JP6622610B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
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- JP6622610B2 JP6622610B2 JP2016022554A JP2016022554A JP6622610B2 JP 6622610 B2 JP6622610 B2 JP 6622610B2 JP 2016022554 A JP2016022554 A JP 2016022554A JP 2016022554 A JP2016022554 A JP 2016022554A JP 6622610 B2 JP6622610 B2 JP 6622610B2
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- 238000004140 cleaning Methods 0.000 claims description 53
- 238000001514 detection method Methods 0.000 claims description 15
- 239000002699 waste material Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 5
- 230000032258 transport Effects 0.000 description 11
- 230000003028 elevating effect Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning In General (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
この研削装置は、前記クラック検出手段が検出したクラックの位置を記憶する記憶部を備え、前記制御部は、該記憶部が記憶するクラックの位置に相当する該保持面の位置を該洗浄手段に洗浄させることが好ましい。
また、ウエーハに発生したクラックの位置を記憶する記憶部を備え、制御部が、記憶部が記憶するクラックの位置に相当する保持面の位置を洗浄手段に洗浄させることで、保持面のうち研削屑を付着している場所のみを洗浄することができるため、洗浄効率がさらに高くなり、生産性がより向上する。
なお、位置合わせテーブル50から第一の搬送手段6aがウエーハを保持し搬出するときのウエーハWの位置は、検知部52がノッチNを検知した位置としたが、検知部52がノッチNを検知して所定角度回転させた位置でもよい。
2:保持テーブル 2a:保持面 20:ターンテーブル 21:ポーラス板
22:枠体 23:ベース 24:吸引路 25:吸引源 26:ノッチ合わせ部
27:バリア 28:ねじ穴
3a、3b:研削手段
30:回転軸 31:ホイールマウント 32:研削ホイール 33:モータ
34:研削砥石 35:ガイドレール 36:昇降板 37:モータ
4a、4b:カセット載置領域 40a、4b:カセット
5:搬出入手段 50:位置合わせテーブル
6a:第一の搬送手段 6b:第二の搬送手段
7:ウエーハ洗浄手段 70:スピンナーテーブル
8:洗浄手段
80:回転軸 81:ハウジング 82:洗浄砥石
83:昇降手段(押圧手段) 830:レール
84:保持テーブル回転手段
840:モータ 841:エンコーダ 842:軸 843:プーリ 844:ベルト
845:従動プーリ
85:ガイドレール
90:クラック検出手段 900:カメラ 901:リング照明
91:制御部 92:記憶部
W:ウエーハ Wa:表面 Wb:裏面 WO:中心 N:ノッチ C:クラック
T:保護テープ
100:研削屑
Claims (2)
- ポーラス板を備えウエーハを保持する保持面を有する保持テーブルと、該保持テーブルの該保持面で保持されるウエーハを砥石の研削面で研削する研削手段と、該保持面を洗浄する洗浄手段と、を備える研削装置であって、
該洗浄手段は、該保持面に接触して該保持面より突出した研削屑を削り取る板状の洗浄砥石と、該洗浄砥石を該保持面に押圧する押圧手段と、該保持テーブルを該保持面の中心を軸に回転させる保持テーブル回転手段とを備え、
該研削手段によって研削され該保持テーブルに保持されるウエーハの被研削面側からウエーハに発生したクラックを検出するクラック検出手段と、
該クラック検出手段がウエーハに発生したクラックを検出したときに、該洗浄手段に該保持面を洗浄させ該保持面と該研削面との平行度を維持する制御部と、
を備える研削装置。 - 前記クラック検出手段が検出したクラックの位置を記憶する記憶部を備え、前記制御部は、該記憶部が記憶するクラックの位置に相当する該保持面の位置を該洗浄手段に洗浄させる請求項1記載の研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016022554A JP6622610B2 (ja) | 2016-02-09 | 2016-02-09 | 研削装置 |
TW105143901A TWI695424B (zh) | 2016-02-09 | 2016-12-29 | 磨削裝置 |
CN201710057507.4A CN107042433B (zh) | 2016-02-09 | 2017-01-26 | 磨削装置 |
KR1020170016142A KR102513203B1 (ko) | 2016-02-09 | 2017-02-06 | 연삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016022554A JP6622610B2 (ja) | 2016-02-09 | 2016-02-09 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017140663A JP2017140663A (ja) | 2017-08-17 |
JP6622610B2 true JP6622610B2 (ja) | 2019-12-18 |
Family
ID=59543656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016022554A Active JP6622610B2 (ja) | 2016-02-09 | 2016-02-09 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6622610B2 (ja) |
KR (1) | KR102513203B1 (ja) |
CN (1) | CN107042433B (ja) |
TW (1) | TWI695424B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6920141B2 (ja) * | 2017-09-05 | 2021-08-18 | 株式会社ディスコ | 研磨装置 |
CN108000324A (zh) * | 2017-12-15 | 2018-05-08 | 大连理工常州研究院有限公司 | 一种用于机械制造的双驱动打磨装置 |
KR102037747B1 (ko) * | 2018-01-08 | 2019-10-29 | 에스케이실트론 주식회사 | 웨이퍼 연마 장치 |
JP2019169608A (ja) * | 2018-03-23 | 2019-10-03 | 株式会社ディスコ | 研削装置 |
US20200411338A1 (en) * | 2018-04-09 | 2020-12-31 | Tokyo Electron Limited | Laser processing device, laser processing system and laser processing method |
CN109015333A (zh) * | 2018-09-06 | 2018-12-18 | 国家电网有限公司 | 一种发电机碳刷弧面研磨装置 |
CN109434671A (zh) * | 2018-10-11 | 2019-03-08 | 德淮半导体有限公司 | 一种晶圆加工设备及加工方法 |
CN111283548B (zh) * | 2018-12-07 | 2023-07-18 | 株式会社迪思科 | 圆板状工件的加工方法 |
JP7364338B2 (ja) * | 2019-01-22 | 2023-10-18 | 株式会社ディスコ | 保持面洗浄装置 |
JP2021074825A (ja) | 2019-11-11 | 2021-05-20 | 株式会社ディスコ | 保持面洗浄装置 |
CN113770883A (zh) * | 2021-09-08 | 2021-12-10 | 国网福建省电力有限公司营销服务中心 | 电能表回收处理线及其工作方法 |
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US3708440A (en) | 1972-02-14 | 1973-01-02 | Upjohn Co | Reclaiming scrap polyisocyanurate foam with an aliphatic diol and a dialkanolamine |
JPH01171762A (ja) * | 1987-12-28 | 1989-07-06 | Shibayama Kikai Kk | 半導体のウエハ研削盤の吸着チャック洗浄装置 |
JPH01205950A (ja) * | 1988-02-12 | 1989-08-18 | Disco Abrasive Syst Ltd | ポーラスチャックテーブルの洗浄方法およびその装置 |
JP3155861B2 (ja) * | 1993-05-18 | 2001-04-16 | ローム株式会社 | 薄板状基板の移送装置 |
JP4079289B2 (ja) | 1998-02-18 | 2008-04-23 | 株式会社ディスコ | チャックテーブル洗浄装置 |
JP3504543B2 (ja) * | 1999-03-03 | 2004-03-08 | 株式会社日立製作所 | 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法 |
US6817057B2 (en) * | 2001-08-30 | 2004-11-16 | Micron Technology, Inc. | Spindle chuck cleaner |
US6910956B1 (en) * | 2003-12-22 | 2005-06-28 | Powerchip Semiconductor Corp. | Wafer grinding apparatus |
JP5164559B2 (ja) * | 2007-12-27 | 2013-03-21 | 株式会社ディスコ | 研削装置 |
JP5180661B2 (ja) * | 2008-04-18 | 2013-04-10 | 株式会社ディスコ | スピンナ洗浄装置および加工装置 |
JP2013122956A (ja) * | 2011-12-09 | 2013-06-20 | Disco Abrasive Syst Ltd | 加工装置 |
JP6074154B2 (ja) * | 2012-04-12 | 2017-02-01 | 株式会社ディスコ | 加工装置 |
JP2014053510A (ja) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | 端面加工方法及び端面加工装置 |
JP2014075379A (ja) * | 2012-10-02 | 2014-04-24 | Nikon Corp | 異物除去方法、異物除去用の工具、並びに露光方法及び装置 |
JP6109010B2 (ja) * | 2013-08-14 | 2017-04-05 | 株式会社ディスコ | 研削装置 |
JP2015079072A (ja) * | 2013-10-16 | 2015-04-23 | キヤノン株式会社 | 基板割れ処理システムを搭載した露光装置 |
-
2016
- 2016-02-09 JP JP2016022554A patent/JP6622610B2/ja active Active
- 2016-12-29 TW TW105143901A patent/TWI695424B/zh active
-
2017
- 2017-01-26 CN CN201710057507.4A patent/CN107042433B/zh active Active
- 2017-02-06 KR KR1020170016142A patent/KR102513203B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI695424B (zh) | 2020-06-01 |
CN107042433B (zh) | 2020-10-09 |
KR102513203B1 (ko) | 2023-03-23 |
TW201729277A (zh) | 2017-08-16 |
CN107042433A (zh) | 2017-08-15 |
JP2017140663A (ja) | 2017-08-17 |
KR20170094497A (ko) | 2017-08-18 |
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