JP6634316B2 - 樹脂封止型車載制御装置 - Google Patents
樹脂封止型車載制御装置 Download PDFInfo
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- JP6634316B2 JP6634316B2 JP2016041707A JP2016041707A JP6634316B2 JP 6634316 B2 JP6634316 B2 JP 6634316B2 JP 2016041707 A JP2016041707 A JP 2016041707A JP 2016041707 A JP2016041707 A JP 2016041707A JP 6634316 B2 JP6634316 B2 JP 6634316B2
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- 229920005989 resin Polymers 0.000 claims description 81
- 239000011347 resin Substances 0.000 claims description 81
- 239000000463 material Substances 0.000 description 46
- 238000010586 diagram Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図1は、実施例1の樹脂封止型車載制御装置1の主要構造を示す分解斜視図である。
ベース部材11は、一方側が開放されたお椀状の形状を有しており、回路基板15が実装される板状部11aおよび板状部11aから突出する側壁11b、回路基板15の座面となる台座部11c、板状部11aの外周に延設された車両組付固定部11d、板状部11aの四隅に設けられた隅台座部11e、板上部11aにコネクタを挿入するためのコネクタ用窓11fおよび、側壁11bに設けられた開口11gを備えている。側壁11bは、板状部11aの隅から突出して壁状に設けられることで、ベース部材11全体がケース状の形状となっており、この中に回路基板15が収容される形となっている。
図7は実施例2の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
図8は、実施例3の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
図9は、実施例4の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
図10は、実施例5の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
開口11gの形状としては、楕円形状に限らず、四角、円形状などいずれの形状も採用することができる。
図11は、実施例6の樹脂封止型車載制御装置1であり、ベース部材11の開口11gと回路基板15との位置関係および開口11gの形状を示す概略図である。
開口11gの形状としては、四角状に限らず、半楕円形状などいずれの形状も採用することができる。
図12は、実施例7の樹脂封止型車載制御装置1の概念図である。
図13は、実施例8の樹脂封止型車載制御装置1の概念図である。
図14は、実施例8の樹脂封止型車載制御装置1の概念図である。
11 ベース部材
11a 板状部
11b 側壁
11c 台座部
11d 車両組付固定部
11e 隅台座部
11f コネクタ用窓
11g 開口
111g 第一の開口
112g 第二の開口
11h フィン
12 コネクタ
12a ピン端子
12b ハウジング
13 高熱伝導層
14 電子部品
14a 回路配線
15 回路基板
16 止めねじ
17 サーマルビア
20 樹脂材料
21 回路基板切り欠き
30 金型
30a 樹脂挿入口
31 ノズル
Claims (4)
- 一対の幅広面と側面とを有する回路基板と、
前記回路基板を収容するベース部材と、
前記回路基板の前記幅広面の両面に充填された樹脂を有し、
前記ベース部材は、前記樹脂を介して前記幅広面と対向する板状部と、
前記板状部から突出して設けられ、前記側面と対向する側壁と、を有し、
前記側壁は、開口を有し、
前記開口は、前記側壁の端部側から前記板状部に向かって切り欠き状に設けられ、切り欠きの端部は前記回路基板の前記側面と対向する位置よりも前記板状部側に設けられ、
前記回路基板は、前記開口と対向する位置に切り欠きを有する車載制御装置。 - 請求項1において、
前記開口は、前記側壁に複数設けられた車載制御装置。 - 一対の幅広面と側面とを有する回路基板と、
前記回路基板を収容するベース部材と、
前記回路基板の前記幅広面の両面に充填された樹脂を有し、
前記ベース部材は、前記樹脂を介して前記幅広面と対向する板状部と、
前記板状部から突出して設けられ、前記側面と対向する側壁と、を有し、
前記側壁は、前記側面と対向する位置よりも前記板状部側に設けられた第一の開口と、前記側面と対向する位置よりも前記側壁の端部側に設けられた第二の開口と、を有し、
前記回路基板は、前記開口と対向する位置に切り欠きを有する車載制御装置。 - 請求項3において、
前記第一の開口と前記第二の開口が、それぞれ複数設けられた車載制御装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016041707A JP6634316B2 (ja) | 2016-03-04 | 2016-03-04 | 樹脂封止型車載制御装置 |
CN201780007412.XA CN108476590B (zh) | 2016-03-04 | 2017-02-01 | 树脂封固型车载控制装置 |
DE112017000446.2T DE112017000446T5 (de) | 2016-03-04 | 2017-02-01 | Kunstharzversiegelte fahrzeugmontierte Steuervorrichtung |
US16/081,515 US10699917B2 (en) | 2016-03-04 | 2017-02-01 | Resin-sealed vehicle-mounted control device |
PCT/JP2017/003512 WO2017150053A1 (ja) | 2016-03-04 | 2017-02-01 | 樹脂封止型車載制御装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016041707A JP6634316B2 (ja) | 2016-03-04 | 2016-03-04 | 樹脂封止型車載制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017157769A JP2017157769A (ja) | 2017-09-07 |
JP6634316B2 true JP6634316B2 (ja) | 2020-01-22 |
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JP2016041707A Active JP6634316B2 (ja) | 2016-03-04 | 2016-03-04 | 樹脂封止型車載制御装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10699917B2 (ja) |
JP (1) | JP6634316B2 (ja) |
CN (1) | CN108476590B (ja) |
DE (1) | DE112017000446T5 (ja) |
WO (1) | WO2017150053A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
JP7105061B2 (ja) * | 2017-12-15 | 2022-07-22 | 日立Astemo株式会社 | 電子制御装置 |
DE102021204069A1 (de) * | 2021-04-23 | 2022-10-27 | Vitesco Technologies GmbH | Leiterplattenbaugruppe und Steckverbindung |
DE102021121465A1 (de) * | 2021-08-18 | 2023-02-23 | Borgwarner Inc. | Leiterplattenverbindungsvorrichtung und Leiterplattenanordnung |
US11910544B2 (en) * | 2022-05-02 | 2024-02-20 | Vitesco Technologies USA, LLC | Assembly of printed circuit board with overmolded epoxy to baseplate |
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JPS4845406Y1 (ja) * | 1969-11-21 | 1973-12-27 | ||
JPS4845406U (ja) | 1971-09-30 | 1973-06-14 | ||
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JP2000183277A (ja) | 1998-12-17 | 2000-06-30 | Toshiba Corp | 半導体装置 |
JP2003332754A (ja) * | 2002-05-15 | 2003-11-21 | Internatl Business Mach Corp <Ibm> | 多層プリント配線板 |
JP4083652B2 (ja) * | 2003-09-19 | 2008-04-30 | 本田技研工業株式会社 | ガスセンサの制御装置 |
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JP2010199152A (ja) * | 2009-02-23 | 2010-09-09 | Denso Corp | 電子部品の成形封止方法及びそれによる電子部品 |
JP5146382B2 (ja) * | 2009-03-25 | 2013-02-20 | 株式会社デンソー | 電子装置の製造方法 |
JP2013138129A (ja) * | 2011-12-28 | 2013-07-11 | Panasonic Corp | 半導体装置およびその製造方法 |
WO2013145438A1 (ja) * | 2012-03-30 | 2013-10-03 | オリンパスメディカルシステムズ株式会社 | 封止構造およびアンテナ装置 |
JP5990418B2 (ja) * | 2012-07-06 | 2016-09-14 | 日立オートモティブシステムズ株式会社 | 車載用電子制御装置およびその製造方法 |
JP6012531B2 (ja) * | 2013-04-02 | 2016-10-25 | 三菱電機株式会社 | 半導体装置 |
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