JP6549150B2 - コンフォーマル電子デバイスの封入方法 - Google Patents
コンフォーマル電子デバイスの封入方法 Download PDFInfo
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- JP6549150B2 JP6549150B2 JP2016562729A JP2016562729A JP6549150B2 JP 6549150 B2 JP6549150 B2 JP 6549150B2 JP 2016562729 A JP2016562729 A JP 2016562729A JP 2016562729 A JP2016562729 A JP 2016562729A JP 6549150 B2 JP6549150 B2 JP 6549150B2
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- conformal
- silicone
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- adhesive
- electronic device
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Classifications
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/86—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the casing, e.g. sealed casings or casings reducible in size
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
本願は、2014年1月6日付で出願された米国仮特許出願第61/924,111号明細書および2014年3月4日付で出願された米国仮特許出願第61/947,709号明細書に対する優先権の利益を主張するものであり、この両仮特許出願の内容は、そのそれぞれの全体およびすべての目的に関して、参照によって本願に組み込まれる。
この実施例においては、湿度センサを含むコンフォーマル電子デバイス−以下「Ex1デバイス」と呼称−をオーバモールド法によって封入する。Ex1デバイスは、高い厚さ測定用として約6mmの最終厚さを有するように、あるいは、防水能力測定用として約2mmの最終厚さを有するように封入される。3つのプレート成形用具−第1プレート701、第2プレート702および第3プレート703−をオーバモールド法用として使用するが、それが図7A〜7Fに示されている。図7A、7Cおよび7Eに示すプレート表面は、高い厚さ測定用のEx1デバイスの一部分の上のコネクタのための開口用のキャップを形成するのに用いられ、一方、図7B、7Dおよび7Fに示すプレートは、防水能力測定用の封入層を形成するのに用いられる。Dake Corporation社から入手できるModel 44−226 25Ton 5”ストロークセルフレベリング型実験室用液圧プレスを、前記のオーバモールド法用として使用できる。高い厚さ測定用および防水能力測定用として2つの異なる封入材料を用いることができる。一例において、高い厚さ測定用として、SMOOTH−ON(商標)社のECOFLEX(登録商標)を封入層の形成に用いることができ、防水能力測定用として、Bluestar社のSILBIONE(登録商標)RTV4545シリコーンを封入層の形成に用いることができる。任意選択肢として、他の適切な材料(例えばBluestar社のSILBIONE(登録商標)LSR4325)を、封入層の形成および/または封入層の防水能力の改善に用いることができる。使用可能なプライマの例は、Nusil Silicone Technology社のMED−142およびMED−166である。これらのプライマは、プライマが塗布される表面への封入材料の接着性を実質的に増大させることができる。
デバイスアイランドおよび相互接続体を含むコンフォーマル電子デバイス−以下「Ex2デバイス」と呼称−を封入するためにオーバモールド法を使用する。Ex2デバイスは、少なくともいくつかの実施形態については、図2および図3A〜3Bに関して記述したコンフォーマル電子デバイス200および/または300に類似または実質的に同一であり、従って、これらの図を参照して記述した任意の対応する選択肢および特徴を含むことができる。この場合、Ex2デバイスは、Ex1デバイスの封入に用いたのと実質的に同じオーバモールド法によって封入される。この実施例においては、使用した封入材料はBluestar社のSILBIONE(登録商標)RTV4545である。他の例においては、Ex2デバイスの形成に代替的な封入材料を用いることができる。図示のように、封入されたEx2デバイスは約1mmの全厚さを有する。図9Aおよび9Bは、封入型Ex2デバイスの代表的な実施形態900の上面および底面を示す。封入層にいくつかの空気気泡を見ることができ、デバイスアイランドにおいて、またはそれに近接して、いくつかの層間剥離が、Ex2デバイスの機能を損なうことなく生起する場合がある。
この実施例においては、湿度感知するコンフォーマル電子デバイス−以下「Ex3デバイス」と呼称−を封入するためにラミネーション法を用いる。Ex3デバイスは、少なくともいくつかの実施形態においては、Ex1デバイスに類似または実質的に同一であり、従って、これを参照して記述した任意の対応する選択肢および特徴を含むことができる。Ex3デバイスは、防水性および信頼性の測定用として約1.0mm〜1.5mmの厚さを有するように封入される。
別の代表的なコンフォーマル電子デバイス−以下「Ex4デバイス」と呼称−を、ラミネーション法を用いて封入する。この形態においては、Ex4デバイスは、埋め込み型近接場通信(Near Field Communication:NFC)マイクロチップを含む。ラミネーション法に用いる液体シリコーンは、低粘度のBluestar社のSILBIONE(登録商標)RTV4545である。Ex4デバイスは、Ex3デバイスの場合とほぼ同じラミネーション手順によって封入される。従って、図9Aおよび9Bは、それぞれ、封入されたEx4デバイスの上面および底面を表すことができる。種々の位置におけるEx4デバイスの厚さは、0.15mm厚さのシリコーンシートを使用した場合、約0.7mm未満であり、0.25mm厚さのシリコーンシートを使用した場合、約1mm未満である。
次に図11A〜11Fを参照すると、さらに別のコンフォーマル電子デバイス−以下「Ex5デバイス」と呼称−がラミネーション法を用いて封入される。Ex5デバイスは、本明細書に記述するEx2デバイスに類似または実質的に同一であり、従って、それを参照して記述した任意の対応する選択肢および特徴を含むことができる。図示の実施形態においては、ラミネーション法に用いる液体シリコーンは、低粘度のBluestar社のSILBIONE(登録商標)RTV4545である。Ex5デバイスは、前記のEx3デバイスの場合とほぼ同じラミネーション手順によって封入される。封入用として用いるシリコーンシートは、透明、着色または半透明である。図11および11Bは、それぞれ、透明(または実質的に透明)なシリコーンシートによって封入されたEx5デバイスの第1の代表的な実施形態1100Aの上面図および底面図を示す。図11Eおよび11Fは、それぞれ、着色シリコーンシートによって封入されたEx5デバイスの第3の代表的な実施形態1100Cの上面図および底面図を示す。図11C〜11Hに示すEx5デバイスの構成は、透明、半透明または着色シリコーンシートによって封入された多島構造(例えば一連のICデバイスアイランド)を有する。図11A〜11Hの封入されたEx5デバイス1100A、1100B、1100Cおよび1100Dの厚さは、例えば、0.076mm厚さのシリコーンシートで封入した場合、約0.20mm未満、例えば、0.25mm厚さのシリコーンシートで封入した場合、約0.70mm未満である。
図12A〜12Dは、封入型コンフォーマル電子デバイスにおけるひずみの制限、強度の補強および外観の見栄えの効果のための繊維の使用の実施例を示す。この実施例においては、電子構造は、伸縮可能な電気的相互接続体によって相互接続されたデバイスアイランドおよび電子部品を含む。この電子構造は、異なる外観効果のための異なる色彩を有することができる材料の上に配置される。例えば、図12Aのコンフォーマル電子デバイス1200Aのベースの一部分を形成する材料は黄色であり、この例のシステムに黄色の外観を与える。図12Bにおいては、コンフォーマル電子デバイス1200Bのベースの一部分を形成する材料は緑色であり、この例のシステムに緑色の外観を与える。これに比較して、図12Cの場合は、コンフォーマル電子デバイス1200Cのベースの一部分を形成する材料は薄い灰色であり、この例のシステムに薄い灰色の外観を与える。図12Dに関しては、図12Bの実施例のシステムの反対側が示されており、これは、この実施例のシステムのベースを形成するために含まれる緑色の材料を示す。ベースの中に組み込まれるこれらの付加的な繊維の部分は、付加的な強度および補強を提供でき、電子構造が任意の形の変形によって受けるひずみを制限するのに役立つ。
Claims (13)
- コンフォーマル電子デバイスの封入方法であって、
第1シリコーンシートを受け入れるステップと、
第2シリコーンシートを受け入れるステップと、
前記第1シリコーンシートを組み立て治具の中に載置するステップと、
前記第1シリコーンシートの上に第1回分の接着剤を配分するステップと、
前記組み立て治具内において前記第1回分の接着剤の頂部に可撓なプリント回路ボードアセンブリ(FPCBA)を載置するステップと、
前記可撓なプリント回路ボードアセンブリの上に第2回分の接着剤を配分するステップと、
前記組み立て治具内において前記第2回分の接着剤の頂部に前記第2シリコーンシートを載置して積層体を作出するステップと、
前記第1および第2シリコーンシートと前記可撓なプリント回路ボードアセンブリとを含む前記組み立て治具を、ラミネータロールに通して搬送するステップと、
を含む方法。 - 前記第2シリコーンシートを前記第2回分の接着剤の頂部に載置する前に、前記第1および第2シリコーンシートの接合表面を清浄化するステップをさらに含む、請求項1に記載の方法。
- 前記接合表面を清浄化する前に、前記第1および第2シリコーンシートを検査するステップをさらに含む、請求項2に記載の方法。
- 前記第1および第2シリコーンシートを受け入れるステップが、液体のシリコーン樹脂から前記シートを液体射出成形するステップを含む、請求項1に記載の方法。
- 前記第1回分の接着剤の頂部にFPCBAを載置する前に、前記可撓なプリント回路ボードアセンブリの両面を清浄化するステップをさらに含む、請求項1に記載の方法。
- 前記FPCBAの両面を清浄化する前に、前記FPCBAを検査するステップをさらに含む、請求項5に記載の方法。
- 前記第1および第2シリコーンシートが、それらのシリコーンシートが前記組み立て治具内において確実に適正に配列されるように構成される補完的な噛み合い形体を含む、請求項1に記載の方法。
- 前記組み立て治具をラミネータロールに通して搬送する前に、前記組み立て治具の上部に保護用の薄片シートを載置するステップをさらに含む、請求項1に記載の方法。
- 前記組み立て治具を前記ラミネータロールに通して搬送するステップが、前記組み立て治具を、前記ラミネータロールを多数回通過させて送り込むステップを含む、請求項1に記載の方法。
- 前記組み立て治具が、前記ラミネータロールの各通過ごとに異なる方位に配置される、請求項9に記載の方法。
- 前記ラミネータロールのローラ高さが、前記ラミネータロールの各通過ごとに変更される、請求項9に記載の方法。
- 前記組み立て治具を前記ラミネータロールから取り外して、前記第1回分および第2回分の接着剤を硬化させるステップをさらに含む、請求項1に記載の方法。
- 硬化した積層体から、複数の封入型コンフォーマル電子デバイスを型抜きするステップをさらに含む、請求項12に記載の方法。
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