JP6671116B2 - 発光素子パッケージ - Google Patents
発光素子パッケージ Download PDFInfo
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- JP6671116B2 JP6671116B2 JP2015136431A JP2015136431A JP6671116B2 JP 6671116 B2 JP6671116 B2 JP 6671116B2 JP 2015136431 A JP2015136431 A JP 2015136431A JP 2015136431 A JP2015136431 A JP 2015136431A JP 6671116 B2 JP6671116 B2 JP 6671116B2
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- 229920005989 resin Polymers 0.000 claims description 135
- 239000011347 resin Substances 0.000 claims description 135
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
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- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
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- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Description
Claims (13)
- リードフレームと、
前記リードフレーム上に配置された発光素子と、
前記リードフレーム上に配置され、前記発光素子が配置される中空部を有し、前記発光素子から放出された光を反射し、金型によって形成された金属材質のリフレクタと、
前記リードフレームと前記リフレクタを囲む樹脂部と、
を含み、
前記樹脂部は、前記リードフレームと前記リフレクタとの間に配置された絶縁層と前記リフレクタ上に配置された突出部とを含み、
前記突出部は、前記リフレクタの上面の一部上に配置され、
前記リフレクタの上面の残りの部分と前記突出部の側面は、レンズガイド部を形成する、発光素子パッケージ。 - 前記突出部の上面と前記突出部から上側に突出した壁部の側面は、プレートガイド部を形成する、請求項1に記載の発光素子パッケージ。
- リードフレームと、
前記リードフレーム上に配置された発光素子と、
前記リードフレーム上に配置され、前記発光素子が配置される中空部を有し、前記発光素子から放出された光を反射し、金型によって形成された金属材質のリフレクタと、
前記リードフレームと前記リフレクタを囲む樹脂部と、
を含み、
前記樹脂部は、前記リードフレームと前記リフレクタとの間に配置された絶縁層と前記リフレクタ上に配置された突出部とを含み、
前記突出部の上面と前記突出部から上側に突出した壁部の側面は、プレートガイド部を形成する、発光素子パッケージ。 - 前記リードフレームは、
前記発光素子が配置される第1フレームと、
前記第1フレームの両側にそれぞれ配置され、前記発光素子と電気的に連結される第2フレームと、
を含み、
前記樹脂部は、
前記第1フレームと前記第2フレームとの間に配置された第1樹脂部と、
前記第2フレームの外側面と前記リフレクタの外側面とを囲む第2樹脂部と、
を含む、請求項1ないし3のいずれか1項に記載の発光素子パッケージ。 - 前記絶縁層は、前記第2樹脂部から延びて前記第2フレームと前記リフレクタとの間に配置され、
前記突出部は、前記第2樹脂部から延びた、請求項4に記載の発光素子パッケージ。 - 前記第1樹脂部は、上面と底面を含み、
前記上面の幅は、前記底面の幅より狭い、請求項4または5に記載の発光素子パッケージ。 - 前記第1樹脂部は、上面と底面を含み、
前記第1樹脂部の底面は、直線部と屈曲部を含み、
前記直線部の幅は、前記上面の幅よりさらに大きく、
前記屈曲部の幅は、前記直線部の幅よりさらに大きい、請求項4ないし6のいずれか1項に記載の発光素子パッケージ。 - 前記第1樹脂部の上面の幅は、0.3〜0.5mmである、請求項4ないし7のいずれか1項に記載の発光素子パッケージ。
- 前記樹脂部は、前記樹脂部の外側面に配置され、リードフレーム原型と結合する凹部を含み、
前記凹部の上部には、係止突起が配置された、請求項1ないし8のいずれか1項に記載の発光素子パッケージ。 - 前記リードフレームは、前記発光素子が配置される第1フレームと、前記第1フレームの両側にそれぞれ配置され、前記リフレクタが配置される第2フレームと、を含み、
前記第1フレームの一端は、前記樹脂部の第1側面に配置され、前記第1フレームの他端は、前記樹脂部の第2側面に配置され、
前記第2フレームの一端は、前記樹脂部の前記第1側面に配置され、前記第2フレームの他端は、前記樹脂部の前記第2側面に配置され、
前記第1側面と前記第2側面は、互いに対向する、請求項1ないし9のいずれか1項に記載の発光素子パッケージ。 - 前記リフレクタは、
前記リードフレームの上に垂直に配置されたベース部と、
前記ベース部に配置され、傾きを有する反射面を有する傾斜部と、
を含み、
前記リフレクタは、純アルミニウムである、請求項1ないし10のいずれか1項に記載の発光素子パッケージ。 - 前記絶縁層の厚さは、0.1〜0.15mmである、請求項1ないし11のいずれか1項に記載の発光素子パッケージ。
- 前記樹脂部は、黒色の樹脂である、請求項1ないし12のいずれか1項に記載の発光素子パッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140084909A KR102252156B1 (ko) | 2014-07-08 | 2014-07-08 | 발광 소자 패키지 |
KR10-2014-0084909 | 2014-07-08 |
Publications (2)
Publication Number | Publication Date |
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JP2016019000A JP2016019000A (ja) | 2016-02-01 |
JP6671116B2 true JP6671116B2 (ja) | 2020-03-25 |
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JP2015136431A Active JP6671116B2 (ja) | 2014-07-08 | 2015-07-07 | 発光素子パッケージ |
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US (2) | US9991429B2 (ja) |
EP (1) | EP2966696B1 (ja) |
JP (1) | JP6671116B2 (ja) |
KR (1) | KR102252156B1 (ja) |
CN (1) | CN105261687B (ja) |
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JP6765804B2 (ja) * | 2014-11-28 | 2020-10-07 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
CN205039173U (zh) * | 2015-09-30 | 2016-02-17 | 佛山市国星光电股份有限公司 | 一种led支架及其制成的led器件与led显示模组 |
KR102562091B1 (ko) * | 2016-02-12 | 2023-08-02 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
JP6901490B2 (ja) * | 2016-02-12 | 2021-07-14 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及びこれを含む照明装置 |
CN110931622A (zh) * | 2016-03-14 | 2020-03-27 | 光宝光电(常州)有限公司 | 发光二极管封装结构 |
JP6690607B2 (ja) * | 2016-08-03 | 2020-04-28 | 信越化学工業株式会社 | 合成石英ガラスリッド及び光学素子用パッケージ |
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KR102335216B1 (ko) | 2017-04-26 | 2021-12-03 | 삼성전자 주식회사 | 발광소자 패키지 |
KR102432024B1 (ko) | 2017-12-08 | 2022-08-12 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 광원 장치 |
KR102455087B1 (ko) * | 2017-12-11 | 2022-10-14 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 광원 장치 |
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-
2014
- 2014-07-08 KR KR1020140084909A patent/KR102252156B1/ko active IP Right Grant
-
2015
- 2015-07-07 JP JP2015136431A patent/JP6671116B2/ja active Active
- 2015-07-08 EP EP15175946.1A patent/EP2966696B1/en active Active
- 2015-07-08 CN CN201510398340.9A patent/CN105261687B/zh active Active
- 2015-07-08 US US14/794,475 patent/US9991429B2/en active Active
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Publication number | Publication date |
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KR20160005885A (ko) | 2016-01-18 |
CN105261687B (zh) | 2019-02-01 |
JP2016019000A (ja) | 2016-02-01 |
EP2966696B1 (en) | 2018-09-12 |
US20160013382A1 (en) | 2016-01-14 |
US20180261740A1 (en) | 2018-09-13 |
US9991429B2 (en) | 2018-06-05 |
KR102252156B1 (ko) | 2021-05-17 |
CN105261687A (zh) | 2016-01-20 |
EP2966696A1 (en) | 2016-01-13 |
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