JP6568650B2 - プローブソケット - Google Patents
プローブソケット Download PDFInfo
- Publication number
- JP6568650B2 JP6568650B2 JP2018512287A JP2018512287A JP6568650B2 JP 6568650 B2 JP6568650 B2 JP 6568650B2 JP 2018512287 A JP2018512287 A JP 2018512287A JP 2018512287 A JP2018512287 A JP 2018512287A JP 6568650 B2 JP6568650 B2 JP 6568650B2
- Authority
- JP
- Japan
- Prior art keywords
- noise
- probe
- signal
- fixing member
- shielding body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0807—Measuring electromagnetic field characteristics characterised by the application
- G01R29/0814—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
- G01R29/0835—Testing shielding, e.g. for efficiency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
Claims (5)
- 複数の信号用プローブを含むプローブソケットであって、
上記複数の信号用プローブを両端部が露出されるように相互平行に収容してノイズを遮蔽する導電性のノイズ遮蔽本体と、
上記ノイズ遮蔽本体から上記複数の信号用プローブの露出両端部の間の一部の領域に延びている上部ノイズ遮断壁及び下部ノイズ遮断壁と、
上記ノイズ遮蔽本体の上部及び下部にそれぞれ配置され、上記複数の信号用プローブの露出両端部をそれぞれ支持し、上記上部ノイズ遮断壁を収容する収容溝部を有する上部固定部材、及び、上記下部ノイズ遮断壁を収容する収容溝部を有する下部固定部材と、
を含む、プローブソケット。 - 上記上部ノイズ遮断壁及び上記下部ノイズ遮断壁を収容する収容溝部は、上記上部及び下部固定部材を貫通している、請求項1に記載のプローブソケット。
- 上記ノイズ遮蔽本体は、黄銅ブロックを含む、請求項1に記載のプローブソケット。
- 上記ノイズ遮蔽本体は、少なくとも2つに分割して積層され、
上記の積層されたノイズ遮蔽本体の間に配置され上記複数の信号用プローブを支持する中間支持部材をさらに含む、請求項1に記載のプローブソケット。 - 複数の接地用プローブをさらに含み、
上記上部ノイズ遮断壁及び上記下部ノイズ遮断壁は、上記複数の接地用プローブの少なくとも一つを収容する、請求項1に記載のプローブソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2015-0128114 | 2015-09-10 | ||
KR1020150128114A KR101762836B1 (ko) | 2015-09-10 | 2015-09-10 | 프로브 소켓 |
PCT/KR2016/010077 WO2017043879A1 (ko) | 2015-09-10 | 2016-09-08 | 프로브 소켓 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018529951A JP2018529951A (ja) | 2018-10-11 |
JP6568650B2 true JP6568650B2 (ja) | 2019-08-28 |
Family
ID=58240862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018512287A Active JP6568650B2 (ja) | 2015-09-10 | 2016-09-08 | プローブソケット |
Country Status (7)
Country | Link |
---|---|
US (1) | US10884047B2 (ja) |
JP (1) | JP6568650B2 (ja) |
KR (1) | KR101762836B1 (ja) |
CN (1) | CN108139429B (ja) |
MY (1) | MY187011A (ja) |
TW (1) | TWI626450B (ja) |
WO (1) | WO2017043879A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10274515B1 (en) * | 2015-08-07 | 2019-04-30 | Johnstech International Corporation | Waveguide integrated testing |
KR101975836B1 (ko) * | 2017-08-11 | 2019-08-28 | 리노공업주식회사 | 검사장치 |
KR102015788B1 (ko) * | 2017-11-30 | 2019-08-29 | 리노공업주식회사 | 검사장치 |
KR102044753B1 (ko) | 2018-05-25 | 2019-11-15 | 리노공업주식회사 | 검사장치 |
TWI673499B (zh) * | 2018-09-10 | 2019-10-01 | 范劉文玲 | 積體電路插座 |
JP2020134216A (ja) * | 2019-02-15 | 2020-08-31 | 株式会社サンケイエンジニアリング | 検査治具 |
JP7206140B2 (ja) * | 2019-03-22 | 2023-01-17 | 株式会社ヨコオ | 検査装置 |
CN111182778A (zh) * | 2019-12-31 | 2020-05-19 | 上海航天科工电器研究院有限公司 | 一种全屏蔽差分接触模块及其制备方法 |
JP2021128055A (ja) * | 2020-02-13 | 2021-09-02 | オムロン株式会社 | 検査ソケット |
JP2021135214A (ja) * | 2020-02-28 | 2021-09-13 | 三菱電機エンジニアリング株式会社 | 通電コンタクトユニット、及び試験システム |
KR102295761B1 (ko) * | 2020-06-01 | 2021-09-01 | 리노공업주식회사 | 검사소켓 |
KR102373067B1 (ko) * | 2020-06-30 | 2022-03-14 | 리노공업주식회사 | 검사소켓 및 그의 제조방법 |
CN111900578A (zh) * | 2020-08-20 | 2020-11-06 | 苏州华兴源创科技股份有限公司 | 一种信号传输组件 |
KR102489319B1 (ko) * | 2020-10-28 | 2023-01-18 | 주식회사 아이에스시 | 전기 접속용 커넥터 |
KR102529636B1 (ko) * | 2023-01-10 | 2023-05-12 | 하이콘 주식회사 | 반도체 소자 테스트용 소켓장치 |
KR102653116B1 (ko) * | 2023-07-20 | 2024-04-02 | 주식회사 비이링크 | 전자 소자의 회로 검사용 소켓 장치 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4603023A (en) * | 1983-12-01 | 1986-07-29 | International Business Machines Corporation | Method of making a hybrid dielectric probe interposer |
JP4535828B2 (ja) * | 2004-09-30 | 2010-09-01 | 株式会社ヨコオ | 検査ユニットの製法 |
JP4438601B2 (ja) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | 検査ユニットの製法 |
WO2006062911A1 (en) * | 2004-12-08 | 2006-06-15 | K & S Interconnect, Inc. | Test socket and method for making |
JP2008070146A (ja) * | 2006-09-12 | 2008-03-27 | Yokowo Co Ltd | 検査用ソケット |
WO2009001731A1 (ja) * | 2007-06-22 | 2008-12-31 | Nhk Spring Co., Ltd. | 導電性接触子ホルダおよび導電性接触子ユニット |
KR101193407B1 (ko) * | 2007-09-11 | 2012-10-24 | 가부시키가이샤 어드밴티스트 | 연결기, 도전 부재, 연결기의 제조 방법, 퍼포먼스 보드 및 시험 장치 |
JP4921344B2 (ja) * | 2007-12-26 | 2012-04-25 | 株式会社ヨコオ | 検査ソケット |
KR20100037431A (ko) * | 2008-10-01 | 2010-04-09 | (주)리뉴젠 | 고주파수용 반도체 테스트 소켓 |
JP2010175371A (ja) * | 2009-01-29 | 2010-08-12 | Yokowo Co Ltd | 検査ソケット |
JP5960383B2 (ja) * | 2010-06-01 | 2016-08-02 | スリーエム イノベイティブ プロパティズ カンパニー | 接触子ホルダ |
JP5788767B2 (ja) * | 2011-11-07 | 2015-10-07 | 株式会社日本マイクロニクス | プローブブロックとそれを備えるプローブカード並びにプローブ装置 |
KR101357535B1 (ko) * | 2012-06-25 | 2014-02-05 | 주식회사 유니세트 | 인터포저 소켓 |
KR101534778B1 (ko) * | 2014-01-24 | 2015-07-09 | 리노공업주식회사 | 검사장치 |
KR101552552B1 (ko) | 2014-08-22 | 2015-09-14 | 리노공업주식회사 | 테스트 소켓 |
-
2015
- 2015-09-10 KR KR1020150128114A patent/KR101762836B1/ko active IP Right Grant
-
2016
- 2016-09-08 WO PCT/KR2016/010077 patent/WO2017043879A1/ko active Application Filing
- 2016-09-08 CN CN201680052420.1A patent/CN108139429B/zh active Active
- 2016-09-08 JP JP2018512287A patent/JP6568650B2/ja active Active
- 2016-09-08 MY MYPI2018700938A patent/MY187011A/en unknown
- 2016-09-09 TW TW105129226A patent/TWI626450B/zh active
-
2018
- 2018-03-09 US US15/916,479 patent/US10884047B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108139429B (zh) | 2020-09-08 |
KR101762836B1 (ko) | 2017-07-28 |
MY187011A (en) | 2021-08-26 |
KR20170030783A (ko) | 2017-03-20 |
CN108139429A (zh) | 2018-06-08 |
WO2017043879A1 (ko) | 2017-03-16 |
TW201734465A (zh) | 2017-10-01 |
TWI626450B (zh) | 2018-06-11 |
US10884047B2 (en) | 2021-01-05 |
JP2018529951A (ja) | 2018-10-11 |
US20180196096A1 (en) | 2018-07-12 |
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