JP6661453B2 - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
- Publication number
- JP6661453B2 JP6661453B2 JP2016084419A JP2016084419A JP6661453B2 JP 6661453 B2 JP6661453 B2 JP 6661453B2 JP 2016084419 A JP2016084419 A JP 2016084419A JP 2016084419 A JP2016084419 A JP 2016084419A JP 6661453 B2 JP6661453 B2 JP 6661453B2
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- JP
- Japan
- Prior art keywords
- plate
- cleaning
- holder
- cleaning member
- shaped object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims description 193
- 239000000463 material Substances 0.000 claims description 70
- 239000007788 liquid Substances 0.000 claims description 27
- 238000002347 injection Methods 0.000 claims description 25
- 239000007924 injection Substances 0.000 claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 238000005406 washing Methods 0.000 claims description 6
- 230000008602 contraction Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
10 保持手段
14 噴射口(洗浄液噴射手段)
15 噴射ノズル(洗浄液噴射手段)
16、17 供給源(洗浄液噴射手段)
20、40、60 洗浄手段
21、41、61 揺動部
22、42、62 追従機構
23、43,63 洗浄部材
28 鉛直ガイド
31 ホルダプレート(ホルダ)
35、55 スプリング
36、56、81 部材ホルダ(ホルダ)
71 ピストン部材
73 エアー噴射口
82 部材ホルダの凹部
83 上部ホルダ(シリンダ部材)
W 板状物
Wa 板状物の上面
Wb 板状物の下面
Claims (2)
- 板状物を外周縁で保持して板状物を周方向に回転させる保持手段と、該保持手段によって保持され回転している板状物を洗浄する洗浄手段と、該保持手段に保持された板状物の上面及び下面のそれぞれに洗浄液を噴射する洗浄液噴射手段とを備えた洗浄装置であって、
該洗浄手段は、板状物の上面に当接して板状物を洗浄する洗浄部材と、該洗浄部材を板状物の径方向に揺動させると共に湾曲した板状物の上面に追従する揺動部とを備え、
該保持手段に保持された板状物の上面に当接し該洗浄部材が板状物の上面に沿って板状物の上面を洗浄し、
該揺動部の該先端に配設され鉛直下向きに延伸しているピストン部材と、該ピストン部材に係合する凹部を備え鉛直方向に駆動可能なシリンダ部材と、該シリンダ部材の該凹部内に鉛直下向きに圧縮エアーを噴射するエアー噴射口とを備え、該洗浄部材が該シリンダ部材の下面側に配設され、
該ピストン部材の該エアー噴射口から該凹部内に圧縮エアーが噴射され該凹部内に空間を有する状態で該洗浄部材が板状物に当接し、該ピストン部材に沿って該シリンダ部材及び該洗浄部材が上下に揺動して湾曲した板状物の上面に追従することを特徴とする洗浄装置。 - 該揺動部は、
揺動する先端に配設され該洗浄部材を鉛直方向にガイドする鉛直ガイドと、
該洗浄部材を保持し且つ該鉛直ガイドにガイドされるホルダと、
該ホルダを該鉛直ガイドにガイドされた状態で該揺動部の該先端に固定するスプリングと、を備え、
該スプリングが伸縮することで該鉛直ガイドに沿って該ホルダ及び該洗浄部材が上下に揺動して湾曲した板状物の上面に追従することを特徴とする、請求項1記載の洗浄装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016084419A JP6661453B2 (ja) | 2016-04-20 | 2016-04-20 | 洗浄装置 |
TW106107999A TWI711494B (zh) | 2016-04-20 | 2017-03-10 | 洗淨裝置 |
KR1020170045180A KR102264628B1 (ko) | 2016-04-20 | 2017-04-07 | 세정 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016084419A JP6661453B2 (ja) | 2016-04-20 | 2016-04-20 | 洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017195271A JP2017195271A (ja) | 2017-10-26 |
JP6661453B2 true JP6661453B2 (ja) | 2020-03-11 |
Family
ID=60156100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016084419A Active JP6661453B2 (ja) | 2016-04-20 | 2016-04-20 | 洗浄装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6661453B2 (ja) |
KR (1) | KR102264628B1 (ja) |
TW (1) | TWI711494B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538761B (zh) * | 2018-04-09 | 2020-11-13 | 绍兴文理学院 | 一种光伏板硅片加工用清洗装置 |
CN108648989B (zh) * | 2018-05-16 | 2020-12-25 | 福建北电新材料科技有限公司 | 一种单晶碳化硅衬底晶片清洗方法 |
JP7167705B2 (ja) | 2018-12-26 | 2022-11-09 | 株式会社島津製作所 | 質量分析方法 |
CN111992268B (zh) * | 2020-09-18 | 2022-06-24 | 苏州格力美特实验室科技发展有限公司 | 一种实验室试验台 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1080797A3 (en) * | 1994-06-28 | 2005-10-05 | Ebara Corporation | Method and apparatus for cleaning workpiece |
JPH10189512A (ja) * | 1996-12-26 | 1998-07-21 | Sony Corp | 基板洗浄装置 |
JP4089837B2 (ja) | 1997-07-10 | 2008-05-28 | 株式会社ディスコ | スピンナー装置 |
JP4111299B2 (ja) * | 1999-07-26 | 2008-07-02 | 東京エレクトロン株式会社 | 基板洗浄具,基板洗浄装置及び基板洗浄方法 |
US6648979B2 (en) * | 2001-01-24 | 2003-11-18 | International Business Machines Corporation | Apparatus and method for wafer cleaning |
JP2007250783A (ja) * | 2006-03-15 | 2007-09-27 | Dainippon Screen Mfg Co Ltd | 基板保持回転装置 |
JP2014110270A (ja) | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | 洗浄装置 |
JP6279276B2 (ja) * | 2013-10-03 | 2018-02-14 | 株式会社荏原製作所 | 基板洗浄装置及び基板処理装置 |
-
2016
- 2016-04-20 JP JP2016084419A patent/JP6661453B2/ja active Active
-
2017
- 2017-03-10 TW TW106107999A patent/TWI711494B/zh active
- 2017-04-07 KR KR1020170045180A patent/KR102264628B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102264628B1 (ko) | 2021-06-11 |
KR20170120024A (ko) | 2017-10-30 |
JP2017195271A (ja) | 2017-10-26 |
TW201801808A (zh) | 2018-01-16 |
TWI711494B (zh) | 2020-12-01 |
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