JP6555542B2 - 窒化物半導体装置及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 117
- 150000004767 nitrides Chemical class 0.000 title claims description 99
- 238000004519 manufacturing process Methods 0.000 title description 5
- 230000004888 barrier function Effects 0.000 claims description 287
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 24
- 229910052799 carbon Inorganic materials 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 312
- 230000004048 modification Effects 0.000 description 41
- 238000012986 modification Methods 0.000 description 41
- 229910002704 AlGaN Inorganic materials 0.000 description 37
- 238000000034 method Methods 0.000 description 32
- 239000012535 impurity Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 230000005684 electric field Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 12
- 239000000203 mixture Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 7
- 238000001312 dry etching Methods 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000012141 concentrate Substances 0.000 description 5
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
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Description
2、22、42、62、82、102、122、142、162、182、202、222、242、262 バッファ層
3、23、43、63、83、103、123、143、163、183、203、223、243、263 チャネル層
6、26、46、66、86、106、126、146、166、186、206、226、246、266 高C濃度バリア層
7、27、47、67、87、107、127、147、167、187、207、227、247、267 2DEG層
8、28、48、68、88、108、128、148、168、188、208、228、248、268 ゲート電極
9、29、49、69、89、109、129、149、169、189、209、229、249、269 ソース電極
10、30、50、70、90、110、130、150、170、190、210、230、250、270 ドレイン電極
24、44、64、84、104、124、144、164、184、204、224、244、264 低C濃度バリア層
45、65、85、105、125、145、165、185、205、225、245、265 リセス部
52、72、92、112、132、212、232、252、272 ゲート電極端
73、93、253 高C濃度バリア層凹部端
111、131、271 リセス部端
154 リセス部の側壁
175、195 リセス底部
176 リセス側壁部
217 凹部の底部のドレイン側端部
238 低C濃度バリア層のドレイン側端部
Claims (12)
- 基板と、
前記基板上に形成されたチャネル層と、
前記チャネル層の上に形成され、リセス部を有する低C濃度バリア層と、
前記リセス部及び前記低C濃度バリア層を覆うように形成された、前記低C濃度バリア層よりも炭素含有量が多い高C濃度バリア層と、
前記リセス部の上に形成されたゲート電極と、
前記ゲート電極の両側方にそれぞれ前記ゲート電極と離間して形成されたソース電極及びドレイン電極とを有し、
前記低C濃度バリア層及び前記高C濃度バリア層は、いずれも炭素を含有し、
前記高C濃度バリア層は前記低C濃度バリア層より炭素含有量が多く、
前記低C濃度バリア層及び前記高C濃度バリア層は、前記チャネル層よりバンドギャップが大きく、
前記高C濃度バリア層の上面は、前記ソース電極および前記ドレイン電極が形成された第1主面と、前記リセス部に沿って形成された凹部底面と、前記第1主面および前記凹部底面を繋ぐ凹部側面とを含み、
前記第1主面と前記凹部側面との境界である高C濃度バリア層凹部端のうち、前記ドレイン電極に最も近い高C濃度バリア層凹部端は、前記ゲート電極で覆われている
ことを特徴とする窒化物半導体装置。 - 前記低C濃度バリア層の上面は、前記第1主面に対向する第2主面と、リセス部側面とを含み、
前記ゲート電極および前記高C濃度バリア層を断面視した場合に、
前記第2主面と前記リセス部側面との境界であるリセス部端のうち、前記ドレイン電極に最も近いリセス部端は、前記ゲート電極の前記ドレイン側の端部の直下にある
ことを特徴とする請求項1に記載の窒化物半導体装置。 - 前記低C濃度バリア層の上面は、前記第1主面に対向する第2主面と、リセス部側面とを含み、
前記ゲート電極および前記高C濃度バリア層を断面視した場合に、
前記第2主面と前記リセス部側面との境界であるリセス部端のうち、前記ドレイン電極に最も近いリセス部端は、前記ゲート電極の前記ドレイン側の端部の直下よりも、前記ドレイン電極と反対方向に位置している
ことを特徴とする請求項1に記載の窒化物半導体装置。 - 前記ソース電極と前記ドレイン電極との並び方向における前記リセス部の開口部の長さは、前記並び方向における前記リセス部の底部の長さより長い
ことを特徴とする請求項1〜3のいずれか一項に記載の窒化物半導体装置。 - 前記高C濃度バリア層のうち、前記凹部底面を含む領域の炭素濃度は、前記凹部側面を含む領域の炭素濃度よりも高い
ことを特徴とする請求項1〜4のいずれか一項に記載の窒化物半導体装置。 - 前記リセス部は、前記低C濃度バリア層を上面から下面にわたって貫通する貫通リセス構造を有し、
前記高C濃度バリア層は、
前記低C濃度バリア層と前記チャネル層との非リセス部における界面の延長面である第1の延長面より上方のバリア部と、
前記第1の延長面より下方のチャネル部とを有し、
前記チャネル部の炭素濃度が、前記バリア部の炭素濃度よりも高い
ことを特徴とする請求項1〜5のいずれか一項に記載の窒化物半導体装置。 - 基板と、
前記基板上に形成されたチャネル層と、
前記チャネル層の上に形成され、リセス部が形成された低C濃度バリア層と、
前記リセス部及び前記低C濃度バリア層を覆うように形成された、前記低C濃度バリア層よりも炭素含有量が多い高C濃度バリア層と、
前記リセス部の上に形成されたゲート電極と、
前記ゲート電極の両側方にそれぞれ前記ゲート電極と離間して形成されたソース電極及びドレイン電極とを有し、
前記ソース電極と前記ドレイン電極との並び方向における前記高C濃度バリア層の凹部の開口部の長さが、前記並び方向における前記凹部の底部の長さより長く、
前記低C濃度バリア層及び前記高C濃度バリア層は、いずれも炭素を含有し、
前記高C濃度バリア層は、前記低C濃度バリア層より炭素含有量が多く、
前記低C濃度バリア層及び前記高C濃度バリア層は、前記チャネル層よりバンドギャップが大きく、
前記高C濃度バリア層の上面は、前記ソース電極および前記ドレイン電極が形成された第1主面と、前記リセス部に沿って形成された凹部底面と、前記第1主面と前記凹部底面とを繋ぐ凹部側面とを含み、
前記凹部底面と前記凹部側面との境界である凹部底面端のうち、前記ドレイン電極に最も近い凹部底面端は、前記ゲート電極で覆われている
ことを特徴とする窒化物半導体装置。 - 前記リセス部は、前記低C濃度バリア層を上面から下面にわたって貫通する貫通リセス構造を有し、
前記低C濃度バリア層の上面は、前記第1主面と対向する第2主面と、前記第2主面およびリセス部底面を繋ぐリセス部側面とを含み、
前記ゲート電極および前記低C濃度バリア層を断面視した場合に、
前記リセス部側面と前記リセス部底面との境界であるリセス部底面端のうち、前記ドレイン電極に最も近いリセス部底面端は、前記ゲート電極の前記ドレイン側の端部の直下よりも、前記ドレイン電極と反対方向に位置している
ことを特徴とする請求項7に記載の窒化物半導体装置。 - 前記第1主面と前記凹部側面との境界である高C濃度バリア層凹部端のうち、前記ドレイン電極に最も近い高C濃度バリア層凹部端は、前記ゲート電極で覆われている
ことを特徴とする請求項7に記載の窒化物半導体装置。 - 前記低C濃度バリア層の上面は、前記第1主面と対向する第2主面と、リセス部側面とを含み、
前記ゲート電極および前記高C濃度バリア層を断面視した場合に、
前記第2主面と前記リセス部側面との境界であるリセス部端のうち、前記ドレイン電極に最も近いリセス部端は、前記ゲート電極の前記ドレイン側の端部の直下よりも、前記ドレイン電極と反対方向に位置している
ことを特徴とする請求項7に記載の窒化物半導体装置。 - 前記ゲート電極、前記低C濃度バリア層、および前記高C濃度バリア層を断面視した場合に、
前記ゲート電極の前記ドレイン側の端部の直下にある前記低C濃度バリア層の膜厚と、前記高C濃度バリア層の膜厚との和の膜厚が、30nm以上である
ことを特徴とする請求項1〜10のいずれか一項に記載の窒化物半導体装置。 - 基板上にチャネル層を形成する工程と、
前記チャネル層の上に、前記チャネル層よりもバンドギャップが大きく、炭素を含有する低C濃度バリア層を形成する工程と、
前記低C濃度バリア層に、リセス部を形成する工程と、
前記リセス部及び前記低C濃度バリア層を覆うように、前記チャネル層よりもバンドギャップが大きく、かつ、前記低C濃度バリア層よりも炭素含有量が多い高C濃度バリア層を形成する工程と、
前記リセス部の上方であって、前記高C濃度バリア層の上にゲート電極を形成する工程と、
前記高C濃度バリア層の上であって、前記ゲート電極の両側方に、前記ゲート電極と離間してソース電極及びドレイン電極を形成する工程とを含み、
前記高C濃度バリア層の上面は、前記ソース電極および前記ドレイン電極が形成された第1主面と、前記リセス部に沿って形成された凹部底面と、前記第1主面および前記凹部底面を繋ぐ凹部側面とを含み、
前記リセス部を形成する工程、前記高C濃度バリア層を形成する工程および前記ゲート電極を形成する工程では、前記第1主面と前記凹部側面との境界である高C濃度バリア層凹部端のうち、前記ドレイン電極に最も近い高C濃度バリア層凹部端が前記ゲート電極で覆われるように、前記リセス部、前記高C濃度バリア層および前記ゲート電極を形成する
窒化物半導体装置の製造方法。
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