JP6559151B2 - 表面保護用シート - Google Patents

表面保護用シート Download PDF

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Publication number
JP6559151B2
JP6559151B2 JP2016555258A JP2016555258A JP6559151B2 JP 6559151 B2 JP6559151 B2 JP 6559151B2 JP 2016555258 A JP2016555258 A JP 2016555258A JP 2016555258 A JP2016555258 A JP 2016555258A JP 6559151 B2 JP6559151 B2 JP 6559151B2
Authority
JP
Japan
Prior art keywords
sheet
surface protection
adhesive
wafer
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016555258A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2016063917A1 (ja
Inventor
和幸 田村
和幸 田村
茂人 奥地
茂人 奥地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2016063917A1 publication Critical patent/JPWO2016063917A1/ja
Application granted granted Critical
Publication of JP6559151B2 publication Critical patent/JP6559151B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2016555258A 2014-10-23 2015-10-21 表面保護用シート Active JP6559151B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014216544 2014-10-23
JP2014216544 2014-10-23
PCT/JP2015/079725 WO2016063917A1 (ja) 2014-10-23 2015-10-21 表面保護用シート

Publications (2)

Publication Number Publication Date
JPWO2016063917A1 JPWO2016063917A1 (ja) 2017-08-03
JP6559151B2 true JP6559151B2 (ja) 2019-08-14

Family

ID=55760948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016555258A Active JP6559151B2 (ja) 2014-10-23 2015-10-21 表面保護用シート

Country Status (3)

Country Link
JP (1) JP6559151B2 (zh)
TW (1) TWI688477B (zh)
WO (1) WO2016063917A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017188205A1 (ja) * 2016-04-28 2017-11-02 リンテック株式会社 保護膜形成用フィルム及び保護膜形成用複合シート
JP6729050B2 (ja) * 2016-06-22 2020-07-22 住友ベークライト株式会社 半導体素子保護用粘着テープおよび半導体素子保護用粘着テープの製造方法
SG11201900617YA (en) 2016-07-26 2019-02-27 Mitsui Chemicals Tohcello Inc Method for manufacturing semiconductor device
JP7055567B2 (ja) * 2018-06-06 2022-04-18 株式会社ディスコ テープ貼着装置
JP7317482B2 (ja) * 2018-10-16 2023-07-31 株式会社ディスコ ウエーハの加工方法
KR102193721B1 (ko) * 2019-01-21 2020-12-21 주식회사 야스 점착척의 점착시트 보호 용 커버 필름
KR20210128382A (ko) * 2019-02-26 2021-10-26 가부시기가이샤 디스코 이면 연삭용 점착 시트 및 반도체 웨이퍼의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3499957B2 (ja) * 1995-03-10 2004-02-23 リンテック株式会社 帯電防止粘着シート
JP2001196404A (ja) * 2000-01-11 2001-07-19 Fujitsu Ltd 半導体装置及びその製造方法
JP4704225B2 (ja) * 2006-01-30 2011-06-15 富士フイルム株式会社 アルバム作成装置、アルバム作成方法、およびアルバム作成プログラム
JP2007296751A (ja) * 2006-04-28 2007-11-15 Mitsubishi Plastics Ind Ltd 樹脂積層体
JP2010177542A (ja) * 2009-01-30 2010-08-12 Lintec Corp 帯電防止性粘着シート
JP5788165B2 (ja) * 2010-11-02 2015-09-30 三菱樹脂株式会社 難燃性樹脂フィルム及びそのフィルムの製造方法
JP2012216619A (ja) * 2011-03-31 2012-11-08 Lintec Corp 表面保護用シート

Also Published As

Publication number Publication date
WO2016063917A1 (ja) 2016-04-28
TW201630734A (zh) 2016-09-01
JPWO2016063917A1 (ja) 2017-08-03
TWI688477B (zh) 2020-03-21

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