JP6585710B2 - チップキャリアを製造するためのストリップ構造基板、この種のチップキャリアを有する電子モジュール、この種のモジュールを有する電子装置及び基板を製造するための方法 - Google Patents
チップキャリアを製造するためのストリップ構造基板、この種のチップキャリアを有する電子モジュール、この種のモジュールを有する電子装置及び基板を製造するための方法 Download PDFInfo
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- JP6585710B2 JP6585710B2 JP2017519796A JP2017519796A JP6585710B2 JP 6585710 B2 JP6585710 B2 JP 6585710B2 JP 2017519796 A JP2017519796 A JP 2017519796A JP 2017519796 A JP2017519796 A JP 2017519796A JP 6585710 B2 JP6585710 B2 JP 6585710B2
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Description
2…ユニット
3…チップアイランド
4…電極
5…ボンドパッド
6…アンテナパッド
7…第1貫通孔
8…第2貫通孔
9…第3貫通孔
10…第4貫通孔
11…アンカーエッジ
12…面取りされた(第1)表面セクション
13…フィルムのひき続く表面
14…(第2)表面セクション
15…貫通孔の内側
16…面取りしていない凹部
17…半導体チップ
18…キャスティング材
19…残りの領域
20…ウェブ
21…搬送帯
22…搬送孔
23…アンカーエッジを有しない貫通孔
24…接続ウェブ
25…第1シャンク
26…第2シャンク
27…再成形ツール
Claims (11)
- 1つのユニットが、半導体チップを固定するためのチップアイランド(3)と、前記半導体チップを電気的に接続するための電極(4)と、前記ユニット(2)を構造化するための貫通孔(7、8、9、10)とをそれぞれ備え、少なくとも1つの貫通孔(7、8、9、10)は、前記半導体チップを封止するキャスティング材のためのアンカーエッジ(11)を形成する、チップキャリアを製造するための複数のユニット(2)を有するフィルム(1)からのストリップ構造基板であって、
前記フィルム(1)の前記貫通孔(7、8、9、10)に隣接する表面セクション(12)が、アンカーエッジ(11)を形成するために面取りされており、前記アンカーエッジ(11)は、前記チップアイランド(3)が配置されるフィルム(1)の面を超えて突出していること、及び、1つの貫通孔(8)は、機械的ストレスを軽減するための面取りしていないカーブ(14)及び/又は面取りしていない凹部(16)を備えること、を特徴とする、
ストリップ構造基板。 - 請求項1に記載の基板であって、フィルム(1)の厚さは、15マイクロメートル〜35マイクロメートルの間であることを特徴とする、基板。
- 請求項1又は2に記載の基板であって、フィルム(1)は、スチール、特にオーステナイト系のステンレススチール又は銅若しくは銅合金から形成されることを特徴とする、基板。
- 請求項1〜3のいずれか一項に記載の基板であって、面取りされた表面セクション(12)と、前記フィルム(1)のひき続く表面(13)との間の面取りの角度は、30°〜60°の間、特に40°〜50°の間にあることを特徴とする、基板。
- 請求項1〜4のいずれか一項に記載の基板であって、少なくとも1つの面取りされた表面セクション(12)は、直線状であることを特徴とする、基板。
- 請求項1〜5のいずれか一項に記載の基板であって、少なくとも1つの面取りされた表面セクション(12)は、機械的ストレスを軽減するためのくし状のプロファイルを備え、及び/又は、少なくとも1つの面取りされた表面セクション(12)は、滑らかな外縁を備える、ことを特徴とする、基板。
- 請求項1〜6のいずれか一項に記載の基板であって、チップアイランド(3)に隣接する貫通孔(8)、特に貫通孔(8)の内側(15)にアンカーエッジ(11)を備えることを特徴とする、基板。
- チップアイランド(3)と、そこに固定される半導体チップ(17)と、前記半導体チップ(17)を特にボンドワイヤを用いて電気的に接続するための電極(4)と、チップキャリアを構造化するための貫通孔(7、8、9、10)とを備え、少なくとも1つの貫通孔(7、8、9、10)は、前記半導体チップ(17)を封止するキャスティング材(18)のためのアンカーエッジ(11)を形成する、チップキャリアを有する電子モジュールであって、
前記貫通孔(7、8、9、10)に隣接する前記チップキャリアの表面セクション(12)が、アンカーエッジ(11)を形成するために面取りされており、前記アンカーエッジ(11)は、前記チップアイランド(3)が配置され且つキャスティング材(18)の中に埋め込まれる、チップキャリアの面を超えて突出していること、及び、1つの貫通孔(8)は、機械的ストレスを軽減するための面取りしていないカーブ(14)及び/又は面取りしていない凹部(16)を備えること、を特徴とする、
電子モジュール。 - 請求項8に記載のモジュールを有する電子装置、特にチップカード、ヘルスカード、銀行カード、交通機関チケット、ホテルカード、身分証、パスポート、入館証などの紙ホイル型のカードである、電子装置。
- 電子モジュールの製造のためにさらに処理するための複数のチップキャリアユニット(2)を有するストリップ構造基板を製造するための方法であって、
前記ユニット(2)は、貫通孔(7、8、9、10)を形成するために、特に打ち抜きにより構造化され、
前記貫通孔(7、8、9、10)に隣接する各ユニット(2)の表面セクション(12)が、キャスティング材のためのアンカーエッジ(11)を形成するために面取りされ、及び、1つの貫通孔(8)は、機械的ストレスを軽減するための面取りしていないカーブ(14)及び/又は面取りしていない凹部(16)を備える、方法。 - チップキャリアを製造するための複数のユニット(2)を有する金属ホイル(1)で作られるストリップ構造基板であって、各ユニット(2)は、半導体チップを固定するためのチップアイランド(3)と、前記半導体チップを電気的に接続するための電極(4)と、前記ユニット(2)を構造化するための貫通孔(7、8、9、10)とを備え、少なくとも1つの貫通孔(7、8、9、10)は、前記半導体チップを封止するキャスティング材のためのアンカーエッジ(11)を形成し、
前記金属ホイル(1)は、スチール、特にオーステナイト系のステンレススチールから形成され、15マイクロメートル〜35マイクロメートルの厚さを有すること、及び、1つの貫通孔(8)は、機械的ストレスを軽減するための面取りしていないカーブ(14)及び/又は面取りしていない凹部(16)を備えること、を特徴とする、
ストリップ構造基板。
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DE102014108916.2 | 2014-06-25 | ||
DE102014108916.2A DE102014108916B4 (de) | 2014-06-25 | 2014-06-25 | Bandförmiges Substrat zur Herstellung von Chipträgern, elektronisches Modul mit einem solchen Chipträger, elektronische Einrichtung mit einem solchen Modul und Verfahren zur Herstellung eines Substrates |
PCT/EP2015/063257 WO2015197386A1 (de) | 2014-06-25 | 2015-06-15 | Bandförmiges substrat zur herstellung von chipträgern, elektronisches modul mit einem solchen chipträger, elektronische einrichtung mit einem solchen modul und verfahren zur herstellung eines substrates |
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FR3081583B1 (fr) * | 2018-05-25 | 2021-10-01 | Linxens Holding | Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede |
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US2522783A (en) | 1949-04-18 | 1950-09-19 | Goldens Foundry & Machine Comp | Hydraulic pump and circuit |
US4805009A (en) * | 1985-03-11 | 1989-02-14 | Olin Corporation | Hermetically sealed semiconductor package |
JPS61284949A (ja) * | 1985-06-11 | 1986-12-15 | Daido Steel Co Ltd | リ−ドフレ−ム材料 |
US5792286A (en) | 1991-12-13 | 1998-08-11 | Nkk Corporation | High-strength thin plate of iron-nickel-cobalt alloy excellent in corrosion resisitance, repeated bending behavior and etchability, and production thereof |
US5252783A (en) * | 1992-02-10 | 1993-10-12 | Motorola, Inc. | Semiconductor package |
JPH0661408A (ja) * | 1992-08-10 | 1994-03-04 | Rohm Co Ltd | 表面実装型半導体装置 |
US5594234A (en) * | 1994-11-14 | 1997-01-14 | Texas Instruments Incorporated | Downset exposed die mount pad leadframe and package |
KR100335480B1 (ko) * | 1999-08-24 | 2002-05-04 | 김덕중 | 칩 패드가 방열 통로로 사용되는 리드프레임 및 이를 포함하는반도체 패키지 |
US6661083B2 (en) | 2001-02-27 | 2003-12-09 | Chippac, Inc | Plastic semiconductor package |
JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
EP1557881A1 (en) * | 2004-01-23 | 2005-07-27 | STMicroelectronics S.r.l. | A lead-frame for electronic devices with extruded pads |
US7968998B1 (en) * | 2006-06-21 | 2011-06-28 | Amkor Technology, Inc. | Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package |
US8008758B1 (en) * | 2008-10-27 | 2011-08-30 | Amkor Technology, Inc. | Semiconductor device with increased I/O leadframe |
US8314489B2 (en) * | 2010-09-13 | 2012-11-20 | Infineon Technologies Ag | Semiconductor module and method for production thereof |
DE202012100694U1 (de) | 2012-02-29 | 2012-03-30 | Heraeus Materials Technology Gmbh & Co. Kg | Substrat mit vergrößerter Chipinsel |
CN102819759B (zh) * | 2012-06-29 | 2015-09-30 | 周宗涛 | 一种非接触大芯片智能卡的条带 |
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DE102014108916A1 (de) | 2015-12-31 |
EP3161864A1 (de) | 2017-05-03 |
DE102014108916B4 (de) | 2019-12-05 |
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US20170133313A1 (en) | 2017-05-11 |
US9941197B2 (en) | 2018-04-10 |
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