右下、右上と左下の領域において、同じ波長変換部材を含んでいる（もしくは透光性樹脂のみで形成されている）と好ましい。また、実施形態のように、第３透光性部材３９は連続した形状であると、第２透光性部材３６の形成の際に堰として機能するため好ましいが、ドット状、波線状等、連続していなくてもよく、連続している場合と同様に光の取り出し効率を向上させることができる。ドット状や波線状に形成した場合、さらに細やかな発光色の調整が可能である。 (Third translucent member)
The third light transmissive member 9 is a weir for partitioning and forming the second light transmissive member 6 into at least a first region 6a and a second region 6b, and is a first light transmissive material made of a light transmissive material. It is formed on the upper surface of the member 3. Since it is translucent, it does not block light emitted from the light-emitting element 7 even above the light-emitting element 7 and is installed on the flat upper surface of the first light-transmitting member 3, so that it can be easily formed. It can be installed freely. That is, it can be formed in a desired planar view shape without matching the arrangement of the light emitting elements 7. In other words, it is not necessary to arrange the light emitting element 7 avoiding the position where the third light transmissive member 9 is formed, and the light emitting region 21 can be arranged at a constant interval even at the boundary between the first region 6a and the second region 6b. The luminance unevenness at is reduced. Furthermore, the efficiency of the mounting operation of the light emitting element 7 is not lowered, and the connection of the wire 8 is facilitated, which is preferable. The third translucent member 9 is formed in a quadrangular ring shape like the frame 5 so that its outline follows the arrangement of the light emitting elements 7, and the rectangular first region whose center substantially coincides with the entire light emitting region 21. It is preferable that 6a and a quadrangular ring-shaped second region 6b surrounding the 6a are partitioned. In the present embodiment, the third translucent member 9 has a concentric shape with the frame 5, but as shown in FIG. 6, the second translucent member such as a cross, an asterisk, or a lattice shape is formed on the first translucent member. If the optical member is separated, its shape is not particularly limited. In the cross or asterisk shape, the third light-transmitting member 39 configured by a straight line partitions the circular light-emitting area into four or eight parts, and the divided mirror-symmetric areas have the same light emission color. If there is, it is preferable to balance the color scheme. That is, it is preferable that the same wavelength conversion member is included in the upper left and lower right, upper right and lower left regions of the partitioned second translucent member 36 (or formed of only translucent resin). Further, as in the embodiment, it is preferable that the third translucent member 39 has a continuous shape because it functions as a weir when the second translucent member 36 is formed. The light extraction efficiency may be improved in the same manner as in the case where the light extraction is not continuous. When formed in the shape of dots or wavy lines, it is possible to finely adjust the emission color.

ここで、連続していない第３透光性部材３９が第２透光性部材３６を分離した状態について図６ｄを用いて説明する。ドット形状であるので、複数の第３透光性部材３９どうしは離間しており、分離領域３０付近では、隣り合う領域の第２透光性部材３６どうしが混合することになる。すなわち、異なる領域の第２透光性部材３６が一部区画されていない状態となる。しかし、分離領域３０を介して、第２透光性部材３６は各領域にほぼ分離されることになるので、この状態を分離した状態とする。このような構成とすることで、十字やアスタリスク形状の第２透光性部材３６を形成する際の、直線の直交部分（重なって一部分厚くなる部分）の発生を回避できるので、発光領域の中心部の色むらや輝度むらの発生を防ぐことができる。また、区画する領域ごとに含有する部材自体の種類は同じで、蛍光体の含有濃度や透光性樹脂の粘度のみが異なる場合など、連続した第３透光性部材３９で確実に第２透光性部材３６を仕切る必要性が低い場合などに好適に用いられる。   Here, a state where the third light transmissive member 39 which is not continuous separates the second light transmissive member 36 will be described with reference to FIG. Because of the dot shape, the plurality of third light transmissive members 39 are separated from each other, and the second light transmissive members 36 in adjacent regions are mixed in the vicinity of the separation region 30. That is, the second light transmissive member 36 in a different region is not partially partitioned. However, since the second translucent member 36 is substantially separated into each region via the separation region 30, this state is assumed to be a separated state. By adopting such a configuration, it is possible to avoid the occurrence of a straight orthogonal portion (a portion that overlaps and becomes thicker) when forming the cross-shaped or asterisk-shaped second translucent member 36. It is possible to prevent color unevenness and luminance unevenness of the part. In addition, the type of the member itself contained in each divided region is the same, and the second transparent member 39 is surely provided by the continuous third transparent member 39, for example, when only the phosphor concentration and the viscosity of the transparent resin are different. It is preferably used when the necessity of partitioning the light member 36 is low.

また、図６ｅのような第２透光性部材３６と第３透光性部材３９とすることもできる。この実施例では、第２透光性部材３６は第３透光性部材３９によって分離しているものの、第３透光性部材３９は直線や点線状に形成されていない。すなわち、第３透光性部材３９は、複数の第２透光性部材３６を囲むようにして分離させている。このような構成は、ある程度の粘度を有する第２透光性部材３６を先に形成し、その離間領域に第３透光性部材３９を充填することで形成できる。このような構成とすることで、第２透光性部材３６と第３透光性部材３９が平坦面に形成できるだけでなく、第３透光性部材３９に左右されることなく所望の位置に第２透光性部材３６を設けることができる。   Moreover, it can also be set as the 2nd translucent member 36 and the 3rd translucent member 39 like FIG. In this embodiment, the second translucent member 36 is separated by the third translucent member 39, but the third translucent member 39 is not formed in a straight line or a dotted line. That is, the third light transmissive member 39 is separated so as to surround the plurality of second light transmissive members 36. Such a configuration can be formed by first forming the second translucent member 36 having a certain degree of viscosity and filling the third translucent member 39 in the separated region. With such a configuration, not only can the second light-transmissive member 36 and the third light-transmissive member 39 be formed on a flat surface, but also at a desired position without being influenced by the third light-transmissive member 39. A second light transmissive member 36 can be provided.

第３透光性部材９は、第１透光性部材３と同様の透光性樹脂材料であるシリコーン樹脂、エポキシ樹脂、ユリア樹脂等を適用することができ、高出力の発光ダイオードを搭載する場合には、特に耐熱性に優れたシリコーン樹脂が好ましい。そして、枠体５と同様に、粘度を調整してペースト状とした前記樹脂材料を第１透光性部材３上に成形し、そのまま凝固して形成される。また、第３透光性部材９は第１透光性部材３上面の平坦な面に設けられることから、第３透光性部材９として予め形成された成形体を接着剤等で設置することもできる。   The third translucent member 9 can be applied with a silicone resin, an epoxy resin, a urea resin, or the like, which is the same translucent resin material as the first translucent member 3, and is equipped with a high-output light emitting diode. In some cases, a silicone resin having particularly excellent heat resistance is preferred. And like the frame 5, the said resin material which adjusted the viscosity and was made into the paste form is shape | molded on the 1st translucent member 3, and it solidifies and forms as it is. Moreover, since the 3rd translucent member 9 is provided in the flat surface of the 1st translucent member 3, the molded object previously formed as the 3rd translucent member 9 is installed with an adhesive agent etc. You can also.

さらに、第３透光性部材９は発光素子７からの出射光を波長変換可能な蛍光体等の波長変換部材を含んでいると好ましい。形成時に高粘度の樹脂材料を用いる場合は、蛍光体が均一に分散するように硬化する。蛍光体等の波長変換部材は、第２透光性部材６と同じものを含んでいてもよいし、異なっていてもかまわない。第３透光性部材９が波長変換部材を含んでいることによって、遮光部材で領域を分離する場合に比べて波長変換できる領域が増えるので、色むらの少ない発光装置を得ることができる。波長変換部材を含有しない場合には、第１領域６ａと第２領域６ｂの光量を均衡化するべく、第１透光性部材３と共に光拡散材を添加してもよい。   Furthermore, it is preferable that the third translucent member 9 includes a wavelength conversion member such as a phosphor capable of converting the wavelength of the light emitted from the light emitting element 7. When a highly viscous resin material is used at the time of formation, the phosphor is cured so as to be uniformly dispersed. The wavelength conversion member such as a phosphor may contain the same material as the second translucent member 6 or may be different. Since the third light-transmissive member 9 includes the wavelength conversion member, the number of regions where the wavelength can be converted is increased as compared with the case where the regions are separated by the light shielding member, so that a light emitting device with less color unevenness can be obtained. When the wavelength conversion member is not included, a light diffusing material may be added together with the first light transmissive member 3 in order to balance the amount of light in the first region 6a and the second region 6b.

第３透光性部材９は、第１透光性部材３からの高さを特に規定しないが、枠体５との間に第２透光性部材６が充填されて第２領域６ｂが形成されるので、枠体５の上面までの高さと略同じであると好ましいが、それよりも低くても高くてもかまわない。また、第３透光性部材９の幅は特に規定せず、所望の高さに形成することができる幅とすればよい。第３透光性部材９に波長変換部材を含有させると、第３透光性部材９の幅が広く第２透光性部材６を充填する領域が狭くなっても、波長変換する光量が維持できる。なお、本実施形態では区画する領域を２つとしたが、それ以上でもよい。第１透光性部材３により平坦面が形成されることで、第３透光性部材９が複数の場合など、複雑な形状の枠であっても、容易に形成することができる。   The third translucent member 9 does not particularly define the height from the first translucent member 3, but the second translucent member 6 is filled with the frame 5 to form the second region 6 b. Therefore, it is preferable that the height to the upper surface of the frame 5 is substantially the same, but it may be lower or higher than that. Moreover, the width | variety of the 3rd translucent member 9 is not prescribed | regulated in particular, What is necessary is just to set it as the width | variety which can be formed in desired height. When the third light transmissive member 9 contains a wavelength conversion member, the amount of light for wavelength conversion is maintained even when the width of the third light transmissive member 9 is wide and the region where the second light transmissive member 6 is filled becomes narrow. it can. In the present embodiment, two areas are defined, but more than that may be used. By forming a flat surface by the first light transmissive member 3, even if it is a frame having a complicated shape, such as when there are a plurality of third light transmissive members 9, it can be easily formed.

第３透光性部材９を遮光性部材で形成してしまうと、その下方に発光素子７が位置する場合、発光素子７から上方へ垂直に出射する光は反射を繰り返すので取り出されない。これを避けるためには、発光素子７を第３透光性部材９の下方近傍を避けて配置する、第１透光性部材３に光拡散材を含有させる、少なくとも第３透光性部材９が形成される第１透光性部材３の表面に凹凸を設ける等の対策をとる必要がある。しかしながら、異なる波長変換部材間の再吸収による光の減衰を防ぐための遮光性の仕切りは、相当に広い幅を有する場合以外は全ての光の再吸収を防ぐことは不可能であり、第３透光性部材９が透光性であるために第１領域ａと第２領域ｂ間において波長変換された光の再吸収は、遮光性部材によって取り出されない光と比べても大きな損失とならない。そして、第３透光性部材９の形成を容易にするために平坦面とした第１透光性部材３の上面に凹凸を設けることは効率的でなく、第１透光性部材３に必ずしも光拡散材を含有しなくても光の取り出し効率を維持できる本構成は、特に好ましいといえる。また、発光素子を第３透光性部材９の下方に設けない構成とすると、色むらや輝度むらの発生に加え、形成精度の問題で配置がずれてしまった場合などに対応できない等の短所が挙げられる。   If the third light-transmissive member 9 is formed of a light-shielding member, when the light-emitting element 7 is positioned below the third light-transmitting member 9, light that is emitted vertically upward from the light-emitting element 7 is repeatedly extracted and is not extracted. In order to avoid this, the light emitting element 7 is disposed avoiding the vicinity of the lower part of the third light transmissive member 9, and the light transmissive material is contained in the first light transmissive member 3, at least the third light transmissive member 9. It is necessary to take measures such as providing unevenness on the surface of the first translucent member 3 on which is formed. However, the light-shielding partition for preventing light attenuation due to reabsorption between different wavelength conversion members cannot prevent reabsorption of all light except when it has a considerably wide width. Since the translucent member 9 is translucent, the reabsorption of light wavelength-converted between the first region a and the second region b does not cause a large loss compared to light that is not extracted by the light-shielding member. . In order to facilitate the formation of the third light transmissive member 9, it is not efficient to provide unevenness on the upper surface of the first light transmissive member 3 which is a flat surface, and the first light transmissive member 3 is not necessarily provided. This configuration that can maintain the light extraction efficiency without containing a light diffusing material is particularly preferable. Further, when the light emitting element is not provided below the third light transmissive member 9, there are disadvantages such as not being able to cope with the occurrence of color unevenness and luminance unevenness as well as the case where the arrangement is shifted due to the problem of formation accuracy. Is mentioned.

（第２透光性部材）
第２透光性部材６は、発光素子７からの出射光を透過する材料で形成される。第３透光性部材９の内側の第１領域６ａ、および第３透光性部材９の外側であって枠体５との間の第２領域６ｂに、それぞれ第１透光性部材３上に液状の樹脂材料を充填して形成される。その高さは、枠体５および第３透光性部材９から流出しない、すなわち、枠体５および第３透光性部材９の上面と略同じまたは低くなるように設けられ、蛍光体等の波長変換部材を含有すると好ましい。 (Second translucent member)
The second light transmissive member 6 is formed of a material that transmits light emitted from the light emitting element 7. On the first light-transmissive member 3, the first region 6 a inside the third light-transmissive member 9 and the second region 6 b outside the third light-transmissive member 9 and between the frame body 5, respectively. And filled with a liquid resin material. Its height does not flow out from the frame 5 and the third translucent member 9, that is, is provided so as to be substantially the same as or lower than the upper surfaces of the frame 5 and the third translucent member 9, It is preferable to contain a wavelength conversion member.

材料としては、前記の第１透光性部材３や第３透光性部材９と同様に透光性樹脂を適用することができ、具体的には、シリコーン樹脂、エポキシ樹脂、ユリア樹脂等が挙げられる。先に形成された枠体５と第３透光性部材９が堰になるので、比較的低粘度の液状の樹脂材料で形成することができ、広い発光領域を封止するには好適である。さらに、低粘度の樹脂材料に蛍光体等の波長変換部材を混合した場合、硬化するまでに蛍光体が沈殿し易く、第１透光性部材３の表面近傍（発光素子７の近く）に偏って分布するので、発光素子７からの光を効率よく変換できる。なお、第２透光性部材６に含まれる波長変換部材は、第１領域６ａと第２領域６ｂで同じでも異なっていてもよく、いずれか一方の領域のみが含んでいてもよい。このような構成としても、第３透光性部材９があるため、異なる波長変換部材どうしが混入したり、波長変換部材を含有しない領域へ流入したりしない。また、前記の第３透光性部材９と同じ波長変換部材を含んでいてもよい。以下、第３透光性部材９、第２透光性部材６に含有させる蛍光体等の波長変換部材について説明する。   As the material, a translucent resin can be applied in the same manner as the first translucent member 3 and the third translucent member 9, and specifically, silicone resin, epoxy resin, urea resin, etc. Can be mentioned. Since the frame 5 and the third translucent member 9 formed previously serve as a weir, they can be formed of a liquid resin material having a relatively low viscosity, which is suitable for sealing a wide light emitting region. . Furthermore, when a wavelength conversion member such as a phosphor is mixed with a low-viscosity resin material, the phosphor is likely to precipitate before curing, and is biased to the vicinity of the surface of the first light-transmissive member 3 (near the light emitting element 7). Therefore, the light from the light emitting element 7 can be converted efficiently. In addition, the wavelength conversion member contained in the 2nd translucent member 6 may be the same or different in the 1st area | region 6a and the 2nd area | region 6b, and may contain only any one area | region. Even in such a configuration, since there is the third translucent member 9, different wavelength conversion members are not mixed in or do not flow into a region not containing the wavelength conversion member. Moreover, the same wavelength conversion member as the said 3rd translucent member 9 may be included. Hereinafter, wavelength conversion members such as phosphors contained in the third light transmissive member 9 and the second light transmissive member 6 will be described.

（波長変換部材（蛍光体））
波長変換部材としては、発光素子７の光の少なくとも一部を吸収して異なる波長の光に変換するものであり、蛍光体が特に好適に用いられる。蛍光体は公知の材料を適用すればよく、例えばＹ（イットリウム）とＡｌ（アルミニウム）の複合酸化物（Ｙ３Ａｌ５Ｏ１２）から成るガーネット構造の結晶であるＹＡＧ系蛍光体や、Ｅｕ，Ｃｅ等のランタノイド系元素で主に賦活された、窒化物系蛍光体、酸窒化物系蛍光体等を用いることができる。これらの材料から、発光素子７の発光色と組み合わせて、第１領域６ａ、第２領域６ｂから照射する光が所望の色となるように選択する。例えば、青色の光によって緑色や黄色を発光するＹＡＧ系、ＬＡＧ系蛍光体やクロロシリケート蛍光体、赤色を発光する（Ｓｒ,Ｃａ）ＡｌＳｉＮ３:Ｅｕ等のＳＣＡＳＮ系蛍光体、ＣａＡｌＳｉＮ３:Ｅｕ等のＣＡＳＮ系蛍光体が挙げられ、２種類以上の蛍光体を混合して用いてもよいが、波長変換された光が他方の蛍光体に再吸収されて取り出し効率が低下しないように、区画された１領域には１種類の蛍光体を含んでいることが好ましい。すなわち、一方の蛍光体の発光波長と他方の蛍光体の吸収波長が重なる場合は、別の領域に含有させるようにすることで、発光装置の輝度を維持することができる。なお、波長変換部材は蛍光体に限定されるものではなく、前記の透光性部材も樹脂に限定されるものではない。また、各領域によって異なる蛍光体を含有させる場合は、発光素子７の発光に対する変換効率が低く、より多量の蛍光体を必要とする方を、発光装置１００の中心近傍に配置すると好ましい。その他、各種部材に所望に応じて着色料、光拡散材、フィラー等を含有させてもよい。 (Wavelength conversion member (phosphor))
As the wavelength conversion member, at least a part of the light of the light emitting element 7 is absorbed and converted into light of a different wavelength, and a phosphor is particularly preferably used. A known material may be applied to the phosphor, for example, a YAG-based phosphor that is a garnet-structured crystal composed of a composite oxide of Y (yttrium) and Al (aluminum) (Y 3 Al 5 O 12 ), Eu, Nitride-based phosphors, oxynitride-based phosphors and the like mainly activated with a lanthanoid-based element such as Ce can be used. From these materials, the light emitted from the first region 6a and the second region 6b is selected so as to have a desired color in combination with the emission color of the light-emitting element 7. For example, YAG-based, LAG-based phosphors and chlorosilicate phosphors that emit green and yellow by blue light, SCASN-based phosphors such as (Sr, Ca) AlSiN 3 : Eu that emit red light, CaAlSiN 3 : Eu, etc. CASSN phosphors may be used, and two or more types of phosphors may be used in combination. However, the wavelength-converted light is re-absorbed by the other phosphor so that the extraction efficiency does not decrease. In addition, it is preferable that one region contains one type of phosphor. That is, when the emission wavelength of one phosphor and the absorption wavelength of the other phosphor overlap, the brightness of the light-emitting device can be maintained by including the phosphor in another region. Note that the wavelength conversion member is not limited to a phosphor, and the above-described translucent member is not limited to a resin. In addition, when phosphors different in each region are contained, it is preferable that the conversion efficiency with respect to the light emission of the light emitting element 7 is low and the one requiring a larger amount of the phosphor is disposed near the center of the light emitting device 100. In addition, you may make a various member contain a coloring agent, a light-diffusion material, a filler, etc. as desired.

＜発光装置の製造方法＞
次に、本発明の実施形態に係る発光装置１００の製造方法の一例を説明する。発光装置１００は、大まかには一般的な半導体素子のＣＯＢパッケージや従来の発光装置と同様の方法で製造できる。 <Method for manufacturing light emitting device>
Next, an example of a method for manufacturing the light emitting device 100 according to the embodiment of the present invention will be described. The light-emitting device 100 can be manufactured by a method similar to that of a general semiconductor element COB package or a conventional light-emitting device.

まず、基板１Ａの上面に、無電解めっきで金属を所定の形状にパターニングした導電部材２０および反射層２９を形成する。このとき、識別マークおよび認識マーク（不図示）を形成してもよい。   First, the conductive member 20 and the reflective layer 29 are formed by patterning a metal into a predetermined shape by electroless plating on the upper surface of the substrate 1A. At this time, an identification mark and a recognition mark (not shown) may be formed.

次に、基板１Ａ上の実装領域２２に所定の間隔で形成された反射層２９に、接合部材で発光素子７を配列する。また、保護素子Ｈを導電配線２３ｂ上の所定位置に搭載する。そして、ワイヤボンディングにより、搭載した発光素子７および保護素子Ｈのそれぞれのパッド電極または反射層２９にワイヤ８を接続し、導電配線２３ｂ，２４ｂへ電気的に接続する。   Next, the light emitting elements 7 are arranged with a bonding member on the reflective layer 29 formed at a predetermined interval in the mounting region 22 on the substrate 1A. Further, the protection element H is mounted at a predetermined position on the conductive wiring 23b. Then, the wire 8 is connected to the pad electrode or the reflective layer 29 of the mounted light emitting element 7 and the protection element H by wire bonding, and is electrically connected to the conductive wirings 23b and 24b.

次に、枠体５および第１透光性部材３を形成する。詳しくは、枠体５の平面視形状に合わせた環形状の吐出口（ノズル）を備えた樹脂吐出装置にて、ペースト状の樹脂材料を基板１Ａ上の枠体５の形成位置に吐出し、熱処理等の樹脂材料に対応した処理により硬化または凝固させる。あるいは、枠体５の幅に合わせた口径の吐出口で、基板１Ａを枠体５の平面視形状に合わせて長方形を描くように水平に移動させながら、樹脂材料を吐出して形成することもできる。このように形成することで、金型を使用しないので生産コストが抑えられ、樹脂の吐出量、吐出装置あるいは基板の移動等を変更するだけで所望の枠体５及び第１透光性部材３を形成することが可能である。また、実施形態１では枠体５は１層からなるが、これに限らず２層以上の構成としてもかまわない。本実施形態のように１層構造とすると、形成工程が複雑にならず、積層部の精度や強度の問題も発生しにくい。   Next, the frame 5 and the first translucent member 3 are formed. Specifically, in a resin discharge device having a ring-shaped discharge port (nozzle) that matches the shape of the frame 5 in plan view, a paste-like resin material is discharged to the formation position of the frame 5 on the substrate 1A. It is cured or solidified by a treatment corresponding to the resin material such as heat treatment. Alternatively, it may be formed by discharging the resin material while moving the substrate 1A horizontally so as to draw a rectangle in accordance with the planar view shape of the frame body 5 with a discharge port having a diameter matched to the width of the frame body 5. it can. By forming in this way, the production cost can be reduced because no mold is used, and the desired frame 5 and the first light-transmissive member 3 can be simply changed by changing the resin discharge amount, the discharge device or the movement of the substrate, and the like. Can be formed. In the first embodiment, the frame 5 is composed of one layer. However, the configuration is not limited to this, and a configuration having two or more layers may be used. When the single-layer structure is used as in the present embodiment, the formation process is not complicated, and the problems of accuracy and strength of the laminated portion are less likely to occur.

続いて、枠体５の内側の発光素子７の実装領域２２に、所望の光拡散材等を含有させた第１透光性部材３を発光素子７およびワイヤ８を覆うように充填し、必要に応じて熱処理や光照射等の処理により硬化させて第１透光性部材３を形成する。ここで、第１透光性部材３の光出射側の上面は、平面状であると第３透光性部材９が形成しやすく好ましいが、平面状でなくてもかまわない。凹凸状に加工すると、発光素子７からの光が拡散されて第２透光性部材６および第３透光性部材９へ均一に到達しやすくなる。   Subsequently, the mounting region 22 of the light emitting element 7 inside the frame 5 is filled with the first light transmissive member 3 containing a desired light diffusing material or the like so as to cover the light emitting element 7 and the wire 8. Accordingly, the first translucent member 3 is formed by curing by heat treatment or light irradiation. Here, the upper surface of the first light transmissive member 3 on the light emitting side is preferably flat, but the third light transmissive member 9 is preferably formed, but may not be flat. When processed into a concavo-convex shape, the light from the light emitting element 7 is diffused and easily reaches the second light transmissive member 6 and the third light transmissive member 9 uniformly.

次に、第１透光性部材３の上面に第３透光性部材９を形成する。形成方法は、枠体５とほぼ同様とすることができる。また、枠体５の上面までと略同じ高さとすると、第２透光性部材６の形成において好ましく、発光装置の上面が略同一面にあると光の出射が均一になり好適である。枠体５および第３透光性部材９は、所望の高さに調整するために適宜切削等を行ってもかまわない   Next, the third light transmissive member 9 is formed on the upper surface of the first light transmissive member 3. The formation method can be substantially the same as that of the frame 5. In addition, when the height is approximately the same as the upper surface of the frame body 5, it is preferable in forming the second light-transmissive member 6, and when the upper surface of the light emitting device is substantially in the same plane, light emission is uniform. The frame body 5 and the third translucent member 9 may be appropriately cut in order to adjust to a desired height.

最後に、第３透光性部材９の内側と枠体５と第３透光性部材９の間に第２透光性部材６を形成することで、発光装置１００が完成する。所望の波長変換部材（ここでは蛍光体とする）を含有させた透光性樹脂材料を、第１領域６ａおよび第２領域６ｂに充填して硬化する。第２透光性部材６は、第１領域６ａと第２領域６ｂで充填、硬化のタイミングは特に限定されず、同時に行っても別々でもよい。また、第１領域６ａと第２領域６ｂで含有する蛍光体が異なっていることが好ましい。例えば、青色の発光素子７を用い、第１領域６ａにＣＡＳＮ系蛍光体（赤色蛍光物質）、第２領域６ｂにＹＡＧ系蛍光体（黄色蛍光物質）を含有させたシリコーン樹脂をそれぞれ充填して第２透光性部材６を形成すると、発光波長と吸収波長が重なる２種類の蛍光体が別々の領域に含まれるので、波長変換された光の再吸収が少なく光損失が抑えられ、演色性の高い白色光を得ることができる。さらに、第３透光性部材９を第２領域６ｂと同じＹＡＧ系蛍光体（黄色蛍光物質）を含有させたシリコーン樹脂で形成することで、形成の効率が良くなる他に、光が無駄なく変換され、より短波長な蛍光体が含まれる領域が外側に広く存在することになり好ましい（第２領域６ａと同じ蛍光体を含む第３透光性部材９としてもかまわない）。また、本実施形態のように、含む蛍光体が異なる界面（第１領域６ａと第３透光性部材９の境界）が、発光素子７の配列に沿うように形成されていると、所望の色調を得やすく好ましい。その他、第２透光性部材６や第３透光性部材９の面積や蛍光体等の含有物の割合、各領域に係る発光素子の種類や搭載個数等を適宜調整することで、所望の発光色や輝度を有する発光装置とすることが可能である。また、実施形態では区画される領域を２つとしたが、それ以上に区画してもよい。また、枠体５、第１透光性部材３、第２透光性部材６、第３透光性部材９等は半硬化状態で用いてもかまわない。   Finally, the second light transmissive member 6 is formed between the inside of the third light transmissive member 9, the frame 5, and the third light transmissive member 9, thereby completing the light emitting device 100. A translucent resin material containing a desired wavelength conversion member (here, a phosphor) is filled in the first region 6a and the second region 6b and cured. The timing of filling and curing the second light-transmissive member 6 in the first region 6a and the second region 6b is not particularly limited, and may be performed simultaneously or separately. Moreover, it is preferable that the phosphors contained in the first region 6a and the second region 6b are different. For example, the blue light-emitting element 7 is used, and the first region 6a is filled with a silicone resin containing a CASN phosphor (red phosphor) and the second region 6b contains a YAG phosphor (yellow phosphor). When the second translucent member 6 is formed, two types of phosphors whose emission wavelength and absorption wavelength overlap are included in separate regions, so that re-absorption of wavelength-converted light is reduced, and light loss is suppressed, and color rendering properties are reduced. High white light can be obtained. Furthermore, by forming the third translucent member 9 with a silicone resin containing the same YAG phosphor (yellow fluorescent substance) as the second region 6b, the formation efficiency is improved and light is not wasted. It is preferable that a region containing a phosphor having a shorter wavelength is converted on the outside widely (the third translucent member 9 including the same phosphor as the second region 6a may be used). In addition, as in the present embodiment, when the interface (the boundary between the first region 6a and the third light transmissive member 9) having different phosphors is formed so as to follow the arrangement of the light emitting elements 7, a desired It is preferable to obtain a color tone. In addition, by appropriately adjusting the area of the second translucent member 6 and the third translucent member 9, the ratio of inclusions such as phosphors, the type and the number of mounted light emitting elements in each region, etc. A light emitting device having a light emitting color and luminance can be obtained. In the embodiment, two regions are divided, but more regions may be divided. Further, the frame body 5, the first light transmissive member 3, the second light transmissive member 6, the third light transmissive member 9 and the like may be used in a semi-cured state.

透光性部材は、上述のように第１透光性部材３、第３透光性部材９、第２透光性部材６の順番で形成されると、効率がよく好ましい。すなわち、この順番で形成することで第３透光性部材９が第２透光性部材６を充填する際の仕切りとなるので、第２透光性部材６の形成が容易となる。   If the translucent member is formed in the order of the first translucent member 3, the third translucent member 9, and the second translucent member 6 as described above, the efficiency is preferable. That is, by forming in this order, the third translucent member 9 serves as a partition when filling the second translucent member 6, so that the second translucent member 6 can be easily formed.

以上のように発光装置１００は、第１透光性部材で発光素子が被覆されていることにより、空気層が存在せず、第２透光性部材への光入射面においてむだな光反射が抑制でき光取り出し効率が向上するだけでなく、発光素子が第１透光性部材で満たされるため、その上面に形成される第２透光性部材を分離する第３透光性部材の仕切りが平坦面に容易に形成できる。従って、発光素子の配列や個数を仕切りの形成に配慮して制限する必要がなく、仕切りの形状・配置・数等の選択の自由度も高くなる。また、第３透光性部材の形成面を平坦面とすることができるので、形成の精度を維持しやすく、信頼性が高く効率の良い発光装置とすることが可能である。また、第１透光性部材３、第３透光性部材９、第２透光性部材６の順に形成することで、部材を効率的に形成できる。したがって、光損失を抑えた高輝度で演色性の高い発光装置を、効率的に得ることが可能である。   As described above, in the light emitting device 100, since the light emitting element is covered with the first light transmissive member, there is no air layer and unnecessary light reflection on the light incident surface to the second light transmissive member. Not only can the light extraction efficiency be improved, but also the light emitting element is filled with the first light transmissive member, so the partition of the third light transmissive member separating the second light transmissive member formed on the upper surface is provided. It can be easily formed on a flat surface. Therefore, it is not necessary to limit the arrangement and number of light emitting elements in consideration of the formation of the partitions, and the degree of freedom in selecting the shape, arrangement, number, etc. of the partitions is increased. In addition, since the formation surface of the third light-transmitting member can be a flat surface, the formation accuracy can be easily maintained, and a highly reliable and efficient light-emitting device can be obtained. Moreover, a member can be formed efficiently by forming in order of the 1st translucent member 3, the 3rd translucent member 9, and the 2nd translucent member 6. FIG. Therefore, it is possible to efficiently obtain a light emitting device with high luminance and high color rendering with reduced light loss.

＜実施形態２＞
以下、実施形態２に係る発光装置２００について、図３を参照して説明する。実施形態１に係る発光装置１００と同一の要素については同じ符号を付して説明を省略する。実施形態２に係る発光装置２００は、図３ｂに示すように、枠体３５が円環形状であるので発光領域３１は円形になる。また、発光色の異なる発光素子３７ａ，３７ｂが２種類搭載されており、第３透光性部材３９は蛍光体を含まず第１領域３６ａと同じ材料で構成され、枠体３５が２層に形成されていることが、第１実施形態と異なっており、これらの相違点について主に詳説する。 <Embodiment 2>
Hereinafter, the light-emitting device 200 according to Embodiment 2 will be described with reference to FIG. The same elements as those of the light emitting device 100 according to Embodiment 1 are denoted by the same reference numerals, and description thereof is omitted. In the light emitting device 200 according to the second embodiment, as illustrated in FIG. 3B, the light emitting region 31 is circular because the frame body 35 has an annular shape. In addition, two types of light emitting elements 37a and 37b having different emission colors are mounted. The third translucent member 39 does not include a phosphor and is made of the same material as the first region 36a. The frame body 35 has two layers. The formation is different from the first embodiment, and these differences will be mainly described in detail.

発光装置２００は、基板１Ｂ上の枠体３５内側の実装領域３２に、発光色の異なる２種類の発光素子３７ａ，３７ｂが搭載される。発光素子３７ａ，３７ｂは、平面視長方形の同一形状で上面に一対の電極２０が形成される。発光素子３７ａ，３７ｂは、長手方向を図３における横方向に、かつｐ電極を左側に向きを揃えて、実装領域の中央に９個×８列をマトリクス状に、その上下に各３列を横方向に半ピッチずらし、計１４列に配列され、さらに配列の左右両端の各３個を右に９０°回転して配置される。従って、計１１０個の発光素子３７ａ，３７ｂが左右上下対称に、均等かつ効率的に実装領域３２に搭載され、実施形態１と同様に第１透光性部材３３で被覆される。発光素子３７ａは後記する第１領域３６ａに対応するように５０個、３７ｂは第２領域３６ｂに対応するように６０個搭載されており、それらをワイヤ３８にて５個と６個の計１１個ずつで一組として直列に接続し、１０組を並列に接続する。また、配列の端の導電配線２３ｂ，２４ｂへ直接接続しない発光素子については、隣の発光素子のパッド電極へワイヤ３８を接続する。従って、ワイヤ３８の両端の接続位置の高低差が小さく、発光素子３７ａ，３７ｂの間隔が比較的短く配列されても、ワイヤボンディングが容易である。ここで、例えば発光素子３７ａを赤色ＬＥＤ（発光波長６２０〜７５０ｎｍ）、３７ｂを青色ＬＥＤ（発光波長４３０〜４９０ｎｍ）とし、赤色ＬＥＤは波長変換せず（第３透光性部材３９と第２透光性部材３６の第１領域３６ａは蛍光体を含まず）、青色ＬＥＤはＹＡＧ系蛍光体により白色光を発光するようにすると、青色みがかった白色光に赤色光が混色して白熱電球光に近い光が得られる。   In the light emitting device 200, two types of light emitting elements 37a and 37b having different emission colors are mounted on the mounting region 32 inside the frame 35 on the substrate 1B. The light emitting elements 37a and 37b have the same rectangular shape in plan view, and a pair of electrodes 20 are formed on the upper surface. The light emitting elements 37a and 37b are arranged in the form of a matrix of 9 × 8 columns in the center of the mounting area with the longitudinal direction in the horizontal direction in FIG. It is arranged in a total of 14 rows, shifted by a half pitch in the horizontal direction, and further arranged by rotating each of the three at the left and right ends of the array by 90 ° to the right. Therefore, a total of 110 light emitting elements 37a and 37b are mounted on the mounting region 32 in a symmetrical manner in the left / right and up / down symmetry, and are covered with the first light transmissive member 33 as in the first embodiment. 50 light emitting elements 37a are mounted so as to correspond to a first area 36a described later, and 60 light emitting elements 37b are mounted so as to correspond to a second area 36b. One set is connected in series as a set, and 10 sets are connected in parallel. For light emitting elements that are not directly connected to the conductive wires 23b and 24b at the end of the array, the wires 38 are connected to the pad electrodes of the adjacent light emitting elements. Therefore, even if the height difference between the connection positions of the both ends of the wire 38 is small and the intervals between the light emitting elements 37a and 37b are arranged relatively short, wire bonding is easy. Here, for example, the light emitting element 37a is a red LED (light emitting wavelength 620 to 750 nm), 37b is a blue LED (light emitting wavelength 430 to 490 nm), and the red LED does not perform wavelength conversion (the third light-transmissive member 39 and the second light transmitting member). The first region 36a of the light member 36 does not include a phosphor), and when the blue LED emits white light by a YAG phosphor, the red light is mixed with the bluish white light and the incandescent light Light close to is obtained.

実施形態２では、枠体３５が２層構造になっており、下層で導電配線や保護素子Ｈを基板１Ｂ上で直接被覆し、第１透光性部材３３を充填するための枠体３５ａと、枠体３５ａ上に設けられて主に第２透光性部材３６を充填するための枠体３５ｂを備えている。この場合、基板１Ｂに直接設置される下側の枠体３５ａを形成した後に、第１透光性部材３３を充填し、枠体３５ａに重ねるように所望の高さの枠体３５ｂを積層する。形成方法は第１実施形態の枠体５とほぼ同様とすることができ、第３透光性部材３９を同時に形成することもできる。枠体３５を２層構造とすることで、第１透光性部材３３が枠体３５上面まで這い上がるのを防ぐことができる。すなわち、枠体３５ａ，３５ｂを先に（もしくは１層として）形成してから第１透光性部材３３を充填すると、第１透光性部材３３が枠体３５の上面まで這い上がり、波長変換されない光が発光装置２００から漏れだす可能性がある。それに対して本実施形態のような構成とすると、色むらや輝度むらの少ない信頼性の高い発光装置２００を得ることができる。また、枠体３５を１層で形成すると、第１透光性部材３の這い上がりを考慮してある程度の高さを確保しなければならない。従って、高粘度の樹脂を使用しなければならないが、２層構造とすると粘度の制限が緩和されるだけでなく、透光性樹脂の這いあがりを防止しつつ、枠体３５の高さを最小限にすることも可能である。また、枠体の高さを十分に高くして樹脂の這い上がりを防ぐ以外には、最外側にある発光素子との間に一定の距離を確保する方法もあるが、枠体を２層に形成することで無駄な距離を短縮し発光装置を小型化することができる。さらに、第２透光性部材３６や第３透光性部材３９の高さに応じて高さを調節でき、枠体３５ａ，３５ｂで材料や含有物を適宜選択することができるので、容易に所望の発光装置とすることが可能である。   In the second embodiment, the frame 35 has a two-layer structure, and a frame 35a for directly covering the substrate 1B with the conductive wiring and the protective element H on the lower layer and filling the first translucent member 33; The frame body 35b is provided on the frame body 35a and mainly filled with the second translucent member 36. In this case, after forming the lower frame 35a that is directly installed on the substrate 1B, the first light-transmissive member 33 is filled, and the frame 35b having a desired height is stacked so as to overlap the frame 35a. . The forming method can be substantially the same as that of the frame 5 of the first embodiment, and the third light transmissive member 39 can be formed simultaneously. By making the frame 35 have a two-layer structure, it is possible to prevent the first light transmissive member 33 from climbing up to the upper surface of the frame 35. That is, when the frame members 35a and 35b are formed first (or as one layer) and then filled with the first light transmissive member 33, the first light transmissive member 33 rises up to the upper surface of the frame member 35, and wavelength conversion is performed. There is a possibility that light that is not leaked from the light emitting device 200. On the other hand, with the configuration as in this embodiment, a highly reliable light-emitting device 200 with little color unevenness and brightness unevenness can be obtained. In addition, when the frame body 35 is formed with one layer, it is necessary to ensure a certain height in consideration of the scooping up of the first light transmissive member 3. Therefore, a high-viscosity resin must be used. However, when the two-layer structure is used, not only the limitation of the viscosity is relaxed, but also the height of the frame 35 is minimized while preventing the translucent resin from creeping up. It is also possible to limit. In addition to making the height of the frame sufficiently high to prevent the resin from creeping up, there is a method of securing a certain distance from the light emitting element on the outermost side, but the frame is made up of two layers. By forming, a useless distance can be shortened and a light emitting device can be downsized. Further, the height can be adjusted according to the height of the second light transmissive member 36 and the third light transmissive member 39, and materials and inclusions can be appropriately selected by the frame bodies 35a and 35b. A desired light-emitting device can be obtained.

さらに発光装置２００は、枠体３５ａに充填された第１透光性部材３３の上に、枠体３５と同心円状の円環形状で小さい第３透光性部材３９を備えており、第２透光性部材３６は、その中心が発光領域全体の中心と略一致する円形の第１領域３６ａとこれを囲む円環形状の第２領域３６ｂとに区画される。本実施形態においては、第３透光性部材３９が平面視で曲線状に形成されているため、発光素子３７ａ，３７ｂは一部が、蛍光体を含む領域と含まない領域の界面（第３透光性部材３９と第２領域３６ｂの境界）を跨いで載置される。また、本実施形態の第３透光性部材３９は蛍光体を含んでおらず、第１領域３６ａと同様に発光素子３７ａからの光を波長変換せずに発光領域３１に出射する。第３透光性部材３９は第１領域３６ａと同じ材料で構成されると、使用する材料が少数で済み好ましいが、材料や粘度は異なっていてもかまわない。   The light emitting device 200 further includes a small third light-transmissive member 39 that is concentric with the frame body 35 and is small on the first light-transmissive member 33 filled in the frame body 35a. The translucent member 36 is divided into a circular first region 36a whose center substantially coincides with the center of the entire light emitting region, and an annular second region 36b surrounding the first region 36a. In the present embodiment, since the third translucent member 39 is formed in a curved shape in plan view, a part of the light emitting elements 37a and 37b is an interface between the region including the phosphor and the region not including the phosphor (third It is placed straddling the translucent member 39 and the second region 36b. Further, the third light transmissive member 39 of the present embodiment does not include a phosphor, and emits light from the light emitting element 37a to the light emitting region 31 without wavelength conversion as in the first region 36a. The third translucent member 39 is preferably made of the same material as that of the first region 36a, but a small amount of material may be used. However, the material and viscosity may be different.

上記の相違する構成および形成方法以外は、実施形態１と同様とすることもできるし、異なっていてもかまわない。所望の発光装置に合わせて、構成や形成方法を適宜組み合わせることができる。   Except for the above-described different configuration and formation method, it may be the same as or different from that of the first embodiment. A structure and a formation method can be combined as appropriate depending on a desired light-emitting device.

以上のように、実施形態２に係る発光装置２００は、第１透光性部材を設けることによって、均等に配列された発光素子のそれぞれの位置に関係なく、任意の平面視形状に形成された第３透光性部材によって区画された照射領域毎に、異なる色に配色された光を照射する。従って、特に円形等の曲線からなる形状に発光領域が区画されても、発光素子を隣り合う照射領域の間で間隔を空けて配列したり、搭載個数を減らしたりする必要がないため、照射領域全体として輝度が均一かつ照射される光量が多い発光装置となる。また、枠体が２層からなり、最下層の枠体、第１透光性部材、最下層の上に積層される２層目の枠体、の順番で形成されることにより、第１透光性部材の這い上がりが起こらず、波長変換されないままの出射光の漏れ出しを防ぎ、色むらのない小型の発光装置とすることができる。   As described above, the light emitting device 200 according to Embodiment 2 is formed in an arbitrary plan view shape by providing the first light transmissive member, regardless of the positions of the light emitting elements arranged evenly. For each irradiation region partitioned by the third light transmissive member, light arranged in different colors is irradiated. Therefore, even if the light emitting region is partitioned into a shape made of a curve such as a circle, it is not necessary to arrange the light emitting elements at intervals between adjacent irradiation regions or to reduce the number of mounted light emitting regions. As a whole, the light emitting device has a uniform luminance and a large amount of light to be irradiated. Further, the frame body is composed of two layers, and is formed in the order of the lowermost frame body, the first light-transmissive member, and the second-layer frame body laminated on the lowermost layer. The light-emitting member does not crawl up, and leakage of emitted light that is not wavelength-converted can be prevented, so that a small light-emitting device without color unevenness can be obtained.

＜実施形態３＞
実施形態１，２では、平板状の支持基板に発光素子を載置した発光装置について説明したが、本実施形態のように、凹部を形成する側壁を有した支持体を適用することもできる。すなわち、図４に示すように、発光素子４７が正負一対のリード電極４２上に配置され、発光素子４７を収納する凹部を有するパッケージ４５が設けられる。このパッケージ４５は、実施形態１，２の枠体及び基板に相当し、第１透光性部材４３と第２透光性部材４６を充填する際の堰となる。以下、特に実施形態１，２と異なる点について詳説する。なお、図４ではワイヤは図示せずに省略している。 <Embodiment 3>
Although Embodiment 1 and 2 demonstrated the light-emitting device which mounted the light emitting element in the flat support substrate, the support body which has the side wall which forms a recessed part like this embodiment is also applicable. That is, as shown in FIG. 4, a light emitting element 47 is disposed on a pair of positive and negative lead electrodes 42, and a package 45 having a recess for housing the light emitting element 47 is provided. The package 45 corresponds to the frame body and the substrate of the first and second embodiments, and serves as a weir when the first light transmissive member 43 and the second light transmissive member 46 are filled. Hereinafter, the differences from Embodiments 1 and 2 will be described in detail. In FIG. 4, the wires are omitted from illustration.

リード電極４２は、発光装置３００の外部から発光素子４７に電力を供給する導電体であり、発光素子４７と電気的に接続する部材であるワイヤやバンプ等との接触性及び電気伝導性が良いことが求められる。具体的な電気抵抗としては、３００μΩ・ｃｍ以下が好ましく、より好ましくは３μΩ・ｃｍ以下である。材料としては、Ｆｅ、Ｃｕ、Ｆｅ入りＣｕ、Ｓｎ入りＣｕ及びＡｌ等が好適に挙げられる。リード電極４２の表面は、Ｐｄを材料とする金属により、鍍金やスパッタリング等の方法により被覆されていることが好ましい。これにより、発光素子４７を搭載したときにリード電極４２表面における光反射率を向上させることができる。本実施形態に係るリード電極は、一方の端部がパッケージ側面から内部に挿入され、他方の端部がパッケージ側面から突出するように一体成型されており、少なくとも端部の一部がパッケージに被覆されている。正のリード電極４２ａと負のリード電極
４２ｂの間は、分離部４４によって離間している。 The lead electrode 42 is a conductor that supplies power to the light emitting element 47 from the outside of the light emitting device 300, and has good contact and electrical conductivity with wires, bumps, and the like that are members electrically connected to the light emitting element 47. Is required. The specific electric resistance is preferably 300 μΩ · cm or less, more preferably 3 μΩ · cm or less. Preferred examples of the material include Fe, Cu, Fe-containing Cu, Sn-containing Cu, and Al. The surface of the lead electrode 42 is preferably coated with a metal made of Pd by a method such as plating or sputtering. Thereby, when the light emitting element 47 is mounted, the light reflectance on the surface of the lead electrode 42 can be improved. The lead electrode according to the present embodiment is integrally molded so that one end is inserted into the inside from the side of the package and the other end protrudes from the side of the package, and at least a part of the end covers the package. Has been. The positive lead electrode 42 a and the negative lead electrode 42 b are separated from each other by the separation portion 44.

本実施形態のパッケージ４５は、発光素子４７、第１，２透光性部材４３，４６、第３透光性部材４９等を配置する支持体で、正負一対のリード電極４２と、そのリード電極４２を絶縁して保持する支持部を備える部材である。パッケージ４５は、リードフレームに成型材料を射出成型で形成すると、効率的に形成でき好ましい。材料は特に限定されず、液晶ポリマー、ポリフタルアミド樹脂、ポリブチレンテレフタート（ＰＢＴ）等とすることができる。特に、ポリフタアルアミド樹脂のように高融点結晶が含有されてなる半結晶性ポリマー樹脂は、例えば第１，２透光性部材４３，４６や第３透光性部材４９を形成するエポキシ樹脂やシリコーン樹脂との密着性が良好なため、パッケージの材料として好適に利用される。また、発光素子４７からの光の反射率を向上させるために、成形材料にＴｉＯ２等の反射材料を含有させてもよい。 The package 45 of this embodiment is a support body on which the light emitting element 47, the first and second light transmissive members 43 and 46, the third light transmissive member 49, and the like are arranged. The pair of positive and negative lead electrodes 42 and the lead electrodes thereof. It is a member provided with the support part which insulates and hold | maintains 42. The package 45 is preferably formed by forming a molding material on the lead frame by injection molding. The material is not particularly limited, and may be a liquid crystal polymer, polyphthalamide resin, polybutylene terephthalate (PBT), or the like. In particular, a semi-crystalline polymer resin containing a high melting point crystal such as a polyphthalamide resin is, for example, an epoxy resin that forms the first and second translucent members 43 and 46 and the third translucent member 49. Since it has good adhesion to silicon and silicone resin, it is suitably used as a package material. Further, in order to improve the reflectance of light from the light emitting element 47, the molding material may contain a reflective material such as TiO 2 .

図４ａに示すように、パッケージ４５の開口部は円形であるので、実施形態２と同様に発光領域４１は円形になる。また、前記のように、パッケージ４５は実施形態１，２の枠体に相当するため、発光素子４７が搭載されるリード電極上面からパッケージ開口部の上面までの高さは、第３透光性部材４９および第２透光性部材４６の高さと略同じまたは高いことが望ましい。さらに、本実施形態のように金型を用いてパッケージを形成する場合は、金型で所望の形状に成型することで、実施形態２のように工程を増やすことなく第１透光性部材４３の這い上がりを防ぎ、信頼性の高い発光装置３００とすることが可能である。すなわち、リード電極４２の端部上面をパッケージで被覆する際、被覆部４０の上面を発光素子４７やワイヤ８の上面以上の高さになるように、かつ、パッケージ全体の高さよりも低くなるように設けることで、段差や傾斜が形成され、這い上がりが起こらないように第１透光性部材４３を充填することができる。例えば、図４ｂのようにパッケージが断面視で略Ｌ字になるように設けると、第１透光性部材４３を被覆部４０の上面まで充填することで、パッケージ全体の上面まで這い上がることがなく、波長変換されない光が不本意に漏れ出すことがなく好ましい。なお、本実施形態における凹部を有するパッケージは、平板状の支持体に貫通孔を有する板材を配置することにより形成してもよい。   As shown in FIG. 4a, since the opening of the package 45 is circular, the light emitting region 41 is circular as in the second embodiment. As described above, since the package 45 corresponds to the frame of the first and second embodiments, the height from the upper surface of the lead electrode on which the light emitting element 47 is mounted to the upper surface of the package opening is the third translucent property. It is desirable that the height of the member 49 and the second translucent member 46 be substantially the same as or higher than the height. Furthermore, when forming a package using a metal mold | die like this embodiment, it shape | molds in a desired shape with a metal mold | die, without increasing a process like Embodiment 2, the 1st translucent member 43 is used. Thus, the light emitting device 300 with high reliability can be obtained. That is, when the upper surface of the end portion of the lead electrode 42 is covered with the package, the upper surface of the covering portion 40 is set to be higher than the upper surfaces of the light emitting elements 47 and the wires 8 and lower than the height of the entire package. By providing the first transparent member 43, the first translucent member 43 can be filled so that a step or inclination is formed and no scooping occurs. For example, when the package is provided so as to be substantially L-shaped in a cross-sectional view as shown in FIG. 4B, the first translucent member 43 is filled up to the upper surface of the covering portion 40, so that the package can rise up to the upper surface of the entire package. In addition, light that is not wavelength-converted is preferable because it does not leak unintentionally. In addition, you may form the package which has a recessed part in this embodiment by arrange | positioning the board | plate material which has a through-hole in a flat support body.

実施形態３では、リード電極上に接着剤を配置し、パッケージ４５の開口部（発光領域４１）に対応するように発光素子４７を３１個接着している。発光素子４７は、実施形態１，２と同様のものを適用できる。接着剤は、導電性接着剤や絶縁性接着剤から選択され、種類や材料は特に限定されない。導電性接着剤は、例えば、Ａｕ、Ａｇ、Ｂｉ、Ｃｕ、Ｉｎ、Ｐｂ、Ｓｎ、Ｚｎから選択された少なくとも一種を含む金属ペーストや共晶材（例えば、Ａｕ−Ｓｎ）、カーボンペースト、鑞材とすることができる。このような接着剤とすることにより、発光素子４７の裏面に配置された電極と、支持体の導体配線とを電気的に接続させたり、発光素子４７からの放熱性を向上させたりすることができる。金属ペーストに含有される金属材料は、Ａｇが好ましく、Ａｇの含有量が８０％〜９０％であるＡｇペーストを用いると放熱性に優れた半導体装置が得られる。絶縁性接着剤は、例えば、ガラス、エポキシ樹脂あるいはシリコーン樹脂などを主材料とする接着剤を挙げることができる。   In the third embodiment, an adhesive is disposed on the lead electrode, and 31 light emitting elements 47 are bonded so as to correspond to the opening (light emitting region 41) of the package 45. The light emitting element 47 can be the same as that in the first and second embodiments. The adhesive is selected from a conductive adhesive and an insulating adhesive, and the type and material are not particularly limited. The conductive adhesive is, for example, a metal paste or eutectic material (for example, Au—Sn), carbon paste, brazing material containing at least one selected from Au, Ag, Bi, Cu, In, Pb, Sn, and Zn. It can be. By using such an adhesive, the electrode disposed on the back surface of the light emitting element 47 and the conductor wiring of the support can be electrically connected, and the heat dissipation from the light emitting element 47 can be improved. it can. The metal material contained in the metal paste is preferably Ag, and when an Ag paste having an Ag content of 80% to 90% is used, a semiconductor device having excellent heat dissipation can be obtained. Examples of the insulating adhesive include an adhesive mainly composed of glass, epoxy resin, or silicone resin.

以上のように、実施形態３に係る発光装置３００は、発光素子４７がリード電極４２に載置され、そのリード電極４２を支持する凹部を有するパッケージを備えている。このような構成とすると、パッケージを一体に成型しているので部材の脱落が起こりにくく、枠体を２層に形成するために工程数を増やすことなく、効率的に信頼性の高い小型の発光装置を提供することができる。   As described above, the light emitting device 300 according to the third embodiment includes the package in which the light emitting element 47 is placed on the lead electrode 42 and has a recess that supports the lead electrode 42. With such a configuration, since the package is integrally molded, the members are unlikely to drop off, and the small and reliable light emission that is efficient and reliable without increasing the number of steps to form the frame in two layers. An apparatus can be provided.

＜実施形態４＞
さらに演色性を向上させた発光装置５００を、実施形態４に示す。この発光装置４００は、図５のように、実施形態２の発光装置２００の構成に加えて、２層の枠体５５ａ，５５ｂの外側にさらに枠体５５ｃを備える。枠体５５ａ，５５ｂと枠体５５ｃの間は、第４透光性部材５０で満たされおり、第４透光性部材５０は波長変換部材や光拡散材等を含んでいてもよい。以下、先の実施形態と異なる点について詳説する。 <Embodiment 4>
A light emitting device 500 with further improved color rendering is shown in Embodiment 4. As shown in FIG. 5, the light emitting device 400 further includes a frame 55 c outside the two-layered frames 55 a and 55 b in addition to the configuration of the light emitting device 200 of the second embodiment. The space between the frame bodies 55a and 55b and the frame body 55c is filled with the fourth light transmissive member 50, and the fourth light transmissive member 50 may include a wavelength conversion member, a light diffusing material, or the like. Hereinafter, differences from the previous embodiment will be described in detail.

発光装置４００では、発光領域５１に発光素子５７が実装された基板１Ｃの所望の位置に、枠体５５ａが円環状に設けられる。第１透光性樹脂５３は、発光素子５７を埋設するように枠体５５ａの内部に充填され、枠体５５ａに積層するように枠体５５ｂが形成される。そして、第１透光性樹脂５３上の平坦面に、枠体５５ａ，５５ｂより小さい同心円状の円環形状の第３透光性部材５９が設けられる。さらに、枠体５５ａ，５５ｂの外側に、枠体５５ａ，５５ｂより大きい同心円状の円環形状の枠体５５ｃを有し、枠体５５ａ，５５ｂと枠体５５ｃの間に第４透光性部材５０が充填される。従って、図５ａでは、中心が発光領域全体の中心と略一致する円形の第１領域５６ａ、これを囲む円環形状の第２領域５６ｂ、さらに外側で第１領域５６ａと第２領域５６ｂを囲む領域に区画される。すなわち、第３透光性部材５９は第１透光性部材５３の上面で第１領域５６ａと第２領域５６ｂの仕切りとなっており、枠体５５ａ，５５ｂは、第１透光性部材５３，第２透光性部材５６と第４透光性部材５０の仕切りとなる。枠体５５ａ，５５ｂと枠体５５ｃの間の発光素子５７ｃは第４透光性部材５０のみで埋設されており、２層に封止されていない。また、ここでは内側の枠体５５ａ，５５ｂを２層としたが、１層としてもよく、外側の枠体５５ｃを２層としてもかまわない。第２領域５６ｂと第４透光性部材５０を同じ材料で構成する場合は、枠体５５ａを第３透光性部材５９の上面よりも低く形成することで、第２領域５６ｂとその外側の領域を一度に充填でき、図示の枠体５５ｂを形成しなくてもよいので効率的である。また、外側の枠体５５ｃは光を通さない反射性の材料で形成されることが好ましいが、内側の枠体５５ａ，５５ｂは光を透過する材料で形成してもよく、蛍光体等の波長変換部材や光拡散材等を含んでいてもかまわない。そうすることで、光が無駄なく波長変換でき、発光素子５７を枠体５５の形成に関係なく（枠体５５ａ，５５ｂと重ねて）、所望の間隔で配置することができる。また、外側の枠体５５ｃのさらに外側に枠体を有していてもよく、平面視において、２層になっている第１透光性部材と第２及び第３透光性樹脂が、複数の枠体で囲まれる構成としてもかまわない。このように複数の領域に区画して、部材の種類や配置を適宜選択することで、発光装置の所望の幅をさらに広げることが可能である。   In the light emitting device 400, the frame body 55a is provided in an annular shape at a desired position of the substrate 1C on which the light emitting element 57 is mounted in the light emitting region 51. The first translucent resin 53 is filled in the frame body 55a so as to embed the light emitting element 57, and the frame body 55b is formed so as to be laminated on the frame body 55a. Then, on the flat surface on the first translucent resin 53, a concentric annular translucent third translucent member 59 smaller than the frame bodies 55a and 55b is provided. Furthermore, the frame body 55a, 55b has a concentric ring-shaped frame body 55c larger than the frame bodies 55a, 55b outside the frame bodies 55a, 55b, and a fourth light transmissive member between the frame bodies 55a, 55b and the frame body 55c. 50 is filled. Accordingly, in FIG. 5a, a circular first region 56a whose center substantially coincides with the center of the entire light emitting region, an annular second region 56b that surrounds the first region 56a, and a first region 56a and a second region 56b that surround the outer region. Divided into regions. That is, the third translucent member 59 is a partition between the first region 56 a and the second region 56 b on the upper surface of the first translucent member 53, and the frame bodies 55 a and 55 b are the first translucent member 53. , A partition between the second translucent member 56 and the fourth translucent member 50. The light emitting element 57c between the frame bodies 55a, 55b and the frame body 55c is embedded only by the fourth light transmissive member 50 and is not sealed in two layers. Here, the inner frames 55a and 55b are two layers, but may be one layer, and the outer frames 55c may be two layers. When the second region 56b and the fourth translucent member 50 are made of the same material, the frame 55a is formed lower than the upper surface of the third translucent member 59, so that the second region 56b and the outer side thereof are formed. It is efficient because the region can be filled at once and the illustrated frame 55b need not be formed. The outer frame 55c is preferably formed of a reflective material that does not transmit light, but the inner frames 55a and 55b may be formed of a material that transmits light. A conversion member, a light diffusing material, or the like may be included. By doing so, the wavelength of light can be converted without waste, and the light emitting elements 57 can be arranged at a desired interval regardless of the formation of the frame body 55 (overlapping the frame bodies 55a and 55b). Further, the outer frame body 55c may have a frame body on the outer side, and a plurality of first and second translucent resins and two layers of the first translucent member in a plan view are provided. It does not matter as a configuration surrounded by the frame. Thus, by dividing into a plurality of regions and appropriately selecting the type and arrangement of the members, the desired width of the light emitting device can be further increased.

ここでは、枠体５５ｃをＴｉＯ２等の反射性材料を含有したシリコーン樹脂等で形成する。枠体５５ａ，５５ｂの内側に当たる領域に配置される第１領域５６ａと第２領域５６ｂの発光素子５７ａ，５７ｂには、青色ＬＥＤ（発光波長４３０〜４９０ｎｍ）を配置し、枠体５５ａ，５５ｂと重なる発光素子およびそれより外側の第３領域５６ｃの発光素子５７ｃには緑色ＬＥＤ（発光波長４９０ｎｍ〜５７０ｎｍ）を配置する。枠体５５ａと第１透光性部材５３は、光拡散材を含有したシリコーン樹脂等で形成される。そして、第３透光性部材５９、第２領域５６ｂの第２透光性部材５６、枠体５５ｂ，第４透光性部材５０は、ＹＡＧ系蛍光体（黄色蛍光物質）を含んだシリコーン樹脂等で、第１領域５６ａの第２透光性部材５６は、ＣＡＳＮ系蛍光体（赤色蛍光物質）を含んだシリコーン樹脂等で充填されると好ましい。そうすることで、同じ材料で効率的に部材が形成でき、演色性のよい白色の発光装置とすることができる。また、第４透光性部材５０は、第１透光性部材５３と同様の材料を用いてもよい。以上のように、枠体を複数有する構成とすることで、第４透光性部材５０からの出射光は１層の透過性部材のみを透過して取り出されるので光束が維持され、さらに緑色成分が加わってＲＧＢ（赤・緑・青）による発光となり、より演色性の高い発光装置を、信頼性を維持しつつ比較的効率よく形成することができる。 Here, the frame body 55c is formed of a silicone resin containing a reflective material such as TiO 2 . Blue LEDs (emission wavelengths of 430 to 490 nm) are disposed in the light emitting elements 57a and 57b in the first region 56a and the second region 56b disposed in the regions corresponding to the inner sides of the frames 55a and 55b, and the frames 55a and 55b Green LEDs (emission wavelengths of 490 nm to 570 nm) are arranged on the overlapping light emitting elements and the light emitting elements 57c in the third region 56c outside the overlapping light emitting elements. The frame body 55a and the first light transmissive member 53 are formed of a silicone resin containing a light diffusing material. The third translucent member 59, the second translucent member 56 in the second region 56b, the frame body 55b, and the fourth translucent member 50 are made of a silicone resin containing a YAG phosphor (yellow phosphor). For example, the second translucent member 56 in the first region 56a is preferably filled with a silicone resin or the like containing a CASN phosphor (red fluorescent substance). By doing so, a member can be formed efficiently with the same material, and a white light emitting device with good color rendering can be obtained. The fourth light transmissive member 50 may be made of the same material as the first light transmissive member 53. As described above, with the configuration having a plurality of frames, the light emitted from the fourth light transmissive member 50 is extracted through the single layer of the transmissive member, so that the luminous flux is maintained and the green component is further increased. Is added to emit light by RGB (red, green, blue), and a light emitting device with higher color rendering can be formed relatively efficiently while maintaining reliability.

また、以上の実施形態１〜３では、第２透光性部材および第４透光性部材は透光性樹脂で形成されることから、発光装置の断面における上面の形状が、両側の部材との間で表面張力によりレンズ状に盛り上がっていたり、這い上がって凹形状になっていたり、枠体や第３透光性部材の上面と略同じ高さで水平であったりする。これは、透光性樹脂の粘度や充填する量などを調節することで適宜所望の組み合わせや形状とすることができ、形成後に研磨などで成形することも可能である。第１透光性部材の上面は、第３透光性部材の形成を考慮して平坦が好ましいが、第２及び第３透光性部材の上面は凹凸形状を有していてもかまわない。そうすることで、発光装置の光拡散を調節することができる。   Moreover, in the above Embodiments 1-3, since the 2nd translucent member and the 4th translucent member are formed with translucent resin, the shape of the upper surface in the cross section of a light-emitting device is the member of both sides, and Between the upper surface of the frame body and the third translucent member, or a horizontal shape. This can be made into a desired combination or shape by adjusting the viscosity of the translucent resin or the amount to be filled, and can be molded by polishing after the formation. The upper surface of the first translucent member is preferably flat in consideration of the formation of the third translucent member, but the upper surfaces of the second and third translucent members may have an uneven shape. By doing so, the light diffusion of the light emitting device can be adjusted.

１００，２００，３００，４００，５００…発光装置
１Ａ，１Ｂ，１Ｃ…基板
２０…電極
２３…正極
２３ａ…パッド電極
２３ｂ…導電配線
２４…負極
２４ａ…パッド電極
２４ｂ…導電配線
４２…リード電極
４２ａ…正のリード電極
４２ｂ…負のリード電極
２１，３１，４１，５１…発光領域
２２，３２，４２，５２…実装領域
２７…接合部材
２９…反射層
３０…分離領域
３，３３，４３，５３…第１透光性部材
４４…分離部
５，３５，５５…枠体
３５ａ，５５ａ…１層目の枠体
３５ｂ，５５ｂ…２層目の枠体
５５ｃ…外側の枠体
４５…パッケージ
４０…被覆部
６，３６，４６，５６…第２透光性部材
６ａ，３６ａ，４６ａ，５６ａ…第１領域
６ｂ，３６ｂ，４６ｂ，５６ｂ…第２領域
５６ｃ…第３領域
７，３７，４７，５７…発光素子
７ａ，３７ａ，４７ａ，５７ａ…第１領域の発光素子
７ｂ，３７ｂ，４７ｂ，５７ｂ…第２領域の発光素子
５７ｃ…第３領域の発光素子
８，３８，５８…ワイヤ
９，３９，４９，５９…第３透光性部材
５０…第４透光性部材 100, 200, 300, 400, 500 ... light emitting devices 1A, 1B, 1C ... substrate 20 ... electrode 23 ... positive electrode 23a ... pad electrode 23b ... conductive wiring 24 ... negative electrode 24a ... pad electrode 24b ... conductive wiring 42 ... lead electrode 42a ... Positive lead electrode 42b ... Negative lead electrode 21, 31, 41, 51 ... Light emitting region 22, 32, 42, 52 ... Mounting region 27 ... Joining member 29 ... Reflective layer 30 ... Separating region 3, 33, 43, 53 ... 1st translucent member 44 ... separation part 5,35,55 ... frame 35a, 55a ... 1st frame 35b, 55b ... 2nd frame 55c ... outer frame 45 ... package 40 ... coating | cover Part 6, 36, 46, 56 ... 2nd translucent member 6a, 36a, 46a, 56a ... 1st area | region 6b, 36b, 46b, 56b ... 2nd area | region 56c ... 3rd area | region 7, 37, 47, 57 ... Luminous element 7a, 37a, 47a, 57a ... Light emitting elements in the first region 7b, 37b, 47b, 57b ... Light emitting devices in the second region 57c ... Light emitting elements 8, 38, 58 ... Wires 9, 39, 49, 59 in the third region ... 3rd translucent member 50 ... 4th translucent member

Claims (12)

基板と、
前記基板に載置された複数の発光素子と、
前記複数の発光素子を被覆する第１透光性部材と、
前記第１透光性部材の上に形成された第２透光性部材及び第３透光性部材と、を備え、
前記第３透光性部材が前記第２透光性部材を複数の領域に分離することを特徴とする発光装置。 A substrate,
A plurality of light emitting elements mounted on the substrate,
A first light transmissive member covering the plurality of light emitting elements;
A second translucent member and a third translucent member formed on the first translucent member ,
The light emitting device, wherein the third light transmissive member separates the second light transmissive member into a plurality of regions. 前記第２透光性部材は、波長変換部材が含有されていることを特徴とする請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the second light transmissive member contains a wavelength conversion member. 前記第３透光性部材は、波長変換部材が含有されていることを特徴とする請求項１または２に記載の発光装置。 The third translucent member, the light emitting device according to claim 1 or 2, characterized in that the wavelength conversion member is contained. 前記第２透光性部材は、前記第３透光性部材によって分離された第１領域及び第２領域を有し、
前記第１領域と前記第２領域の前記第２透光性部材は、それぞれ互いに異なる波長変換部材が含有されていることを特徴とする請求項１乃至３のいずれか１項に記載の発光装置。 The second light transmissive member has a first region and a second region separated by the third light transmissive member,
4. The light emitting device according to claim 1 , wherein the second light transmissive members in the first region and the second region contain different wavelength conversion members. 5. . 前記第１透光性部材は、光拡散材が含有されていることを特徴とする請求項１乃至４のいずれか１項に記載の発光装置。 The light emitting device according to claim 1, wherein the first light transmissive member contains a light diffusing material. 前記発光装置は、前記基板上に第１の枠体があり、
前記第１透光性部材、第２透光性部材及び第３透光性部材は、前記第１の枠体によって囲まれている、請求項１乃至５のいずれか１項に記載の発光装置。 The light emitting device has a first frame on the substrate,
The first light-transmissive member, the second light-transmissive member and the third light transmitting member, the first surrounded by the frame, the light emitting device according to any one of claims 1 to 5 . 前記第１の枠体が、多層構造である請求項６に記載の発光装置。The light emitting device according to claim 6, wherein the first frame has a multilayer structure. 前記発光装置は、前記基板上に１又は２以上の第２の枠体があり、
平面視において、前記第１の枠体を囲むように前記第２の枠体が配置されていることを特徴とする請求項６または７に記載の発光装置。 The light emitting device has one or more second frames on the substrate,
The light emitting device according to claim 6 or 7 , wherein the second frame body is disposed so as to surround the first frame body in a plan view. 前記第１の枠体は、透光性であることを特徴とする請求項８に記載の発光装置。 The light emitting device according to claim 8 , wherein the first frame is translucent. 前記発光装置は、前記基板上に第４透光性部材があり、
前記第１の枠体と前記第２の枠体の間に、前記第４透光性部材が配置されていることを特徴とする請求項８または９のいずれか１項に記載の発光装置。 The light emitting device has a fourth light transmissive member on the substrate,
10. The light emitting device according to claim 8 , wherein the fourth translucent member is disposed between the first frame and the second frame. 基板に複数の発光素子を載置する工程と、
第１透光性部材により前記複数の発光素子を被覆する工程と、
１つの領域を有する前記第１透光性部材の上に、第３透光性部材を形成する工程と、
前記第３透光性部材により複数の領域に分離された前記第１透光性部材の上に、第２透光性部材を形成する工程と、
を有する発光装置の製造方法。 Placing a plurality of light emitting elements on a substrate;
A step of covering the plurality of light emitting elements by the first light transmitting member,
Forming a third light transmissive member on the first light transmissive member having one region;
Forming a second light transmissive member on the first light transmissive member separated into a plurality of regions by the third light transmissive member;
Method of manufacturing a light-emitting device to have a. 前記複数の発光素子を被覆する工程の前に、平面視において前記複数の発光素子を囲む１層目の枠体を前記基板上に形成する工程を有し、
前記複数の発光素子を被覆する工程の後に、前記１層目の枠体上に２層目の枠体を形成する工程を有する、請求項１１に記載の発光装置の製造方法。 Before the step of covering the plurality of light emitting elements, including a step of forming on the substrate a first layer frame surrounding the plurality of light emitting elements in a plan view;
The method for manufacturing a light-emitting device according to claim 11 , further comprising a step of forming a second-layer frame on the first-layer frame after the step of covering the plurality of light-emitting elements .
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